UPG158TB [NEC]

L, S- BAND SPDT SWITCH; L, S- BAND SPDT开关
UPG158TB
型号: UPG158TB
厂家: NEC    NEC
描述:

L, S- BAND SPDT SWITCH
L, S- BAND SPDT开关

开关 光电二极管
文件: 总8页 (文件大小:58K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
GaAs INTEGRATED CIRCUIT  
µPG158TB  
L, S- BAND SPDT SWITCH  
DESCRIPTION  
The µPG158TB is a L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital  
cellular, cordless telephone and other L, S-band wireless application. The device can operate from 500 MHz to 2.5  
GHz, having the low insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual  
6-pin minimold easy to install and contributes to miniaturizing the system.  
FEATURES  
Low Insertion Loss: LINS = 0.3 dB TYP. @VCONT = +3.0 V/0 V, f = 1 GHz  
LINS = 0.4 dB TYP. @VCONT = +3.0 V/0 V, f = 2 GHz  
LINS = 0.5 dB TYP. @VCONT = +3.0 V/0 V, f = 2.5 GHz  
High isolation: ISL = 27 dB TYP. @VCONT = +3.0 V/0 V, f = 0.5 to 2 GHz  
Small 6-pin super minimold package (Size: 2.0 × 1.25 × 0.9 mm)  
APPLICATIONS  
L, S-band digital cellular or cordless telephone  
PCS, WLAN, WLL and Bluetooth applications  
ORDERING INFORMATION  
Part Number  
Marking  
G1M  
Package  
Supplying Form  
Embossed tape 8 mm wide.  
µPG158TB-E3  
6-pin super minimold  
Pin 1, 2, 3 face to tape perforation side.  
Qty 3 kp/reel.  
Remark  
To order evaluation samples, please contact your local NEC sales office. (Part number for sample  
order: µPG158TB)  
Caution The IC must be handled with care to prevent static discharge because its circuit is composed of  
GaAs MES FET.  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No. P14267EJ2V0DS00 (2nd edition)  
Date Published November 1999 N CP(K)  
Printed in Japan  
The mark  
shows major revised points.  
©
1999  
µPG158TB  
ABSOLUTE MAXIMUM RATINGS (TA = +25 °C)  
Parameter  
Control Voltage 1, 2  
Symbol  
Ratings  
6.0 to +6.0 Note  
+28  
Unit  
V
VCONT1, 2  
Pin  
Input Power  
dBm  
W
Total Power Dissipation  
Operating Temperature  
Storage Temperature  
Ptot  
0.15  
TA  
45 to +85  
45 to +150  
°C  
Tstg  
°C  
Note Condition 2.5 | VCONT1 VCONT2| 6.0 V  
Remarks 1. Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85 °C  
2. Operation in excess of any one of these parameters may result in permanent damage.  
PIN CONNECTIONS  
(Top View)  
(Bottom View)  
3
2
4
5
4
5
3
2
Pin No.  
Connection  
OUT1  
Pin No.  
Connection  
VCONT2  
IN  
1
2
3
4
5
6
GND  
OUT2  
VCONT1  
1
6
6
1
RECOMMENDED OPERATING CONDITIONS (TA = +25 °C)  
Parameter  
Symbol  
VCONT  
MIN.  
+2.5  
0.2  
TYP.  
+3.0  
0
MAX.  
Unit  
V
Control Voltage (High)  
Control Voltage (Low)  
+5.3  
+0.2  
VCONT  
V
2
Data Sheet P14267EJ2V0DS00  
µPG158TB  
ELECTRICAL CHARACTERISTICS  
(Unless otherwise specified, TA = +25 °C, VCONT1 = 3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = 3 V, Off chip DC  
blocking capacitors value; 51 pF)  
Parameter  
Insertion Loss  
Symbol  
LINS  
Test Conditions  
f = 0.5 to 1.0 GHz  
MIN.  
TYP.  
0.3  
MAX.  
Unit  
dB  
0.55  
f = 2.0 GHz  
0.4  
0.65  
f = 2.5 GHz  
0.5Note1  
27  
Isolation  
ISL  
f = 0.5 to 2.0 GHz  
f = 2.5 GHz  
22  
dB  
23Note1  
Input Return Loss  
Output Return Loss  
RLin  
RLout  
f = 0.5 to 2.0 GHz  
f = 0.5 to 2.0 GHz  
f = 1.0 GHz, VCONT = 3 V/0 V  
13  
13  
19  
dB  
dB  
19  
Input Power at 0.1 dB  
Compression PointNote2  
Pin(0.1 dB)  
23.0  
dBm  
Input Power at 1 dB  
Compression PointNote2  
Pin(1 dB)  
f = 1.0 GHz, VCONT = 3 V/0 V  
22.0  
26.5  
dBm  
Switching Speed  
Control Current  
tsw  
50  
200  
10  
ns  
ICONT  
VCONT = 3 V/0 V  
0.5  
µA  
Notes1. Characteristic for reference at 2.0 to 2.5 GHz  
2. Pin(0.1 dB) or Pin(1 dB) is measured the input power level when the insertion loss increases more 0.1 dB or  
1 dB than that of linear range. All other characteristics are measured in linear range.  
Cautions 1. When the µPG158TB is used it is necessary to use DC blocking capacitors for No. 1 (OUT1),  
No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to  
accommodate the frequency of operation, band width, switching speed and the condition  
with actual board of your system.  
The range of recommended DC blocking capacitor value is less than 100 pF.  
2. The distance between IC’s GND pin and ground pattern of substrate should be as shorter as  
possible to avoid parasitic parameters.  
3
Data Sheet P14267EJ2V0DS00  
µPG158TB  
TYPICAL CHARACTERISTICS  
TEST CONDITIONS: VCONT = 3 V/0 V, Pin = 0 dBm, TA = +25 °C  
OUT1  
IN  
OUT2  
50 Ω  
IN-OUT1  
INPUT RETURN LOSS vs. FREQUENCY  
IN-OUT1  
log MAG  
ISOLATION vs. FREQUENCY  
CH1 S11 log MAG  
10 dB/ REF 0 dB  
CH1 S21  
10 dB/ REF 0 dB  
1: –23.433 dB  
1 GHz  
1: –28.047 dB  
1 GHz  
2: –30.102 dB  
1.5 GHz  
3: –25.504 dB  
2 GHz  
2: –28.565 dB  
1.5 GHz  
3: –25.835 dB  
2 GHz  
MARKER 1  
1 GHz  
MARKER 1  
1 GHz  
4: –16.018 dB  
2.5 GHz  
4: –22.507 dB  
2.5 GHz  
0
0
–10  
–20  
–30  
–40  
–10  
–20  
–30  
–40  
1
4
1
4
3
3
2
2
START 0.300 000 000 GHz  
STOP 3.300 000 000 GHz  
START 0.300 000 000 GHz  
STOP 3.300 000 000 GHz  
Frequency f (GHz)  
Frequency f (GHz)  
IN-OUT1  
log MAG  
INSERTION LOSS vs. FREQUENCY  
1 dB/ REF 0 dB  
IN-OUT1  
CH1 S22  
OUTPUT RETURN LOSS vs. FREQUENCY  
CH1 S21  
log MAG  
10 dB/ REF 0 dB  
1: –0.574 dB  
1 GHz  
1: –22.502 dB  
1 GHz  
2: –0.662 dB  
1.5 GHz  
3: –0.795 dB  
2 GHz  
2: –28.139 dB  
1.5 GHz  
3: –25.867 dB  
2 GHz  
MARKER 1  
1 GHz  
MARKER 1  
1 GHz  
4: –1.111 dB  
2.5 GHz  
4: –15.601 dB  
2.5 GHz  
1
0
0
–1  
–2  
–3  
–4  
–10  
–20  
–30  
–40  
2
3
4
1
4
3
2
START 0.300 000 000 GHz  
STOP 3.300 000 000 GHz  
START 0.300 000 000 GHz  
STOP 3.300 000 000 GHz  
Frequency f (GHz)  
Frequency f (GHz)  
Caution This data is including loss of the test fixture.  
4
Data Sheet P14267EJ2V0DS00  
µPG158TB  
TEST CIRCUIT  
TA= +25 °C, VCONT1 = +3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = +3 V, f = 2 GHz  
Off chip DC blocking capacitors value: C0 = 51 pF, C1 = 1000 pF (Bypass), Using NEC standard evaluation board  
OUT1  
OUT2  
C0  
C0  
1
6
2
5
3
4
C1  
C1  
C0  
V
CONT1  
IN  
V
CONT2  
EVALUATION BOARD  
OUT1  
OUT2  
V
CONT1  
IN  
V
CONT2  
5
Data Sheet P14267EJ2V0DS00  
µPG158TB  
TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE  
VCONT1  
VCONT(H)  
VCONT(L)  
VCONT2  
VCONT(H)  
OUT1  
OUT2  
OUT1  
OUT2  
IN  
IN  
V
CONT(L)  
OUT1  
OUT2  
OUT1  
OUT2  
IN  
IN  
PACKAGE DIMENSIONS  
6 PIN SUPER MINIMOLD (UNIT: mm)  
+0.1  
+0.1  
0.2  
0.15  
–0  
–0  
0 to 0.1  
0.7  
0.9 ±0.1  
0.65  
0.65  
1.3  
2.0 ±0.2  
6
Data Sheet P14267EJ2V0DS00  
µPG158TB  
RECOMMENDED SOLDERING CONDITIONS  
This product should be soldered under the following recommended conditions. For soldering method and  
conditions other than those recommended below, contact your NEC sales representative.  
Recommended Condition  
Soldering Method  
Infrared Reflow  
Soldering Conditions  
Symbol  
Package peak temperature: 235 °C or below  
Time: 30 seconds or less (at 210 °C)  
Count: 3, Exposure limit: NoneNote  
IR35-00-3  
VP15-00-3  
WS60-00-1  
VPS  
Package peak temperature: 215 °C or below  
Time: 40 seconds or less (at 200 °C)  
Count: 3, Exposure limit: NoneNote  
Wave Soldering  
Partial Heating  
Soldering bath temperature: 260 °C or below  
Time: 10 seconds or less  
Count: 1, Exposure limit: NoneNote  
Pin temperature: 300 °C  
Time: 3 seconds or less (per pin row)  
Exposure limit: NoneNote  
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.  
Caution Do not use different soldering methods together (except for partial heating).  
For details of recommended soldering conditions for surface mounting, refer to information document  
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).  
7
Data Sheet P14267EJ2V0DS00  
µPG158TB  
CAUTION  
The Great Care must be taken in dealing with the devices in this guide.  
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is  
designated as harmful substance according to the law concerned.  
Keep the law concerned and so on, especially in case of removal.  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
No part of this document may be copied or reproduced in any form or by any means without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in  
this document.  
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property  
rights of third parties by or arising from use of a device described herein or any other liability arising from use  
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other  
intellectual property rights of NEC Corporation or others.  
Descriptions of circuits, software, and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these circuits,  
software, and information in the design of the customer's equipment shall be done under the full responsibility  
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third  
parties arising from the use of these circuits, software, and information.  
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,  
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or  
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety  
measures in its design, such as redundancy, fire-containment, and anti-failure features.  
NEC devices are classified into the following three quality grades:  
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a  
customer designated "quality assurance program" for a specific application. The recommended applications of  
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device  
before using it in a particular application.  
Standard: Computers, office equipment, communications equipment, test and measurement equipment,  
audio and visual equipment, home electronic appliances, machine tools, personal electronic  
equipment and industrial robots  
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems or medical equipment for life support, etc.  
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.  
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,  
they should contact an NEC sales representative in advance.  
M7 98. 8  

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