UPG158TB-E3-A [NEC]
SPDT, 500MHz Min, 2500MHz Max, 0.65dB Insertion Loss-Max, SUPER MINIMOLD, 6 PIN;
| 型号： | UPG158TB-E3-A |
| 厂家： | 
NEC |
| 描述： | SPDT, 500MHz Min, 2500MHz Max, 0.65dB Insertion Loss-Max, SUPER MINIMOLD, 6 PIN 射频 微波 光电二极管 |
| 文件： | 总10页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG158TB
L, S-BAND SPDT SWITCH
DESCRIPTION
The µPG158TB is GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were developed for
mobile phone and another L, S-band application.
This device can operate frequency from 0.5 to 2.5 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin super minimold package. And this package is able to high-density surface
mounting.
FEATURES
•
Switch control voltage
: Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.)
: Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
•
Low insertion loss
: LINS1 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont = 3.0 V/0 V
: LINS2 = 0.40 dB TYP. @ f = 2.0 GHz, Vcont = 3.0 V/0 V
: LINS3 = 0.90 dB MAX. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
: ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, Vcont = 3.0 V/0 V
: ISL2 = 18 dB MIN. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
: Pin (1 dB) = +26.5 dBm TYP. @ f = 1.0 GHz, Vcont = 3.0 V/0 V
•
High isolation
Middle power
•
•
High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
•
•
L-band digital cellular or cordless telephone
PCS, W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number
Package
Marking
G1M
Supplying Form
• Embossed tape 8 mm wide
µPG158TB-E3
6-pin super minimold
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPG158TB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PG10441EJ01V0DS (1st edition)
(Previous No. P14267EJ2V0DS00)
The mark shows major revised points.
Date Published November 2003 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices 1999, 2003
µPG158TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
OUTPUT1
GND
(Top View)
(Top View)
(Bottom View)
1
2
3
4
5
6
3
2
1
4
5
6
3
2
1
4
5
6
4
5
6
3
2
1
OUTPUT2
Vcont2
INPUT
Vcont1
TRUTH TABLE
Vcont1
Low
Vcont2
High
Low
INPUT−OUTPUT1
INPUT−OUTPUT2
ON
OFF
ON
High
OFF
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Switch Control Voltage
Input Power
Symbol
Vcont
Pin
Ratings
−6.0 to +6.0Note 1
+28
Unit
V
dBm
mW
°C
Power Dissipation
PD
150Note 2
Operating Ambient Temperature
Storage Temperature
TA
−45 to +85
−55 to +150
Tstg
°C
Notes 1. | Vcont1 − Vcont2 | ≤ 6.0 V
2. Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Switch Control Voltage (H)
Switch Control Voltage (L)
Symbol
Vcont (H)
Vcont (L)
MIN.
2.5
TYP.
3.0
0
MAX.
5.3
Unit
V
−0.2
0.2
V
2
Data Sheet PG10441EJ01V0DS
µPG158TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont = 3.0 V/0 V, DC cut capacitors = 51 pF, unless otherwise specified)
Parameter
Insertion Loss 1
Symbol
LINS1
Test Conditions
f = 0.5 to 1.0 GHz
MIN.
−
TYP.
0.30
0.40
−
MAX.
Unit
dB
0.55
Insertion Loss 2
Insertion Loss 3
Isolation 1
LINS2
f = 2.0 GHz
−
0.65
dB
LINS3
f = 2.0 to 2.5 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 1.0 GHz
−
0.90
−
dB
ISL1
22
18
13
11
13
11
+22.0
27
dB
Isolation 2
ISL2
−
−
dB
Input Return Loss 1
Input Return Loss 2
Output Return Loss 1
Output Return Loss 2
RLin1
RLin2
RLout1
RLout2
Pin (1 dB)
19
−
dB
−
−
dB
19
−
dB
−
−
dB
1 dB Loss Compression
Input PowerNote
+26.5
−
dBm
Switch Control Speed
Switch Control Current
tSW
−
−
50
200
10
ns
Icont
0.5
µA
Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont = 3.0 V/0 V, DC cut capacitors = 51 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
0.1 dB Loss Compression
Input PowerNote
Pin (0.1 dB) f = 1.0 GHz
−
+23.0
−
dBm
Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear
range.
Caution This device is used it is necessary to use DC cut capacitors.
The value of DC cut capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system. The range of
recommended DC cut capacitor value is less than 100 pF.
3
Data Sheet PG10441EJ01V0DS
µPG158TB
EVALUATION CIRCUIT (Vcont = 3.0 V/0 V, DC cut capacitors = 51 pF)
V
cont2
INPUT
V
cont1
51 pF
1 000 pF
1 000 pF
4
5
6
3
2
1
51 pF
51 pF
OUTPUT2
OUTPUT1
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PG10441EJ01V0DS
µPG158TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Vcont1
6pin SMM SPDT SW
Vc1
OUTPUT1
OUT 1
C2
C1
C3
INPUT
C1
C1
IN
C2
OUT 2
OUTPUT2
Vc2
V
cont2
USING THE NEC EVALUATION BOARD
Symbol
C1, C2, C3
C4, C5
Values
51 pF
1 000 pF
5
Data Sheet PG10441EJ01V0DS
µPG158TB
TYPICAL CHARACTERISTICS
(TA = +25°C, Vcont = 3.0 V/0 V, Pin = 0 dBm, unless otherwise specified)
OUT1
IN
OUT2
50 Ω
IN–OUT1
IN–OUT1
INPUT RETURN LOSS vs. FREQUENCY
ISOLATION vs. FREQUENCY
CH1 S11 log MAG
10 dB/ REF 0 dB
CH1 S21 log MAG
10 dB/ REF 0 dB
1: –23.433 dB
1 GHz
2: –30.102 dB
1.5 GHz
1: –28.047 dB
1 GHz
2: –28.565 dB
1.5 GHz
MARKER 1
1 GHz
MARKER 1
1 GHz
3: –25.504 dB
2 GHz
4: –16.018 dB
2.5 GHz
3: –25.835 dB
2 GHz
4: –22.507 dB
2.5 GHz
0
0
–10
–10
1
–20
–20
1
4
4
–30
–40
–30
–40
3
3
2
2
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
IN–OUT1
INSERTION LOSS vs. FREQUENCY
IN–OUT1
OUTPUT RETURN LOSS vs. FREQUENCY
CH1 S21 log MAG
1 dB/ REF 0 dB
CH1 S22 log MAG
10 dB/ REF 0 dB
1: –0.574 dB
1 GHz
2: –0.662 dB
1.5 GHz
1: –22.502 dB
1 GHz
2: –28.139 dB
1.5 GHz
MARKER 1
1 GHz
MARKER 1
1 GHz
3: –0.795 dB
2 GHz
4: –1.111 dB
2.5 GHz
3: –25.867 dB
2 GHz
4: –15.601 dB
2.5 GHz
1
0
0
–1
–2
–3
–4
–10
2
3
1
4
–20
4
–30
–40
3
2
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
Caution This data is including loss of the test fixture.
Remark The graphs indicate nominal characteristics.
6
Data Sheet PG10441EJ01V0DS
µPG158TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1 0.1
1.25 0.1
0.1 MIN.
7
Data Sheet PG10441EJ01V0DS
µPG158TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120 30 seconds
: 3 times
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
VPS
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
VP215
WS260
HS350
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Caution Do not use different soldering methods together (except for partial heating).
8
Data Sheet PG10441EJ01V0DS
µPG158TB
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
•
The information in this document is current as of November, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
9
Data Sheet PG10441EJ01V0DS
µPG158TB
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
Caution GaAs Products
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-01 FAX: +49-211-6503-487
California Eastern Laboratories, Inc.
TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0310
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