UPG168TB [CEL]
L, S-BAND SPDT SWITCH; L, S波段SPDT开关![UPG168TB](http://pdffile.icpdf.com/pdf1/p00105/img/icpdf/UPG168TB_569968_icpdf.jpg)
型号: | UPG168TB |
厂家: | ![]() |
描述: | L, S-BAND SPDT SWITCH |
文件: | 总7页 (文件大小:344K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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DATA SHEET
NEC's L, S-BAND SPDT SWITCH
UPG168TB
FEATURES
DESCRIPTION
•
SWITCH CONTROL VOLTAGE:
Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.)
Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
NEC's UPG168TB is GaAs MMIC for L, S-band
SPDT (Single Pole Double Throw) switch which were
developed for mobile phone and another L, S-band
application.
•
LOW INSERTION LOSS:
This device can operate frequency from 0.5 to 2.5
GHz, having the low insertion loss and high isolation.
LINS1 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont = 3.0 V/0 V
LINS2 = 0.40 dB TYP. @ f = 2.0 GHz, Vcont = 3.0 V/0V
LINS3 = 0.90 dB MAX. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
This device is housed in a 6-pin super minimold pack-
age. And this package is able to high-density surface
mounting.
•
HIGH ISOLATION:
ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, Vcont = 3.0 V/0 V
ISL2 = 18 dB MIN. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
•
•
MIDDLE POWER:
Pin (1 dB) = +26.5 dBm TYP. @ f = 1.0 GHz, Vcont = 3.0 V/0 V
APPLICATION
•
•
L-band digital cellular or cordless telephone
PCS, W-LAN, WLL and BluetoothTM etc.
HIGH-DENSITY SURFACE MOUNTING:
6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
ORDERING INFORMATION
PART NUMBER
PACKAGE
MARKING
SUPPLYING FORM
UPG168TB-E4
6-pin super minimold
G2T
• Embossed tape 8 mm wide
• Pin 4, 5, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: UPG168TB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
California Eastern Laboratories
UPG168TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
(Top View)
(Bottom View)
PIN NO.
PIN NAME
OUTPUT2
GND
1
2
3
4
5
6
1
2
3
6
5
4
1
2
3
6
5
4
6
5
4
1
2
3
OUTPUT1
Vcont1
INPUT
V cont2
TRUTH TABLE
Vcont1
Vcont2
INPUT-OUTPUT1
INPUT-OUTPUT2
Low
High
Low
ON
OFF
ON
High
OFF
ABSOLUTE MAXIMUM RATINGS (TA =+25ºC, unless otherwise specified)
PARAMETER
Switch Control Voltage
Input Power
SYMBOL
Vcont
Pin
RATINGS
−6.0 to +6.0Note 1
+28
UNIT
V
dBm
mW
°C
Power Dissipation
PD
150Note 2
Operating Ambient Temperature
Storage Temperature
TA
−45 to +85
−55 to +150
Tstg
°C
Notes 1. Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C
2. | Vcont1 − Vcont2 | ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA =+25ºC, unless otherwise specified)
PARAMETER
Switch Control Voltage (H)
Switch Control Voltage (L)
SYMBOL
Vcont (H)
MIN.
2.5
TYP.
3.0
0
MAX.
5.3
UNIT
V
Vcont (L)
−0.2
0.2
V
UPG168TB
ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF, unless otherwise specified)
PARAMETER
Insertion Loss 1
SYMBOL
LINS1
TEST CONDITIONS
f = 0.5 to 1.0 GHz
MIN.
−
TYP.
0.30
0.40
−
MAX.
UNIT
dB
0.55
−
Insertion Loss 2
Insertion Loss 3
Isolation 1
LINS2
f = 2.0 GHz
0.65
dB
−
LINS3
f = 2.0 to 2.5 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 1.0 GHz
0.90
−
dB
ISL1
22
18
13
11
27
dB
−
−
Isolation 2
ISL2
dB
−
Input Return Loss 1
Input Return Loss 2
Output Return Loss 1
Output Return Loss 2
RLin1
19
dB
−
−
RLin2
dB
−
RLout1
RLout2
Pin (1 dB)
13
11
19
dB
−
−
dB
−
1 dB Gain Compression
Input PowerNote
+22.0
+26.5
dBm
−
−
Switch Control Speed
Switch Control Current
tSW
50
200
10
ns
Icont
0.5
μA
Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range.
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont = 3.0 V/0 V, DC cut capacitors = 51 pF, unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
f = 1.0 GHz
MIN.
TYP.
MAX.
UNIT
−
−
0.1 dB Gain Compression
Input PowerNote
Pin (0.1 dB)
+23.0
dBm
Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range.
Caution This device is used it is necessary to use DC cut capacitors.
The value of DC blocking capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system. The range of recommended
DC cut capacitor value is less than 100 pF.
UPG168TB
EVALUATION CIRCUIT (Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF)
Vcont2
INPUT
Vcont1
51 pF
1000 pF
1000 pF
6
5
4
1
2
3
51 pF
51 pF
OUTPUT2
OUTPUT1
This application circuit and its parameters are for reference only.
UPG168TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
VDD
6Pin SMM SPDT SW
VC 1
OUTPUT1
OUT 1
C2
C1
C1
C3
INPUT
C1
IN
C2
OUT 2
OUTPUT2
VC 2
Vcont
USING THE NEC EVALUATION BOARD
SYMBOL
C1, C2, C3
C4, C5
VALUES
51 pF
1000 pF
UPG168TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT:mm)
2.1±0.1
1.25±0.1
0.1 MIN.
UPG168TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
IR260
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
VPS
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
VP215
WS260
HS350
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Caution
Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
03/15/2005
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
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