UPG168TB [NEC]
SPDT, 500MHz Min, 2500MHz Max, 0.9dB Insertion Loss-Max, 2 X 1.25 MM, 0.90 MM HEIGHT, SUPER MINIMOLD PACKAGE-6;型号: | UPG168TB |
厂家: | NEC |
描述: | SPDT, 500MHz Min, 2500MHz Max, 0.9dB Insertion Loss-Max, 2 X 1.25 MM, 0.90 MM HEIGHT, SUPER MINIMOLD PACKAGE-6 射频 微波 光电二极管 |
文件: | 总9页 (文件大小:72K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG168TB
L, S-BAND SPDT SWITCH
DESCRIPTION
The µPG168TB is GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were developed for
mobile phone and another L, S-band application.
This device can operate frequency from 0.5 to 2.5 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin super minimold package. And this package is able to high-density surface
mounting.
FEATURES
•
Switch control voltage
: Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.)
: Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
•
Low insertion loss
: LINS1 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont = 3.0 V/0 V
: LINS2 = 0.40 dB TYP. @ f = 2.0 GHz, Vcont = 3.0 V/0 V
: LINS3 = 0.90 dB MAX. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
: ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, Vcont = 3.0 V/0 V
: ISL2 = 18 dB MIN. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
: Pin (1 dB) = +26.5 dBm TYP. @ f = 1.0 GHz, Vcont = 3.0 V/0 V
•
High isolation
Middle power
•
•
High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
•
•
L-band digital cellular or cordless telephone
PCS, W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number
Package
Marking
G2T
Supplying Form
• Embossed tape 8 mm wide
µPG168TB-E4
6-pin super minimold
• Pin 4, 5, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPG168TB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PG10359EJ02V0DS (2nd edition)
Date Published July 2004 CP(K)
Printed in Japan
The mark shows major revised points.
NEC Compound Semiconductor Devices, Ltd. 2003, 2004
µPG168TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
OUTPUT2
GND
(Top View)
(Top View)
(Bottom View)
1
2
3
4
5
6
1
2
3
6
5
4
1
2
3
6
5
4
6
5
4
1
2
3
OUTPUT1
Vcont1
INPUT
V cont2
TRUTH TABLE
Vcont1
Low
High
Vcont2
High
Low
INPUT−OUTPUT1
INPUT−OUTPUT2
ON
OFF
ON
OFF
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Switch Control Voltage
Input Power
Symbol
Vcont
Pin
Ratings
−6.0 to +6.0Note1
+28
Unit
V
dBm
mW
°C
Power Dissipation
PD
150Note2
Operating Ambient Temperature
Storage Temperature
TA
−45 to +85
−55 to +150
Tstg
°C
Note1. Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C
2. Vcont1 − Vcont2 ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Switch Control Voltage (H)
Switch Control Voltage (L)
Symbol
Vcont (H)
Vcont (L)
MIN.
2.5
TYP.
3.0
0
MAX.
5.3
Unit
V
−0.2
0.2
V
2
Data Sheet PG10359EJ02V0DS
µPG168TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont = 3.0 V/0 V, DC cut capacitors = 51 pF, unless otherwise specified)
Parameter
Insertion Loss 1
Symbol
LINS1
Test Conditions
f = 0.5 to 1.0 GHz
MIN.
−
TYP.
0.30
0.40
−
MAX.
Unit
dB
0.55
Insertion Loss 2
Insertion Loss 3
Isolation 1
LINS2
f = 2.0 GHz
−
0.65
dB
LINS3
f = 2.0 to 2.5 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
f = 0.5 to 2.0 GHz
f = 2.0 to 2.5 GHz
−
0.90
−
dB
ISL1
ISL2
RLin1
RLin2
RLout1
RLout2
22
18
13
11
13
11
+22.0
27
dB
Isolation 2
−
−
dB
Input Return Loss 1
Input Return Loss 2
Output Return Loss 1
Output Return Loss 2
19
−
dB
−
−
dB
19
−
dB
−
−
dB
1 dB Gain Compression
Input PowerNote
Pin (1 dB) f = 1.0 GHz
+26.5
−
dBm
Switch Control Speed
Switch Control Current
tSW
−
−
50
200
10
ns
Icont
0.5
µA
Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont = 3.0 V/0 V, DC cut capacitors = 51 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
0.1 dB Gain Compression
Input PowerNote
Pin (0.1 dB) f = 1.0 GHz
−
+23.0
−
dBm
Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear
range.
Caution This device is used it is necessary to use DC cut capacitors.
The value of DC cut capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system. The range of
recommended DC cut capacitor value is less than 100 pF.
3
Data Sheet PG10359EJ02V0DS
µPG168TB
EVALUATION CIRCUIT (Vcont = 3.0 V/0 V, DC cut capacitors = 51 pF)
V
cont2
INPUT
V
cont1
51 pF
1 000 pF
1 000 pF
6
5
4
1
2
3
51 pF
51 pF
OUTPUT2
OUTPUT1
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PG10359EJ02V0DS
µPG168TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Vcont1
6pin SMM SPDT SW
Vc1
OUTPUT1
OUT 1
C2
C1
C3
INPUT
C1
C1
IN
C2
OUT 2
OUTPUT2
Vc2
Vcont2
USING THE NEC EVALUATION BOARD
Symbol
C1, C2, C3
C4, C5
Values
51 pF
1 000 pF
5
Data Sheet PG10359EJ02V0DS
µPG168TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1 0.1
1.25 0.1
0.1 MIN.
6
Data Sheet PG10359EJ02V0DS
µPG168TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120 30 seconds
: 3 times
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
VPS
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
VP215
WS260
HS350
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Caution Do not use different soldering methods together (except for partial heating).
7
Data Sheet PG10359EJ02V0DS
µPG168TB
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
•
The information in this document is current as of July, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
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and visual equipment, home electronic appliances, machine tools, personal electronic equipment
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
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to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
8
Data Sheet PG10359EJ02V0DS
µPG168TB
SAFETY INFORMATION ON THIS PRODUCT
The product contains gallium arsenide, GaAs.
GaAs vapor and powder are hazardous to human health if inhaled or ingested.
Caution GaAs Products
• Do not destroy or burn the product.
• Do not cut or cleave off any part of the product.
• Do not crush or chemically dissolve the product.
• Do not put the product in the mouth.
Follow related laws and ordinances for disposal. The product should be excluded from general
industrial waste or household garbage.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0406
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