MC100EP223FA [MOTOROLA]

Low Skew Clock Driver, 100E Series, 22 True Output(s), 0 Inverted Output(s), ECL, PQFP64, PLASTIC, TQFP-64;
MC100EP223FA
型号: MC100EP223FA
厂家: MOTOROLA    MOTOROLA
描述:

Low Skew Clock Driver, 100E Series, 22 True Output(s), 0 Inverted Output(s), ECL, PQFP64, PLASTIC, TQFP-64

驱动 逻辑集成电路
文件: 总5页 (文件大小:115K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
The MC100EP223 is a low skew 1–to–22 differential driver, designed  
with clock distribution in mind. It accepts two clock sources into an input  
multiplexer. The selected signal is fanned out to 22 identical differential  
outputs.  
LOW–VOLTAGE  
1:22 DIFFERENTIAL  
PECL/HSTL CLOCK DRIVER  
200ps Part–to–Part Skew  
50ps Output–to–Output Skew  
Differential Design  
Open Emitter HSTL Compatible Outputs  
3.3V V  
CC  
Both PECL and HSTL Inputs  
75kInput Pulldown Resistors  
The EP223 is specifically designed, modeled and produced with low  
skew as the key goal. Optimal design and layout serve to minimize  
gate–to–gate skew within a device, and empirical modeling is used to  
determine process control limits that ensure consistent t distributions  
pd  
from lot to lot. The net result is a dependable, guaranteed low skew  
device.  
FA SUFFIX  
64–LEAD TQFP PACKAGE  
CASE 840F–02  
The EP223 HSTL outputs are not realized in the conventional  
manner. To minimize part–to–part and output–to–output skew, the HSTL  
compatible output levels are generated with an open emitter  
architecture. The outputs are pulled down with 50to ground, rather  
than the typical 50to V  
pullup of a “standard” HSTL output.  
DDQ  
Because the HSTL outputs are pulled to ground, the EP223 does not  
utilize the V supply of the HSTL standard. The output levels are  
DDQ  
derived from V  
.
CC  
In the case of an asynchronous control, there is a chance of  
generating a ‘runt’ clock pulse when the device is enabled/disabled. To  
avoid this, the output enable (OE) is synchronous so that the outputs  
will only be enabled/disabled when they are already in the LOW state.  
To ensure that the tight skew specification is met it is necessary that both sides of the differential output are terminated into  
50, even if only one side is being used. In most applications, all 22 differential pairs will be used and therefore terminated. In  
the case where fewer than 22 pairs are used, it is necessary to terminate at least the output pairs on the same package side as  
the pair(s) being used on that side, in order to maintain minimum skew. Failure to do this will result in small degradations of  
propagation delay (on the order of 10–20ps) of the output(s) being used which, while not being catastrophic to most designs, will  
mean a loss of skew margin.  
This document contains information on a product under development. Motorola reserves the right to change or  
discontinue this product without notice.  
08/99  
REV 1  
Motorola, Inc. 1999  
MC100EP223  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
VCCO  
Q6B  
Q6  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
VCCO  
Q14  
Q14B  
Q15  
Q5B  
Q5  
Q15B  
Q16  
Q4B  
Q4  
Q16B  
Q17  
Q3B  
Q3  
MC100EP223  
Q17B  
Q18  
Q2B  
Q2  
Q18B  
Q19  
Q1B  
Q1  
Q19B  
Q20  
Q0B  
Q0  
Q20B  
VCCO  
VCCO  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
Figure 1. 64–Lead Pinout (Top View)  
CLK_SEL  
PIN NAMES  
Pins  
HSTL_CLK  
0
1
Function  
Differential HSTL Inputs  
HSTL_CLK  
22  
22  
Q0 – Q21  
Q0 – Q21  
HSTL_CLK, HSTL_CLKB  
PECL_CLK, PECL_CLKB Differential PECL Inputs  
Q0:21, Q0B:21B  
CLK_SEL  
OE  
LVPECL_CLK  
LVPECL_CLK  
Differential HSTL Outputs  
Active Clock Select Input  
Output Enable  
Ground  
LEN  
Q
D
OE  
GND  
VCCI  
VCCO  
Core VCC  
I/O VCC  
Figure 2. Logic Symbol  
SIGNAL GROUPS  
FUNCTION  
OE  
CLK_SEL  
Q0:21, Q0B:21B  
Level  
Direction  
Signal  
0
0
1
1
0
1
0
1
Q = Low, QB = High  
Q = Low, QB = High  
HSTL_CLK, HSTL_CLKB  
PECL_CLK, PECL_CLKB  
HSTL  
HSTL  
LVPECL  
LVCMOS/LVTTL  
Input  
Output  
Input  
HSTL_CLK, HSTL_CLKB  
Q0:21, Q0B:21B  
PECL_CLK, PECL_CLKB  
CLK_SEL, OE  
Input  
MOTOROLA  
2
MC100EP223  
HSTL DC CHARACTERISTICS  
0°C  
25°C  
85°C  
Symbol  
Characteristic  
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
Min  
Typ  
Max  
Min  
Typ  
Max  
Min  
Typ  
Max  
Unit  
V
V
V
V
V
V
1.0  
OH  
OL  
IH  
0.4  
1.6  
V
V +0.1  
–0.3  
V
Input LOW Voltage  
V –0.1  
0.9  
V
IL  
Input Crossover Voltage  
0.68  
V
PECL DC CHARACTERISTICS  
0°C  
25°C  
85°C  
Symbol  
Characteristic  
Input HIGH Voltage (Note 1.)  
Input LOW Voltage (Note 1.)  
Input HIGH Current  
Min  
Typ  
Max  
2.420  
1.825  
150  
Min  
Typ  
Max  
2.420  
1.825  
150  
Min  
Typ  
Max  
2.420  
1.825  
150  
Unit  
V
V
V
2.135  
1.490  
2.135  
1.490  
2.135  
1.490  
IH  
V
IL  
I
IH  
µA  
1. These values are for V  
= 3.3V. Level specifications vary 1:1 with V  
.
CC  
CC  
AC CHARACTERISTICS (V  
= GND, V  
=V  
to V  
)
CC(max)  
EE  
CC  
CC(min)  
0°C  
25°C  
85°C  
Symbol  
Characteristic  
Propagation Delay to Output  
Min  
Typ  
Max  
Min  
Typ  
Max  
Min  
Typ  
Max  
Unit  
t
t
,
ns  
PLH  
PHL  
IN (Differential)  
1.0  
1.0  
1.0  
t
Within–Device Skew  
Part–to–Part Skew (Diff)  
50  
200  
50  
200  
50  
200  
ps  
skew  
f
Maximum Input Frequency  
250  
250  
250  
MHz  
mV  
V
max  
V
V
Minimum Input Swing PECL_CLK  
CommonMode Range PECL_CLK  
Output Rise/Fall Time (20–80%)  
600  
600  
600  
PP  
CMR  
t , t  
r f  
300  
600  
300  
600  
300  
600  
ps  
Power Supply Characteristics  
Symbol  
Characteristic  
Min  
Typ  
Max  
Unit  
V
V
CCI  
Core V  
3.0  
1.6  
3.3  
1.8  
3.6  
2.0  
CC  
V
CCO  
I/O V  
V
CC  
I
I
Power Supply Current  
Power Supply Current  
mA  
mA  
CC  
EE  
3
MOTOROLA  
MC100EP223  
OUTLINE DIMENSIONS  
FA SUFFIX  
PLASTIC TQFP PACKAGE  
CASE 840F–02  
ISSUE A  
4X  
4X 16 TIPS  
C2  
0.2 (0.008)  
H
L–M  
N
0.2 (0.008)  
T
L–M  
N
M
0.05 (0.020)  
(W)  
64  
49  
2X R R  
1
48  
1
0.25 (0.010)  
GAUGE PLANE  
–L–  
–M–  
(K)  
V
B
C1  
E
(Z)  
3X  
VIEW Y  
VIEW AA  
B1  
V1  
16  
33  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
17  
32  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE, –H– IS LOCATED AT THE  
BOTTOM OF LEAD AND IS COINCIDENT WITH  
THE LEAD WHERE THE LEAD EXITS THE  
PLASTIC BODY AT THE BOTTOM OF THE  
PARTING LINE.  
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED  
AT DATUM PLANE –H–.  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
–N–  
A1  
S1  
A
S
SEATING PLANE –T–.  
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25  
(0.010) PER SIDE. DIMENSIONS A AND B DO  
INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE –H–.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED 0.35  
(0.014). MINIMUM SPACE BETWEEN  
4X  
(
(
2)  
3)  
C
–H–  
0.08 (0.003)  
T
PROTRUSION AND ADJACENT LEAD OR  
PROTRUSION 0.07 (0.003).  
–T–  
4X  
SEATING  
PLANE  
MILLIMETERS  
MIN MAX  
10.00 BSC  
5.00 BSC  
10.00 BSC  
5.00 BSC  
INCHES  
MIN MAX  
0.394 BSC  
0.197 BSC  
0.394 BSC  
0.197 BSC  
VIEW AA  
DIM  
A
A1  
B
B2  
C
C1  
C2  
D
–––  
0.05  
1.35  
0.17  
0.45  
0.17  
1.60  
–––  
0.002  
0.053  
0.007  
0.018  
0.007  
0.063  
0.15  
1.45  
0.27  
0.75  
0.23  
0.006  
0.057  
0.011  
0.030  
0.009  
BASE METAL  
F
E
F
–X–  
G
G1  
J
K
R1  
S
0.50 BSC  
0.25 BSC  
0.09 0.20  
0.50 REF  
0.10 0.20  
0.020 BSC  
0.010 BSC  
0.004 0.008  
0.020 REF  
0.004 0.008  
X=L, M, N  
U
J
C
L
12.00 BSC  
6.00 BSC  
0.472 BSC  
0.236 BSC  
AB  
AB  
4X  
G1  
S1  
U
PLATING  
D
0.09  
0.16  
0.004  
0.006  
V
12.00 BSC  
6.00 BSC  
0.20 REF  
1.00 REF  
0.472 BSC  
0.236 BSC  
0.008 REF  
0.039 REF  
60X G  
M
S
S
0.08 (0.003)  
T
L–M  
N
V1  
W
Z
VIEW Y  
SECTION AB–AB  
ROTATED 90 CLOCKWISE  
0
0
7
–––  
0
0
7
–––  
1
2
3
12 REF  
12 REF  
12 REF  
12 REF  
MOTOROLA  
4
MC100EP223  
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
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MC100EP223/D  

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