MC100EP223TC [FREESCALE]

Low-Voltage 1:22 Differential PECL/HSTL Clock Driver; 低电压1:22差分PECL / HSTL时钟驱动器


型号：	MC100EP223TC
厂家：	Freescale
描述：	Low-Voltage 1:22 Differential PECL/HSTL Clock Driver 低电压1:22差分PECL / HSTL时钟驱动器时钟驱动器逻辑集成电路
文件：	总8页 (文件大小：87K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SEMICONDUCTOR TECHNICAL DATA

The MC100EP223 is a low skew 1–to–22 differential driver, designed

with clock distribution in mind. It accepts two clock sources into an input

multiplexer. The selected signal is fanned out to 22 identical differential

outputs.

LOW–VOLTAGE

1:22 DIFFERENTIAL

PECL/HSTL CLOCK DRIVER

•

200ps Part–to–Part Skew

50ps Output–to–Output Skew

Differential Design

Open Emitter HSTL Compatible Outputs

3.3V V

Both PECL and HSTL Inputs

75kΩ Input Pulldown Resistors

Thermally Enhanced 64 lead Exposed Pad LQFP

The EP223 is specifically designed, modeled and produced with low

skew as the key goal. Optimal design and layout serve to minimize

gate–to–gate skew within a device, and empirical modeling is used to

determine process control limits that ensure consistent t distributions

from lot to lot. The net result is a dependable, guaranteed low skew

device.

TC SUFFIX

64–LEAD LQFP PACKAGE

CASE 840K–01

The EP223 HSTL outputs are not realized in the conventional

manner. To minimize part–to–part and output–to–output skew, the HSTL

compatible output levels are generated with an open emitter

architecture. The outputs are pulled down with 50Ω to ground, rather

than the typical 50Ω to V

pullup of a “standard” HSTL output.

DDQ

Because the HSTL outputs are pulled to ground, the EP223 does not

utilize the V supply of the HSTL standard. The output levels are

DDQ

derived from V

In the case of an asynchronous control, there is a chance of

generating a ‘runt’ clock pulse when the device is enabled/disabled. To

avoid this, the output enable (OE) is synchronous so that the outputs

will only be enabled/disabled when they are already in the LOW state.

To ensure that the tight skew specification is met it is necessary that both sides of the differential output are terminated into

50Ω, even if only one side is being used. In most applications, all 22 differential pairs will be used and therefore terminated. In

the case where fewer than 22 pairs are used, it is necessary to terminate at least the output pairs on the same package side as

the pair(s) being used on that side, in order to maintain minimum skew. Failure to do this will result in small degradations of

propagation delay (on the order of 10–20ps) of the output(s) being used which, while not being catastrophic to most designs, will

mean a loss of skew margin.

This document contains information on a product under development. Motorola reserves the right to change or

discontinue this product without notice.

03/01

REV 2

Motorola, Inc. 2001

MC100EP223

48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33

VCCO

Q6B

VCCO

Q14

Q14B

Q15

Q5B

Q15B

Q16

Q4B

Q16B

Q17

Q3B

MC100EP223

Q17B

Q18

Q2B

Q18B

Q19

Q1B

Q19B

Q20

Q0B

Q20B

VCCO

10 11 12 13 14 15 16

Figure 1. 64–Lead Pinout (Top View)

CLK_SEL

PIN NAMES

Pins

HSTL_CLK

Function

Differential HSTL Inputs

HSTL_CLK

Q0 – Q21

HSTL_CLK, HSTL_CLKB

PECL_CLK, PECL_CLKB Differential PECL Inputs

Q0:21, Q0B:21B

CLK_SEL

LVPECL_CLK

Differential HSTL Outputs

Active Clock Select Input

Output Enable

Ground

LEN

GND

VCCI

VCCO

Core VCC

I/O VCC

Figure 2. Logic Symbol

SIGNAL GROUPS

FUNCTION

CLK_SEL

Q0:21, Q0B:21B

Level

Direction

Signal

Q = Low, QB = High

HSTL_CLK, HSTL_CLKB

PECL_CLK, PECL_CLKB

HSTL

LVPECL

LVCMOS/LVTTL

Input

Output

Input

HSTL_CLK, HSTL_CLKB

Q0:21, Q0B:21B

PECL_CLK, PECL_CLKB

CLK_SEL, OE

Input

MOTOROLA

TIMING SOLUTIONS

DL207 — Rev 0

MC100EP223

HSTL DC CHARACTERISTICS

0°C

25°C

85°C

Symbol

Characteristic

Output HIGH Voltage

Output LOW Voltage

Input HIGH Voltage

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Unit

1.0

0.4

1.6

V +0.1

–0.3

Input LOW Voltage

V –0.1

0.9

Input Crossover Voltage

0.68

PECL DC CHARACTERISTICS

0°C

25°C

85°C

Symbol

Characteristic

Input HIGH Voltage (Note 1.)

Input LOW Voltage (Note 1.)

Input HIGH Current

Min

Typ

Max

2.420

1.825

150

Min

Typ

Max

2.420

1.825

150

Min

Typ

Max

2.420

1.825

150

Unit

2.135

1.490

2.135

1.490

2.135

1.490

µA

1. These values are for V

= 3.3V. Level specifications vary 1:1 with V

AC CHARACTERISTICS (V

= GND, V

to V

)

CC(max)

CC(min)

0°C

25°C

85°C

Symbol

Characteristic

Propagation Delay to Output

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Unit

PLH

PHL

IN (Differential)

1.0

Within–Device Skew

Part–to–Part Skew (Diff)

200

skew

Maximum Input Frequency

250

MHz

max

Minimum Input Swing PECL_CLK

CommonMode Range PECL_CLK

Output Rise/Fall Time (20–80%)

600

CMR

t , t

r f

300

600

300

600

300

600

Power Supply Characteristics

Symbol

Characteristic

Min

Typ

Max

Unit

CCI

Core V

3.0

1.6

3.3

1.8

3.6

2.0

CCO

I/O V

Power Supply Current

TIMING SOLUTIONS

DL207 — Rev 0

MOTOROLA

MC100EP223

APPLICATIONS INFORMATION

Using the thermally enhanced package of the

Thermal Resistance

MC100EP223

Convection

LFPM

THJB

THJA

THJC

The MC100EP223 uses a thermally enhanced 64 lead

LQFP package. This package provides the low thermal

impedance that supports the power consumption of the

MC100EP223 high-speed bipolar integrated circuit and

eases the power management task for the system design. An

exposed pad at the bottom of the package establishes

thermal conductivity from the package to the printed circuit

board. In order to take advantage of the enhanced thermal

capabilitites of this package, it is recommended to solder the

exposed pad of the package to the printed circuit board. The

attachment process for exposed pad package is the same as

for any standard surface mount package. Vias are

recommended from the pad on the board down to an

appropriate plane in the board that is capable of distributing

the heat. In order to supply enough solder paste to fill those

vias and not starve the solder joints, it may be required to

stencil print solder paste onto the printed circuit pad. This pad

should match the dimensions of the exposed pad. The

dimensions of the exposed pad are shown on the package

outline in this specification. For thermal system analysis and

junction temperature calculation the thermal resistance

parameters of the package is provided:

°C/W

Natural

100

57.1

50.0

46.9

43.4

38.6

24.9

21.3

20.0

18.7

16.9

200

15.8

9.7

400

800

a. Junction to ambient, single layer test board, per JESD51-6

b. Junction to ambient, four conductor layer test board (2S2P),

per JES51-6

c. Junction to case, per MIL-SPEC 883E, method 1012.1

d. Junction to board, four conductor layer test board (2S2P) per

JESD 51-8

It is recommended that users employ thermal modeling

analysis to assist in applying the general recommendations

to their particular application. The exposed pad of the

MC100EP223 package does not have an electrical low

impedance path to the substrate of the integrated circuit and

its terminals.

MOTOROLA

TIMING SOLUTIONS

DL207 — Rev 0

MC100EP223

OUTLINE DIMENSIONS

TC SUFFIX

PLASTIC LQFP PACKAGE, EXPOSED PAD

CASE 840K–01

ISSUE O

4X 16 TIPS

0.2 H A–B D

0.2

A–B D

0.05

(S)

PIN 1

IDENTIFIER

0.25

GAGE PLANE

(L1)

VIEW AA

E1/2

VIEW Y

E/2

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M–1994.

3. DATUMS A, B AND D TO BE DETERMINED AT DATUM

PLANE H.

4. DIMENSIONS D AND E TO BE DETERMINED AT

SEATING PLANE C.

D1/2

5. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED

THE MAXIMUM b DIMENSION BY MORE THAN 0.08 mm.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN

PROTRUSION AND ADJACENT LEAD OR

PROTRUSION 0.07 mm.

6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 mm

PER SIDE. D1 AND E1 ARE MAXIMUM PLASTIC BODY

SIZE DIMENSIONS INCLUDING MOLD MISMATCH.

7. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

D/2

4X Z2

4X Z3

0.08 C

64X b

8. THESE DIMENSIONS APPLY TO THE FLAT SECTION

OF THE LEAD BETWEEN 0.10 mm AND 0.25 mm FROM

THE LEAD TIP.

SEATING

PLANE

VIEW AA

0.08

C A–B D

MILLIMETERS

DIM MIN

MAX

1.60

0.15

1.45

0.27

0.23

0.20

0.16

–––

0.05

1.35

0.17

0.09

12.00 BSC

10.00 BSC

0.50 BSC

X=A, B OR D

e/2

60X e

12.00 BSC

10.00 BSC

BASE METAL

VIEW Y

0.45

0.75

1.00 REF

0.08

0.20

6.00

–––

7.00

–––

PLATING

SECTION AB–AB

ROTATED 90 CLOCKWISE

EXPOSED PAD

VIEW J–J

TIMING SOLUTIONS

DL207 — Rev 0

MOTOROLA

MC100EP223

NOTES

MOTOROLA

TIMING SOLUTIONS

DL207 — Rev 0

MC100EP223

NOTES

TIMING SOLUTIONS

DL207 — Rev 0

MOTOROLA

MC100EP223

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or

guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the

applicationor use of any product or circuit, and specifically disclaims any and all liability, includingwithoutlimitationconsequentialorincidental

damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in differentapplications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application

by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are

not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where

personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application,

BuyershallindemnifyandholdMotorolaanditsofficers, employees, subsidiaries, affiliates, anddistributorsharmlessagainstallclaims, costs,

damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated

with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the

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How to reach us:

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JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1,

P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569

Technical Information Center: 1–800–521–6274

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2, Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong.

852–26668334

HOME PAGE: http://www.motorola.com/semiconductors/

MOTOROLA

TIMING SOLUTIONS

◊

MC100EP223/D

DL207 — Rev 0

MC100EP223TC [FREESCALE]

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