APTGF200SK120D3G [MICROSEMI]

Buck Chopper NPT IGBT Power Module; 降压斩波NPT IGBT功率模块
APTGF200SK120D3G
型号: APTGF200SK120D3G
厂家: Microsemi    Microsemi
描述:

Buck Chopper NPT IGBT Power Module
降压斩波NPT IGBT功率模块

晶体 晶体管 电动机控制 双极性晶体管 栅 局域网
文件: 总5页 (文件大小:212K)
中文:  中文翻译
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APTGF200SK120D3G  
Buck Chopper  
NPT IGBT Power Module  
VCES = 1200V  
IC = 200A @ Tc = 80°C  
Application  
3
AC and DC motor control  
Switched Mode Power Supplies  
Q1  
4
Features  
5
Non Punch Through (NPT) FAST IGBT  
- Low voltage drop  
- Low tail current  
1
- Switching frequency up to 50 kHz  
- Soft recovery parallel diodes  
- Low diode VF  
2
- Low leakage current  
- RBSOA and SCSOA rated  
Kelvin emitter for easy drive  
High level of integration  
M6 power connectors  
Benefits  
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive TC of VCEsat  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VCES  
Collector - Emitter Breakdown Voltage  
1200  
300  
200  
400  
±20  
1400  
V
TC = 25°C  
TC = 80°C  
TC = 25°C  
IC  
Continuous Collector Current  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
V
W
TC = 25°C  
Tj = 125°C  
RBSOA Reverse Bias Safe Operating Area  
400A@1150V  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 - 5  
www.microsemi.com  
APTGF200SK120D3G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
ICES  
Zero Gate Voltage Collector Current  
VGE = 0V, VCE = 1200V  
5
mA  
Tj = 25°C  
3.2  
3.9  
5.8  
3.7  
V
GE = 15V  
VCE(on) Collector Emitter on Voltage  
VGE(th) Gate Threshold Voltage  
V
IC = 200A  
Tj = 125°C  
VGE = VCE , IC = 8 mA  
VGE = 20V, VCE = 0V  
5.2  
6.4  
400  
V
nA  
IGES  
Gate – Emitter Leakage Current  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Cres  
Input Capacitance  
Reverse Transfer Capacitance  
V
GE = 0V, VCE = 25V  
13  
1
nF  
f = 1MHz  
VGE=±15V, IC=200A  
VCE=600V  
QG  
Gate charge  
2.1  
µC  
Inductive Switching (25°C)  
Td(on)  
Tr  
Turn-on Delay Time  
Rise Time  
100  
60  
V
GE = ±15V  
ns  
VBus = 600V  
IC = 200A  
RG = 4.7Ω  
Td(off) Turn-off Delay Time  
530  
Tf  
Fall Time  
30  
Inductive Switching (125°C)  
Td(on)  
Tr  
Turn-on Delay Time  
Rise Time  
110  
70  
V
GE = ±15V  
ns  
VBus = 600V  
IC = 200A  
RG = 4.7Ω  
Td(off) Turn-off Delay Time  
550  
40  
Tf  
Fall Time  
V
GE = ±15V  
Eon  
Turn On Energy  
Tj = 125°C  
Tj = 125°C  
19  
15  
VBus = 600V  
IC = 200A  
RG = 4.7Ω  
mJ  
A
Eoff  
Isc  
Turn Off Energy  
Short Circuit data  
V
GE 15V ; VBus = 900V  
1300  
tp 10µs ; Tj = 125°C  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
VRRM  
1200  
V
Tj = 25°C  
750  
IRRM  
VR=1200V  
IF = 200A  
µA  
Tj = 125°C  
1000  
IF  
DC Forward Current  
Tc = 80°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
200  
2.1  
1.9  
A
V
VF  
Diode Forward Voltage  
100  
trr  
Reverse Recovery Time  
ns  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
200  
14  
IF = 200A  
VR = 600V  
di/dt =3000A/µs  
Qrr  
Err  
Reverse Recovery Charge  
Reverse Recovery Energy  
µC  
mJ  
40  
5.2  
11.2  
2 - 5  
www.microsemi.com  
APTGF200SK120D3G  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.09  
0.16  
°C/W  
RthJC  
Junction to Case Thermal Resistance  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
TJ  
TSTG  
TC  
2500  
-40  
-40  
-40  
3
V
150  
125  
125  
5
5
350  
°C  
Operating Case Temperature  
For terminals  
To Heatsink  
M6  
M6  
Torque Mounting torque  
N.m  
g
3
Wt  
Package Weight  
D3 Package outline (dimensions in mm)  
1°  
A
DÉTAIL A  
3 - 5  
www.microsemi.com  
APTGF200SK120D3G  
Typical Performance Curve  
Output Characteristics (VGE=15V)  
Output Characteristics  
400  
400  
300  
200  
100  
0
TJ = 125°C  
VGE=15V  
VGE=20V  
TJ=25°C  
300  
200  
100  
0
VGE=12V  
VGE=9V  
TJ=125°C  
0
1
2
3
4
5
6
0
1
2
3
CE (V)  
4
5
6
VCE (V)  
V
Energy losses vs Collector Current  
Transfert Characteristics  
400  
300  
200  
100  
0
60  
50  
40  
30  
20  
10  
0
VCE = 600V  
VGE = 15V  
RG = 4.7  
TJ = 125°C  
Eon  
TJ=125°C  
Eoff  
TJ=25°C  
Err  
0
100  
200  
300  
400  
5
6
7
8
9
10  
11  
12  
IC (A)  
VGE (V)  
Switching Energy Losses vs Gate Resistance  
Reverse Bias Safe Operating Area  
100  
500  
VCE = 600V  
VGE =15V  
IC = 200A  
TJ = 125°C  
Eon  
80  
60  
40  
20  
0
400  
300  
200  
100  
0
Eoff  
VGE=15V  
TJ=125°C  
RG=4.7 Ω  
Err  
0
300  
600  
900  
CE (V)  
1200  
1500  
0
5
10  
15  
20  
25  
30  
35  
Gate Resistance (ohms)  
V
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.1  
0.08  
0.06  
0.04  
0.02  
0
IGBT  
0.9  
0.7  
0.5  
0.3  
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
4 - 5  
www.microsemi.com  
APTGF200SK120D3G  
Operating Frequency vs Collector Current  
Forward Characteristic of diode  
400  
70  
60  
50  
40  
30  
20  
10  
0
VCE=600V  
D=50%  
RG=4.7  
300  
TJ=125°C  
ZVS  
TJ=125°C  
TC=75°C  
200  
ZCS  
TJ=25°C  
100  
hard  
switching  
0
0
0.5  
1
1.5  
2
2.5  
3
0
50  
100  
IC (A)  
150  
200  
250  
VF (V)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.18  
0.16  
0.14  
0.12  
0.1  
Diode  
0.9  
0.7  
0.5  
0.3  
0.08  
0.06  
0.04  
0.02  
0
0.1  
Single Pulse  
0.05  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103  
5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262  
and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
5 - 5  
www.microsemi.com  

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