TC12653.3VAT [MICROCHIP]
3.3 V FIXED POSITIVE LDO REGULATOR, 1.3 V DROPOUT, PSFM5, TO-220, 5 PIN;
| 型号： | TC12653.3VAT |
| 厂家： | 
MICROCHIP |
| 描述： | 3.3 V FIXED POSITIVE LDO REGULATOR, 1.3 V DROPOUT, PSFM5, TO-220, 5 PIN 局域网 输出元件 调节器 |
| 文件： | 总18页 (文件大小：846K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1265
800 mA Fixed-Output CMOS LDO with Shutdown
Features
Description
• Very Low Dropout Voltage
The TC1265 is a fixed-output, high-accuracy (typically
±0.5%) CMOS low dropout regulator. Designed
specifically for battery-operated systems, the TC1265’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80 µA at full load (20 to 60 times lower than
in bipolar regulators).
• 800 mA Output Current
• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Overcurrent and Overtemperature Protection
• SHDN Input for Active Power Management
• ERROR Output Can Be Used as a Low Battery
Detector (SOIC only)
Key features of the TC1265 include ultra low noise
operation, very low dropout voltage (typically 450 mV
at full load) and fast response to step changes in load.
Applications
The TC1265 incorporates both overtemperature and
overcurrent protection. The TC1265 is stable with an
output capacitor of only 1 µF and has a maximum
output current of 800 mA. It is available in 8-Pin SOIC,
5-Pin TO-220 and 5-Pin DDPAK packages.
• Battery-operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
Package Type
5-Pin TO-220
5-Pin DDPAK
Front View
Tab Is GND
Tab Is GND
Typical Application
TC1265
TC1265
VOUT
VOUT
VIN
VIN
+
C1
1 µF
TC1265
1
2
3
4
5
3
2
5
4
1
GND
SHDN
SHDN
8-Pin SOIC
V
V
1
2
8
OUT
IN
GND
NC
NC
TC12657
6
SHDN
ERROR
3
4
BYPASS
5
© 2006 Microchip Technology Inc.
DS21376D-page 1
TC1265
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage .........................................................6.5V
Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 7)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range...... -40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Operating Voltage
Maximum Output Current
Output Voltage
VIN
2.7
—
—
6.0
V
mA
V
Note 2
IOUTMAX
VOUT
800
—
VR – 2.5% VR ± 0.5% VR + 2.5%
VR – 2% VR ± 0.5% VR + 3%
VR ≥ 2.5V
VR = 1.8V
VOUT Temperature Coefficient
Line Regulation
ΔVOUT/ΔT
ΔVOUT/ΔVIN
ΔVOUT/VOUT
VIN–VOUT
—
—
40
0.007
0.002
20
—
0.35
+0.01
30
ppm/°C Note 3
%
(VR + 1V) ≤ VIN ≤ 6V
Load Regulation (Note 4)
Dropout Voltage (Note 5)
-0.01
—
%/mA IL = 0.1 mA to IOUTMAX
mV
VR ≥ 2.5V, IL = 100 µA
VR ≥ 2.5V, IL = 100 mA
VR ≥ 2.5V, IL = 300 mA
VR ≥ 2.5V, IL = 500 mA
VR ≥ 2.5V, IL = 800 mA
VR = 1.8V, IL = 500 mA
IL = 800 mA
—
50
160
480
800
1300
1200
1400
130
1
—
150
260
450
1000
1200
80
—
—
—
—
Supply Current
IDD
ISHDN
—
µA
µA
SHDN = VIH, IL = 0
SHDN = 0V
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
—
0.05
64
PSRR
IOUTSC
ΔVOUT/ΔPD
eN
—
—
db
F ≤ 1 kHz
—
1200
0.04
260
1400
—
mA
V/W
VOUT = 0V
—
Note 6
Output Noise
—
—
nV/√Hz IL = IOUTMAX, F = 10 kHZ
Note 1: VR is the regulator output voltage setting.
2: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX
.
(VOUTMAX – VOUTMIN) – 106
3:
TCVOUT = -------------------------------------------------------------------------
VOUT × ΔT
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects
are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value
measured at a 1.5V differential.
6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper-
ature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipa-
tion causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.
8: Hysteresis voltage is referenced to VR.
DS21376D-page 2
© 2006 Microchip Technology Inc.
TC1265
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
SHDN Input
Sym
Min
Typ
Max
Units
Conditions
SHDN Input High Threshold
SHDN Input Low Threshold
ERROR Output (SOIC Only)
Minimum Operating Voltage
Output Logic Low Voltage
ERROR Threshold Voltage
ERROR Positive Hysteresis
VIH
VIL
45
—
—
—
%VIN
%VIN
—
15
VMIN
VOL
1.0
—
—
—
—
—
—
400
—
V
mV
V
1 mA Flows to ERROR
VTH
0.95 x VR
50
VHYS
—
mV
Note 8
Note 1: VR is the regulator output voltage setting.
2: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX
.
(VOUTMAX – VOUTMIN) – 106
3:
TCVOUT = -------------------------------------------------------------------------
VOUT × ΔT
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects
are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value
measured at a 1.5V differential.
6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper-
ature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipa-
tion causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.
8: Hysteresis voltage is referenced to VR.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C.
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 5L-DDPAK
Thermal Resistance, 5L-TO-220
Thermal Resistance, 8L-SOIC
TA
TJ
TA
-40
-40
-65
—
—
—
+125
+125
+150
°C
°C
°C
(Note 1)
θJA
θJA
θJA
—
—
—
57
71
—
—
—
°C/W
°C/W
°C/W
163
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).
© 2006 Microchip Technology Inc.
DS21376D-page 3
TC1265
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
.
020
150
135
0
.
018
0
.
016
014
012
120
105
90
0
0
.
.
V
= 3V
OUT
0
0
.
010
008
75
.
60
0
.
006
45
0
.
004
30
0
.
002
15
0
0
.
000
-
40
°C
0
°C
25°C
70°
C
85°
C
125
°
C
-40°C 0°C
25°C 70°C 85°C 125°C
TEMPERATURE (°C)
TE
M
PERA
TUR
E (°C)
FIGURE 2-1:
Line Regulation vs.
FIGURE 2-4:
I
vs. Temperature.
DD
Temperature.
0.600
0.550
0.500
0.450
0.400
10.0
125°C
85
70
25
°C
R
C
= 50Ω
LOAD
= 1
µ
F
OUT
°
C
°
C
1.0
0.350
0.300
0.250
0.200
0.150
0.100
0.050
0.000
0°C
0.1
0.0
-40°C
400 500 600 700 800
(mA)
0
100
200 300
I
0.01
10
FREQUENCY (kHz)
0.01
1
100
1000
LOAD
FIGURE 2-5:
3.0V Dropout Voltage vs.
FIGURE 2-2:
Output Noise vs. Frequency.
I
.
LOAD
0.0100
0.0090
0.0080
0.0070
0.0060
0.0050
0.0040
0.0030
3.030
I
=
0
.
1
m
A
LOAD
3
3
.
020
010
000
.
3
.
I
=
=
300
500
m
m
A
A
LOAD
LOAD
2
2
.
990
980
.
.
.
.
I
V
= 3V
OUT
1 mA to 800 mA
2
2
2
970
960
950
I
=
800mA
LOAD
0.0020
0.0010
0.0100
2
2
2
.
940
930
920
.
.
-40°C
-
40
°C
0
°C
25°C
70°C
85°C 125°C
0°C
25°C 70°C
85°C 125°C
TEMPERATURE (°C)
TEM
PERA
T
UR
E (°C)
FIGURE 2-3:
Load Regulation vs.
FIGURE 2-6:
3.0V V
vs.Temperature.
OUT
Temperature.
DS21376D-page 4
© 2006 Microchip Technology Inc.
TC1265
2.0
TYPICAL PERFORMANCE CURVES (CONT)
0.090
0.080
0.070
0.060
0.050
0.040
0.030
0.020
0.010
0.000
-40°C 0°C
25°C 70°C
85°C 125°C
TEMPERATURE (°C)
FIGURE 2-1:
I
vs. Temperature.
SHDN
© 2006 Microchip Technology Inc.
DS21376D-page 5
TC1265
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Pin No.
(8-Pin SOIC)
(5-Pin DDPAK)
(5-Pin TO-220)
Symbol
Description
1
2
3
4
5
6
7
8
5
3
VOUT
GND
NC
Regulated voltage output
Ground terminal
No connect
—
1
BYPASS Reference bypass input
ERROR Out-of-Regulation Flag (open-drain output)
—
2
SHDN
NC
Shutdown control input
No connect
—
4
VIN
Unregulated supply input
3.1
Regulated Output Voltage (VOUT
)
3.4
Out-of-Regulation Flag (ERROR)
Regulated voltage output.
Out-of-regulation flag (open-drain output). This output
goes low when VOUT is out-of-tolerance by
approximately -5%.
3.2
Ground (GND)
Ground terminal.
3.5
Shutdown Control (SHDN)
Shutdown control input. The regulator is fully enabled
when a logic-high is applied to this input. The regulator
enters shutdown when a logic-low is applied to this
input. During shutdown, the output voltage falls to zero
and the supply current is reduced to 0.05 µA (typical).
3.3
Reference Bypass (BYPASS)
Reference bypass input. Connecting a 470 pF to this
input further reduces output noise.
3.6
Unregulated Supply (VIN)
Unregulated supply input.
DS21376D-page 6
© 2006 Microchip Technology Inc.
TC1265
4.2
ERROR Output
4.0
DETAILED DESCRIPTION
ERROR is driven low whenever VOUT falls out of
regulation by more than – 5% (typ.). This condition may
be caused by low input voltage, output current limiting,
or thermal limiting. The ERROR threshold is 5% below
rated VOUT regardless of the programmed output
voltage value (e.g., ERROR = VOL at 4.75V (typ.) for a
5.0V regulator and 2.85V (typ.) for a 3.0V regulator).
ERROR output operation is shown in Figure 4-2.
The TC1265 is a precision, fixed-output LDO. Unlike
bipolar regulators, the TC1265’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0 mA to ILOADMAX load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 4-1 shows a typical application circuit.
Note that ERROR is active when VOUT is at or below
VTH and inactive when VOUT is above VTH + VH.
V
V
V
OUT
IN
OUT
As shown in Figure 4-1, ERROR can be used as a
battery low flag or as a processor RESET signal (with
the addition of timing capacitor C3). R1 x C3 should be
chosen to maintain ERROR below VIH of the processor
RESET input for at least 200 ms to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
VOUT, VIN or any other voltage less than (VIN + 0.3V).
+
+
1 µF
2
1 µF
1
+
C
C
TC1265
Battery
GND
+
V
SHDN
ERROR
R
1
Shutdown Control
(to CMOS Logic or Tie
1 M
C
Required Only
BATTLOW
or RESET
to V , if unused)
3
IN
V
if ERROR is used as a
Processor RESET Signal
(See Text)
OUT
+
0.2 µF
C
3
Hysteresis (V )
H
V
TH
FIGURE 4-1:
Typical Application Circuit.
ERROR
V
IH
4.1
Output Capacitor
V
OL
A 1 µF (min.) capacitor from VOUT to ground is
required. The output capacitor should have an Effective
Series Resistance (ESR) greater than 0.1Ω and less
than 5Ω. A 1 µF capacitor should be connected from
VIN to GND if there is more than 10 inches of wire
between the regulator and the AC filter capacitor, or if a
battery is used as the power source. Aluminum electro-
lytic or tantalum capacitor types can be used. Since
many aluminum electrolytic capacitors freeze at
FIGURE 4-2:
ERROR Output Operation.
approximately
-30°C,
solid
tantalums
are
recommended for applications operating below -25°C.
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors, and by employing passive filtering
techniques.
© 2006 Microchip Technology Inc.
DS21376D-page 7
TC1265
TABLE 5-2:
THERMAL RESISTANCE
GUIDELINES FOR TC1265 IN
5-PIN DDPAK/TO-220
PACKAGE
5.0
5.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
Copper
Area
(Topside)*
Copper
Area
Thermal
Resistance
Board
Area
(Backside)
(θ
)
JA
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
125 sq mm 2500 sq mm 2500 sq mm
* Tab of device attached to top-side copper
25°C/W
27°C/W
35°C/W
5.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input voltage, output voltage and
output current. The following equation is used to
calculate worst-case actual power dissipation:
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
EQUATION 5-1:
Given:
PD = (VINMAX – VOUTMIN)ILOADMAX
VINMAX = 3.3V ± 10%
VOUTMIN = 2.7V ± 0.5%
ILOADMAX = 275 mA
TJMAX = 125°C
Where:
PD = Worst-case actual power dissipation
= Maximum voltage on VIN
VINMAX
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
TAMAX = 95°C
θJA = 60°C/W (SOIC)
The
maximum
allowable
power
dissipation
Find:
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (θJA).
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
PD = (3.3 × 1.1) – (2.7 × .995)275 × 10–3
PD = 260 mW
EQUATION 5-2:
TJMAX – TAMAX
PDMAX = --------------------------------------
θJA
Where:
PD = Worst-case actual power dissipation
Maximum allowable power dissipation:
= Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
VINMAX
TJMAX – TAMAX
PDMAX = --------------------------------------
θJA
(125 – 95)
PDMAX = -------------------------
60
Table 5-1 and Table 5-2 show various values of θJA for
the TC1265 package types.
PDMAX = 500 mW
In this example, the TC1265 dissipates a maximum of
260 mW, below the allowable limit of 500 mW. In a
similar manner, Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 500 mW into Equation 5-1, from
which VINMAX = 4.6V.
TABLE 5-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1265 IN
8-PIN SOIC PACKAGE
Copper
Area
(Topside)*
Copper
Area
(Backside)
Thermal
Resistance
Board
Area
(θJA)
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
60°C/W
60°C/W
68°C/W
74°C/W
225 sq mm
100 sq mm
2500 sq mm 2500 sq mm
2500 sq mm 2500 sq mm
* Pin 2 is ground. Device is mounted on the top-side.
DS21376D-page 8
© 2006 Microchip Technology Inc.
TC1265
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Lead DDPAK
Example
XXXXXXXXX
XXXXXXXXX
YYWWNNN
TC1265
3.3VET
0642256
5-Lead TO-220
Example:
TC1265
3.3VAT^
0642256
XXXXXXXXX
XXXXXXXXX
YYWWNNN
e
3
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
1265-33V
e
3
OA^0642
NNN
256
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
DS21376D-page 9
TC1265
5-Lead Plastic (ET) (DDPAK) )
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
L3
E1
D2
D
D1
1
e
b
BOTTOM VIEW
α
TOP VIEW
(5X)
c2
A
Φ
A1
c
L
Units
Dimension Limits
INCHES
NOM
*
MILLIMETERS
MIN
MAX
MIN
NOM
5
MAX
Number of Pins
Pitch
5
e
.067 BSC
1.70 BSC
4.50
Overall Height
Standoff
A
A1
E
.170
.000
.385
.177
.005
.398
.183
4.32
0.00
9.78
4.65
§
.010
.410
0.13
0.25
Overall Width
10.11
6.50 REF
8.89
10.41
Exposed Pad Width
Molded Package Length
Overall Length
Exposed Pad Length
Lead Thickness
Pad Thickness
Lead Width
E1
D
.256 REF
.330
.549
.350
.577
.370
.605
8.38
9.40
D1
D2
c
13.94
14.66
7.75 REF
0.51
15.37
.303 REF
.014
.045
.026
.068
.045
--
.020
--
.026
.055
.037
.110
.067
0.36
1.14
0.66
1.73
1.14
--
0.66
1.40
0.94
2.79
1.70
c2
b
--
.032
.089
--
0.81
Foot Length
L
2.26
Pad Length
L3
Φ
α
--
Foot Angle
--
8°
7°
--
8°
7°
Mold Draft Angle
3°
--
3°
--
*
Controlling Parameter
§
Significant Characteristic
Notes:
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: TO-252
Drawing No. C04-012
Revised 07-19-05
DS21376D-page 10
© 2006 Microchip Technology Inc.
TC1265
5-Lead Plastic Transistor Outline (AT) (TO-220)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
L
H1
Q
β
e3
e1
E
e
EJECTOR PIN
ØP
(5°)
α
C1
A
J1
F
D
Units
e
INCHES
MIN
.060
.263
.030
.160
.385
.560
.234
.045
.103
.146
.540
.090
.014
.025
3°
*
MILLIMETERS
MIN
Dimension Limits
MAX
.072
.273
.040
.190
.415
.590
.258
.055
.113
.156
.560
.115
.022
.040
7°
MAX
1.83
6.93
1.02
4.83
10.54
14.99
6.55
1.40
2.87
3.96
14.22
2.92
0.56
1.02
7°
Lead Pitch
1.52
Overall Lead Centers
Space Between Leads
Overall Height
e1
e3
A
6.68
0.76
4.06
Overall Width
E
9.78
Overall Length
D
14.22
5.94
Flag Length
H1
F
Flag Thickness
Through Hole Center
Through Hole Diameter
Lead Length
1.14
Q
P
2.62
3.71
L
J1
C1
β
13.72
2.29
Base to Bottom of Lead
Lead Thickness
Lead Width
0.36
0.64
α
Mold Draft Angle
3°
*
Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.
JEDEC equivalent: TO-220
Drawing No. C04-036
Revised 08-01-05
© 2006 Microchip Technology Inc.
DS21376D-page 11
TC1265
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
8
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
.050
1.27
Overall Height
A
.053
.061
.056
.007
.237
.154
.193
.015
.025
4
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21376D-page 12
© 2006 Microchip Technology Inc.
TC1265
APPENDIX A: REVISION HISTORY
Revision D (October 2006)
• Section 1.0 “Electrical Characteristics”:
Changed dropout voltage voltage typical value for
IL = 500 mA from 700 to 1000 and maximum
value from 1000 to 1200 for. Changed typical
value for IL = 800 mA from 890 to 1200
• Section 6.0 “Packaging Information”: Added
pb-free symbol to package marking information
• Added disclaimer to package outline drawings
• Updated package outline drawings as needed
• Added Appendix A - Revision History
Revision C (October 2004)
• Not Documented
Revision B (May 2002)
• Not Documented
Revision A (March 2002)
• Original Release of this Document.
© 2006 Microchip Technology Inc.
DS21376D-page 13
TC1265
NOTES:
DS21376D-page 14
© 2006 Microchip Technology Inc.
TC1265
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X.XX
XX
XX
a)
b)
c)
d)
TC1265-1.8VAT
1.8V LDO, TO-220-5 pkg.
2.5V LDO, TO-220-5 pkg.
3.0V LDO, TO-220-5 pkg.
3.3V LDO, TO-220-5 pkg.
Voltage
Option
Package
Tape and
Reel
TC1265-2.5VAT
TC1265-3.0VAT
TC1265-3.3VAT
a)
b)
TC1265-1.8VETTR 1.8V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1265-2.5VETTR 2.5V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1265-3.0VETTR 3.0V LDO, DDPAK-5 pkg.,
Tape and Reel
TC1265-3.3VETTR 3.3V LDO, DDPAK-5 pkg.,
Tape and Reel
Device
TC1265 Fixed Output CMOS LDO with Shutdown
Voltage Option:*
1.8V
2.5V
3.0V
3.3V
=
=
=
=
1.8V
2.5V
3.0V
3.3V
c)
d)
* Other output voltages are available. Please contact your local
Microchip sales office for details.
a)
b)
TC1265-1.8VOA
1.8V LDO, SOIC-8 pkg.
TC1265-1.8VOATR 1.8V LDO, SOIC-8 pkg.,
Tape and Reel
Package
AT
=
=
=
Plastic (TO-220), 5-Lead
c)
d)
TC1265-2.5VOA
2.5V LDO, SOIC-8 pkg.
ET
Plastic Transistor Outline (DDPAK), 5-Lead
Plastic Transistor Outline (DDPAK), 5-Lead,
Tape and Reel
TC1265-2.5VOATR 2.5V LDO, SOIC-8 pkg.,
Tape and Reel
ETTR
OA
OATR
=
=
Plastic SOIC, (150 mil Body), 8-lead
Plastic SOIC, (150 mil Body), 8-lead,
Tape and Reel
e)
f)
TC1265-3.0VOA
3.0V LDO, SOIC-8 pkg.
TC1265-3.0VOATR 3.0V LDO, SOIC-8 pkg.,
Tape and Reel
g)
h)
TC1265-3.3VOA
TC1265-3.3VOATR 3.3V LDO, SOIC-8 pkg.,
Tape and Reel
3.3V LDO, SOIC-8 pkg.
© 2006 Microchip Technology Inc.
DS21376D-page 15
TC1265
NOTES:
DS21376D-page 16
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs,
microperipherals, nonvolatile memory and analog products. In addition,
Microchip’s quality system for the design and manufacture of
development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21376D-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
10/19/06
DS21376D-page 18
© 2006 Microchip Technology Inc.
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