IXTK21N100 [IXYS]
High Voltage MegaMOSTMFETs; 高压MegaMOSTMFETs型号: | IXTK21N100 |
厂家: | IXYS CORPORATION |
描述: | High Voltage MegaMOSTMFETs |
文件: | 总4页 (文件大小:140K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IXTK 21N100 VDSS = 1000 V
IXTN 21N100 ID25 = 21 A
High Voltage
MegaMOSTMFETs
RDS(on) = 0.55 Ω
N-Channel,EnhancementMode
TO-264 AA (IXTK)
Symbol
Test Conditions
MaximumRatings
IXTK
IXTN
VDSS
VDGR
TJ = 25°C to 150°C
1000
1000
1000
1000
V
V
G
D(TAB)
D
S
TJ = 25°C to 150°C; RGS = 1 MΩ
VGS
Continuous
Transient
±20
±30
±20
±30
V
V
miniBLOC, SOT-227 B
E153432
VGSM
S
ID25
IDM
TC = 25°C, Chip capability
21
84
21
84
A
A
G
D
TC = 25°C, pulse width limited by TJM
PD
TC = 25°C
500
520
W
G
S
TJ
-55 ... +150
150
-55 ... +150
300
°C
°C
°C
S
D
TJM
Tstg
S
G = Gate
S = Source
D = Drain
TAB = Drain
TL
1.6 mm (0.063 in) from case for 10 s
-
°C
Either Source terminal at miniBLOC can be used
as Main or Kelvin Source
VISOL
50/60Hz, RMS
ISOL ≤ 1 mA
t = 1 min
t = 1 s
-
-
2500
3000
V~
V~
I
Md
Mountingtorque
Terminalconnectiontorque
0.9/6
-
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
Features
Internationalstandardpackages
JEDECTO-264,epoxymeetUL94V-0
flammabilityclassification
Weight
10
30
g
miniBLOC,(ISOTOP-compatible)with
Aluminiumnitrideisolation
Low RDS (on) HDMOSTM process
Rugged polysilicon gate cell structure
Lowpackageinductance
Applications
Symbol
Test Conditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
DC-DC converters
Synchronousrectification
Batterychargers
Switched-modeandresonant-mode
powersupplies
DC choppers
VDSS
VGS = 0 V, ID = 6 mA
1000
2
V
V
VGH(th)
VDS = VGS, ID = 500 µA
4.5
IGSS
IDSS
VGS = ±20 VDC, VDS = 0
±200 nA
500 µA
Temperatureandlightingcontrols
VDS = 0.8 • VDSS
VGS = 0 V
TJ = 25°C
TJ = 125°C
Advantages
2
mA
Easy to mount
Space savings
Highpowerdensity
RDS(on)
VGS = 10 V, ID = 0.5 • ID25
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
0.55
Ω
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
92808I(5/97)
1 - 4
IXTK 21N100
IXTN 21N100
Symbol
gfs
Test Conditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
TO-264 AA Outline
VDS = 10 V; ID = 0.5 • ID25, pulse test
24
S
Ciss
Coss
Crss
8400
630
pF
pF
pF
VGS = 0 V, VDS = 25 V, f = 1 MHz
110
td(on)
tr
td(off)
tf
30
50
ns
ns
ns
ns
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 1 Ω (External),
100
40
Dim.
Millimeter
Min. Max.
Inches
Min.
Max.
A
A1
A2
b
b1
b2
4.82
2.54
2.00
5.13
2.89
2.10
.190
.100
.079
.202
.114
.083
Qg(on)
Qgs
250
60
nC
nC
nC
1.12
2.39
2.90
1.42
2.69
3.09
.044
.094
.114
.056
.106
.122
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
100
c
0.53
0.83
.021
1.020
.780
.033
1.030
.786
D
E
e
25.91 26.16
19.81 19.96
5.46 BSC
RthJC
RthCK
TO-264AA
TO-264AA
0.25 K/W
K/W
.215 BSC
0.15
0.05
J
0.00
0.00
0.25
0.25
.000
.000
.010
.010
K
L
L1
P
20.32 20.83
.800
.090
.820
.102
RthJC
RthCK
miniBLOC, SOT-227 B
miniBLOC, SOT-227 B
0.24 K/W
K/W
2.29
2.59
3.17
3.66
.125
.144
Q
Q1
6.07
8.38
6.27
8.69
.239
.330
.247
.342
R
R1
3.81
1.78
4.32
2.29
.150
.070
.170
.090
S
T
6.04
1.57
6.30
1.83
.238
.062
.248
.072
Source-Drain Diode
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Symbol
IS
Test Conditions
miniBLOC, SOT-227 B
VGS = 0 V
21
84
A
A
V
ISM
Repetitive; pulse width limited by TJM
VSD
IF = IS, VGS = 0 V,
1.5
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
trr
IRM
1000
20
ns
A
IF = IS, -di/dt = 100 A/µs, VR = 100 V
M4 screws (4x) supplied
Dim.
Millimeter
Inches
Min.
Max.
Min.
Max.
A
B
31.50
7.80
31.88
8.20
1.240
0.307
1.255
0.323
C
D
4.09
4.09
4.29
4.29
0.161
0.161
0.169
0.169
E
F
4.09
14.91
4.29
15.11
0.161
0.587
0.169
0.595
G
H
30.12
38.00
30.30
38.23
1.186
1.496
1.193
1.505
J
K
11.68
8.92
12.22
9.60
0.460
0.351
0.481
0.378
L
M
0.76
12.60
0.84
12.85
0.030
0.496
0.033
0.506
N
O
25.15
1.98
25.42
2.13
0.990
0.078
1.001
0.084
P
Q
4.95
26.54
5.97
26.90
0.195
1.045
0.235
1.059
R
S
3.94
4.72
4.42
4.85
0.155
0.186
0.174
0.191
T
U
24.59
-0.05
25.07
0.1
0.968
-0.002
0.987
0.004
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
© 2000 IXYS All rights reserved
2 - 4
4,835,592
4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,486,715
5,381,025
IXTK 21N100
IXTN 21N100
Fig. 1 OutputCharacteristics
Fig. 2 InputAdmittance
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
TJ = 25°C
V
GS = 10V
6V
TJ = 25°C
5V
0
0
0
5
10
15
20
0
1
2
3
4
5
6
7
8
9
10
VDS - Volts
VGS - Volts
Fig. 3 RDS(on) vs. Drain Current
Fig. 4 TemperatureDependence
of Drain to Source Resistance
1.5
1.4
1.3
1.2
1.1
1.0
0.9
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
TJ = 25°C
VGS = 10V
VGS = 15V
ID = 12A
0
5
10 15 20 25 30 35 40 45 50
ID - Amperes
-50 -25
0
25 50 75 100 125 150
TJ - Degrees C
Fig. 5 Drain Current vs.
CaseTemperature
Fig. 6 TemperatureDependenceof
BreakdownandThresholdVoltage
25
20
15
10
5
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
VGS(th)
BVDSS
0
-50 -25
0
25 50 75 100 125 150
TC - Degrees C
-50 -25
0
25 50 75 100 125 150
TJ - Degrees C
© 2000 IXYS All rights reserved
3 - 4
IXTK 21N100
IXTN 21N100
Fig.7 Gate Charge Characteristic Curve
Fig.8 CapacitanceCurves
10
9
8
7
6
5
4
3
2
1
0
9000
8000
7000
6000
5000
4000
3000
2000
1000
0
Ciss
VDS = 500V
ID = 12A
IG = 10mA
f = 1 MHz
VDS = 25V
Coss
Crss
0
50
100
150
200
250
300
0
5
10
15
20
Gate Charge - nCoulombs
VDS - Volts
Fig.9 Source Current vs. Source
to Drain Voltage
40
35
30
25
20
15
10
5
TJ = 125°C
TJ = 25°C
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
VSD - Volts
Fig.10 TransientThermalImpedance
1
0.1
D=0.5
D=0.2
D=0.1
D=0.05
D=0.02
0.01
D = Duty Cycle
D=0.01
Single pulse
0.001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2000 IXYS All rights reserved
4 - 4
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