ISL59830IAZ-T7 [INTERSIL]

True Single Supply Video Driver; 真正的单电源视频驱动器
ISL59830IAZ-T7
型号: ISL59830IAZ-T7
厂家: Intersil    Intersil
描述:

True Single Supply Video Driver
真正的单电源视频驱动器

驱动器
文件: 总14页 (文件大小:327K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ISL59830  
®
Data Sheet  
May 4, 2006  
FN7489.6  
True Single Supply Video Driver  
Features  
The ISL59830 is a revolutionary device that allows true single-  
supply operation of video amplifiers. The device runs off a  
single 3.3V supply and generates the required negative  
voltage internally. This allows for DC-accurate coupling of  
video onto a 75Ω double-terminated line. Since the buffers  
have an integrated 6dB gain, no external gain setting resistors  
are required. An input reference voltage can be supplied to  
shift the analog video level down by an amount equal to the  
reference (typically 0.6V).  
• Triple single-supply buffer  
• Operates from single +3.3V supply  
• No output DC blocking capacitor needed  
• Fixed gain of 2 output buffer  
• Output three-statable  
• Enable/disable function  
• 50MHz 0.1dB bandwidth  
Ordering Information  
• 200MHz -3dB bandwidth  
PART  
TAPE &  
PKG.  
• Pb-free plus anneal available (RoHS compliant)  
PART NUMBER MARKING REEL  
PACKAGE DWG. #  
Applications  
ISL59830IA  
59830IA  
59830IA  
-
7”  
13”  
-
16 Ld QSOP M16.15A  
16 Ld QSOP M16.15A  
16 Ld QSOP M16.15A  
• Driving video  
ISL59830IA-T7  
ISL59830IA-T13 59830IA  
Pinout  
ISL59830IAZ  
(See Note)  
59830IAZ  
16 Ld QSOP M16.15A  
(Pb-Free)  
ISL59830  
(16 LD QSOP)  
TOP VIEW  
ISL59830IAZ-T7 59830IAZ  
(See Note)  
7”  
16 Ld QSOP M16.15A  
(Pb-Free)  
RIN  
GIN  
1
2
3
4
5
6
7
8
16 ROUT  
15 GOUT  
14 BOUT  
13 VCC  
12 EN  
ISL59830IAZ-T13 59830IAZ  
(See Note)  
13”  
16 Ld QSOP M16.15A  
(Pb-Free)  
NOTE: Intersil Pb-free plus anneal products employ special Pb-free  
material sets; molding compounds/die attach materials and 100%  
matte tin plate termination finish, which are RoHS compliant and  
compatible with both SnPb and Pb-free soldering operations. Intersil  
Pb-free products are MSL classified at Pb-free peak reflow  
temperatures that meet or exceed the Pb-free requirements of  
IPC/JEDEC J STD-020.  
BIN  
REF  
VEE  
GND  
11 VCC  
10 NC  
VEEOUT  
DGND  
9
DVCC  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2005, 2006. All Rights Reserved.  
All other trademarks mentioned are the property of their respective owners.  
ISL59830  
Absolute Maximum Ratings (T = 25°C)  
A
V
V
, Supply Voltage between V and GND . . . . . . . . . . . . . . . . .5V  
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C  
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C  
Lead Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves  
CC  
, V  
S
. . . . . . . . . . . . . . . . . . . . . . . . . . . .VCC+0.3V, VEE-0.3V  
IN REF  
Voltage between V and V  
. . . . . . . . . . . . . . . . . . . . . . . . . .±2V  
IN  
REF  
Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . . 30mA  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests  
are at the specified temperature and are pulsed tests, therefore: T = T = T  
A
J
C
AC Electrical Specifications  
V
= DV  
= +3.3V, REF = GND, T = 25°C, R = 150Ω, unless otherwise specified.  
CC A L  
CC  
DESCRIPTION  
3dB Bandwidth  
PARAMETER  
CONDITIONS  
= 200mV  
MIN  
TYP  
200  
100  
50  
MAX  
UNIT  
MHz  
MHz  
MHz  
V/µs  
%
BW -3dB  
V
V
V
V
OUT  
OUT  
OUT  
OUT  
PP  
= 2V  
= 2V  
= 2V  
PP  
PP  
PP  
BW 0.1dB  
0.1dB Bandwidth  
Slew Rate  
S
500  
R
G
P
d
d
Differential Gain  
Differential Phase  
Hostile Crosstalk  
Input to Output Isolation  
Input Noise Voltage  
0.07  
0.06  
-90  
-70  
20  
°
X
I
6MHz  
6MHz  
dB  
T
dB  
V
nV/Hz  
MHz  
mV  
N
Fcp  
Charge Pump Switch Frequency  
168  
12  
Load Reg  
I
= 0mA to 10mA  
60  
EE  
V
Output Amp Ripple Voltage  
30  
mV  
RIPPLE  
With Bead Core to DV  
10  
mV  
CC  
DC Electrical Specifications  
V
= D = +3.3V, REF = GND, T = 25°C, R = 150Ω, unless otherwise specified.  
VCC A L  
CC  
PARAMETER  
V+  
DESCRIPTION  
CONDITIONS  
MIN  
TYP  
MAX  
3.6  
UNIT  
V
Supply Range  
Gain Error  
3.0  
V %  
G
R
R
= 150Ω, V = +2.5V to -1V  
1.5  
%
L
IN  
ΔG  
Gain Matching  
= 150Ω  
0.5  
1.7  
7
%
L
R
Input Resistance  
Output Offset Voltage  
Output Current  
V
V
= 0V to 1.5V  
1.0  
-25  
50  
15  
MΩ  
mV  
mA  
mA  
Ω
IN  
IN  
V
= 0  
+25  
OS  
REF  
I
I
R
R
= 10Ω, V = 1.2V  
IN  
OUT +  
OUT -  
L
L
Output Current  
= 10Ω, V = -0.3V  
IN  
-18  
Z
Output Impedance  
Enabled  
1
10  
90  
120  
80  
5
OUT  
Three-stated  
MΩ  
dB  
mA  
mA  
kΩ  
PSRR  
Power Supply Rejection Ratio  
Supply Current  
60  
4
I
Amp Enabled  
Amp Disabled  
150  
6
S
R
Input Reference Resistor  
REF  
FN7489.6  
May 4, 2006  
2
ISL59830  
Pin Descriptions  
PIN NUMBER  
PIN NAME  
PIN FUNCTION  
EQUIVALENT CIRCUIT  
1
RIN  
Analog input  
V
CC  
V
EE  
CIRCUIT 1  
2
3
4
GIN  
BIN  
Analog input  
Analog input  
Reference input  
Reference Circuit 1  
Reference Circuit 1  
REF  
R
IN  
IN  
IN  
V
CC  
R
G
B
OUT  
OUT  
OUT  
G
B
+
-
3
REF  
V
EE  
CIRCUIT 2  
5
VEE  
Chip substrate  
V
CC  
V
EE OUT  
-
+
D
VCC  
V
EE  
CHARGE  
PUMP  
D
GND  
CIRCUIT 3  
6
7
GND  
VEE OUT  
DGND  
DVCC  
NC  
Analog ground  
Charge pump output  
Charge pump ground  
Charge pump supply voltage  
Not connected  
Reference Circuit 3  
Reference Circuit 3  
Reference Circuit 3  
8
9
10  
11, 13  
12  
VCC  
Positive power supply  
Chip enable  
EN  
V
CC  
V
EE  
CIRCUIT 4  
FN7489.6  
May 4, 2006  
3
ISL59830  
Pin Descriptions (Continued)  
PIN NUMBER  
PIN NAME  
PIN FUNCTION  
EQUIVALENT CIRCUIT  
14  
BOUT  
Analog output  
V
CC  
V
EE  
CIRCUIT 5  
15  
16  
GOUT  
ROUT  
Analog output  
Analog output  
Reference Circuit 5  
Reference Circuit 5  
Typical Performance Curves  
3
5
A =+2  
A =+2  
V
L
V
9pF  
C =0pF  
R =500Ω  
L
2
1
4.7pF  
2.2pF  
3
1
1kΩ  
0
500Ω  
0pF  
-1  
-3  
-5  
-1  
-2  
-3  
150Ω  
75Ω  
1M  
10M  
100M  
1G  
100K  
1M  
10M  
100M  
1G  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
FIGURE 1. GAIN vs FREQUENCY FOR VARIOUS R  
FIGURE 2. GAIN vs FREQUENCY FOR VARIOUS C  
LOAD  
LOAD  
5
300  
A =+2  
V
A =+2  
V
L
C =0pF  
R =500Ω  
0
-5  
L
-3dB ROLL-OFF  
R =500Ω  
L
240  
180  
120  
60  
-10  
-15  
-20  
-25  
-30  
-35  
-0.1dB ROLL-OFF  
0
2.25  
1
100  
200  
300  
400  
500  
2.8  
3.35  
3.9  
4.45  
5
FREQUENCY (MHz)  
TOTAL SUPPLY VOLTAGE, V  
CC  
- V (V)  
EE  
FIGURE 3. V  
PIN OUTPUT FREQUENCY RESPONSE  
FIGURE 4. GAIN ROLL-OFF  
REF  
FN7489.6  
May 4, 2006  
4
ISL59830  
Typical Performance Curves (Continued)  
-30  
-40  
1.6  
A =+2  
V
A =+2  
V
R =500Ω  
L
R =500Ω  
L
C =3.9pF  
L
-50  
1.2  
0.8  
0.4  
0
-60  
ENABLED  
-70  
-80  
DISABLED  
-90  
-100  
-110  
-120  
100K  
1M  
10M  
FREQUENCY (Hz)  
100M  
1G  
2.2 2.4 2.6 2.8  
3
3.2 3.4 3.6 3.8  
4
SUPPLY VOLTAGE (V)  
FIGURE 6. CROSS TALK CHANNEL TO CHANNEL (TYPICAL)  
FIGURE 5. PEAKING vs SUPPLY VOLTAGE  
-20  
120  
A =+2  
V
L
A =+2  
V
L
R =500Ω  
R =500Ω  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
100  
80  
60  
40  
20  
0
100K  
1M  
10M  
100M  
1G  
1
1.5  
2
2.5  
3
3.5  
FREQUENCY (Hz)  
SUPPLY VOLTAGE (V)  
FIGURE 7. INPUT TO OUTPUT ISOLATION vs FREQUENCY  
FIGURE 8. SUPPLY CURRENT vs SUPPLY VOLTAGE  
200  
95  
A =+2  
V
-3dB  
R =500Ω  
L
CL  
V
=3.3V  
160  
A =+2  
90  
85  
80  
75  
V
R =500Ω  
L
120  
80  
40  
0
-0.1dB  
25  
55  
85  
TEMPERATURE (°C)  
115  
145  
25  
55  
85  
115  
145  
TEMPERATURE (°C)  
FIGURE 9. BANDWIDTH vs TEMPERATURE  
FIGURE 10. SUPPLY CURRENT vs TEMPERATURE  
FN7489.6  
May 4, 2006  
5
ISL59830  
Typical Performance Curves (Continued)  
100  
-10  
-30  
10  
1
-50  
PSRR-  
-70  
PSRR+  
0.1  
0.01  
-90  
-110  
10K  
100K  
1M  
10M  
100M  
1K  
10K  
100K  
1M  
10M  
100M  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
FIGURE 11. OUTPUT IMPEDANCE vs FREQUENCY  
FIGURE 12. POWER SUPPLY REJECTION RATIO vs  
FREQUENCY  
-30  
-40  
1K  
100  
THD  
-50  
-60  
e
N
10  
1
-70  
2ND HD  
3RD HD  
-80  
I +  
N
I -  
N
-90  
-100  
0.1  
10  
0
10  
20  
30  
40  
100  
1K  
10K  
100K  
1M  
10M  
FUNDAMENTAL FREQUENCY (MHz)  
FREQUENCY (Hz)  
FIGURE 14. HARMONIC DISTORTION vs FREQUENCY  
FIGURE 13. VOLTAGE AND CURRENT NOISE vs FREQUENCY  
-30  
-40  
-50  
THD  
F
=10MHz  
-60  
-70  
-80  
-90  
IN  
0
-0.02  
-0.04  
-0.06  
-0.08  
THD  
F
=1MHz  
IN  
0.5  
1
1.5  
2
2.5  
3
3.5  
IRE  
OUTPUT VOLTAGE (V  
FIGURE 15.  
)
P-P  
FIGURE 16. DIFFERENTIAL GAIN  
FN7489.6  
May 4, 2006  
6
ISL59830  
Typical Performance Curves (Continued)  
0
-0.02  
-0.04  
-0.06  
-0.08  
IRE  
TIME (2µs/DIV)  
FIGURE 17. DIFFERENTIAL PHASE  
FIGURE 18. DISABLE TIME  
TIME (200ns/DIV)  
TIME (10ns/DIV)  
FIGURE 20. SMALL SIGNAL RISE & FALL TIMES  
FIGURE 19. ENABLE TIME  
TIME (10ns/DIV)  
TIME (20ns/DIV)  
FIGURE 21. LARGE SIGNAL RISE & FALL TIMES  
FIGURE 22. AMP OUTPUT NOISE (CHARGE PUMP  
OSCILLATION)  
FN7489.6  
May 4, 2006  
7
ISL59830  
Typical Performance Curves (Continued)  
1.6  
1.2  
0.8  
0.4  
0
3.25  
BACKDRIVE ACROSS 5Ω RESISTOR  
TYPICAL CHANNEL  
VCC = 3.3V  
3
2.75  
A =+2  
V
C =3.9pF  
L
2.5  
50  
0
1
2
3
4
5
250  
450  
650  
850  
1050  
BACKDRIVE VOLTAGE (V)  
LOAD RESISTANCE (Ω)  
FIGURE 24. BACKDRIVE VOLTAGE vs CURRENT  
AMP DISABLED OUTPUT LOADING  
FIGURE 23. MAXIMUM OUTPUT MAGNITUDE vs LOAD  
RESISTANCE  
JEDEC JESD51-3 LOW EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
1.4  
Block Diagram  
V
CC  
1.2  
1
791mW  
0.8  
R
IN  
Y
+
-
R
OUT  
6dB  
6dB  
6dB  
0.6  
0.4  
0.2  
0
REFERENCE  
G
B
IN  
IN  
Pb  
+
-
G
OUT  
0
25  
50  
75 85 100  
125  
150  
AMBIENT TEMPERATURE (°C)  
FIGURE 25. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
Pr  
+
-
B
OUT  
DV  
CC  
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL  
CONDUCTIVITY TEST BOARD  
1.8  
V
EE-OUT  
CHARGE  
PUMP  
1.6  
V
EE  
1.4  
V
= 2V - V  
IN REFERENCE  
OUT  
1.116W  
1.2  
1
0.8  
0.6  
0.4  
0.2  
0
0
25  
50  
75 85 100  
125  
150  
AMBIENT TEMPERATURE (°C)  
FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT  
TEMPERATURE  
FN7489.6  
May 4, 2006  
8
ISL59830 + DC-Restore Solution  
1
2
3
4
5
6
7
8
IN1  
IN2 16  
COM1 COM2 15  
NC1  
V-  
NC2 14  
V+ 13  
R
7
2kΩ  
GND  
NC 12  
NC3 11  
(No Connect)  
NC4  
COM4 COM3 10  
YO  
Pb  
Pr  
R
1
IN4  
IN3 9  
CN = Option for lower  
charge pump noise  
75Ω  
R
R
10  
2kΩ  
ISL43140  
9
2kΩ  
YO  
C
12  
20pF  
C
C
C
0.1µF  
0.1µF  
0.1µF  
R
R
R
75Ω  
75Ω  
75Ω  
4
5
6
4
5
6
1
2
3
4
5
6
7
8
RIN  
ROUT 16  
GOUT 15  
BOUT 14  
VCC 13  
EN 12  
R
2
75Ω  
GIN  
Pb  
Pr  
C
13  
20pF  
BIN  
REF  
V
CC  
R
11  
499Ω  
REF  
C
C
C
1
14  
R
3
75Ω  
7
V
(-1.6V)  
EE  
1kΩ  
0.1µF  
20pF  
1.0µF  
VEE  
MMBP  
3904  
R
12  
GND  
VEEOUT  
VCC 11  
NC 10  
R
8
ENABLE  
V
V
V
CC  
CC  
CC  
2
1
V
+ C  
CC  
16  
1µF  
REFERENCE  
CONTROL  
D
C
11  
0.1µF  
1
C
0.1µF  
15  
3
1N4148  
(or similar)  
DGND DVCC  
ISL59830  
9
GND  
COMP  
SYNC OUT  
Option: Panasonic 120Ω Bead  
VDD  
1
2
3
4
8
7
6
5
C
8
0.1µF  
C
EXC3BP121H  
Lower Amp output noise from charge pump  
4
COMP  
VIDEO IN  
OUT  
0.1µF  
VSYNC  
OUT  
RESET  
R
13  
681kΩ  
C
BACK  
PORCH  
OUT  
9
0.1µF  
GND  
C
10  
EL1881  
0.1µF  
ISL59830  
Demo Board Schematic  
RED_IN  
R
1
75Ω  
RED_OUT  
R
R
R
75Ω  
75Ω  
75Ω  
4
5
6
GREEN_IN  
BLUE_IN  
1
2
3
4
5
6
7
8
RIN  
ROUT 16  
R
2
75Ω  
GIN  
GOUT 15  
BOUT 14  
VCC 13  
EN 12  
GREEN_OUT  
BLUE_OUT  
BIN  
V
CC  
REF  
R
1kΩ  
C
C
3
0.1µF  
7
4
R
3
1.0µF  
75Ω  
VEE  
R
4
GND  
VEEOUT  
VCC 11  
NC 10  
ENABLE  
2
V
CC  
1
499Ω  
V
CC  
R
1kΩ  
C
2
0.1µF  
8
C
0.1µF  
5
3
V
DGND DVCC 9  
CC  
REFERENCE  
CONTROL  
D
1
1N4148  
(or similar)  
Option: Panasonic 120Ω Bead  
EXC3BP121H  
Lower Amp output noise from charge pump  
bandwidth limiting of the Miller capacitance is greatly  
reduced. The signal is then passed through a second fully-  
realized differential gain stage and finally through a  
proprietary common emitter output stage for improved rail-  
to-rail output performance. The result is a highly-stable, low  
distortion, low power, and high frequency amplifier capable  
of driving moderately capacitive loads with near rail-to-rail  
performance.  
Description of Operation and Application  
Information  
Theory Of Operation  
The ISL59830 is a highly practical and robust marriage of  
three high bandwidth, high speed, low power, rail-to-rail  
voltage feedback amplifiers with a charge pump, to provide a  
negative rail without an additional power supply. Designed to  
operate with a single supply voltage range of from 0V to  
3.3V, the ISL59830 eliminates the need for a split supply with  
the incorporation of a charge pump capable of generating a  
bottom rail as much as 1.6V below ground; for a 4.9V range  
on a single 3.3V supply. This performance is ideal for NTSC  
video with its negative-going sync pulses.  
Input Output Range  
The three amplifier channels have an input common mode  
voltage range from 0.15V below the bottom rail to within  
100mV of the positive supply, V + pin (Note: bottom rail is  
S
established by the charge pump at negative one half the  
positive supply). As the input signal moves outside the  
specified range, the output signal will exhibit increasingly  
higher levels of harmonic distortion. And of course, as load  
resistance becomes lower, the current drive capability of the  
device will be challenged and its ability to drive close to each  
rail is reduced. For instance, with a load resistance of 1kΩ  
the output swing is within a 100mV of the rails, while a load  
resistance of 150Ω limits the output swing to within around  
300mV of the rails.  
The Amplifier  
The ISL59830 fabricated on a dielectrically isolated high  
speed 5V Bi-CMOS process with 4GHz PNPs and NPN  
transistor exceeding 20GHz - perfect for low distortion, low  
power demand and high frequency circuits. While the  
ISL59830 utilizes somewhat standard voltage mode  
feedback topologies, there are many non-standard analog  
features providing its outstanding bandwidth, rail-to-rail  
operation, and output drive capabilities. The input signal  
initially passes through a folded cascode, a topology  
providing enhanced frequency response essentially by fixing  
the base collector voltage at the junction of the input and  
gain stage. The collector of each input device looks directly  
into an emitter that is tied closely to ground through a  
resistor and biased with a very stable DC source. Since the  
voltage of this collector is "locked stable" the effective  
Amplifier Output Impedance  
To achieve near rail-to-rail performance, the output stage of  
the ISL59830 uses transistors in the common emitter  
configuration, typically producing higher output impedance  
than the standard emitter follower output stage. The  
exceptionally high open loop gain of the ISL59830 and local  
feedback reduces output impedance to less than a 2Ω at low  
frequency. However, since output impedance of the device is  
FN7489.6  
May 4, 2006  
10  
ISL59830  
I +  
N
I -  
N
OUT  
BIAS  
FIGURE 27.  
exponentially modulated by the magnitude of the open loop  
gain, output impedance increases with frequency as the  
open loop gain decreases with frequency. This inductive-like  
effect of the output impedance is countered in the ISL59830  
with proprietary output stage topology, keeping the output  
impedance low over a wide frequency range and making it  
possible to easily and effectively drive relatively heavy  
capacitive loads.(See Figure 11).  
The Charge Pump  
The ISL59830 charge pump provides a bottom rail up to  
1.65V below ground while operating on a 0V to 3.3V power  
supply. The charge pump is internally regulated to one-half  
the potential of the positive supply. This internal multi-phase  
charge pump is driven by a 160MHz differential ring  
oscillator driving a series of inverters and charge storage  
circuitry. Each series inverter charges and places parallel  
adjoining charge circuitry slightly out of phase with the  
immediately preceding block. The overall effect is sequential  
discharge and generation of a very low ripple of about 10mV  
that is applied to the amplifiers providing a negative rail of up  
to -1.65V.  
TIME (20ns/DIV)  
FIGURE 28. CHARGE PUMP OSCILLATION (AMP OUTPUT)  
The system operates at sufficiently high frequencies that any  
related charge pump noise is far beyond standard video  
bandwidth requirements. Still, appropriate bypassing  
discipline must be observed, and all pins related to either the  
power supply or the charge pump must be properly  
bypassed. See "Power Supply Bypassing and Printed Circuit  
Board Layout" in this section.  
There are two options to reduce the output supply noise.  
To maximize resistance to latch-up, a diode should be added  
between the VEEOUT pin (anode) and GND (cathode), as  
shown in the Demo Board Schematic. This prevents VEE  
from rising more than 0.7V above ground during startup.  
(VEE > 1V above GND can cause latchup under some  
conditions.)  
• Add a 120Ω bead in series between V  
further reduce ripple.  
and DV  
to  
CC  
CC  
Add a 20pF capacitor between the back load 75Ω resistor  
and ground (see the ISL59830A + DC-Restore Solution  
schematic on page 10).  
FN7489.6  
May 4, 2006  
11  
ISL59830  
specifications of 0.06% and 0.1°, while driving 150Ω at a  
The V  
Pin  
REF  
Applying a voltage to the V  
gain of +2. Driving higher impedance loads would result in  
similar or better differential gain and differential phase  
performance.  
pin simply places that  
REF  
voltage on what would usually be the ground side of the gain  
resistor of the amplifier, resulting in a DC-level shift of the  
output signal. Applying 100mV to the Vref pin would apply a  
-100mV DC level shift to the outgoing signal. The charge  
pump provides sufficient bottom room to accommodate the  
NTSC  
The ISL59830, generating a negative rail internally, is ideally  
suited for NTSC video with its accompanying negative-going  
sync signals; easily handled by the ISL59830 without the  
need of an additional supply as the ISL59830 generates a  
negative rail with an internal charge pump referenced at  
negative 1/2 the positive supply.  
shifted signal. V  
may be connected to ground for back  
REF  
porch at ground.  
Note: The V  
REF  
minus input resistors. Any common resistance on V  
input is the common point of the 3 amps  
REF  
input will share the voltage induced on it with all the other  
amps, so using a resistor source to get offset will cause  
cross talk and gain change for the offset for all amps and  
YPbPr  
YPbPr signals originating from a DVD player requiring three  
channels of very tightly-controlled amplifier gain accuracy  
present no difficulty for the ISL59830. Specifically, this  
standard encodes sync on the Y channel and it is a negative-  
going signal; easily handled by the ISL59830 without the  
need of an additional supply as the ISL59830 generates a  
negative rail placed at negative 1/2 the positive supply.  
Additionally, the Pb and Pr are bipolar analog signals and  
the video signals are negative-going; and again easily  
handled by the ISL59830.  
amp +input gain change. Offset on the V  
pin must be low  
REF  
impedance to prevent gain error and cross talk. A transistor  
emitter follower should work like an NPN MMBT3904 with  
the emitter connected to the V  
pin and 1k pull down to V-  
REF  
with 1µF cap bypass to ground and the collector to V+ and  
base to V offset source. If better tempco is needed then a  
diode may be used in series with the pot to ground. A 499Ω  
resistor may be added in series with the collector to prevent  
damage when testing.  
Driving Capacitive Loads and Cables  
See the Block Diagram on page 8.  
The ISL59830, internally-compensated to drive 75Ω cables,  
will drive 10pF loads in parallel with 1kΩ with less than 5dB  
of peaking. If less peaking is required, a small series resistor,  
usually between 5Ω to 50Ω, can be placed in series with the  
output. This will reduce peaking at the expense of a slight  
closed loop gain reduction. When used as a cable driver,  
double termination is always recommended for reflection-  
free performance. For those applications, a back-termination  
series resistor at the amplifier's output will isolate the  
amplifier from the cable and allow extensive capacitive drive.  
However, other applications may have high capacitive loads  
without a back-termination resistor. Again, a small series  
resistor at the output can help to reduce peaking. The  
ISL59830 is a triple amplifier designed to drive three  
channels; simply deal with each channel separately as  
described in this section.  
The V Pin  
EE  
The V pin is the output pin for the charge pump. A  
EE  
voltmeter applied to this pin will display the output of the  
charge pump. This pin does not affect the functionality of the  
part. One may use this pin as an additional voltage source.  
Keep in mind that the output of this pin is generated by the  
internal charge pump and a fully regulated supply that must  
be properly bypassed. We recommend a 0.1µF ceramic  
capacitor placed as close to the pin and connected to the  
ground plane of the board.  
Input, Output, and Supply Voltage Range  
The ISL59830 is designed to operate with a single supply  
voltage range of from 0V to 3.3V. The need for a split supply  
has been eliminated with the incorporation of a charge pump  
capable of generating a bottom rail as much as 1.6V below  
ground, for a 4.9V range on a single 3.3V supply. This  
performance is ideal for NTSC video with its negative-going  
sync pulses.  
DC-Restore  
When the ISL59830 is AC-coupled it becomes necessary to  
restore the DC reference for the signal. This is accomplished  
with a DC-restore system applied between the capacitive  
"AC" coupling and the input of the device. Refer to  
Video Performance  
For good video performance, an amplifier is required to  
maintain the same output impedance and the same  
frequency and phase response as DC levels are changed at  
the output. This is especially difficult when driving a standard  
video load of 150Ω because of the change in output current  
with changing DC levels. Special circuitry has been  
incorporated into the ISL59830 for the reduction of output  
impedance variation with the current output. This results in  
outstanding differential gain and differential phase  
Application Circuit for reference DC-restore solution.  
Amplifier Disable  
The ISL59830 can be disabled and its output placed in a  
high impedance state. The turn-off time is around 25ns and  
the turn-on time is around 200ns. When disabled, the  
amplifier's supply current is reduced to 80mA typically,  
reducing power consumption. The amplifier's power-down  
can be controlled by standard TTL or CMOS signal levels at  
FN7489.6  
May 4, 2006  
12  
ISL59830  
the EN pin. The applied logic signal is relative to GND pin.  
Where:  
Letting the EN pin float or applying a signal that is less than  
0.8V above GND will enable the amplifier. The amplifier will  
be disabled when the signal at EN pin is 2V above GND. The  
V = Supply voltage  
S
I
= Maximum quiescent supply current  
SMAX  
V
charge pump remains active.  
EE  
V
= Maximum output voltage of the application  
OUT  
Output Drive Capability  
R
= Load resistance tied to ground  
LOAD  
The ISL59830 does not have internal short-circuit protection  
circuitry. A short-circuit current of 80mA sourcing and 150mA  
sinking for the output is connected to half way between the  
rails with a 10Ω resistor. If the output is shorted indefinitely,  
the power dissipation could easily increase such that the part  
will be destroyed. Maximum reliability is maintained if the  
output current never exceeds ±40mA, after which the  
electro-migration limit of the process will be exceeded and  
the part will be damaged. This limit is set by the design of the  
internal metal interconnections.  
I
= Load current  
LOAD  
i = Number of output channels  
By setting the two P equations equal to each other, we  
DMAX  
can solve the output current and R  
overheat.  
to avoid the device  
LOAD  
Power Supply Bypassing and Printed Circuit  
Board Layout  
Strip line design techniques are recommended for the input  
and output signal traces. As with any high frequency device,  
a good printed circuit board layout is necessary for optimum  
performance. Lead lengths should be as short as possible.  
The power supply pin must be well bypassed to reduce the  
risk of oscillation. For normal single supply operation, where  
the V - pin is connected to the ground plane, a single 4.7µF  
tantalum capacitor in parallel with a 0.1µF ceramic capacitor  
from V + to GND will suffice. This same capacitor  
combination should be placed at each supply pin to ground if  
Power Dissipation  
With the high output drive capability of the ISL59830, it is  
possible to exceed the 150°C absolute maximum junction  
temperature under certain load current conditions.  
Therefore, it is important to calculate the maximum junction  
temperature for an application to determine if load conditions  
or package types need to be modified to assure operation of  
the amplifier in a safe operating area.  
S
S
The maximum power dissipation allowed in a package is  
determined according to:  
split-internal supplies are to be used. In this case, the V -  
pin becomes the negative supply rail.  
S
T
T  
AMAX  
JMAX  
For good AC performance, parasitic capacitance should be  
kept to a minimum. Use of wire-wound resistors should be  
avoided because of their additional series inductance. Use  
of sockets should also be avoided if possible. Sockets add  
parasitic inductance and capacitance can result in  
PD  
= --------------------------------------------  
MAX  
Θ
JA  
Where:  
T
= Maximum junction temperature  
= Maximum ambient temperature  
JMAX  
compromised performance. Minimizing parasitic capacitance  
at the amplifier's inverting input pin is also very important.  
T
AMAX  
Θ
= Thermal resistance of the package  
JA  
The maximum power dissipation actually produced by an IC  
is the total quiescent supply current times the total power  
supply voltage, plus the power in the IC due to the load, or:  
for sourcing:  
V
i
OUT  
R i  
L
-----------------  
i) ×  
OUT  
PD  
= V × I  
+ (V V  
MAX  
S
SMAX  
SMAX  
S
for sinking:  
PD  
= V × I  
+ (V  
i V ) × I  
i
LOAD  
MAX  
S
OUT  
S
FN7489.6  
May 4, 2006  
13  
ISL59830  
Shrink Small Outline Plastic Packages (SSOP)  
Quarter Size Outline Plastic Packages (QSOP)  
M16.15A  
N
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE  
(0.150” WIDE BODY)  
INDEX  
M
M
B
0.25(0.010)  
H
AREA  
E
INCHES  
MILLIMETERS  
GAUGE  
PLANE  
-B-  
SYMBOL  
MIN  
MAX  
MIN  
1.55  
0.102  
1.40  
0.20  
0.191  
4.80  
3.81  
MAX  
1.73  
0.249  
1.55  
0.31  
0.249  
4.98  
3.99  
NOTES  
A
A1  
A2  
B
0.061  
0.004  
0.055  
0.008  
0.0075  
0.189  
0.150  
0.068  
0.0098  
0.061  
0.012  
0.0098  
0.196  
0.157  
-
1
2
3
-
L
-
0.25  
0.010  
SEATING PLANE  
A
9
-A-  
D
h x 45°  
C
D
E
-
3
-C-  
4
α
A2  
e
A1  
e
0.025 BSC  
0.635 BSC  
-
C
B
H
h
0.230  
0.010  
0.016  
0.244  
0.016  
0.035  
5.84  
0.25  
0.41  
6.20  
0.41  
0.89  
-
0.10(0.004)  
M
M
S
B
0.17(0.007)  
C
A
5
L
6
NOTES:  
N
α
16  
16  
7
1. Symbols are defined in the “MO Series Symbol List” in Section  
2.2 of Publication Number 95.  
0°  
8°  
0°  
8°  
-
Rev. 2 6/04  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs. Mold flash, protrusion and gate burrs shall not exceed  
0.15mm (0.006 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions.  
Interlead flash and protrusions shall not exceed 0.25mm (0.010  
inch) per side.  
5. The chamfer on the body is optional. If it is not present, a visual  
index feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “B” does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.10mm (0.004 inch) total in excess  
of “B” dimension at maximum material condition.  
10. Controlling dimension: INCHES. Converted millimeter dimen-  
sions are not necessarily exact.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN7489.6  
May 4, 2006  
14  

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