IRF7756 [INFINEON]
HEXFET Power MOSFET; HEXFET功率MOSFET型号: | IRF7756 |
厂家: | Infineon |
描述: | HEXFET Power MOSFET |
文件: | 总9页 (文件大小:183K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PD -94159A
IRF7756
HEXFET® Power MOSFET
l Ultra Low On-Resistance
l Dual P-Channel MOSFET
l Very Small SOIC Package
l Low Profile (< 1.2mm)
VDSS
-12V
RDS(on) max
ID
0.040@VGS = -4.5V
0.058@VGS = -2.5V
0.087@VGS = -1.8V
±4.3A
±3.4A
±2.2A
l Available in Tape & Reel
Description
8
7
6
5
1
2
3
4
HEXFET® Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that Inter-
nationalRectifier iswellknownfor,providesthedesigner
with an extremely efficient and reliable device for
battery and load management.
1 = D1
8 = D2
7 = S2
6 = S2
5 = G2
2 = S1
3 = S1
4 = G1
TSSOP-8
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.1mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Max.
-12
Units
V
VDS
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ -4.5V
Continuous Drain Current, VGS @ -4.5V
Pulsed Drain Current
-4.3
-3.5
A
-17
PD @TA = 25°C
PD @TA = 70°C
Maximum Power Dissipation
Maximum Power Dissipation
Linear Derating Factor
1.0
W
W
0.64
8.0
mW/°C
V
VGS
Gate-to-Source Voltage
±8.0
TJ , TSTG
Junction and Storage Temperature Range
-55 to +150
°C
Thermal Resistance
Parameter
Max.
Units
RθJA
Maximum Junction-to-Ambient
125
°C/W
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3/17/04
IRF7756
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
-12 ––– –––
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
V
VGS = 0V, ID = -250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
––– -0.006 ––– V/°C Reference to 25°C, ID = -1mA
––– ––– 0.040
––– 0.058
––– 0.087
-0.4 ––– -0.9
13 ––– –––
––– ––– -1.0
––– ––– -25
––– ––– -100
––– ––– 100
VGS = -4.5V, ID = -4.3A
GS = -2.5V, ID = -3.4A
RDS(on)
Static Drain-to-Source On-Resistance
Ω
V
VGS = -1.8V, ID = -2.2A
VDS = VGS, ID = -250µA
VDS = -10V, ID = -4.3A
VGS(th)
gfs
IDSS
Gate Threshold Voltage
V
S
Forward Transconductance
V
DS = -9.6V, VGS = 0V
VDS = -9.6V, VGS = 0V, TJ = 70°C
GS = -8.0V
Drain-to-Source Leakage Current
µA
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
V
nA
IGSS
VGS = 8.0V
ID = -4.3A
Qg
––– 12
18
Qgs
Qgd
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
––– 1.8 2.7
––– 2.9 4.4
––– 12 –––
––– 18 –––
––– 160 –––
––– 170 –––
––– 1400 –––
––– 310 –––
––– 240 –––
nC VDS = -6.0V
VGS = -4.5V
VDD = -6.0V,
ns
Rise Time
ID = -1.0A
td(off)
tf
Turn-Off Delay Time
Fall Time
RG = 6.0Ω
VGS = -4.5V
VGS = 0V
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
pF
VDS = -10V
ƒ = 1.0kHz
Reverse Transfer Capacitance
Source-Drain Ratings and Characteristics
Parameter
Continuous Source Current
(Body Diode)
Min. Typ. Max. Units
Conditions
D
IS
MOSFET symbol
showing the
-1.0
A
G
ISM
Pulsed Source Current
(Body Diode)
integral reverse
p-n junction diode.
-17
S
VSD
trr
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
––– ––– -1.2
V
TJ = 25°C, IS = -1.0A, VGS = 0V
TJ = 25°C, IF = -1.0A
––– 35
––– 20
53
30
ns
Qrr
nC di/dt = -100A/µs
Notes:
Repetitive rating; pulse width limited by
Surface mounted on FR-4 board, t ≤ 10sec.
max. junction temperature.
Pulse width ≤ 400µs; duty cycle ≤ 2%.
2
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IRF7756
100
10
1
100
10
VGS
VGS
TOP
-7.5V
-4.5V
-2.5V
-1.8V
-1.5V
-1.2V
-1.0V
TOP
-7.5V
-4.5V
-2.5V
-1.8V
-1.5V
-1.2V
-1.0V
BOTTOM -0.8V
BOTTOM -0.8V
1
-0.8V
0.1
-0.8V
20µs PULSE WIDTH
20µs PULSE WIDTH
°
T = 25 C
J
°
T = 150 C
J
0.01
0.1
0.1
0.1
1
10
1
10
-V , Drain-to-Source Voltage (V)
DS
-V , Drain-to-Source Voltage (V)
DS
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
2.0
100
10
-4.3A
=
I
D
1.5
1.0
0.5
0.0
T
= 150°C
J
1
0
T
= 25°C
J
V
= -10V
DS
20µs PULSE WIDTH
V
GS
=-4.5V
-60 -40 -20
0
20 40 60 80 100 120 140 160
°
0.5
1.0
1.5 2.0
T , Junction Temperature( C)
J
-V , Gate-to-Source Voltage (V)
GS
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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IRF7756
10
8
2400
2000
1600
1200
800
I = -4.3A
D
V
= 0V,
f = 1 MHZ
GS
C
= C + C
,
C
ds
SHORTED
V
V
=-9.6V
=-6V
iss
gs
gd
DS
DS
C
= C
rss
gd
C
= C + C
oss
ds
gd
Ciss
6
4
2
Coss
Crss
400
0
1
0
0
5
10
15
20
25
10
100
Q
, Total Gate Charge (nC)
G
-V , Drain-to-Source Voltage (V)
DS
Fig 5. Typical Capacitance Vs.
Fig 6. Typical Gate Charge Vs.
Drain-to-Source Voltage
Gate-to-Source Voltage
100
10
1
100
10
1
OPERATION IN THIS AREA
LIMITED BY R (on)
DS
100µsec
1msec
°
T = 150 C
J
10msec
°
T = 25 C
T
= 25°C
J
A
Tj = 150°C
Single Pulse
V
= 0 V
GS
0.1
0.1
0.2
0.4
0.6
0.8
1.0
0.1
1
10
100
-V ,Source-to-Drain Voltage (V)
SD
-V
, Drain-toSource Voltage (V)
DS
Fig 7. Typical Source-Drain Diode
Fig 8. Maximum Safe Operating Area
Forward Voltage
4
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IRF7756
5.0
4.0
3.0
2.0
1.0
0.0
RD
VDS
VGS
D.U.T.
RG
-
+
VDD
VGS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
t
t
r
t
t
f
d(on)
d(off)
V
GS
10%
25
50
75
100
125
150
°
T , Case Temperature ( C)
C
90%
Fig 9. Maximum Drain Current Vs.
V
DS
Case Temperature
Fig 10b. Switching Time Waveforms
1000
100
10
1
D = 0.50
0.20
0.10
0.05
P
2
DM
0.02
0.01
t
1
t
2
SINGLE PULSE
(THERMAL RESPONSE)
Notes:
1. Duty factor D = t / t
1
2. Peak T =P
J
x Z
+ T
thJA A
DM
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
t , Rectangular Pulse Duration (sec)
1
Fig 10. Typical Effective Transient Thermal Impedance, Junction-to-Ambient
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IRF7756
0.040
0.035
0.030
0.025
0.020
0.07
0.06
0.05
0.04
0.03
V
= -1.8V
GS
V
V
= -2.5V
GS
I
= -4.3A
D
= -4.5V
GS
0.02
1.0
2.0
3.0
4.0
5.0
0
4
8
12
16
-V
Gate -to -Source Voltage (V)
-I , Drain Current (A)
GS,
D
Fig 12. Typical On-Resistance Vs. Drain
Fig 11. Typical On-Resistance Vs. Gate
Current
Voltage
Current Regulator
Same Type as D.U.T.
50KΩ
Q
G
.2µF
12V
.3µF
-
V
+
DS
Q
Q
GD
D.U.T.
GS
V
GS
V
G
-3mA
I
I
D
G
Charge
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
6
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IRF7756
0.7
0.6
0.5
0.4
0.3
0.2
80
60
40
20
0
I
= -250µA
D
0.001
0.010
0.100
1.000
10.000
100.000
-75 -50 -25
0
25
50
75 100 125 150
Time (sec)
T
, Temperature ( °C )
J
Fig 15. Typical Power Vs. Time
Fig 14. Threshold Voltage Vs. Tempera-
ture
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IRF7756
TSSOP-8 Part Marking Information
EXAMPLE: THIS IS AN IRF7702
DATE CODE (YW)
LOT CODE (XX)
TABLE 1
XXYW
7702
PART NUMBER
WORK WEEK 1-26, NUMERIC YEAR CODE (1,2, ....ETC.)
WORK
YEAR
Y
WEEK
W
2001
2002
2003
1994
1995
1996
1997
1998
1999
2000
1
2
3
4
5
6
7
8
9
0
01
02
03
04
A
B
C
D
DATE CODE EXAMPLES:
9503 = 5C
9532 = EF
24
25
26
X
Y
Z
TABLE 2
WORK WEEK 27-52, ALPHANUMERICYEAR CODE (A,B, ...ETC.)
WORK
YEAR
Y
WEEK
W
2001
2002
2003
1994
1995
1996
1997
1998
1999
2000
A
B
C
D
E
27
28
29
30
A
B
C
D
F
G
H
J
K
50
51
52
X
Y
Z
TSSOP-8 Tape and Reel
8LTSSOP (MO-153AA)
Ø 13"
16 mm
16mm
FEED DIRECTION
NOTES:
8 mm
1. TAPE & REEL OUTLINE CONFORMS TO EIA-481 & EIA-541.
8
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IRF7756
TSSOP-8 Package Outline
Data and specifications subject to change without notice.
This product has been designed and qualified for the consumer market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 3/04
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