SSF3056C_15 [GOOD-ARK]

30V Complementary MOSFET;
SSF3056C_15
型号: SSF3056C_15
厂家: GOOD-ARK ELECTRONICS    GOOD-ARK ELECTRONICS
描述:

30V Complementary MOSFET

文件: 总5页 (文件大小:378K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSF3056C  
30V Complementary MOSFET (Preliminary)  
Main Product Characteristics  
NMOS  
30V  
PMOS  
-30V  
D1  
D1  
D2  
D2  
S1  
G1  
S2  
G2  
NMOS  
PMOS  
VDSS  
RDS(on) 37mohm(typ.) 68mohm(typ.)  
ID 5A -4.5A  
SchematicDiagram  
DFN2X3-8L  
Features and Benefits  
AdvancedtrenchMOSFETprocess technology  
Special designed for buck-boost circuit, DSC, portable  
devicesandgeneralpurpose applications  
Ultralowon-resistancewithlowgatecharge  
150operating temperature  
Leadfreeproduct  
Description  
It utilizes the latest trench processing techniques to achieve the high cell density and reduces the  
on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely  
efficient and reliable device for use in buck-boost circuit, DSC, portable devices and a wide variety of others  
applications.  
Absolute Max Rating  
Max.  
Symbol  
Parameter  
Units  
N-channel  
P-channel  
-4.5  
ID @ TC = 25°C  
5
Continuous Drain Current, VGS @ 4.5V①  
Continuous Drain Current, VGS @ 4.5V①  
Pulsed Drain Current②  
A
ID @ TC = 100°C  
4.2  
18.8  
2.1  
30  
-3.4  
IDM  
-12.5  
1.8  
PD @TC = 25°C  
W
V
Power Dissipation③  
VDS  
VGS  
Drain-Source Voltage  
-30  
Gate-to-Source Voltage  
± 12  
± 12  
V
Operating Junction and Storage Temperature  
Range  
TJ TSTG  
-55 to + 150 -55 to + 150  
°C  
www.goodark.com  
Page 1 of 5  
Rev.1.0  
SSF3056C  
30V Complementary MOSFET (Preliminary)  
Thermal Resistance  
Max.  
Symbol  
Characteristics  
Typ.  
Units  
N-channel  
P-channel  
60  
95  
Junction-to-ambient (t ≤ 10s) ④  
/W  
/W  
RθJA  
40  
40  
Junction-to-Ambient (PCB mounted, steady-state) ④  
Electrical Characteristics @TA=25unless otherwise specified  
Symbol Parameter  
Min.  
30  
Typ.  
Max.  
Units  
Conditions  
VGS = 0V, ID = 250μA  
TJ = 125°C  
N-channel  
P-channel  
Drain-to-Source  
27.5  
-30  
-27.5  
V(BR)DSS  
V
breakdown voltage  
VGS = 0V, ID = -250μA  
TJ = 125°C  
N-channel  
P-channel  
N-channel  
P-channel  
N-channel  
P-channel  
N-channel  
P-channel  
N-channel  
P-channel  
N-channel  
N-channel  
P-channel  
P-channel  
37  
55  
85  
90  
115  
2
VGS=4.5V,ID = 4.8A  
VGS=-4.5V,ID = -2.3A  
VGS=3.5V,ID = 3.8A  
Static  
68  
RDS(on)  
Drain-to-Source  
on-resistance  
mΩ  
50  
84  
VGS=-3.5V,ID = -1.8A  
0.7  
0.7  
-0.7  
-0.7  
1.48  
1.12  
-1.49  
-1.26  
VDS = VGS, ID = 250μA  
TJ = 125°C  
Gate threshold  
voltage  
2
VGS(th)  
V
-2  
VDS = VGS, ID = -250μA  
TJ = 125°C  
-2  
Drain-to-Source  
leakage current  
1
VDS = 30V,VGS = 0V  
VDS = -30V,VGS = 0V  
VGS =12V  
IDSS  
μA  
nA  
-1  
100  
-100  
100  
-100  
Gate-to-Source  
forward leakage  
VGS = -12V  
IGSS  
VGS =12V  
VGS = -12V  
Source-Drain Ratings and Characteristics  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Units  
Conditions  
MOSFET symb
5
Continuous Source Current  
(Body Diode)  
IS  
A
showing the  
-4.5  
integral reverse  
p-n junction diode.  
Pulsed Source Current  
(Body Diode)  
18.8  
ISM  
A
V
-12.5  
1.2  
0.82  
-0.84  
IS=2.4A, VGS=0V  
IS=-1.5A, VGS=0V  
VSD  
Diode Forward Voltage  
-1.2  
www.goodark.com  
Page 2 of 5  
Rev.1.0  
SSF3056C  
30V Complementary MOSFET (Preliminary)  
Test Circuits and Waveforms  
Switch Waveforms:  
Notes:  
The maximum current rating is limited by bond-wires.  
Repetitive rating; pulse width limited by max. junction temperature.  
The power dissipation PD is based on max. junction temperature, using junction-to- ambient thermal  
resistance.  
The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a  
still air environment with TA =25°C  
www.goodark.com  
Page 3 of 5  
Rev.1.0  
SSF3056C  
30V Complementary MOSFET (Preliminary)  
Mechanical Data  
DFN2X3-8L  
Bottom View  
Bottom View  
Top View  
COMMON DIMENSIONS(MM)  
PKG.  
REF.  
A
W:VERY VERY THIN  
MIN.  
0.70  
0.00  
NOM.  
0.75  
MAX.  
0.80  
0.05  
A1  
A3  
0.2 REF.  
3.00  
D
2.95  
1.95  
0.25  
0.25  
0.77  
0.38  
3.05  
2.05  
0.35  
0.45  
1.02  
0.63  
E
b
2.00  
0.30  
Side View  
L
D2  
E2  
e
0.35  
0.92  
0.53  
0.65 BCS.  
NOTES:  
1. All dimensions are in millimeters.  
2. Tolerance ±0.10mm (4 mil) unless otherwise specified  
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be  
less than 5 mils.  
4. Dimension L is measured in gauge plane.  
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.  
www.goodark.com  
Page 4 of 5  
Rev.1.0  
SSF3056C  
30V Complementary MOSFET (Preliminary)  
Ordering and Marking Information  
Device Marking: 3056C  
Package (Available)  
DFN2X3-8L  
Operating Temperature Range  
C : -55 to 150 ºC  
Devices per Unit  
Package Units/ Tubes/  
Units/  
Inner Boxes/ Units/  
Type  
Tube  
Inner Box Inner Box Carton Box  
Carton Box  
DFN2*3-8L 3000pcs 10pcs  
30000pcs  
4pcs  
120000pcs  
www.goodark.com  
Page 5 of 5  
Rev.1.0  

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