SSF318W [SECOS]

N-Ch Enhancement Mode Power MOSFET;
SSF318W
型号: SSF318W
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

N-Ch Enhancement Mode Power MOSFET

文件: 总4页 (文件大小:492K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSF318W  
50V , 200mA , RDS(ON) 3.5  
N-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of -C” specifies halogen & lead-free  
DESCRIPTION  
Typical applications are dc–dc converters,  
SOT-323  
power management in portable and battery–powered  
products such as computers, printers, PCMCIA cards,  
cellular and cordless telephones.  
A
L
3
3
Top View  
C B  
FEATURES  
1
1
2
Lower Gate Charge  
2
K
F
E
Small Package Outline  
D
H
G
J
MARKING  
Millimeter  
Millimeter  
REF.  
REF.  
Min.  
1.80  
1.80  
1.15  
0.80  
1.20  
0.20  
Max.  
2.20  
2.45  
1.35  
1.10  
1.40  
0.40  
Min.  
0.100 REF.  
0.525 REF.  
0.08 0.25  
Max.  
J1  
A
B
C
D
E
F
G
H
J
K
L
-
-
PACKAGE INFORMATION  
0.650 TYP.  
Package  
SOT-323  
MPQ  
3K  
Leader Size  
7 inch  
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)  
Parameter  
Symbol  
VDS  
Ratings  
50  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain Current  
V
VGS  
±20  
V
TA=25°C  
TA=25°C  
I D  
200  
mA  
mA  
Pulsed Drain Current (tp 10µS)  
Power Dissipation  
IDM  
800  
P D  
150  
mW  
Maximum Junction-to-Ambient  
RθJA  
556  
°C / W  
Maximum Lead Temperature for Soldering Purposes, for 10  
seconds  
TL  
260  
°C  
°C  
Operating Junction and Storage Temperature Range  
TJ, TSTG  
150, -55~150  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
07-Feb-2014 Rev. A  
Page 1 of 4  
SSF318W  
50V , 200mA , RDS(ON) 3.5Ω  
N-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Teat Conditions  
Static  
Drain-Source Breakdown Voltage  
Gate-Threshold Voltage  
BVDSS  
VGS(th)  
IGSS  
50  
-
-
-
-
-
-
V
V
VGS=0, ID=250µA  
0.5  
1.5  
VDS=VGS, ID=1mA  
VGS=±20V  
Gate-Body Leakage Current  
-
-
-
±100  
0.1  
nA  
VDS=25V, VGS=0  
VDS=50V, VGS=0  
Drain-Source Leakage Current  
IDSS  
µA  
0.5  
VGS=2.75V, ID<200mA,  
TA=-40°C ~85°C  
-
5.6  
10  
Drain-Source On-Resistance 1  
Forward Transconductance  
RDS(ON)  
-
-
-
3.5  
-
VGS=5V, ID=200mA  
gfs  
100  
mS VDS=25V, ID=200mA, f=1KHz  
Switch2  
Turn-on Delay Time1  
Turn-off Delay Time  
Td(on)  
Td(off)  
-
-
20  
20  
-
-
VDD=30V,  
nS  
ID=200mA  
Dynamic  
Input Capacitance  
Output Capacitance  
Ciss  
Coss  
Crss  
-
-
-
40  
12  
-
-
-
VGS=0,  
VDS=25V,  
f=1.0MHz  
pF  
Reverse Transfer Capacitance  
Notes:  
3.5  
1. Pulse Test: Pulse Width 300 µs, Duty Cycle 2%.  
2. Switching characteristics are independent of operating junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
07-Feb-2014 Rev. A  
Page 2 of 4  
SSF318W  
50V , 200mA , RDS(ON) 3.5Ω  
N-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
CHARACTERISTIC CURVE  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
07-Feb-2014 Rev. A  
Page 3 of 4  
SSF318W  
50V , 200mA , RDS(ON) 3.5Ω  
N-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
CHARACTERISTIC CURVE  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
07-Feb-2014 Rev. A  
Page 4 of 4  

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