FMS2029 [FILTRONIC]
DC?20 GHZ MMIC SPST NON-REFLECTIVE SWITCH; DC ？ 20 GHz的MMIC SPST无反射开关
| 型号： | FMS2029 |
| 厂家： | 
FILTRONIC COMPOUND SEMICONDUCTORS |
| 描述： | DC?20 GHZ MMIC SPST NON-REFLECTIVE SWITCH |
| 文件： | 总4页 (文件大小：162K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FMS2029
Preliminary Datasheet v2.1
DC–20 GHZ MMIC SPST NON-REFLECTIVE SWITCH
FEATURES:
FUNCTIONAL SCHEMATIC:
•
•
•
•
•
Available in die form
Both ports Non-Reflective
Low Insertion loss 2.2dB at 20 GHz typical
Very high isolation 50dB at 20 GHz typical
Excellent low control voltage performance
RRFouuuttt
RFiin
GENERAL DESCRIPTION:
The FMS2029 is loss, high isolation
broadband single pole single throw Gallium
Arsenide switch designed for use in broadband
a
V11
V22
T
•
YPICAL APPLICATIONS:
Broadband communication
Instrumentation
communications,
instrumentation
and
s
electronic warfare applications. It offers non-
reflective properties from both ports. The die
is fabricated using the Filtronic FL05 0.5µm
switch process technology that offers leading
edge performance optimised for switch
applications.
•
•
Electronic warfare (ECM, ESM)
ELECTRICAL SPECIFICATIONS (based on on-wafer measurements):
P
ARAMETER
Insertion Loss
Insertion Loss
C
ONDITIONS
MIN
T
YP
MAX
U
NITS
dB
(DC-10) GHz, Small Signal
(10-15) GHz, Small Signal
1.4
1.6
dB
Insertion Loss
Isolation
(15-20) GHz, Small Signal
(DC-10) GHz, Small Signal
(10-15) GHz, Small Signal
(15-20) GHz, Small Signal
(DC-20) GHz, Small Signal
(DC-20) GHz, Small Signal
(DC-20) GHz, Small Signal
-5V control
2.2
70
57
50
20
20
12
26
dB
dB
dB
dB
dB
dB
ns
Isolation
Isolation
Input Return Loss (on state)
Output Return Loss (on state)
Output Return Loss (off state)
P1dB
dBm
Note: TAMBIENT = 25°C, Vctrl = 0V/-5V, ZIN = ZOUT = 50Ω
1
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
FMS2029
Preliminary Datasheet v2.1
ABSOLUTE MAXIMUM RATINGS:
TRUTH TABLE:
ABSOLUTE
MAXIMUM
PARAMETER
SYMBOL
CONTROL LINE
RF PATH
V1
V2
RFIN-RFO
Max Input Power
Operating Temp
Storage Temp
Pin
+38dBm
-5V
0V
0V
On (Low Loss)
Off (Isolation)
Toper
Tstor
-40°C to +100°C
-55°C to +150°C
-5V
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
Note: -5V 0.2V; 0V 0.2V
PAD LAYOUT:
PAD
DESCRIPTION
PIN
NAME
COORDINATES (µm)
RFIN
RFO
V1
RFIN
RFOUT
V1
141,587
1789,587
901,161
1101,161
RFI
RFO
V1 V2
V2
V2
Note: Co-ordinates are referenced from the bottom
left hand corner of the die to the centre of bond pad
opening
MIN. BOND PAD PITCH
MIN. BOND PAD OPENING
DIE SIZE (µm)
DIE THICKNESS (µm)
(µm)
(µm x µm )
1910 x 1110
100
150
116 x 116
2
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
FMS2029
Preliminary Datasheet v2.1
TYPICAL MEASURED PERFORMANCE ON WAFER:
Note: Measurement Conditions VCTRL= -5V (low) & 0V (high), TAMBIENT = 25°C unless otherwise stated
Insertion Loss (dB)
Isolation (dB)
-0.5
-1
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-1.5
-2
-2.5
-3
1
6
11
16
20
1
6
11
16
20
Frequency (GHz)
Frequency (GHz)
Output Return Loss (dB)
Input Return Loss (dB)
0
-10
-20
-30
-40
0
-10
-20
-30
-40
ON-STATE
ON-STATE
OFF-STATE
OFF-STATE
1
6
11
16
20
1
6
11
16
20
Frequency (GHz)
Frequency (GHz)
3
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
FMS2029
Preliminary Datasheet v2.1
PREFERRED ASSEMBLY INSTRUCTIONS:
HANDLING
PRECAUTIONS:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
To avoid damage to the devices care should
be exercised during handling. Proper
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
The back of the die is metallised and the
recommended mounting method is by the use
of solder or conductive epoxy. If epoxy is
selected then it should be applied to the
attachment surface uniformly and sparingly to
avoid encroachment of epoxy on to the top
face of the die and ideally should not exceed
half the chip height. For automated dispense
Ablestick LMISR4 is recommended and for
manual dispense Ablestick 84-1 LMI or 84-1
LMIT are recommended. These should be
cured at a temperature of 150°C for 1 hour in
an oven especially set aside for epoxy curing
only. If possible the curing oven should be
flushed with dry nitrogen.
handling, assembly, and testing.
These
devices should be treated as Class 1A (0-500
V) as defined in JEDEC Standard No. 22-
A114. Further information on ESD control
measures can be found in MIL-STD-1686 and
MIL-HDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters are available; please contact
Filtronic Compound Semiconductors Ltd.
This part has gold (Au) bond pads requiring
the use of gold (99.99% pure) bondwire. It is
recommended that 25.4µm diameter gold wire
be used. Thermosonic ball bonding is
preferred. A nominal stage temperature of
150°C and a bonding force of 40g has been
shown to give effective results for 25µm wire.
Ultrasonic energy shall be kept to a minimum.
For this bonding technique, stage temperature
should not be raised above 200°C and bond
force should not be raised above 60g.
DISCLAIMERS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
ORDERING INFORMATION:
PART NUMBER
DESCRIPTION
Thermosonic
wedge
bonding
and
FMS2029-000
Die in Waffle-pack
thermocompression wedge bonding can also
be used to achieve good wire bonds.
(Gel-pak available on request)
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
4
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
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