FCH35N60 [FAIRCHILD]

N-Channel SuperFET® MOSFET; N沟道MOSFET SuperFET®
FCH35N60
型号: FCH35N60
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

N-Channel SuperFET® MOSFET
N沟道MOSFET SuperFET®

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March 2013  
FCH35N60  
N-Channel SuperFET MOSFET  
®
600 V, 35 A, 98 mΩ  
Features  
Description  
SuperFET® MOSFET is Fairchild Semiconductor®’s first genera-  
tion of high voltage super-junction (SJ) MOSFET family that is  
utilizing charge balance technology for outstanding low on-resis-  
tance and lower gate charge performance. This technology is tai-  
lored to minimize conduction loss, provide superior switching  
performance, dv/dt rate and higher avalanche energy. Conse-  
quently, SuperFET MOSFET is very suitable for the switching  
power applications such as PFC, server/telecom power, FPD TV  
power, ATX power and industrial power applications.  
650 V @ TJ = 150°C  
Typ.RDS(on) = 79 mΩ  
Ultra Low Gate Charge ( Typ. Qg = 139 nC )  
Low Effective Output Capacitance (Typ. Coss.eff = 340 pF)  
100% Avalanche Tested  
Application  
Solar Inverter  
AC-DC Power Supply  
D
G
TO-247  
G
D
S
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
Parameter  
FCH35N60  
600  
Unit  
V
Drain to Source Voltage  
Gate-Soure voltage  
±30  
V
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- P ul s ed  
35  
ID  
D r a in C u r r e n t  
A
22.2  
IDM  
Dr ain Curr ent  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
105  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
1455  
35  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
31.25  
20  
mJ  
V/ns  
W
W/oC  
oC  
(TC = 25oC)  
- Derate above 25oC  
312.5  
2.5  
PD  
Power Dissipation  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Typ.  
Max.  
0.4  
-
Unit  
RθJC  
RθCS  
RθJA  
-
0.24  
-
Thermal Resistance, Case-to-Heat Sink  
Thermal Resistance, Junction to Ambient  
oC/W  
42  
©2009 Fairchild Semiconductor Corporation  
FCH35N60 Rev. C0  
1
www.fairchildsemi.com  
Package Marking and Ordering Information TC = 25oC unless otherwise noted  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FCH35N60  
FCH35N60  
TO-247  
-
-
30  
Electrical Characteristics  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Off Characteristics  
I
D = 250 μA, VGS = 0 V, TJ = 25oC  
ID = 250 μA, VGS = 0 V, TJ = 150oC  
600  
-
-
-
-
V
V
BVDSS  
Drain to Source Breakdown Voltage  
650  
ΔBVDSS  
Breakdown Voltage Temperature  
Coefficient  
I
D = 250 μA, Referenced to 25oC  
-
-
0.6  
-
-
V/oC  
/
ΔTJ  
Drain-Source Avalanche Breakdown  
Voltage  
BVDS  
V
GS = 0 V, ID = 16 A  
700  
V
V
DS = 600 V, VGS = 0 V  
-
-
-
-
-
-
1
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
μA  
VDS = 480 V, TC = 125oC  
10  
VGS = ±30 V, VDS = 0 V  
±100  
nA  
On Characteristics  
VGS(th)  
RDS(on)  
gFS  
Gate Threshold Voltage  
VGS = VDS, ID = 250 μA  
VGS = 10 V, ID = 17.5 A  
VDS = 40 V, ID = 17.5 A  
3.0  
-
5.0  
0.098  
-
V
Ω
S
Static Drain to Source On Resistance  
Forward Transconductance  
-
-
0.079  
28.8  
Dynamic Characteristics  
Ciss  
Input Capacitance  
-
-
-
-
-
-
-
4990  
2380  
140  
113  
340  
139  
31  
6640  
pF  
pF  
pF  
pF  
pF  
nC  
nC  
VDS = 25 V, VGS = 0 V  
f = 1 MHz  
Coss  
Crss  
Output Capacitance  
3170  
Reverse Transfer Capacitance  
Output Capacitance  
-
Coss  
Coss eff.  
Qg  
VDS = 480 V, VGS = 0 V, f = 1.0 MHz  
VDS = 0 V to 480 V, VGS = 0 V  
-
Effective Output Capacitance  
Total Gate Charge at 10V  
Gate to Source Gate Charge  
-
181  
-
V
V
DS = 480 V, ID = 35 A  
GS = 10 V  
Qgs  
Qgd  
Gate to Drain “Miller” Charge  
-
-
69  
-
-
nC  
(Note 4)  
ESR  
Equivalent Series Resistance (G-S)  
Drain Open, F= 1 MHZ  
1.4  
Ω
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
-
-
-
-
34  
120  
105  
73  
78  
ns  
ns  
ns  
ns  
VDD = 300 V, ID = 35 A  
250  
220  
155  
R
G = 4.7 Ω  
(Note 4)  
Drain-Source Diode Characteristics  
IS  
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
-
-
-
-
-
-
-
35  
105  
1.4  
-
A
A
ISM  
VSD  
trr  
Drain to Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0 V, ISD = 35 A  
-
V
614  
16.3  
ns  
μC  
VGS = 0 V, ISD = 35 A  
dIF/dt = 100 A/μs  
Qrr  
Reverse Recovery Charge  
-
Notes:  
1: Repetitive Rating: Pulse width limited by maximum junction temperature  
2:  
3:  
I
I
= 17.5 A, V = 50 V, R = 25 Ω, Starting T = 25°C  
AS  
SD  
DD  
G
J
35 A, di/dt 200 A/μs, V BV  
, Starting T = 25°C  
DD  
DSS J  
4: Essentially Independent of Operating Temperature Typical Characteristics  
©2009 Fairchild Semiconductor Corporation  
FCH35N60 Rev. C0  
www.fairchildsemi.com  
2
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
200  
200  
VGS = 15.0 V  
100  
10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
5.5 V  
100  
10  
-55oC  
25oC  
150oC  
10  
*Notes:  
1. 250μs Pulse Test  
2. TC = 25oC  
1
*Notes:  
1. VDS = 20V  
2. 250μs Pulse Test  
1
0.3  
0.1  
4
5
6
7
8
9
1
10  
20  
VGS, Gate-Source Voltage[V]  
VDS, Drain-Source Voltage[V]  
Figure 3. On-Resistance Variation vs.  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperature  
Drain Current and Gate Voltage  
0.24  
0.20  
0.16  
0.12  
0.08  
0.04  
500  
100  
150oC  
25oC  
10  
VGS = 10V  
VGS = 20V  
*Notes:  
1. VGS = 0V  
*Note: TC = 25oC  
2. 250μs Pulse Test  
1
0.2  
0
25  
50  
75  
100  
125  
0.4  
0.8  
1.2  
1.6  
ID, Drain Current [A]  
VSD, Body Diode Forward Voltage [V]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
10  
50000  
VDS = 100V  
VDS = 250V  
VDS = 400V  
8
10000  
Ciss  
6
4
2
1000  
Coss  
*Note:  
1. VGS = 0V  
2. f = 1MHz  
100  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
= C + C  
ds  
oss  
rss  
gd  
*Note: ID = 35A  
120  
= C  
gd  
Crss  
600  
0
10  
0.1  
0
40  
80  
160  
1
10  
100  
Qg, Total Gate Charge [nC]  
VDS, Drain-Source Voltage [V]  
©2009 Fairchild Semiconductor Corporation  
FCH35N60 Rev. C0  
www.fairchildsemi.com  
3
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
Figure 8. On-Resistance Variation  
vs. Temperature  
vs. Temperature  
1.15  
3.0  
1.10  
1.05  
1.00  
0.95  
2.5  
2.0  
1.5  
1.0  
*Notes:  
1. VGS = 0V  
*Notes:  
1. VGS = 10V  
2. ID = 17.5A  
0.90  
0.5  
2. ID = 250μA  
0.85  
-100  
0.0  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
o
o
TJ, Junction Temperature [ C]  
TJ, Junction Temperature [ C]  
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current  
vs. Case Temperature  
300  
40  
30  
20  
10  
0
10μs  
100  
100μs  
1ms  
10ms  
10  
DC  
Operation in This Area  
is Limited by R DS(on)  
1
*Notes:  
0.1  
1. TC = 25oC  
2. TJ = 150oC  
3. Single Pulse  
0.01  
1
10  
100  
1000  
25  
50  
75  
100  
125  
150  
o
TC, Case Temperature [ C]  
VDS, Drain-Source Voltage [V]  
Figure 11. Transient Thermal Response Curve  
0.6  
0.1  
0.5  
0.2  
0.1  
PDM  
0.05  
t1  
t2  
0.02  
0.01  
0.01  
*Notes:  
Single pulse  
1. ZθJC(t) = 0.4oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
0.001  
10-5  
10-4  
10-3  
10-2  
10-1  
1
10  
Rectangular Pulse Duration [sec]  
©2009 Fairchild Semiconductor Corporation  
FCH35N60 Rev. C0  
www.fairchildsemi.com  
4
Gate Charge Test Circuit & Waveform  
Resistive Switching Test Circuit & Waveforms  
Unclamped Inductive Switching Test Circuit & Waveforms  
©2009 Fairchild Semiconductor Corporation  
FCH35N60 Rev. C0  
www.fairchildsemi.com  
5
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
©2009 Fairchild Semiconductor Corporation  
FCH35N60 Rev. C0  
www.fairchildsemi.com  
6
Mechanical Dimensions  
TO-247  
Dimensions in Millimeters  
©2009 Fairchild Semiconductor Corporation  
FCH35N60 Rev. C0  
www.fairchildsemi.com  
7
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
2Cool™  
AccuPower™  
AX-CAP *  
BitSiC™  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
Current Transfer Logic™  
DEUXPEED  
Dual Cool™  
EcoSPARK  
EfficentMax™  
ESBC™  
FPS™  
F-PFS™  
FRFET  
Global Power Resource  
Green Bridge™  
Green FPS™  
Green FPS™ e-Series™  
Gmax™  
GTO™  
IntelliMAX™  
ISOPLANAR™  
Sync-Lock™  
®*  
®
tm  
®
®
®
PowerTrench  
PowerXS™  
Programmable Active Droop™  
QFET  
QS™  
Quiet Series™  
RapidConfigure™  
SM  
TinyBoost™  
TinyBuck™  
TinyCalc™  
®
®
TinyLogic  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
®
Marking Small Speakers Sound Louder Saving our world, 1mW/W/kW at a time™  
®
TranSiC  
®
and Better™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MicroPak2™  
MillerDrive™  
MotionMax™  
mWSaver™  
OptoHiT™  
SignalWise™  
SmartMax™  
TriFault Detect™  
TRUECURRENT *  
μSerDes™  
®
SMART START™  
Solutions for Your Success™  
®
®
SPM  
®
STEALTH™  
SuperFET  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
Fairchild  
®
®
UHC  
®
Fairchild Semiconductor  
FACT Quiet Series™  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
VoltagePlus™  
XS™  
®
FACT  
FAST  
®
®
®
OPTOLOGIC  
OPTOPLANAR  
SupreMOS  
SyncFET™  
FastvCore™  
FETBench™  
®
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY  
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY  
THEREIN, WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used here in:  
1. Life support devices or systems are devices or systems which, (a) are  
intended for surgical implant into the body or (b) support or sustain life,  
and (c) whose failure to perform when properly used in accordance with  
instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or  
effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,  
www.Fairchildsemi.com, under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their  
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed  
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the  
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild  
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Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of  
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and  
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committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
Preliminary  
First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I64  
www.fairchildsemi.com  
©2009 Fairchild Semiconductor Corporation  
FCH35N60 Rev. C0  
8

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