FCH47N60F_13 [FAIRCHILD]

N-Channel SuperFET FRFET MOSFET; N沟道的SuperFET FRFET MOSFET
FCH47N60F_13
型号: FCH47N60F_13
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

N-Channel SuperFET FRFET MOSFET
N沟道的SuperFET FRFET MOSFET

文件: 总8页 (文件大小:290K)
中文:  中文翻译
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May 2013  
FCH47N60F  
N-Channel SuperFET FRFET MOSFET  
®
®
600 V, 47 A, 73 m  
Features  
Description  
®
®
650 V @TJ = 150 C  
SuperFET MOSFET is Fairchild Semiconductor ’s first gener-  
ation of high voltage super-junction (SJ) MOSFET family that is  
utilizing charge balance technology for outstanding low on-  
resistance and lower gate charge performance.This technology  
is tailored to minimize conduction loss, provide superior switch-  
ing performance,dv/dt rate and higher avalanche energy. Con-  
sequently, SuperFET MOSFET is very suitable for the switching  
power applications such as PFC, server / telecom power, FPD  
TV power, ATX power and industrial power applications. Super-  
Typ. RDS(on) = 58 m  
Ultra Low Gate Charge (Typ. Qg = 210 nC)  
Low Effective Output Capacitance (Typ. Cosseff. = 420 pF)  
100% Avalanche Tested  
RoHS Compliant  
®
FET FRFET MOSFET’s optimized body diode reverse recov-  
ery performance can remove additional component and  
improve system reliability.  
Applications  
Solar Inverter  
AC-DC Power Supply  
D
G
TO-247  
G
D
S
Absolute Maximum Ratings  
S
Symbol  
Parameter  
FCH47N60F_F133  
Unit  
VDSS  
Drain-Source Voltage  
Drain Current  
600  
V
ID  
- Continuous (TC = 25C)  
- Continuous (TC = 100C)  
47  
29.7  
A
A
(Note 1)  
IDM  
Drain Current  
- Pulsed  
A
141  
30  
1800  
47  
VGSS  
EAS  
IAR  
Gate-Source voltage  
V
mJ  
A
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
41.7  
50  
mJ  
V/ns  
Power Dissipation  
(TC = 25C)  
417  
W
- Derate above 25C  
3.33  
W/C  
T
J, TSTG  
Operating and Storage Temperature Range  
-55 to +150  
300  
C  
TL  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
C  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
--  
Max.  
Unit  
C/W  
°C/W  
C/W  
RJC  
RCS  
RJA  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink  
0.3  
--  
0.24  
--  
Thermal Resistance, Junction-to-Ambient  
41.7  
©2010 Fairchild Semiconductor Corporation  
FCH47N60F Rev. C1  
www.fairchildsemi.com  
1
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FCH47N60F  
FCH47N60F_F133  
TO-247  
-
-
30  
Electrical Characteristics  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Conditions  
Min  
Typ Max Unit  
Off Characteristics  
BVDSS  
Drain-Source Breakdown Voltage  
VGS = 0V, ID = 250A, TJ = 25C  
VGS = 0V, ID = 250A, TJ = 150C  
600  
--  
--  
--  
--  
V
V
650  
BVDSS  
Breakdown Voltage Temperature  
Coefficient  
I
D = 250A, Referenced to 25C  
--  
--  
0.6  
--  
--  
V/C  
/
TJ  
BVDS  
Drain-Source Avalanche Breakdown  
Voltage  
VGS = 0V, ID = 47A  
700  
V
IDSS  
Zero Gate Voltage Drain Current  
VDS = 600V, VGS = 0V  
--  
--  
--  
--  
10  
100  
A  
A  
V
DS = 480V, TC = 125C  
IGSSF  
IGSSR  
Gate-Body Leakage Current, Forward  
Gate-Body Leakage Current, Reverse  
VGS = 30V, VDS = 0V  
VGS = -30V, VDS = 0V  
--  
--  
--  
--  
100  
nA  
nA  
-100  
On Characteristics  
VGS(th) Gate Threshold Voltage  
RDS(on)  
VDS = VGS, ID = 250A  
3.0  
--  
--  
0.062  
40  
5.0  
0.073  
--  
V
S
Static Drain-Source  
On-Resistance  
V
GS = 10V, ID = 23.5A  
(Note 4)  
gFS  
Forward Transconductance  
VDS = 40V, ID = 23.5A  
--  
Dynamic Characteristics  
Ciss  
Input Capacitance  
VDS = 25V, VGS = 0V,  
f = 1.0MHz  
--  
--  
--  
--  
--  
5900  
3200  
250  
8000  
4200  
--  
pF  
pF  
pF  
pF  
pF  
Coss  
Output Capacitance  
Crss  
Reverse Transfer Capacitance  
Output Capacitance  
Coss  
VDS = 480V, VGS = 0V, f = 1.0MHz  
VDS = 0V to 400V, VGS = 0V  
160  
--  
Coss eff.  
Effective Output Capacitance  
420  
--  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
VDD = 300V, ID = 47A  
--  
--  
--  
--  
--  
--  
--  
185  
210  
520  
75  
430  
450  
1100  
160  
270  
--  
ns  
ns  
RG = 25  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
ns  
(Note 4, 5)  
(Note 4, 5)  
ns  
Qg  
VDS = 480V, ID = 47A  
GS = 10V  
210  
38  
nC  
nC  
nC  
V
Qgs  
Qgd  
110  
--  
Drain-Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
--  
--  
--  
--  
--  
--  
--  
47  
141  
1.4  
--  
A
A
ISM  
VSD  
trr  
Drain-Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0V, IS = 47A  
--  
V
VGS = 0V, IS = 47A  
240  
2.04  
ns  
C  
dIF/dt =100A/s  
(Note 4)  
Qrr  
Reverse Recovery Charge  
--  
NOTES:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature  
2. I = 18A, V = 50V, R = 25, Starting T = 25C  
AS  
DD  
G
J
3. I 47A, di/dt 1,200A/s, V BV  
, Starting T = 25C  
SD  
DD  
DSS  
J
4. Pulse Test: Pulse width 300s, Duty Cycle 2%  
5. Essentially Independent of Operating Temperature Typical Characteristics  
©2010 Fairchild Semiconductor Corporation  
FCH47N60F Rev. C1  
www.fairchildsemi.com  
2
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
VGS  
Top :  
15.0 V  
10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
102  
101  
100  
102  
Bottom : 5.5 V  
150C  
101  
25C  
-55C  
* Notes :  
1. 250s Pulse Test  
2. TC = 25oC  
- Note  
1. VDS = 40V  
100  
2. 250s Pulse Test  
10-1  
100  
101  
2
4
6
8
10  
VGS , Gate-Source Voltage [V]  
VDS, Drain-Source Voltage [V]  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperatue  
0.25  
0.20  
102  
0.15  
VGS = 10V  
101  
0.10  
150C  
VGS = 20V  
25C  
0.05  
* Notes :  
1. VGS = 0V  
2. 250s Pulse Test  
* Note : TJ = 25C  
100  
0.2  
0.00  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
VSD , Source-Drain Voltage [V]  
ID, Drain Current [A]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
25000  
12  
Ciss = Cgs + Cgd (Cds = shorted)  
oss = Cds + Cgd  
Crss = Cgd  
C
VDS = 100V  
10  
8
VDS = 250V  
VDS = 400V  
20000  
15000  
10000  
5000  
0
Coss  
6
* Notes :  
1. VGS = 0 V  
2. f = 1 MHz  
C
iss  
4
2
Crss  
* Note : ID = 47A  
200  
0
10-1  
100  
101  
0
50  
100  
150  
250  
QG, Total Gate Charge [nC]  
VDS, Drain-Source Voltage [V]  
©2010 Fairchild Semiconductor Corporation  
FCH47N60F Rev. C1  
www.fairchildsemi.com  
3
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.2  
1.1  
1.0  
* Notes :  
1. VGS = 0 V  
0.9  
0.8  
* Notes :  
1. VGS = 10 V  
2. ID = 23.5 A  
2. ID = 250A  
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [C]  
TJ, Junction Temperature [C]  
Figure 9. Safe Operating Area  
Figure 10. Maximum Drain Current  
vs. Case Temperature  
50  
40  
30  
20  
10  
0
Operation in This Area  
is Limited by R DS(on)  
102  
100 s  
1 ms  
10 ms  
101  
DC  
* Notes :  
1. TC = 25C  
2. TJ = 150C  
3. Single Pulse  
100  
10-1  
100  
101  
102  
103  
25  
50  
75  
100  
125  
150  
TC, Case Temperature [C]  
VDS, Drain-Source Voltage [V]  
Figure 11. Transient Thermal Response Curve  
D = 0.5  
1 0 -1  
*
N o te s  
1 . Z JC (t)  
2 . D uty F a cto r, D = t1 /t2  
:
0.2  
=
0.3 C /W M a x.  
0 .1  
3 . T JM  
-
T C  
=
P D M * Z JC (t)  
0.05  
PDM  
0.02  
0.01  
t1  
1 0 -2  
t2  
single pulse  
1 0 -5  
1 0 -4  
1 0 -3  
1 0 -2  
1 0 -1  
1 0 0  
1 0 1  
t1 , S q u are W a ve P ulse D u ra tio n [se c]  
©2010 Fairchild Semiconductor Corporation  
FCH47N60F Rev. C1  
www.fairchildsemi.com  
4
Figure 12. Gate Charge Test Circuit & Waveform  
Figure 13. Resistive Switching Test Circuit & Waveforms  
Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms  
©2010 Fairchild Semiconductor Corporation  
FCH47N60F Rev. C1  
www.fairchildsemi.com  
5
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
©2010 Fairchild Semiconductor Corporation  
FCH47N60F Rev. C1  
www.fairchildsemi.com  
6
Physical Dimensions  
Figure 16. TO-247, Molded, 3-Lead, JEDEC Variation AB  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-  
ically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO247-003  
©2010 Fairchild Semiconductor Corporation  
FCH47N60F Rev. C1  
www.fairchildsemi.com  
7
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
2Cool™  
AccuPower™  
AX-CAP *  
BitSiC™  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
Current Transfer Logic™  
DEUXPEED  
Dual Cool™  
EcoSPARK  
EfficentMax™  
ESBC™  
FPS™  
F-PFS™  
FRFET  
Global Power Resource  
Green Bridge™  
Green FPS™  
Green FPS™ e-Series™  
Gmax™  
GTO™  
IntelliMAX™  
ISOPLANAR™  
Sync-Lock™  
®*  
®
tm  
®
®
®
PowerTrench  
PowerXS™  
Programmable Active Droop™  
QFET  
QS™  
Quiet Series™  
RapidConfigure™  
SM  
TinyBoost™  
TinyBuck™  
TinyCalc™  
®
®
TinyLogic  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
®
Marking Small Speakers Sound Louder Saving our world, 1mW/W/kW at a time™  
®
TranSiC  
®
and Better™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MicroPak2™  
MillerDrive™  
MotionMax™  
mWSaver™  
OptoHiT™  
SignalWise™  
SmartMax™  
TriFault Detect™  
TRUECURRENT *  
SerDes™  
®
SMART START™  
Solutions for Your Success™  
®
®
SPM  
®
STEALTH™  
SuperFET  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
Fairchild  
®
®
UHC  
®
Fairchild Semiconductor  
FACT Quiet Series™  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
VoltagePlus™  
XS™  
®
FACT  
FAST  
®
®
®
OPTOLOGIC  
OPTOPLANAR  
SupreMOS  
SyncFET™  
FastvCore™  
FETBench™  
®
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
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and (c) whose failure to perform when properly used in accordance with  
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Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
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First Production  
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make changes at any time without notice to improve the design.  
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Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I64  
www.fairchildsemi.com  
©2010 Fairchild Semiconductor Corporation  
FCH47N60F Rev. C1  
8

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