FAN1540 [FAIRCHILD]

1A/1.3A, LDO With Low Quiescent Current; 1A / 1.3A , LDO具有低静态电流
FAN1540
型号: FAN1540
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

1A/1.3A, LDO With Low Quiescent Current
1A / 1.3A , LDO具有低静态电流

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中文:  中文翻译
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www.fairchildsemi.com  
FAN1539/FAN1540  
1A/1.3A, LDO With Low Quiescent Current  
Features  
Description  
Very Low Ground Current (I  
• Excellent Line Regulation  
• Excellent Load Regulation  
Very Low Transient Overshoot  
• Stable with low ESR Output Capacitor (ESR = 0m)  
• Thermal Shutdown  
= 1mA)  
The FAN1539/FAN1540 series of high current LDO (1.0A  
and 1.3A) has been developed for portable applications  
where low quiescent current is an important requirement.  
The device features excellent line and load transient response  
which does not exceed 10% of nominal output value for full  
operating temperature range even during power ON cycle  
and short circuit removal. Internally trimmed, temperature  
compensated bandgap reference guarantees 2.5% accuracy  
for full range of input voltage, output current and tempera-  
ture. Included on the chip are accurate current limit and ther-  
mal shutdown protection. Device stability is achieved with  
only two external low ESR ceramic capacitors.  
GND  
• Current Limit  
• Output Options: 3.3V and 1.8V  
Applications  
• Disk Drive Circuits  
• Desktop Computers  
• Laptop, Notebook Computers  
• General purpose Three Terminal Regulator  
The FAN1539/FAN1540 is available in thermally enhanced  
3x3mm 6-lead MLP, 5x6mm 8-lead MLP package and  
3-lead TO-252 packages. The 5x6mm MLP package version  
features separate Kelvin sense pin for high precision applica-  
tions.  
Block Diagram  
V
V
OUT  
IN  
(Note1)  
X
BANDGAP  
REFERENCE  
V
SENSE  
(Note2)  
CURRRENT  
LIMIT  
SRART-UP  
CIRCUIT  
ERROR  
AMPLIFIER  
THERMAL  
SHUTDOWN  
GND  
Notes:  
1. No connection for FAN1540MMPX.  
2. VSEN available for FAN1540MMPX.  
REV. 1.0.8 3/22/04  
FAN1539/FAN1540  
PRODUCT SPECIFICATION  
Pin Assignments  
TOP VIEW  
1
8
7
6
5
GND  
GND  
GND  
GND  
1
NC  
6
GND  
NC  
V
V
2
5
2
OUT  
OUT  
FAN1540  
FAN1540  
3
V
4
NC  
IN  
V
3
4
SEN  
FAN1539/FAN1540  
3x3mm 6-Lead MLP  
V
GND  
IN  
V
V
IN  
OUT  
GND  
5x6mm 8-Lead MLP  
3-Lead TO-252 PACKAGE  
Pin Description  
Symbol  
Name And Function  
V
Input pin  
IN  
GND  
Ground Pin (Tab)  
V
V
Output pin: Fixed Output Voltage  
OUT  
SEN  
Output sense pin. Connect to V  
No Connection  
if Kelvin sensing is not required  
OUT  
NC  
2
REV. 1.0.8 3/22/04  
PRODUCT SPECIFICATION  
FAN1539/FAN1540  
Absolute Maximum Ratings  
Parameter  
Operating Input Voltage  
Symbol  
Value  
Units  
V
V
10  
IN  
Power Dissipation  
P
Internally  
Limited  
W
D
Short Circuit Output Current  
I
Internally  
Limited  
A
OSH  
Operating Junction Temperature Range  
T
0 to 150  
°C  
°C/W  
°C/W  
°C/W  
°C  
J
Thermal Resistance- Junction to Tab, TO-252  
θ
3
JC  
JC  
JC  
Thermal Resistance- Junction to Tab, 3mmx3mm 6-lead MLP (Note 3)  
Thermal Resistance- Junction to Tab, 5mmx6mm 8-lead MLP (Note 3)  
Storage Temperature Range (Note 3)  
θ
θ
8
4
T
-65 to 150  
240  
STG  
Lead Temperature (I.R. Reflow) 30Sec.  
(Note 4)  
T
°C  
LEAD  
Lead Temperature (Soldering) 10Sec.  
(Note 4)  
T
260  
°C  
LEAD  
Electrostatic Discharge Protection (Note 5)  
HBM  
CDM  
ESD  
4
2
kV  
Notes:  
3. Junction to ambient thermal resistance, θ JA, is a strong function of PCB material, board thickness, thickness and number of  
copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink  
characteristics.Thermal resistance(θJA ), VIN, IOUT must be chosen not to exceed TJ = 150°C.  
4. Soldering temperature should be 260°C for 10 second after 240°C for 30 second in I.R. reflow using 60/40 solder. Maximum  
rate of temperature rise is 3°C/SEC to within 100°C of the final temperature.  
5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).  
REV. 1.0.8 3/22/04  
3
FAN1539/FAN1540  
PRODUCT SPECIFICATION  
Electrical CharacteristicsFAN1539MPX, FAN1540MPX, FAN1540MMPX,  
FAN1540DX  
Unless otherwise specified, V = 4.50V to 7V, T = 25°C, I  
(FAN1539) = 1.0A, I (FAN1540) = 1.3A. Boldface  
MAX  
IN  
j
MAX  
limits apply over operating junction temperature range of 0°C TJ 125°C.  
TEST CONDITIONS  
TEST LIMITS  
Parameter  
Symbol  
VIN  
IOUT  
Min. Typ. Max.  
Units  
Output Voltage  
FAN1540  
VOUT  
4.75V VIN 5.25V  
5mA IOUT IMAX  
3.234 3.300 3.366  
V
3.217  
3.383  
15  
2
mV  
mV  
Line Regulation REG  
5mA IOUT IMAX  
3.0V VIN 5.25V  
(LINE)  
Load Regulation REG  
4.75V  
FAN1539  
FAN1540  
25  
30  
35  
40  
(LOAD)  
5mA IOUT IMAX  
IOUT = IMAX  
0.9  
3.3  
1.2  
V
Dropout Voltage  
(Note 6)  
V
D
Current Limit  
IS  
5.5V  
A
Min. Output  
Current for  
regulation  
IOMIN  
0
mA  
(∆VOUT 3%)  
Temperature  
Stability  
TS  
VN  
IOUT = 5mA  
IOUT = IMAX  
0.3  
%
RMS Output  
Noise  
(Note 7)  
0.003  
%VOUT  
Ripple Rejection  
Ratio (Note 8)  
RA  
5V  
5V  
IOUT = 10mA  
IOUT = 100mA  
IOUT = IMAX  
65  
63  
45  
75  
73  
57  
2.0  
dB  
%
Transient  
Response  
Change of VOUT  
with step load  
change (Note 9)  
1mA to IMAX  
10  
(un-  
der-  
shoot  
or  
over-  
shoot  
of  
VOUT  
-----------------  
IOUT  
tr 1µS  
IMAX to 1mA  
tf 1µS  
VOUT  
)
Transient  
0 to 5V Step Input  
5.0  
%
10  
(un-  
der-  
shoot  
or  
VOUT  
-----------------  
VIN  
1mA IOUT IMAX  
Response  
Change of VOUT  
with application  
of VIN  
tr 1µS  
10% to 90%  
(Note 9)  
over-  
shoot  
of  
VOUT  
)
4
REV. 1.0.8 3/22/04  
PRODUCT SPECIFICATION  
FAN1539/FAN1540  
Electrical CharacteristicsFAN1539MPX, FAN1540MPX, FAN1540MMPX,  
FAN1540DX (Continued)  
Unless otherwise specified, V = 4.50V to 7V, T = 25°C, I  
(FAN1539) = 1.0A, I (FAN1540) = 1.3A. Boldface  
MAX  
IN  
j
MAX  
limits apply over operating junction temperature range of 0°C TJ 125°C.  
TEST CONDITIONS  
TEST LIMITS  
Parameter  
Transient  
Response  
Short circuit  
Removal  
Response  
(Note 9)  
Symbol  
VIN  
IOUT  
Min.  
Typ.  
Max. Units  
5V  
IOUT = short  
to  
IOUT = 10mA  
5.0  
10  
%
VOUT  
-----------------  
VIN  
(over-  
shoot  
or un-  
der-  
@IOUT  
= short  
shoot  
of VO)  
Quiescent  
Current  
IGND  
IGND  
IGND  
TjSD  
V
V
IN 7V  
IN 7V  
I
= 0mA  
1.0  
1.0  
1.0  
160  
15  
2.0  
2.0  
2.0  
mA  
mA  
mA  
°C  
OUT  
Quiescent  
Current  
2mA IOUT IMAX  
0mA IOUT 50mA  
VIN = 5V  
Quiescent  
Current  
Thermal  
Shutdown  
3.0V VIN 5.25V  
3.0 VIN 5.25V  
Thermal  
THYST  
°C  
Hysteresis  
Notes:  
6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the nominal  
value measured at V = 5V.  
IN  
7. Measured within 10Hz to 10kHz bandwidth.  
8. Measured at DC, specified at 120 Hz.  
9. CIN = 22µF, COUT = 10µF. Both capacitors are low ESR X7R type.  
Test Circuit  
V
V
IN  
OUT  
IN  
OUT  
DUT  
22µF  
10µF  
C
IN  
COUT  
GND  
Notes: 1. Use low ESR capacitors.  
2. CIN should be placed as close to VIN as possible.  
REV. 1.0.8 3/22/04  
5
FAN1539/FAN1540  
PRODUCT SPECIFICATION  
Electrical CharacteristicsFAN1540D18X  
Unless otherwise specified, V = 3.135V to 3.465V, T = 25°C, I  
= 1.3A. Boldface limits apply over operating junction  
IN  
j
MAX  
temperature range of 0°C TJ 125°C.  
TEST CONDITIONS  
TEST LIMITS  
Parameter  
Symbol  
VIN  
IOUT  
Min. Typ. Max.  
1.755 1.800 1.845  
Units  
Output Voltage  
VOUT  
3.15V VIN 3.465V  
3.135V VIN 3.465V  
3.3V  
5mA IOUT IMAX  
V
Line Regulation REG  
5mA IOUT IMAX  
3
10  
40  
mV  
mV  
(LINE)  
20  
Load Regulation REG  
(LOAD)  
5mA IOUT IMAX  
Dropout Voltage  
(Note 6)  
V
IOUT = IMAX  
0.9  
2.5  
1.2  
0
V
D
Current Limit  
IS  
3.3V  
A
Min. Output  
Current for  
regulation  
IOMIN  
mA  
(∆VOUT 3%)  
Temperature  
Stability  
TS  
VN  
IOUT = 5mA  
IOUT = IMAX  
0.3  
%
RMS Output  
Noise  
(Note 7)  
0.003  
%VOUT  
Ripple Rejection  
Ratio (Note 8)  
RA  
3.3V  
3.3V  
IOUT = 500mA  
40  
dB  
%
Transient  
Response  
Change of VOUT  
with step load  
change (Note 9)  
1mA to IMAX  
2.0  
10  
(un-  
der-  
shoot  
or  
over-  
shoot  
of  
VOUT  
-----------------  
IOUT  
tr 1µS  
IMAX to 1mA  
tf 1µS  
VOUT  
)
Transient  
0 to 1.8V Step Input  
3.0  
%
10  
(un-  
der-  
shoot  
or  
VOUT  
-----------------  
VIN  
1mA IOUT IMAX  
Response  
Change of VOUT  
with application  
of VIN  
tr 1µS  
10% to 90%  
(Note 9)  
over-  
shoot  
of  
VOUT  
)
6
REV. 1.0.8 3/22/04  
PRODUCT SPECIFICATION  
FAN1539/FAN1540  
Electrical CharacteristicsFAN1540D18X (Continued)  
Unless otherwise specified, V = 3.135V to 3.465V, T = 25°C. Boldface limits apply over operating junction temperature  
IN  
A
range of 0°C TJ 125°C.  
TEST CONDITIONS  
TEST LIMITS  
Parameter  
Transient  
Response  
Short circuit  
Removal  
Response  
(Note 9)  
Symbol  
VIN  
IOUT  
Min.  
Typ.  
Max. Units  
3.3V  
I
OUT = short  
3.0  
10  
%
VOUT  
-----------------  
VIN  
to  
(over-  
shoot  
or un-  
der-  
I
OUT = 10mA  
@IOUT  
= short  
shoot  
of VO)  
IGND  
IGND  
Quiescent  
Current  
3.3V  
3.3V  
I
= 0mA  
1.0  
1.0  
160  
10  
2.0  
2.0  
mA  
mA  
°C  
OUT  
Quiescent  
Current  
2mA IOUT IMAX  
Thermal  
Shutdown  
TjSD  
THYST  
°C  
Thermal  
Hysteresis  
Notes:  
6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the nominal  
value measured at V = 3.3V.  
IN  
7. Measured within 10Hz to 10kHz bandwidth.  
8. Measured at DC, specified at 120 Hz.  
9. CIN = 22µF, COUT = 10µF. Both capacitors are low ESR X7R type.  
Test Circuit  
V
V
IN  
OUT  
IN  
OUT  
DUT  
22µF  
10µF  
C
IN  
COUT  
GND  
Notes: 1. Use low ESR capacitors.  
2. CIN should be placed as close to VIN as possible.  
REV. 1.0.8 3/22/04  
7
FAN1539/FAN1540  
PRODUCT SPECIFICATION  
Typical Performance CharacteristicsFAN1539MPX, FAN1540MPX,  
FAN1540MMPX, FAN1540DX  
Output Voltage vs. Temperature  
Ground Pin Current vs. Temperature  
3.310  
3.305  
3.300  
3.295  
3.290  
3.285  
3.280  
3.275  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
VIN = 5V  
OUT = 10mA  
I
VIN = 5V  
OUT = 10mA  
I
Typical3.3VDevice  
0
50  
100  
150  
-50  
0
50  
100  
150  
Ambient Temperature (  
°
C)  
Ambient Temperature (°C)  
Ground Pin Current vs. Output Current  
Ground Pin Current vs. Input Voltage  
1.07  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
1.06  
1.05  
1.04  
1.03  
1.02  
1.01  
1.00  
VIN = 5V  
IOUT = 10mA  
0
200  
400  
600  
800  
1000  
1200  
1400  
4
5
6
7
8
9
10  
Output Current (mA)  
Input Voltage (V)  
Output Voltage vs. Output Current  
Dropout Voltage vs. Temperature  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
IOUT = 1.3A  
VIN = 5V  
Tj = 25°C  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
-50  
0
50  
100  
Output Current (A)  
Ambient Temperature (°C)  
8
REV. 1.0.8 3/22/04  
PRODUCT SPECIFICATION  
FAN1539/FAN1540  
Typical Performance CharacteristicsFAN1539MPX, FAN1540MPX,  
FAN1540MMPX, FAN1540DX (Continued)  
Line Transient Response  
Load Transient Response  
VIN = 5V  
3.300V  
IOUT = IMAX  
3.300V  
CIN = 22µF  
COUT = 10  
CIN = 22µF  
COUT = 10  
µ
F
µ
F
(Ceramic Low ESR Capacitors)  
(Ceramic Low ESR Capacitors)  
t =  
r
1µs  
t = 1µ  
f
s
t = 1µs  
r
Tj = 25°C  
Tj = 25°C  
Time (20  
µ
s/div)  
Time (20µs/div)  
Short Circuit Removal Response  
Ripple Rejection vs. Frequency  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 5V  
IN  
3.300V  
CIN = 22  
COUT = 10  
(Ceramic Low ESR Capacitors)  
µF  
µ
F
VIN = 5V  
IOUT = 10mA  
~3.3A  
COUT = 10  
µ
F (Low ESR)  
t = 1µs  
T = 25°C  
f
j
10mA  
101  
102  
103  
104  
105  
106  
Frequency (Hz)  
Time (40µs/div)  
Output Spectral Noise Density  
vs. Frequency  
Typical Region of Stability  
ESR vs. Output Current  
*
1000  
100  
10  
Region of Instability  
Region of Stability  
VIN = 5V  
CIN= 22  
µ
F
1
COUT = 10µF  
Tj = 25°C  
0.1  
0
200  
400  
Output Current (mA)  
: ESR Values measured at f=10kHz  
600  
800 1000 1200 1400  
Frequency (Hz)  
*Note  
Note:  
Transient response tests require short lead lengths and low resistance connections at source and load.  
REV. 1.0.8 3/22/04  
9
FAN1539/FAN1540  
PRODUCT SPECIFICATION  
Typical Performance CharacteristicsFAN1540D18X  
Output Voltage vs. Temperature  
Ground Pin Current vs. Temperature  
1.810  
1.805  
1.800  
1.795  
1.790  
1.785  
1.780  
1.775  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
VIN = 3.3V  
OUT = 10mA  
I
VIN = 3.3V  
IOUT = 10mA  
Typical 1.8V Device  
0
50  
100  
150  
0
50  
100  
150  
Ambient Temperature (  
°
C)  
Ambient Temperature (°C)  
Ground Pin Current vs. Output Current  
Ground Pin Current vs. Input Voltage  
1.07  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
1.06  
1.05  
1.04  
1.03  
1.02  
1.01  
1.00  
VIN = 3.3V  
IOUT = 10mA  
0
200  
400  
600  
800  
1000  
1200  
1400  
3
4
5
6
7
8
9
10  
Output Current (mA)  
Input Voltage (V)  
Output Voltage vs. Output Current  
Dropout Voltage vs. Temperature  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
VIN = 3.3V  
IOUT = 1.3A  
Tj = 25°C  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
-50  
0
50  
100  
Output Current (A)  
Ambient Temperature (°C)  
10  
REV. 1.0.8 3/22/04  
FAN1539/FAN1540  
PRODUCT SPECIFICATION  
The power dissipation is equal to the product of the input-to-  
output voltage differential and the output current plus the  
ground current multiplied by the input voltage, or:  
Applications Information  
General Circuit Description  
PD = (VIN – VOUT)IOUT + VINIGND  
The FAN1539/FAN1540 is an advanced low dropout voltage  
regulator, specially designed for applications in portable  
computers, where high performance and low quiescent cur-  
rent is required. The device has an internal trimmed bandgap  
voltage reference and an internal output voltage sense  
divider. These two signals form the input to the error ampli-  
fier which regulates the output voltage.  
The ground pin current, I  
can be found in the charts  
GND  
provided in the “Electrical Characteristics” section.  
The relationship describing the thermal behavior of the  
package is:  
The FAN1539/FAN1540 has a complete set of internal pro-  
tection circuitry including thermal shutdown, short circuit  
current limit and electrostatic discharge protection. Low  
ESR ceramic capacitors are needed for input as well as out-  
put pins to maintain the circuit stability.  
T
J(max) – T  
A   
-----------------------------  
PD(max)  
=
θJA  
where T  
is the maximum allowable junction tempera-  
ture of the die, which is 150°C, and T is the ambient operat-  
J(max)  
A
ing temperature. θ is dependent on the surrounding PC  
board layout and can be empirically obtained. While the θ  
JA  
Short Circuit Current Limit  
JC  
The device has internal over-current limit and short circuit  
protection. Under over-current conditions the device current  
is determined by the current limit threshold. Once the device  
is released from short circuit conditions, the normal level of  
current limit is gradually re-established as the device output  
voltage reaches normal levels. Special circuitry has been  
added to ensure that recovery from short circuit current con-  
ditions does not lead to excessive overshoot of the output  
voltage -- a phenomenon often encountered in conventional  
regulators.  
(junction-to-case) of the 6-lead MLP package is specified at  
8°C /W, the θ for a minimum PWB footprint will be in  
JA  
substantially higher. This can be improved upon by provid-  
ing a heat sink of surrounding copper ground on the PWB.  
Depending on the size of the copper area, and the thickness  
of the copper layer, the resulting θ can vary over a wide  
JA  
range. The addition of backside copper with through-holes,  
stiffeners, and other enhancements can also aid in reducing  
thermal resistance. Thermal simulations performed on a  
thermally optimized board layout indicate that θ as low  
JA  
as 20°C /W can be achieved. For example, the heat contrib-  
uted by the dissipation of other devices located nearby must  
be included in the design considerations.  
Thermal Protection  
The FAN1539/FAN1540 is designed to supply at least 1A/  
1.3A output currents. Excessive output load at high input -  
output voltage difference will cause the device temperature  
to increase and exceed maximum ratings due to power dissi-  
pation. During output overload conditions, when the die tem-  
perature exceeds the shutdown limit temperature of 160°C,  
an onboard thermal protection will disable the output until  
the temperature drops approximately 15°C below the limit,  
at which point the output is re-enabled.  
Overload conditions also need to be considered. It is possible  
for the device to enter a thermal cycling loop, in which the  
circuit enters a shutdown condition, cools, re-enables, and  
then again overheats and shuts down repeatedly due to a per-  
sistent fault condition.  
Capacitor ESR and Printed Circuit Board Layout  
The FAN1539/FAN1540 has been optimized to accommo-  
date low ESR bypass capacitors down to 0 m. For best  
results it is important to place both input and output bypass  
capacitors as near to the input and output pins as possible.  
Use of X7R types such as Murata’s  
Thermal Characteristics  
The FAN1539/FAN1540 is designed to supply at least 1A/  
1.3A at the specified output voltage with an operating die  
(junction) temperature of up to 125°C. Once the power dissi-  
pation and thermal resistance is known, the maximum junc-  
tion temperature of the device can be calculated. While the  
power dissipation is calculated from known electrical param-  
eters, the actual thermal resistance depends on the thermal  
characteristics of the chosen package and the surrounding  
PC board copper to which it is mounted.  
GRM31CR70J106KA01B (10µF) and  
GRM43ER71A226KE01B (22µF) or similar component  
from TDK. The capacitors should connect directly to the  
ground plane. Use of ground plane on the top and the bottom  
side of the PCB is recommended. As many via as possible  
should be used to minimize ground plane resistance.  
11  
REV. 1.0.8 3/22/04  
PRODUCT SPECIFICATION  
FAN1539/FAN1540  
Mechanical Dimensions  
5x6mm 8-Lead MLP  
REV. 1.0.8 3/22/04  
12  
PRODUCT SPECIFICATION  
FAN1539/FAN1540  
Mechanical Dimensions  
3x3mm 6-Lead MLP  
REV. 1.0.8 3/22/04  
13  
PRODUCT SPECIFICATION  
FAN1539/FAN1540  
Mechanical Dimensions  
3-Lead TO-252  
REV. 1.0.8 3/22/04  
14  
FAN1539/FAN1540  
PRODUCT SPECIFICATION  
Ordering Information  
Product Number  
FAN1540MMPX  
FAN1539MX  
Output Voltage  
Package  
3.3V  
3.3V  
3.3V  
3.3V  
1.8V  
5x6mm 8-Lead MLP in T&R  
3x3mm 6-Lead MLP in T&R  
3x3mm 6-Lead MLP in T&R  
3-Lead TO-252 in T&R  
FAN1540MX  
FAN1540DX  
FAN1540D18X  
3-Lead TO-252 in T&R  
Tape and Reel Information  
Quantity  
Reel Size  
Width  
3000  
7"  
8mm  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO  
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME  
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, and (c) whose failure to  
perform when properly used in accordance with  
instructions for use provided in the labeling, can be  
reasonably expected to result in a significant injury of the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
REV. 1.0.8 3/22/04  
2004 Fairchild Semiconductor Corporation  

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