FAN1540DX [FAIRCHILD]

1A/1.3A, LDO with Low Quiescent Current; 1A / 1.3A , LDO具有低静态电流
FAN1540DX
型号: FAN1540DX
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

1A/1.3A, LDO with Low Quiescent Current
1A / 1.3A , LDO具有低静态电流

调节器 输出元件
文件: 总15页 (文件大小:577K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
November 2005  
FAN1539/FAN1540  
1A/1.3A, LDO with Low Quiescent Current  
Features  
Description  
Very Low Ground Current (I  
Excellent Line Regulation  
Excellent Load Regulation  
= 1mA)  
The FAN1539/FAN1540 series of high current LDOs  
(1.0A and 1.3A) has been developed for portable appli-  
cations where low quiescent current is an important  
requirement. The device features excellent line and load  
transient response which does not exceed 10% of nomi-  
nal output value for full operating temperature range  
even during power ON cycle and short circuit removal.  
Internally trimmed, temperature compensated bandgap  
reference guarantees 2.5% accuracy for full range of  
input voltage, output current and temperature. Included  
on the chip are accurate current limit and thermal shut-  
down protection. Device stability is achieved with only  
two external low ESR ceramic capacitors.  
GND  
Very Low Transient Overshoot  
Stable with low ESR Output Capacitor (ESR = 0m)  
Thermal Shutdown  
Current Limit  
Output Options: 3.3V and 1.8V  
Applications  
Disk Drive Circuits  
The FAN1539/FAN1540 is available in thermally  
enhanced 3x3mm 6-lead MLP, 5x6mm 8-lead MLP and  
3-lead TO-252 packages. The 5x6mm MLP package ver-  
sion features a separate Kelvin sense pin for high preci-  
sion applications.  
Desktop Computers  
Laptop, Notebook Computers  
General Purpose Three Terminal Regulator  
Ordering Information  
Product Number  
FAN1540MMPX  
FAN1539MPX  
FAN1540MPX  
FAN1540DX  
Output Voltage  
Package  
3.3V  
3.3V  
3.3V  
3.3V  
1.8V  
5x6mm 8-Lead MLP in T&R  
3x3mm 6-Lead MLP in T&R  
3x3mm 6-Lead MLP in T&R  
3-Lead TO-252 in T&R  
3-Lead TO-252 in T&R  
FAN1540D18X  
Tape and Reel Information  
Quantity  
Reel Size  
Width  
3000  
7"  
8mm  
©2005 Fairchild Semiconductor Corporation  
1
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Block Diagram  
VOUT  
VIN  
(Note 1)  
X
BANDGAP  
REFERENCE  
VSENSE  
(Note 2)  
CURRRENT  
LIMIT  
START-UP  
CIRCUIT  
ERROR  
AMPLIFIER  
THERMAL  
SHUTDOWN  
GND  
Notes:  
1. No connection for FAN1540MMPX.  
2. V available for FAN1540MMPX.  
SEN  
Pin Assignments  
TOP VIEW  
1
8
7
6
5
GND  
GND  
GND  
GND  
1
NC  
6
GND  
NC  
V
V
2
5
2
OUT  
OUT  
FAN1540  
FAN1540  
3
V
4
NC  
IN  
V
3
4
SEN  
FAN1539/FAN1540  
3x3mm 6-Lead MLP  
V
GND  
IN  
V
V
IN  
OUT  
5x6mm 8-Lead MLP  
GND  
3-Lead TO-252 PACKAGE  
Pin Description  
Symbol  
Name and Function  
V
Input pin  
IN  
GND  
Ground Pin (Tab)  
V
Output pin: Fixed Output Voltage  
OUT  
V
Output sense pin. Connect to V if Kelvin sensing is not required  
OUT  
SEN  
NC  
No Connection  
2
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Units  
V
Operating Input Voltage  
Power Dissipation  
V
10  
IN  
P
Internally  
Limited  
W
D
Short Circuit Output Current  
I
Internally  
Limited  
A
OSH  
Operating Junction Temperature Range  
T
0 to 150  
°C  
°C/W  
°C/W  
°C/W  
°C  
J
Thermal Resistance–Junction to Tab, TO-252  
θ
3
JC  
JC  
JC  
Thermal Resistance–Junction to Tab, 3mmx3mm 6-lead MLP (Note 3)  
Thermal Resistance–Junction to Tab, 5mmx6mm 8-lead MLP (Note 3)  
Storage Temperature Range (Note 3)  
θ
θ
8
4
T
-65 to 150  
STG  
Lead Temperature (I.R. Reflow) 30 Sec. (Note 4)  
Lead Temperature (Soldering) 10 Sec. (Note 4)  
T
T
240  
260  
4
°C  
LEAD  
LEAD  
°C  
Electrostatic Discharge Protection (Note 5)  
HBM  
CDM  
ESD  
kV  
2
Notes:  
3. Junction to ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and  
number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink  
characteristics.Thermal resistance (θJA), V , I  
must be chosen not to exceed T = 150°C.  
IN OUT  
J
4. Soldering temperature should be 260°C for 10 second after 240°C for 30 second in I.R. reflow using 60/40 solder.  
Maximum rate of temperature rise is 3°C/SEC to within 100°C of the final temperature.  
5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).  
3
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Electrical Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX,  
FAN1540DX  
Unless otherwise specified, V = 4.50V to 7V, T = 25°C, I  
(FAN1539) = 1.0A, I (FAN1540) = 1.3A.  
MAX  
IN  
j
MAX  
Boldface limits apply over operating junction temperature range of 0°C T 125°C.  
J
Test Conditions  
Test Limits  
Parameter  
Symbol  
V
I
Min. Typ.  
Max.  
3.366  
3.383  
15  
Units  
IN  
OUT  
Output Voltage  
FAN1540  
V
4.75V V 5.25V  
5mA I  
I  
I  
3.234 3.300  
V
OUT  
IN  
OUT  
MAX  
3.217  
2
Line Regulation  
REG  
3.0V V 5.25V  
5mA I  
mV  
mV  
(LINE)  
IN  
OUT  
MAX  
Load Regulation REG  
4.75V  
5mA I  
FAN1539  
FAN1540  
25  
35  
(LOAD)  
OUT  
MAX  
I  
30  
40  
Dropout Voltage  
(Note 6)  
V
I
= I  
0.9  
1.2  
V
D
OUT  
MAX  
Current Limit  
I
5.5V  
3.3  
A
S
Min. Output  
Current for  
regulation  
I
0
mA  
OMIN  
(V  
3%)  
OUT  
Temperature  
Stability  
T
V
I
= 5mA  
0.3  
%
S
OUT  
RMS Output  
Noise  
I
= I  
0.003  
%V  
OUT  
N
OUT  
MAX  
(Note 7)  
Ripple Rejection  
Ratio (Note 8)  
R
5V  
5V  
I
= 10mA  
65  
63  
45  
75  
73  
57  
2.0  
dB  
A
OUT  
I
= 100mA  
OUT  
I
= I  
MAX  
OUT  
Transient  
Response  
1mA to I  
10  
MAX  
t 1µS  
VOUT  
(under-  
shoot or  
overshoot  
%
%
------------------  
r
IOUT  
Change of V  
OUT  
I
to 1mA  
t 1µS  
MAX  
f
with step load  
change (Note 9)  
of V  
)
OUT  
Transient  
Response  
0 to 5V Step Input  
1mA I  
I  
5.0  
10  
OUT  
MAX  
VOUT  
t 1µS  
(under-  
shoot or  
overshoot  
r
------------------  
10% to 90%  
VIN  
Change of V  
OUT  
with application  
of V  
of V  
)
IN  
OUT  
(Note 9)  
Transient  
Response  
Short circuit  
Removal  
Response  
(Note 9)  
5V  
I
= short  
to  
= 10mA  
5.0  
1.0  
10 (over-  
shoot or  
under-  
%
mA  
OUT  
VOUT  
VIN  
------------------  
I
OUT  
shoot of  
@I  
=
V )  
OUT  
O
short  
Quiescent  
Current  
I
V
7V  
I
= 0mA  
2.0  
GND  
IN  
OUT  
4
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Electrical Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX,  
FAN1540DX (Continued)  
Unless otherwise specified, V = 4.50V to 7V, T = 25˚C, I  
(FAN1539) = 1.0A, I (FAN1540) = 1.3A.  
IN  
j
MAX  
MAX  
Boldface limits apply over operating junction temperature range of 0°C T 125°C.  
J
Test Conditions  
Test Limits  
Parameter  
Symbol  
V
I
Min. Typ.  
Max.  
2.0  
Units  
IN  
OUT  
Quiescent  
Current  
I
V
V
7V  
2mA I  
I  
MAX  
1.0  
1.0  
160  
15  
mA  
GND  
IN  
OUT  
Quiescent  
Current  
I
= 5V  
0mA I 50mA  
OUT  
2.0  
mA  
°C  
GND  
IN  
Thermal  
Shutdown  
T
3.0V V 5.25V  
jSD  
IN  
Thermal  
Hysteresis  
T
3.0V V 5.25V  
°C  
HYST  
IN  
Notes:  
6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the  
nominal value measured at V = 5V.  
IN  
7. Measured within 10Hz to 10kHz bandwidth.  
8. Measured at DC, specified at 120 Hz.  
9. C = 22µF, C  
= 10µF. Both capacitors are low ESR X7R type.  
IN  
OUT  
Test Circuit  
VOUT  
VIN  
IN  
OUT  
DUT  
10µF  
CIN  
22µF  
COUT  
GND  
Notes: 1. Use low ESR capacitors.  
2. CIN should be placed as close to VIN as possible.  
5
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Electrical Characteristics—FAN1540D18X  
Unless otherwise specified, V = 3.135V to 3.465V, T = 25°C, I  
= 1.3A. Boldface limits apply over operating  
IN  
j
MAX  
junction temperature range of 0°C T 125°C.  
J
Test Conditions  
Test Limits  
Parameter  
Output Voltage  
Line Regulation  
Load Regulation  
Symbol  
V
I
Min. Typ.  
Max.  
1.845  
10  
Units  
V
IN  
OUT  
V
3.15V V 3.465V 5mA I  
I  
I  
I  
1.755 1.800  
OUT  
IN  
OUT  
OUT  
OUT  
MAX  
MAX  
MAX  
REG  
3.135V V 3.465V 5mA I  
3
mV  
mV  
V
(LINE)  
IN  
REG  
3.3V  
5mA I  
20  
0.9  
40  
(LOAD)  
Dropout Voltage  
(Note 6)  
V
I
= I  
MAX  
1.2  
D
OUT  
Current Limit  
I
3.3V  
2.5  
A
S
Min. Output  
Current for  
regulation  
I
0
mA  
OMIN  
(V  
3%)  
OUT  
Temperature  
Stability  
T
V
I
= 5mA  
0.3  
0.003  
40  
%
S
OUT  
RMS Output  
Noise (Note 7)  
I
= I  
%V  
OUT  
N
OUT  
MAX  
Ripple Rejection  
Ratio (Note 8)  
R
3.3V  
3.3V  
I
= 500mA  
dB  
A
OUT  
Transient  
Response  
1mA to I  
2.0  
10  
MAX  
t 1µS  
VOUT  
(undershoot  
orovershoot  
%
------------------  
r
IOUT  
Change of V  
OUT  
I
to 1mA  
t 1µS  
MAX  
with step load  
change (Note 9)  
of V  
)
OUT  
f
Transient  
Response  
Change of V  
0 to 1.8V Step Input  
1mA I  
I  
3.0  
3.0  
10  
%
%
OUT  
MAX  
VOUT  
VIN  
t 1µS  
(undershoot  
orovershoot  
------------------  
r
10% to 90%  
OUT  
with application of  
(Note 9)  
of V  
)
OUT  
V
IN  
Transient  
Response  
Short circuit  
Removal  
Response  
(Note 9)  
3.3V  
I
= short  
to  
= 10mA  
10  
OUT  
VOUT  
(overshoot  
or under-  
shoot of V )  
------------------  
I
VIN  
OUT  
O
@I  
=
OUT  
short  
Quiescent Current  
Quiescent Current  
Thermal Shutdown  
Thermal Hysteresis  
I
I
3.3V  
3.3V  
I
= 0mA  
OUT  
1.0  
1.0  
160  
10  
2.0  
2.0  
mA  
mA  
°C  
GND  
GND  
2mA I  
I  
OUT  
MAX  
T
jSD  
T
°C  
HYST  
Notes:  
6 Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the  
nominal value measured at V = 3.3V.  
IN  
7. Measured within 10Hz to 10kHz bandwidth.  
8. Measured at DC, specified at 120 Hz.  
9. C = 22µF, C  
= 10µF. Both capacitors are low ESR X7R type.  
IN  
OUT  
6
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Test Circuit  
VOUT  
VIN  
IN  
OUT  
DUT  
10µF  
CIN  
22µF  
COUT  
GND  
Notes: 1. Use low ESR capacitors.  
2. CIN should be placed as close to VIN as possible.  
7
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Typical Performance Characteristics—FAN1539MPX, FAN1540MPX,  
FAN1540MMPX, FAN1540DX  
Output Voltage vs. Temperature  
Ground Pin Current vs. Temperature  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
3.310  
3.305  
3.300  
3.295  
3.290  
3.285  
3.280  
3.275  
V IN = 5V  
IOUT  
= 10mA  
V
= 5V  
IN  
I
= 10mA  
OUT  
Typical 3.3V Device  
0
50  
100  
150  
-50  
0
50  
100 150  
Ambient Temperature (°C)  
Ambient Temperature (°C)  
Ground Pin Current vs. Input Voltage  
Ground Pin Current vs. Output Current  
1.07  
1.06  
1.05  
1.04  
1.03  
1.02  
1.01  
1.00  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
I
= 10 mA  
VIN = 5V  
OUT  
4
5
6
7
8
9
10  
0
200  
400  
600  
800  
1000  
1200 1400  
Input Voltage (V)  
Output Current (mA)  
Dropout Voltage vs. Temperature  
Output Voltage vs. Output Current  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
IOUT = 1.3A  
VIN = 5V  
T j = 25°C  
IO U  
T
=
0
.
5
A
-50  
0
50  
100  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
Ambient Temperature (°C)  
Output Current (A)  
8
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Typical Performance Characteristics—FAN1539MPX, FAN1540MPX,  
FAN1540MMPX, FAN1540DX (Continued)  
Line Transient Response  
Load Transient Response  
V
= 5V  
IN  
3.300V  
I
= I  
MAX  
OUT  
3.300V  
C
= 22µF  
= 10µF  
IN  
C
= 22µF  
= 10µF  
IN  
C
OUT  
C
OUT  
(Ceramic Low ESR Capacitors)  
(Ceramic Low ESR Capacitors)  
t
t
=1µs  
= 1µs  
= 25°C  
r
f
t
= 1µs  
r
T
j
T
= 25°C  
j
Time (20µs/div)  
Time (20µs/div)  
Short Circuit Removal Response  
Ripple Rejection vs. Frequency  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 5V  
IN  
3.300V  
C
C
= 22µF  
= 10µF  
IN  
OUT  
(Ceramic Low ESR Capacitors)  
V
IN = 5V  
~3.3A  
IOUT = 10mA  
t
= 1µs  
f
COUT = 10µF (Low ESR)  
T
= 25°C  
j
10mA  
1
2
3
4
5
6
10  
10  
10  
10  
10  
10  
Frequency (Hz)  
Time (40µs/div)  
Typical Region of Stability  
ESR vs. Output Current*  
Output Spectral Noise Density  
vs. Frequency  
1000  
100  
10  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
Region of Instability  
Region of Stability  
V
= 5V  
IN  
I
= I  
OUT  
MAX  
V
C
C
= 5V  
1
IN  
IN  
= 22µF  
C
C
= 22µF  
OUT  
IN  
= 10µF  
OUT  
= 10µF  
T = 25°C  
j
Ceramic Low ESR  
0.1  
0
200  
400  
600  
Output Current (mA)  
*Note: ESR Values measured at f = 10kHz  
800  
1000  
1200  
1400  
10  
100  
1K  
10K  
100K  
Frequency (H z)  
Note:  
Transient response tests require short lead lengths and low resistance connections at source and load.  
9
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Typical Performance Characteristics—FAN1540D18X  
Output Voltage vs. Temperature  
Ground Pin Current vs. Temperature  
1.810  
1.805  
1.800  
1.795  
1.790  
1.785  
1.780  
1.775  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
V
= 3.3V  
IN  
I
= 10mA  
OUT  
V
= 3.3V  
IN  
OUT = 10mA  
Typical 1.8V Device  
I
0
50  
100  
150  
0
50  
100  
150  
Ambient Temperature (°C)  
Ambient Temperature (°C)  
Ground Pin Current vs. Input Voltage  
Ground Pin Current vs. Output Current  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
1.07  
1.06  
1.05  
1.04  
1.03  
1.02  
1.01  
1.00  
V
= 3.3V  
I
= 10mA  
IN  
OUT  
3
4
5
6
7
8
9
10  
0
200  
400  
600  
800  
1000  
1200  
1400  
Input Voltage (V)  
Output Current (mA)  
Output Voltage vs. Output Current  
Dropout Voltage vs. Temperature  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
1.9  
1.8  
1.7  
IOUT  
= 1.3A  
1.6  
1.5  
1.4  
I
O
U
T
=
0
.
5
A
VIN = 3.3V  
Tj = 25°C  
0.6  
-50  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
50  
100  
Ambient Temperature (°C)  
Output Current (A)  
10  
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Applications Information  
The ground pin current, I  
provided in the “Electrical Characteristics” section.  
can be found in the charts  
General Circuit Description  
GND  
The FAN1539/FAN1540 is an advanced low dropout volt-  
age regulator, specially designed for applications in por-  
table computers, where high performance and low  
quiescent current are required. The device has an inter-  
nal trimmed bandgap voltage reference and an internal  
output voltage sense divider. These two signals form the  
input to the error amplifier which regulates the output  
voltage.  
The relationship describing the thermal behavior of the  
package is:  
T
J(max) T  
A   
--------------------------------  
PD(max)  
=
θJA  
where T  
is the maximum allowable junction temper-  
J(max)  
The FAN1539/FAN1540 has a complete set of internal  
protection circuitry including thermal shutdown, short cir-  
cuit current limit and electrostatic discharge protection.  
Low ESR ceramic capacitors are needed for input as  
well as output pins to maintain the circuit stability.  
ature of the die, which is 150°C, and T is the ambient  
A
operating temperature. θ  
is dependent on the sur-  
rounding PC board layout and can be empirically  
JA  
obtained. While the θ (junction-to-case) of the 6-lead  
JC  
MLP package is specified at 8°C /W, the θ for a mini-  
JA  
mum PWB footprint will be in substantially higher. This  
can be improved upon by providing a heat sink of sur-  
rounding copper ground on the PWB. Depending on the  
size of the copper area, and the thickness of the copper  
Short Circuit Current Limit  
The device has internal over-current limit and short cir-  
cuit protection. Under over-current conditions the device  
current is determined by the current limit threshold. Once  
the device is released from short circuit conditions, the  
normal level of current limit is gradually re-established as  
the device output voltage reaches normal levels. Special  
circuitry has been added to ensure that recovery from  
short circuit current conditions does not lead to exces-  
sive overshoot of the output voltage — a phenomenon  
often encountered in conventional regulators.  
layer, the resulting θ can vary over a wide range. The  
JA  
addition of backside copper with through-holes, stiffen-  
ers, and other enhancements can also aid in reducing  
thermal resistance.Thermal simulations performed on  
a thermally optimized board layout indicate that θ  
JA  
as low as 20°C /W can be achieved. For example, the  
heat contributed by the dissipation of other devices  
located nearby must be included in the design consider-  
ations.  
Thermal Protection  
Overload conditions also need to be considered. It is  
possible for the device to enter a thermal cycling loop, in  
which the circuit enters a shutdown condition, cools, re-  
enables, and then again overheats and shuts down  
repeatedly due to a persistent fault condition.  
The FAN1539/FAN1540 is designed to supply at least  
1A/1.3A output currents. Excessive output load at high  
input-output voltage difference will cause the device tem-  
perature to increase and exceed maximum ratings due  
to power dissipation. During output overload conditions,  
when the die temperature exceeds the shutdown limit  
temperature of 160°C, an onboard thermal protection will  
disable the output until the temperature drops approxi-  
mately 15°C below the limit, at which point the output is  
re-enabled.  
Capacitor ESR and Printed Circuit Board  
Layout  
The FAN1539/FAN1540 has been optimized to accom-  
modate low ESR bypass capacitors down to 0 m.  
For best results it is important to place both input and  
output bypass capacitors as near to the input and  
output pins as possible. Use of X7R types such as  
Thermal Characteristics  
The FAN1539/FAN1540 is designed to supply at least  
1A/1.3A at the specified output voltage with an operating  
die (junction) temperature of up to 125°C. Once the  
power dissipation and thermal resistance is known, the  
maximum junction temperature of the device can be cal-  
culated. While the power dissipation is calculated from  
known electrical parameters, the actual thermal resis-  
tance depends on the thermal characteristics of the cho-  
sen package and the surrounding PC board copper to  
which it is mounted.  
Murata’s  
GRM31CR70J106KA01B  
(10µF)  
and  
GRM43ER71A226KE01B (22µF) or similar compo-  
nent from TDK. The capacitors should connect directly  
to the ground plane. Use of ground plane on the top and  
the bottom side of the PCB is recommended. As many  
vias as possible should be used to minimize ground  
plane resistance.  
The power dissipation is equal to the product of the  
input-to-output voltage differential and the output current  
plus the ground current multiplied by the input voltage,  
or:  
PD = (VIN VOUT)IOUT + VINIGND  
11  
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Mechanical Dimensions  
5x6mm 8-Lead MLP  
5.0  
A
4.50  
B
6.25  
3.50  
6.0  
4.25  
(1.00)  
0.25  
C
2X  
0.65 TYP  
1.27 TYP  
TOP VIEW  
SIDE VIEW  
0.25  
C
2X  
C
LAND PATTERN RECOMMENDATION  
0.10  
0.08  
(0.25)  
1.0 MAX  
C
C
0.05  
0.00  
SEATING  
PLANE  
4.25  
1.75  
A
1
2
3
4
0.75  
A
A
0.35  
PIN #1 IDENT.  
(OPTIONAL)  
NOTES:  
A)  
DOES NOT FULLY CONFORM TO JEDEC  
REGISTRATION MO-229, DATED 11/2001.  
3.25  
1.25  
B)  
DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONING AND TOLERANCES PER  
ASME Y14.5–1994.  
8
7
6
5
0.28–0.40 A  
0.10 M  
1.27  
C
C
A B  
3.81  
A
M
0.05  
BOTTOM VIEW  
12  
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Mechanical Dimensions  
3x3mm 6-Lead MLP  
3.0  
A
B
0.15 C  
2X  
2.45  
0.10 C  
2X  
2.15  
3.45  
1.85  
2.6  
3.0  
(0.65)  
0.95 TYP  
0.15 C  
2.6  
2X  
0.10 C  
2X  
0.65 TYP  
TOP VIEW  
RECOMMENDED LAND PATTERN  
1.0 MAX  
0.10 C  
0°~12°  
1.00  
0.65  
0.08 C  
0.05  
0.00  
(0.20)  
C
SIDE VIEW  
SEATING  
PLANE  
2.25  
0.95  
1
3
0.45  
0.20  
1.65  
0.2 MIN  
4
6
0.30~0.45  
M
1.90  
Ø0.10  
Ø0.05  
C A B  
C
M
BOTTOM VIEW  
NOTES:  
A. CONFORMS TO JEDEC REGISTRATION MO-229,  
VARIATION VEEA, DATED 11/2001  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994  
13  
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
Mechanical Dimensions  
3-Lead TO-252  
A
6.73  
6.35  
6.00 MIN  
5.46  
5.21  
L3  
4
6.50 MIN  
3.00 MIN  
D
6.25  
1.02  
0.64  
C
2
1
3
1
3
1.14  
0.76  
2.30  
1.40 MIN  
(0.59)  
0.89  
0.64  
4.60  
2.29  
4.57  
E1  
M
M
C
0.25  
A
LAND PATTERN RECOMMENDATION  
B
2.39  
2.18  
SEE  
NOTE D  
0.58  
0.46  
4
D1  
10.41  
9.40  
SEE  
DETAIL A  
2
1
3
0.10  
B
NOTES: UNLESS OTHERWISE SPECIFIED  
0.51  
GAGE PLANE  
A)  
B)  
ALL DIMENSIONS ARE IN MILLIMETERS.  
THIS PACKAGE CONFORMS TO JEDEC, TO-252,  
ISSUE C. VARIATION AA & AB, DATED NOV. 1999.  
0.61  
0.46  
(1.54)  
C) DIMENSIONING AND TOLERANCING PER  
ASME Y14.5–1994.  
10°  
0°  
D) HEAT SINK TOP EDGE COULD BE IN CHAMFERED  
CORNERS OR EDGE PROTRUSION.  
1.78  
1.40  
E)  
DIMENSIONS L3, D, E1 & D1 TABLE:  
0.127 MAX  
SEATING PLANE  
OPTION AA OPTION AB  
L3 0.89 – 1.27 1.52 – 2.03  
(2.90)  
D
5.97 – 6.22 5.33 – 5.59  
DETAIL A  
E1 4.32 MIN  
D1 5.21 MIN  
3.81 MIN  
4.57 MIN  
(ROTATED –90°)  
SCALE 12X  
14  
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
FAST®  
FASTr™  
FPS™  
FRFET™  
GlobalOptoisolator™  
GTO™  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
TinyLogic®  
TINYOPTO™  
TruTranslation™  
UHC™  
ACEx™  
PowerSaver™  
PowerTrench®  
QFET®  
ISOPLANAR™  
LittleFET™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MICROWIRE™  
MSX™  
ActiveArray™  
Bottomless™  
Build it Now™  
CoolFET™  
CROSSVOLT™  
DOME™  
EcoSPARK™  
E2CMOS™  
EnSigna™  
FACT™  
QS™  
QT Optoelectronics™  
Quiet Series™  
RapidConfigure™  
RapidConnect™  
µSerDes™  
ScalarPump™  
SILENT SWITCHER®  
SMART START™  
SPM™  
HiSeC™  
UltraFET®  
I2C™  
MSXPro™  
OCX™  
OCXPro™  
UniFET™  
VCX™  
Wire™  
i-Lo™  
ImpliedDisconnect™  
IntelliMAX™  
OPTOLOGIC®  
OPTOPLANAR™  
PACMAN™  
POP™  
FACT Quiet Series™  
Across the board. Around the world.™  
The Power Franchise®  
Programmable Active Droop™  
Stealth™  
SuperFET™  
SuperSOT™-3  
Power247™  
PowerEdge™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY  
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY  
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT  
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. I17  
15  
www.fairchildsemi.com  
FAN1539/FAN1540 Rev. 1.1.1  

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