FAN1540MX [FAIRCHILD]
暂无描述;November 2005
FAN1539/FAN1540
1A/1.3A, LDO with Low Quiescent Current
Features
Description
■ Very Low Ground Current (I
■ Excellent Line Regulation
■ Excellent Load Regulation
= 1mA)
The FAN1539/FAN1540 series of high current LDOs
(1.0A and 1.3A) has been developed for portable appli-
cations where low quiescent current is an important
requirement. The device features excellent line and load
transient response which does not exceed 10% of nomi-
nal output value for full operating temperature range
even during power ON cycle and short circuit removal.
Internally trimmed, temperature compensated bandgap
reference guarantees 2.5% accuracy for full range of
input voltage, output current and temperature. Included
on the chip are accurate current limit and thermal shut-
down protection. Device stability is achieved with only
two external low ESR ceramic capacitors.
GND
■ Very Low Transient Overshoot
■ Stable with low ESR Output Capacitor (ESR = 0mΩ)
■ Thermal Shutdown
■ Current Limit
■ Output Options: 3.3V and 1.8V
Applications
■ Disk Drive Circuits
The FAN1539/FAN1540 is available in thermally
enhanced 3x3mm 6-lead MLP, 5x6mm 8-lead MLP and
3-lead TO-252 packages. The 5x6mm MLP package ver-
sion features a separate Kelvin sense pin for high preci-
sion applications.
■ Desktop Computers
■ Laptop, Notebook Computers
■ General Purpose Three Terminal Regulator
Ordering Information
Product Number
FAN1540MMPX
FAN1539MPX
FAN1540MPX
FAN1540DX
Output Voltage
Package
3.3V
3.3V
3.3V
3.3V
1.8V
5x6mm 8-Lead MLP in T&R
3x3mm 6-Lead MLP in T&R
3x3mm 6-Lead MLP in T&R
3-Lead TO-252 in T&R
3-Lead TO-252 in T&R
FAN1540D18X
Tape and Reel Information
Quantity
Reel Size
Width
3000
7"
8mm
©2005 Fairchild Semiconductor Corporation
1
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FAN1539/FAN1540 Rev. 1.1.1
Block Diagram
VOUT
VIN
(Note 1)
X
BANDGAP
REFERENCE
VSENSE
(Note 2)
CURRRENT
LIMIT
START-UP
CIRCUIT
ERROR
AMPLIFIER
THERMAL
SHUTDOWN
GND
Notes:
1. No connection for FAN1540MMPX.
2. V available for FAN1540MMPX.
SEN
Pin Assignments
TOP VIEW
1
8
7
6
5
GND
GND
GND
GND
1
NC
6
GND
NC
V
V
2
5
2
OUT
OUT
FAN1540
FAN1540
3
V
4
NC
IN
V
3
4
SEN
FAN1539/FAN1540
3x3mm 6-Lead MLP
V
GND
IN
V
V
IN
OUT
5x6mm 8-Lead MLP
GND
3-Lead TO-252 PACKAGE
Pin Description
Symbol
Name and Function
V
Input pin
IN
GND
Ground Pin (Tab)
V
Output pin: Fixed Output Voltage
OUT
V
Output sense pin. Connect to V if Kelvin sensing is not required
OUT
SEN
NC
No Connection
2
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FAN1539/FAN1540 Rev. 1.1.1
Absolute Maximum Ratings
Parameter
Symbol
Value
Units
V
Operating Input Voltage
Power Dissipation
V
10
IN
P
Internally
Limited
W
D
Short Circuit Output Current
I
Internally
Limited
A
OSH
Operating Junction Temperature Range
T
0 to 150
°C
°C/W
°C/W
°C/W
°C
J
Thermal Resistance–Junction to Tab, TO-252
θ
3
JC
JC
JC
Thermal Resistance–Junction to Tab, 3mmx3mm 6-lead MLP (Note 3)
Thermal Resistance–Junction to Tab, 5mmx6mm 8-lead MLP (Note 3)
Storage Temperature Range (Note 3)
θ
θ
8
4
T
-65 to 150
STG
Lead Temperature (I.R. Reflow) 30 Sec. (Note 4)
Lead Temperature (Soldering) 10 Sec. (Note 4)
T
T
240
260
4
°C
LEAD
LEAD
°C
Electrostatic Discharge Protection (Note 5)
HBM
CDM
ESD
kV
2
Notes:
3. Junction to ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and
number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink
characteristics.Thermal resistance (θJA), V , I
must be chosen not to exceed T = 150°C.
IN OUT
J
4. Soldering temperature should be 260°C for 10 second after 240°C for 30 second in I.R. reflow using 60/40 solder.
Maximum rate of temperature rise is 3°C/SEC to within 100°C of the final temperature.
5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
3
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FAN1539/FAN1540 Rev. 1.1.1
Electrical Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX,
FAN1540DX
Unless otherwise specified, V = 4.50V to 7V, T = 25°C, I
(FAN1539) = 1.0A, I (FAN1540) = 1.3A.
MAX
IN
j
MAX
Boldface limits apply over operating junction temperature range of 0°C ≤ T ≤ 125°C.
J
Test Conditions
Test Limits
Parameter
Symbol
V
I
Min. Typ.
Max.
3.366
3.383
15
Units
IN
OUT
Output Voltage
FAN1540
V
4.75V ≤ V ≤ 5.25V
5mA ≤ I
≤ I
≤ I
3.234 3.300
V
OUT
IN
OUT
MAX
3.217
2
Line Regulation
REG
3.0V ≤ V ≤ 5.25V
5mA ≤ I
mV
mV
(LINE)
IN
OUT
MAX
Load Regulation REG
4.75V
5mA ≤ I
FAN1539
FAN1540
25
35
(LOAD)
OUT
MAX
≤ I
30
40
Dropout Voltage
(Note 6)
V
I
= I
0.9
1.2
V
D
OUT
MAX
Current Limit
I
5.5V
3.3
A
S
Min. Output
Current for
regulation
I
0
mA
OMIN
(∆V
≤ 3%)
OUT
Temperature
Stability
T
V
I
= 5mA
0.3
%
S
OUT
RMS Output
Noise
I
= I
0.003
%V
OUT
N
OUT
MAX
(Note 7)
Ripple Rejection
Ratio (Note 8)
R
5V
5V
I
= 10mA
65
63
45
75
73
57
2.0
dB
A
OUT
I
= 100mA
OUT
I
= I
MAX
OUT
Transient
Response
1mA to I
10
MAX
t ≥ 1µS
∆VOUT
(under-
shoot or
overshoot
%
%
------------------
r
∆IOUT
Change of V
OUT
I
to 1mA
t ≥ 1µS
MAX
f
with step load
change (Note 9)
of V
)
OUT
Transient
Response
0 to 5V Step Input
1mA ≤ I
≤ I
5.0
10
OUT
MAX
∆VOUT
t ≥ 1µS
(under-
shoot or
overshoot
r
------------------
10% to 90%
∆VIN
Change of V
OUT
with application
of V
of V
)
IN
OUT
(Note 9)
Transient
Response
Short circuit
Removal
Response
(Note 9)
5V
I
= short
to
= 10mA
5.0
1.0
10 (over-
shoot or
under-
%
mA
OUT
∆VOUT
∆VIN
------------------
I
OUT
shoot of
@I
=
V )
OUT
O
short
Quiescent
Current
I
V
≤ 7V
I
= 0mA
2.0
GND
IN
OUT
4
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FAN1539/FAN1540 Rev. 1.1.1
Electrical Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX,
FAN1540DX (Continued)
Unless otherwise specified, V = 4.50V to 7V, T = 25˚C, I
(FAN1539) = 1.0A, I (FAN1540) = 1.3A.
IN
j
MAX
MAX
Boldface limits apply over operating junction temperature range of 0°C ≤ T ≤ 125°C.
J
Test Conditions
Test Limits
Parameter
Symbol
V
I
Min. Typ.
Max.
2.0
Units
IN
OUT
Quiescent
Current
I
V
V
≤ 7V
2mA ≤ I
≤ I
MAX
1.0
1.0
160
15
mA
GND
IN
OUT
Quiescent
Current
I
= 5V
0mA ≤ I ≤ 50mA
OUT
2.0
mA
°C
GND
IN
Thermal
Shutdown
T
3.0V ≤ V ≤ 5.25V
jSD
IN
Thermal
Hysteresis
T
3.0V ≤ V ≤ 5.25V
°C
HYST
IN
Notes:
6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the
nominal value measured at V = 5V.
IN
7. Measured within 10Hz to 10kHz bandwidth.
8. Measured at DC, specified at 120 Hz.
9. C = 22µF, C
= 10µF. Both capacitors are low ESR X7R type.
IN
OUT
Test Circuit
VOUT
VIN
IN
OUT
DUT
10µF
CIN
22µF
COUT
GND
Notes: 1. Use low ESR capacitors.
2. CIN should be placed as close to VIN as possible.
5
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FAN1539/FAN1540 Rev. 1.1.1
Electrical Characteristics—FAN1540D18X
Unless otherwise specified, V = 3.135V to 3.465V, T = 25°C, I
= 1.3A. Boldface limits apply over operating
IN
j
MAX
junction temperature range of 0°C ≤ T ≤ 125°C.
J
Test Conditions
Test Limits
Parameter
Output Voltage
Line Regulation
Load Regulation
Symbol
V
I
Min. Typ.
Max.
1.845
10
Units
V
IN
OUT
V
3.15V ≤ V ≤ 3.465V 5mA ≤ I
≤ I
≤ I
≤ I
1.755 1.800
OUT
IN
OUT
OUT
OUT
MAX
MAX
MAX
REG
3.135V ≤ V ≤ 3.465V 5mA ≤ I
3
mV
mV
V
(LINE)
IN
REG
3.3V
5mA ≤ I
20
0.9
40
(LOAD)
Dropout Voltage
(Note 6)
V
I
= I
MAX
1.2
D
OUT
Current Limit
I
3.3V
2.5
A
S
Min. Output
Current for
regulation
I
0
mA
OMIN
(∆V
≤ 3%)
OUT
Temperature
Stability
T
V
I
= 5mA
0.3
0.003
40
%
S
OUT
RMS Output
Noise (Note 7)
I
= I
%V
OUT
N
OUT
MAX
Ripple Rejection
Ratio (Note 8)
R
3.3V
3.3V
I
= 500mA
dB
A
OUT
Transient
Response
1mA to I
2.0
10
MAX
t ≥ 1µS
∆VOUT
(undershoot
orovershoot
%
------------------
r
∆IOUT
Change of V
OUT
I
to 1mA
t ≥ 1µS
MAX
with step load
change (Note 9)
of V
)
OUT
f
Transient
Response
Change of V
0 to 1.8V Step Input
1mA ≤ I
≤ I
3.0
3.0
10
%
%
OUT
MAX
∆VOUT
∆VIN
t ≥ 1µS
(undershoot
orovershoot
------------------
r
10% to 90%
OUT
with application of
(Note 9)
of V
)
OUT
V
IN
Transient
Response
Short circuit
Removal
Response
(Note 9)
3.3V
I
= short
to
= 10mA
10
OUT
∆VOUT
(overshoot
or under-
shoot of V )
------------------
I
∆VIN
OUT
O
@I
=
OUT
short
Quiescent Current
Quiescent Current
Thermal Shutdown
Thermal Hysteresis
I
I
3.3V
3.3V
I
= 0mA
OUT
1.0
1.0
160
10
2.0
2.0
mA
mA
°C
GND
GND
2mA ≤ I
≤ I
OUT
MAX
T
jSD
T
°C
HYST
Notes:
6 Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the
nominal value measured at V = 3.3V.
IN
7. Measured within 10Hz to 10kHz bandwidth.
8. Measured at DC, specified at 120 Hz.
9. C = 22µF, C
= 10µF. Both capacitors are low ESR X7R type.
IN
OUT
6
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FAN1539/FAN1540 Rev. 1.1.1
Test Circuit
VOUT
VIN
IN
OUT
DUT
10µF
CIN
22µF
COUT
GND
Notes: 1. Use low ESR capacitors.
2. CIN should be placed as close to VIN as possible.
7
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FAN1539/FAN1540 Rev. 1.1.1
Typical Performance Characteristics—FAN1539MPX, FAN1540MPX,
FAN1540MMPX, FAN1540DX
Output Voltage vs. Temperature
Ground Pin Current vs. Temperature
1.3
1.2
1.1
1.0
0.9
0.8
0.7
3.310
3.305
3.300
3.295
3.290
3.285
3.280
3.275
V IN = 5V
IOUT
= 10mA
V
= 5V
IN
I
= 10mA
OUT
Typical 3.3V Device
0
50
100
150
-50
0
50
100 150
Ambient Temperature (°C)
Ambient Temperature (°C)
Ground Pin Current vs. Input Voltage
Ground Pin Current vs. Output Current
1.07
1.06
1.05
1.04
1.03
1.02
1.01
1.00
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
I
= 10 mA
VIN = 5V
OUT
4
5
6
7
8
9
10
0
200
400
600
800
1000
1200 1400
Input Voltage (V)
Output Current (mA)
Dropout Voltage vs. Temperature
Output Voltage vs. Output Current
1.2
1.1
1.0
0.9
0.8
0.7
0.6
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
IOUT = 1.3A
VIN = 5V
T j = 25°C
IO U
T
=
0
.
5
A
-50
0
50
100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Ambient Temperature (°C)
Output Current (A)
8
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FAN1539/FAN1540 Rev. 1.1.1
Typical Performance Characteristics—FAN1539MPX, FAN1540MPX,
FAN1540MMPX, FAN1540DX (Continued)
Line Transient Response
Load Transient Response
V
= 5V
IN
3.300V
I
= I
MAX
OUT
3.300V
C
= 22µF
= 10µF
IN
C
= 22µF
= 10µF
IN
C
OUT
C
OUT
(Ceramic Low ESR Capacitors)
(Ceramic Low ESR Capacitors)
t
t
=1µs
= 1µs
= 25°C
r
f
t
= 1µs
r
T
j
T
= 25°C
j
Time (20µs/div)
Time (20µs/div)
Short Circuit Removal Response
Ripple Rejection vs. Frequency
100
90
80
70
60
50
40
30
20
10
0
V
= 5V
IN
3.300V
C
C
= 22µF
= 10µF
IN
OUT
(Ceramic Low ESR Capacitors)
V
IN = 5V
~3.3A
IOUT = 10mA
t
= 1µs
f
COUT = 10µF (Low ESR)
T
= 25°C
j
10mA
1
2
3
4
5
6
10
10
10
10
10
10
Frequency (Hz)
Time (40µs/div)
Typical Region of Stability
ESR vs. Output Current*
Output Spectral Noise Density
vs. Frequency
1000
100
10
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Region of Instability
Region of Stability
V
= 5V
IN
I
= I
OUT
MAX
V
C
C
= 5V
1
IN
IN
= 22µF
C
C
= 22µF
OUT
IN
= 10µF
OUT
= 10µF
T = 25°C
j
Ceramic Low ESR
0.1
0
200
400
600
Output Current (mA)
*Note: ESR Values measured at f = 10kHz
800
1000
1200
1400
10
100
1K
10K
100K
Frequency (H z)
Note:
Transient response tests require short lead lengths and low resistance connections at source and load.
9
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FAN1539/FAN1540 Rev. 1.1.1
Typical Performance Characteristics—FAN1540D18X
Output Voltage vs. Temperature
Ground Pin Current vs. Temperature
1.810
1.805
1.800
1.795
1.790
1.785
1.780
1.775
1.3
1.2
1.1
1.0
0.9
0.8
0.7
V
= 3.3V
IN
I
= 10mA
OUT
V
= 3.3V
IN
OUT = 10mA
Typical 1.8V Device
I
0
50
100
150
0
50
100
150
Ambient Temperature (°C)
Ambient Temperature (°C)
Ground Pin Current vs. Input Voltage
Ground Pin Current vs. Output Current
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
1.07
1.06
1.05
1.04
1.03
1.02
1.01
1.00
V
= 3.3V
I
= 10mA
IN
OUT
3
4
5
6
7
8
9
10
0
200
400
600
800
1000
1200
1400
Input Voltage (V)
Output Current (mA)
Output Voltage vs. Output Current
Dropout Voltage vs. Temperature
1.2
1.1
1.0
0.9
0.8
0.7
1.9
1.8
1.7
IOUT
= 1.3A
1.6
1.5
1.4
I
O
U
T
=
0
.
5
A
VIN = 3.3V
Tj = 25°C
0.6
-50
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
50
100
Ambient Temperature (°C)
Output Current (A)
10
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FAN1539/FAN1540 Rev. 1.1.1
Applications Information
The ground pin current, I
provided in the “Electrical Characteristics” section.
can be found in the charts
General Circuit Description
GND
The FAN1539/FAN1540 is an advanced low dropout volt-
age regulator, specially designed for applications in por-
table computers, where high performance and low
quiescent current are required. The device has an inter-
nal trimmed bandgap voltage reference and an internal
output voltage sense divider. These two signals form the
input to the error amplifier which regulates the output
voltage.
The relationship describing the thermal behavior of the
package is:
T
J(max) – T
A
--------------------------------
PD(max)
=
θJA
where T
is the maximum allowable junction temper-
J(max)
The FAN1539/FAN1540 has a complete set of internal
protection circuitry including thermal shutdown, short cir-
cuit current limit and electrostatic discharge protection.
Low ESR ceramic capacitors are needed for input as
well as output pins to maintain the circuit stability.
ature of the die, which is 150°C, and T is the ambient
A
operating temperature. θ
is dependent on the sur-
rounding PC board layout and can be empirically
JA
obtained. While the θ (junction-to-case) of the 6-lead
JC
MLP package is specified at 8°C /W, the θ for a mini-
JA
mum PWB footprint will be in substantially higher. This
can be improved upon by providing a heat sink of sur-
rounding copper ground on the PWB. Depending on the
size of the copper area, and the thickness of the copper
Short Circuit Current Limit
The device has internal over-current limit and short cir-
cuit protection. Under over-current conditions the device
current is determined by the current limit threshold. Once
the device is released from short circuit conditions, the
normal level of current limit is gradually re-established as
the device output voltage reaches normal levels. Special
circuitry has been added to ensure that recovery from
short circuit current conditions does not lead to exces-
sive overshoot of the output voltage — a phenomenon
often encountered in conventional regulators.
layer, the resulting θ can vary over a wide range. The
JA
addition of backside copper with through-holes, stiffen-
ers, and other enhancements can also aid in reducing
thermal resistance.Thermal simulations performed on
a thermally optimized board layout indicate that θ
JA
as low as 20°C /W can be achieved. For example, the
heat contributed by the dissipation of other devices
located nearby must be included in the design consider-
ations.
Thermal Protection
Overload conditions also need to be considered. It is
possible for the device to enter a thermal cycling loop, in
which the circuit enters a shutdown condition, cools, re-
enables, and then again overheats and shuts down
repeatedly due to a persistent fault condition.
The FAN1539/FAN1540 is designed to supply at least
1A/1.3A output currents. Excessive output load at high
input-output voltage difference will cause the device tem-
perature to increase and exceed maximum ratings due
to power dissipation. During output overload conditions,
when the die temperature exceeds the shutdown limit
temperature of 160°C, an onboard thermal protection will
disable the output until the temperature drops approxi-
mately 15°C below the limit, at which point the output is
re-enabled.
Capacitor ESR and Printed Circuit Board
Layout
The FAN1539/FAN1540 has been optimized to accom-
modate low ESR bypass capacitors down to 0 mΩ.
For best results it is important to place both input and
output bypass capacitors as near to the input and
output pins as possible. Use of X7R types such as
Thermal Characteristics
The FAN1539/FAN1540 is designed to supply at least
1A/1.3A at the specified output voltage with an operating
die (junction) temperature of up to 125°C. Once the
power dissipation and thermal resistance is known, the
maximum junction temperature of the device can be cal-
culated. While the power dissipation is calculated from
known electrical parameters, the actual thermal resis-
tance depends on the thermal characteristics of the cho-
sen package and the surrounding PC board copper to
which it is mounted.
Murata’s
GRM31CR70J106KA01B
(10µF)
and
GRM43ER71A226KE01B (22µF) or similar compo-
nent from TDK. The capacitors should connect directly
to the ground plane. Use of ground plane on the top and
the bottom side of the PCB is recommended. As many
vias as possible should be used to minimize ground
plane resistance.
The power dissipation is equal to the product of the
input-to-output voltage differential and the output current
plus the ground current multiplied by the input voltage,
or:
PD = (VIN – VOUT)IOUT + VINIGND
11
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FAN1539/FAN1540 Rev. 1.1.1
Mechanical Dimensions
5x6mm 8-Lead MLP
5.0
A
4.50
B
6.25
3.50
6.0
4.25
(1.00)
0.25
C
2X
0.65 TYP
1.27 TYP
TOP VIEW
SIDE VIEW
0.25
C
2X
C
LAND PATTERN RECOMMENDATION
0.10
0.08
(0.25)
1.0 MAX
C
C
0.05
0.00
SEATING
PLANE
4.25
1.75
A
1
2
3
4
0.75
A
A
0.35
PIN #1 IDENT.
(OPTIONAL)
NOTES:
A)
DOES NOT FULLY CONFORM TO JEDEC
REGISTRATION MO-229, DATED 11/2001.
3.25
1.25
B)
DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONING AND TOLERANCES PER
ASME Y14.5–1994.
8
7
6
5
0.28–0.40 A
0.10 M
1.27
C
C
A B
3.81
A
M
0.05
BOTTOM VIEW
12
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FAN1539/FAN1540 Rev. 1.1.1
Mechanical Dimensions
3x3mm 6-Lead MLP
3.0
A
B
0.15 C
2X
2.45
0.10 C
2X
2.15
3.45
1.85
2.6
3.0
(0.65)
0.95 TYP
0.15 C
2.6
2X
0.10 C
2X
0.65 TYP
TOP VIEW
RECOMMENDED LAND PATTERN
1.0 MAX
0.10 C
0°~12°
1.00
0.65
0.08 C
0.05
0.00
(0.20)
C
SIDE VIEW
SEATING
PLANE
2.25
0.95
1
3
0.45
0.20
1.65
0.2 MIN
4
6
0.30~0.45
M
1.90
Ø0.10
Ø0.05
C A B
C
M
BOTTOM VIEW
NOTES:
A. CONFORMS TO JEDEC REGISTRATION MO-229,
VARIATION VEEA, DATED 11/2001
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
13
www.fairchildsemi.com
FAN1539/FAN1540 Rev. 1.1.1
Mechanical Dimensions
3-Lead TO-252
A
6.73
6.35
6.00 MIN
5.46
5.21
L3
4
6.50 MIN
3.00 MIN
D
6.25
1.02
0.64
C
2
1
3
1
3
1.14
0.76
2.30
1.40 MIN
(0.59)
0.89
0.64
4.60
2.29
4.57
E1
M
M
C
0.25
A
LAND PATTERN RECOMMENDATION
B
2.39
2.18
SEE
NOTE D
0.58
0.46
4
D1
10.41
9.40
SEE
DETAIL A
2
1
3
0.10
B
NOTES: UNLESS OTHERWISE SPECIFIED
0.51
GAGE PLANE
A)
B)
ALL DIMENSIONS ARE IN MILLIMETERS.
THIS PACKAGE CONFORMS TO JEDEC, TO-252,
ISSUE C. VARIATION AA & AB, DATED NOV. 1999.
0.61
0.46
(1.54)
C) DIMENSIONING AND TOLERANCING PER
ASME Y14.5–1994.
10°
0°
D) HEAT SINK TOP EDGE COULD BE IN CHAMFERED
CORNERS OR EDGE PROTRUSION.
1.78
1.40
E)
DIMENSIONS L3, D, E1 & D1 TABLE:
0.127 MAX
SEATING PLANE
OPTION AA OPTION AB
L3 0.89 – 1.27 1.52 – 2.03
(2.90)
D
5.97 – 6.22 5.33 – 5.59
DETAIL A
E1 4.32 MIN
D1 5.21 MIN
3.81 MIN
4.57 MIN
(ROTATED –90°)
SCALE 12X
14
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FAN1539/FAN1540 Rev. 1.1.1
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The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
FAST®
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TruTranslation™
UHC™
ACEx™
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QFET®
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
CROSSVOLT™
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
FACT™
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
ScalarPump™
SILENT SWITCHER®
SMART START™
SPM™
HiSeC™
UltraFET®
I2C™
MSXPro™
OCX™
OCXPro™
UniFET™
VCX™
Wire™
i-Lo™
ImpliedDisconnect™
IntelliMAX™
OPTOLOGIC®
OPTOPLANAR™
PACMAN™
POP™
FACT Quiet Series™
Across the board. Around the world.™
The Power Franchise®
Programmable Active Droop™
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SuperFET™
SuperSOT™-3
Power247™
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I17
15
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FAN1539/FAN1540 Rev. 1.1.1
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FAN1581DX_NL
Adjustable Positive LDO Regulator, 1.25V Min, 5.7V Max, 0.6V Dropout, PSSO5, LEAD FREE, PLASTIC, TO-252, DPAK-5
FAIRCHILD
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