FAN1540BMPX [ROCHESTER]
3.3 V FIXED POSITIVE LDO REGULATOR, 1.2 V DROPOUT, QCC6, 3 X 3 MM, LEAD FREE, MO-229WEEA, MLP-6;
| 型号： | FAN1540BMPX |
| 厂家： | 
Rochester Electronics |
| 描述： | 3.3 V FIXED POSITIVE LDO REGULATOR, 1.2 V DROPOUT, QCC6, 3 X 3 MM, LEAD FREE, MO-229WEEA, MLP-6 输出元件 调节器 |
| 文件： | 总12页 (文件大小：1067K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
June 2007
FAN1539B / FAN1540B
1A/1.3A, LDO with Low Quiescent Current
Features
Description
The FAN1539B / FAN1540B series of high-current
LDOs (1.0A and 1.3A) has been developed for portable
applications where low quiescent current is an important
requirement. The device features excellent line and load
transient response that does not exceed 10% of nominal
output value for full operating temperature range, even
during power ON cycle and short-circuit removal.
Internally trimmed, temperature-compensated bandgap
reference guarantees 2.5% accuracy for full range of
input voltage, output current, and temperature. Included
on the chip are accurate current limit and thermal
shutdown protection. Device stability is achieved with
only two external, low-ESR ceramic capacitors.
Very Low Ground Current (IGND = 1mA)
Excellent Line Regulation
Excellent Load Regulation
Very Low Transient Overshoot
Stable with Low-ESR Output Capacitor
Thermal Shutdown
Current Limit
Applications
Disk Drive Circuits
The FAN1539B / FAN1540B is available in the thermally
enhanced 3x3mm 6-lead MLP package.
Desktop Computers
Laptops, Notebook Computers
General-Purpose, Three-Terminal Regulators
Ordering Information
Part Number
FAN1539BMPX
FAN1540BMPX
Pb-Free Output Voltage
Package
Packing Method
Tape and Reel
Yes
Yes
3.3V
3.3V
3x3mm 6-Lead Molded Leadless Package
3x3mm 6-Lead Molded Leadless Package
Tape and Reel
Tape and Reel Information
Quantity
Reel Size
Width
3000
7 inch
8mm
© 2007 Fairchild Semiconductor Corporation
FAN1539B / FAN1540B • Rev. 1.0.0
www.fairchildsemi.com
Block Diagram
VOUT
VIN
BANDGAP
REFERENCE
CURRRENT
LIMIT
START-UP
CIRCUIT
ERROR
AMPLIFIER
THERMAL
SHUTDOWN
GND
Figure 1. Block Diagram
Pin Configuration
1
NC
6
5
4
GND
NC
V
2
3
OUT
V
NC
IN
Figure 2.
6-Lead, 3x3mm MLP(Top View)
Pin Definitions
Name
VIN
Description
Input pin.
GND
VOUT
NC
Ground Pin (Tab).
Output pin: Fixed Output Voltage.
No Connection.
Test Circuit
VOUT
VIN
IN
OUT
DUT
10µF
CIN
22µF
COUT
GND
Notes: 1. Use low-ESR capacitors.
2. CIN should be placed as close to VIN as possible.
Figure 3. Test Circuit
© 2007 Fairchild Semiconductor Corporation
FAN1539B / FAN1540B • Rev. 1.0.0
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VIN
Parameter
Value
Unit
V
Operating Input Voltage
Power Dissipation
10
PD
Internally Limited
W
IOSH
TJ
Short-Circuit Output Current
Internally Limited
A
Operating Junction Temperature Range
Thermal Resistance–Junction to Tab(1)
Storage Temperature Range(1)
0 to 150
°C
8
°C/W
°C
θJC
TSTG
-65 to 150
I.R. Reflow 30 seconds
Soldering 10 seconds
Human Body Model
240
260
4
°C
TL
Lead Temperature(2)
°C
ESD
Electrostatic Discharge Protection(3)
kV
Charged Device Model
2
Notes:
1. Junction-to-ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and
number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat
sink characteristics. Thermal resistance (θJA), VIN, and IOUT must be chosen not to exceed TJ = 150°C.
2. Soldering temperature should be 260°C for 10 seconds after 240°C for 30 seconds in I.R. reflow using 60/40
solder. Maximum rate of temperature rise is 3°C per second to within 100°C of the final temperature.
3. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charged Device Model).
© 2007 Fairchild Semiconductor Corporation
FAN1539B / FAN1540B • Rev. 1.0.0
www.fairchildsemi.com
3
Electrical Characteristics
Unless otherwise specified, VIN = 4.50V to 7V, TJ = 25°C, IMAX = 1.3A. Bold limits apply over operating junction
temperature range of 0°C ≤ TJ ≤ 125°C.
Test Conditions
VIN IOUT
Test Limits
Symbol
Parameter
Units
Min. Typ.
Max.
4.75V ≤ VIN
5.25V
≤
3.234
3.217
3.366
3.383
VOUT
VLINE
Output Voltage
Line Regulation
5mA ≤ IOUT ≤ IMAX
5mA ≤ IOUT ≤ IMAX
3.300
2
V
3.0V ≤ VIN
5.25V
≤
15
mV
Load Regulation –
FAN1539B
4.75V
4.75V
5mA ≤ IOUT ≤ IMAX
25
30
35
mV
mV
VLOAD
Load Regulation –
FAN1540B
5mA ≤ IOUT ≤ IMAX
40
VD
IS
Dropout Voltage(4)
IOUT = IMAX
0.9
3.3
1.2
V
A
Current Limit
5.5V
Minimum Output
Current for Regulation
(ΔVOUT ≤ 3%)
IOMIN
0
mA
TS
VN
Temperature Stability
RMS Output Noise(5)
IOUT = 5mA
IOUT = IMAX
0.3
%
0.003
%VOUT
IOUT = 10mA
IOUT = 100mA
65
63
45
75
73
57
Ripple Rejection
Ratio(6)
RA
5V
5V
dB
I
OUT = IMAX
1mA to IMAX
tr ≥ 1µs
IMAX to 1mA
tr ≥ 1µs
Transient Response
Change of VOUT with
Step Load Change(7)
10 (undershoot
or overshoot of
2.0
VOUT
)
ΔVOUT
ΔIOUT
0 to 5V Step
Input
tr ≥ 1µs
10% to 90%
Transient Response
Change of VOUT with
Application of VIN
10 (undershoot
or overshoot of
%
1mA ≤ IOUT ≤ IMAX
5.0
5.0
(7)
VOUT
)
Transient Response
Short-Circuit Removal
Response(7)
10 (undershoot
or overshoot of
IOUT = short to
5V
I
OUT = 10mA
VOUT
)
VIN ≤ 7V
VIN ≤ 7V
IOUT = 0mA
2mA ≤ IOUT ≤ IMAX
1.0
1.0
2.0
2.0
mA
mA
IQ
Quiescent Current
0mA ≤ IOUT
≤
VIN = 5V
1.0
160
15
2.0
mA
°C
50mA
3.0V ≤ VIN
5.25V
3.0V ≤ VIN
5.25V
≤
≤
TSD
Thermal Shutdown
Thermal Hysteresis
THYS
°C
Notes:
4. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below
the nominal value measured at VIN = 5V.
5. Measured within 10Hz to 10kHz bandwidth.
6. Measured at DC, specified at 120Hz.
7.
CIN = 22µF, COUT = 10µF. Both capacitors are low-ESR X7R type.
© 2007 Fairchild Semiconductor Corporation
FAN1539B / FAN1540B • Rev. 1.0.0
www.fairchildsemi.com
4
Typical Performance Characteristics
© 2007 Fairchild Semiconductor Corporation
FAN1539B / FAN1540B • Rev. 1.0.0
www.fairchildsemi.com
5
Typical Performance Characteristics (Continued)
Note:
8. Transient response tests require short lead lengths and low-resistance connections at source and load.
© 2007 Fairchild Semiconductor Corporation
FAN1539B / FAN1540B • Rev. 1.0.0
www.fairchildsemi.com
6
Applications Information
General Circuit Description
EQ. 1
The FAN1539B / FAN1540B is an advanced low-
dropout voltage regulator specially designed for
applications in portable computers, where high
performance and low quiescent current are required.
The device has an internal trimmed bandgap voltage
reference and an internal output voltage sense
divider. These two signals form the input to the error
amplifier that regulates the output voltage.
The ground pin current, IGND can be found in the
Electrical Characteristics tables.
The relationship describing the thermal behavior of
the package is:
EQ. 2
The FAN1539B / FAN1540B has a set of internal
protection circuitry, including thermal shutdown, short-
circuit current limit, and electrostatic discharge
protection. Low-ESR ceramic capacitors are needed
for input as well as output pins to maintain the circuit
stability.
where TJ(max) is the maximum allowable junction
temperature of the die, which is 150°C, and TA is the
ambient operating temperature. θJA is dependent on
the surrounding PC board layout and can be
empirically obtained. While the θJC (junction-to-case)
of the 6-lead MLP package is specified at 8°C/W, the
θJA for a minimum PWB footprint is substantially
higher. This can be improved by providing a heat sink
of surrounding copper ground on the PWB.
Depending on the size of the copper area and the
thickness of the copper layer, the resulting θJA can
vary over a wide range. The addition of backside
copper with through-holes, stiffeners, and other
enhancements can also reduce thermal resistance.
Short-Circuit Current Limit
The device has internal over-current limit and short-
circuit protection. Under over-current conditions, the
device current is determined by the current-limit
threshold. Once the device is released from short-
circuit conditions, the normal level of current limit is
gradually re-established as the device output voltage
reaches normal levels. Special circuitry has been
added to ensure that recovery from short-circuit
current conditions does not lead to excessive
overshoot of the output voltage — a phenomenon
often encountered in conventional regulators.
Thermal simulations performed on a thermally
optimized board layout indicate that θJA as low as
20°C /W can be achieved.
The heat contributed by the dissipation of other
devices located nearby must be included in the design
considerations. Overload conditions also need to be
considered. It is possible for the device to enter a
thermal cycling loop, in which the circuit enters a
shutdown condition, cools, re-enables, and then again
overheats and shuts down repeatedly due to a
persistent fault condition.
Thermal Protection
The FAN1539B / FAN1540B is designed to supply at
least 1A/1.3A output current. Excessive output load at
high input-output voltage difference causes the device
temperature to increase and exceed maximum ratings
due to power dissipation. During output overload
conditions, if the die temperature exceeds the
shutdown limit temperature of 160°C, an onboard
thermal protection disables the output until the
temperature drops approximately 15°C below the limit;
at which point, the output is re-enabled.
Capacitor ESR and PCB Layout
The FAN1539/FAN1539B / FAN1540B has been
optimized to accommodate low-ESR bypass
capacitors down to less than 0mΩ. For best results,
place both input and output bypass capacitors as near
to the input and output pins as possible. X7R types
Thermal Characteristics
The FAN1539/FAN1539B / FAN1540B is designed to
supply at least 1A/1.3A at the specified output
voltage, with an operating die (junction) temperature
of up to 125°C. Once the power dissipation and
thermal resistance are known, the maximum junction
temperature of the device can be calculated. While
the power dissipation is calculated from known
electrical parameters, the actual thermal resistance
depends on the thermal characteristics of the chosen
package and the surrounding PC board copper to
which it is mounted.
are
recommended,
including
(10µF)
(22µF) or
Murata’s
and
similar
GRM31CR70J106KA01B
GRM43ER71A226KE01B
component from TDK. The capacitors should connect
directly to the ground plane. Use of ground plane on
the top and the bottom side of the PCB is
recommended. As many vias as possible should be
used to minimize ground plane resistance.
The power dissipation is equal to the product of the
input-to-output voltage differential and the output
current, plus the ground current, multiplied by the
input voltage:
© 2007 Fairchild Semiconductor Corporation
FAN1539B / FAN1540B • Rev. 1.0.0
www.fairchildsemi.com
7
Physical Dimensions
Dimensions are in millimeters unless otherwise specified.
Figure 4. 3x3mm 6-Lead Molded Leadless Package (MLP)
© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN1539B / FAN1540B • Rev. 1.0.0
8
© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN1539B / FAN1540B • Rev. 1.0.0
9
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FAN1540B
1A Low Quiescent Current LDO
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Contents
•General description
•Features
•Applications
•Order Samples
•Qualification Support
Product Change Notices
(PCNs)
Datasheet
Download this
datasheet
•Product status/pricing/packaging
Support
Sales support
Quality and reliability
Design center
General description
The FAN1539B / FAN1540B series of high-current LDOs (1.0A and 1.3A)
has been developed for portable applications where low quiescent current
is an important requirement. The device features excellent line and load
transient response that does not exceed 10% of nominal output value for
full operating temperature range, even during power ON cycle and short-
circuit removal. Internally trimmed, temperature-compensated bandgap
reference guarantees 2.5% accuracy for full range of input voltage, output
current, and temperature. Included on the chip are accurate current limit
and thermal shutdown protection. Device stability is achieved with only two
external, low-ESR ceramic capacitors.
e-mail this datasheet
This page
Bookmark this page
Print version
The FAN1539B / FAN1540B is available in the thermally enhanced 3x3mm
6-lead MLP package.
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Features
z
Very Low Ground Current (I
= 1mA)
GND
z
z
z
z
z
z
Excellent Line Regulation
Excellent Load Regulation
Very Low Transient Overshoot
Stable with Low-ESR Output Capacitor
Thermal Shutdown
Current Limit
back to top
Applications
z
z
z
z
Disk Drive Circuits
Desktop Computers
Laptop, Notebook Computers
General Purpose, Three-Terminal Regulator
back to top
Product status/pricing/packaging
Product
Product status
Pb-free Status Pricing* Package type Leads Packing method
Package Marking Convention**
Line 1: (Fairchild logo)
$Y
(Asm. Plant Code)
&
Z
FAN1540BMPX
Full Production
$0.486
MLP
6
TAPE REEL
& (2-Digit Date Code)
2
&
T
(Die Trace Code)
Line 2: 1540B
* Fairchild 1,000 piece Budgetary Pricing
** A sample button will appear if the part is available through Fairchild's on-line samples program. If there is no sample button, please
contact a Fairchild distributor to obtain samples
Indicates product with Pb-free second-level interconnect. For more information click here.
Package marking information for product FAN1540B is available. Click here for more information .
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Qualification Support
Click on a product for detailed qualification data
Product
FAN1540BMPX
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