AN-6067 [FAIRCHILD]

Design and Application of Primary-Side Regulation (PSR) PWM Controller; 设计与应用初级侧调节( PSR ) PWM控制器
AN-6067
型号: AN-6067
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Design and Application of Primary-Side Regulation (PSR) PWM Controller
设计与应用初级侧调节( PSR ) PWM控制器

控制器
文件: 总21页 (文件大小:932K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
www.fairchildsemi.com  
AN-6067  
Design and Application of Primary-Side Regulation (PSR)  
PWM Controller  
FAN100 / FAN102 / FSEZ1016A / FSEZ1216  
Abstract  
Features  
This application note describes a typical charger using the  
PSR controller. Both the features of this controller, as well  
as the operation of the power supply adaptor, are presented  
in detail. Based on the proposed design guideline, a design  
example with detailed parameters is given to demonstrate  
the superior performance of the controller.  
„
„
„
„
Constant-Voltage (CV) and Constant-Current (CC)  
Control without Secondary-Feedback Circuitry  
Accurate Constant Current Achieved by Fairchild’s  
Proprietary TRUECURRENTTechnique  
Green-Mode Function: PWM Frequency Decreasing  
Linearly  
Fixed PWM Frequency at 42kHz with Frequency  
Hopping to Solve EMI Problems  
Applications  
„
„
„
„
„
„
„
„
„
Low Startup Current: 10μA (Typical)  
Low Operating Current: 3.5mA (Typical)  
Peak-Current-Mode Control  
ƒ
Battery chargers for cellular phones, cordless phones,  
PDAs, digital cameras, power tools  
ƒ
Optimal choice for the replacement of linear  
transformers and RCC SMPS  
Cycle-by-Cycle Current Limiting  
V
V
DD Over-Voltage Protection (OVP)  
DD Under-Voltage lockout (UVLO)  
Gate Output Maximum Voltage Clamped at 18V  
Fixed Over-Temperature Protection (OTP)  
Cable Compensation for Tight CV Regulation  
(FAN102 / FSEZ1216)  
PSR PWM Controller  
FAN100  
PSR PWM Controller  
FAN102  
FAN100 + Cable Compensation  
FAN100 + MOSFET (1A/600V)  
FAN102 + MOSFET (1A/600V)  
FSEZ1016A  
FSEZ1216  
Pin Configurations  
Figure 1. FAN100  
Figure 2. FAN102  
Figure 3. FSEZ1016A  
Figure 4. FSEZ1216  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
AN-6067  
APPLICATION NOTE  
Typical Applications  
Vbus  
VS  
VDD  
7
3
4
6
5
8
1
2
VS  
VDD  
7
3
4
6
5
8
1
2
COMI  
COMV  
GATE  
CS  
COMI  
COMV  
GATE  
CS  
GND  
COMR  
SGND  
PGND  
FAN100  
Figure 5. FAN100  
Figure 6. FAN102 (FAN100 + Cable Compensation)  
Vbus  
Vbus  
VS  
VDD  
5
8
1
2
6
3
4
7
VDD  
VS  
5
8
1
7
6
3
4
2
DRAIN  
DRAIN  
COMI  
COMV  
COMI  
COMV  
CS  
CS  
COMR  
GND  
GND  
N.C.  
FSEZ1016A  
FSEZ1216  
Figure 8. FSEZ1216 (FAN102 + MOSEFET)  
Figure 7. FSEZ1016A (FAN100 + MOSFET)  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
2
AN-6067  
APPLICATION NOTE  
Block Diagrams  
Figure 9. FSEZ1016A (FAN100 + MOSFET)  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
3
AN-6067  
APPLICATION NOTE  
Block Diagrams (Continued)  
Figure 10. FSEZ1216 (FAN102 + MOSFET)  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
4
AN-6067  
APPLICATION NOTE  
Introduction  
This highly integrated PSR PWM controller contains several  
features to enhance the performance of low-power flyback  
converters. The patented topology of the PSR controller  
allows for simplified of circuit designs, particularly battery  
charger applications. CV and CC control can be accurately  
achieved without secondary feedback circuitry. With the  
addition of frequency-hopping in PWM operation, EMI  
problems can be solved using minimized filter components.  
As a result, a low-cost, smaller, and lighter charger is  
produced when compared to a conventional design or a  
linear transformer.  
protection function shuts down the controller with auto  
recovery when over heating occurs.  
By using the PSR controller, a charger can be implemented  
with few external components and at a minimized cost.  
Internal Block Operation  
Constant Voltage Output Regulation  
PSR controller’s innovative method can achieve accurate  
output CV/CC characteristic without voltage and current  
sensing circuitry on the secondary side. The application  
circuit and a conceptualized internal block diagram relating  
to the constant voltage regulation are shown in Figure 11,  
and the key waveform is shown in Figure 12. The secondary  
output status is taken from the primary auxiliary winding  
when the MOSFET is off. A unique sampling method is  
used to acquire a duplication of the output voltage (Vsah) and  
the output diode discharge time (tdis). The sampled voltage  
(Vsah) is then compared with the precise internal reference  
voltage (Vref) to determine the on-time of the MOSFET by  
modulating error amplifier’s output. This inexpensive  
method achieves accurate output voltage regulation.  
To minimize standby power consumption, the proprietary  
green-mode function provides off-time modulation to  
linearly decrease the PWM frequency under light-load  
conditions. This green-mode function is designed to help the  
power supply meet power conservation requirements. The  
startup current is only 10µA, which allows for the use of  
large startup resistance for further power savings.  
The PSR controller also provides numerous protection  
functions. The VDD pin is equipped with over-voltage  
protection and under-voltage lockout. Pulse-by-pulse current  
limiting and CC control ensure over-current protection  
during heavy loads. The GATE output is clamped at 15V to  
protect the external/internal MOSFET from over-voltage  
damage. Additionally, the internal over-temperature-  
Vin  
iS  
IO  
+
VO  
Naux  
Npri  
Nsec  
CO  
RO  
n :1  
Vref  
Vsah  
R1  
R2  
VS  
PWM  
iP  
S / H  
CS  
COMV  
RS  
Figure 11. Internal Block of Constant Voltage Output Operation  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
5
AN-6067  
APPLICATION NOTE  
Constant Current Output Regulation  
Green-Mode Operation  
As shown in Figure 12, the output current IO can be  
expressed by Equation 1 when the flyback converter is  
operated in DCM. As a result, the output current IO can be  
calculated by the signal ipk, tdis. The PSR controller then  
determines the on-time of the MOSFET to modulate input  
power and provide constant output current.  
The proprietary green-mode function of the PSR controller  
provides off-time modulation to linearly decrease the PWM  
frequency at light-load conditions, as low as 500Hz. With  
the green-mode function, the power supply can easily meet  
the most stringent of power conservation requirements.  
Figure 13 shows the characteristics of the PWM frequency  
vs. the output voltage of the error amplifier (VCOMV). The  
PSR controller uses the positive, proportional, output load  
parameter (VCOMV) as an indication of the output load for  
modulating the PWM frequency. In heavy load conditions,  
the PWM frequency is fixed at 42KHz. Once VCOMV is lower  
than VN, the PWM frequency starts to linearly decrease from  
42KHz to 500Hz. Figure 14 is a measured waveform at  
burst-mode operation.  
Gate  
Ts  
Vin  
Lp  
ipk  
iP  
tdis  
ton  
Frequency  
n2 Vo  
Lp  
-
IO  
42KHz  
40KHz  
iS  
sampling voltage  
1KHz  
500Hz  
VS  
VG  
VN  
VCOMV  
Figure 12. Principal Operation Waveform of the  
Flyback Converter (DCM)  
Figure 13. PWM Frequency vs. VCOMV  
The current-sense resistor can adjust the value of the  
constant current. Through better design of the transformer  
operations under discontinuous current mode, the PSR  
controller’s proprietary control structure is able to achieve  
accurate and constant current characteristics. Detailed  
design guideline for the transformer is introduced in the  
following section.  
Vo(AC)  
100mV/Div  
Gate  
10V/Div  
1
Io =  
[
tdis is, pk  
]
]
VCOMV  
500mV/Div  
2Ts  
1
=
=
[
np ipk tdis  
(1)  
2Ts  
1
Figure 14. Measured Waveform at Burst-Mode Operation  
VCS  
RCS  
np ⋅  
tdis  
2Ts  
where:  
is,pk is the peak inductor current of the secondary side,  
ipk is the peak inductor of primary side.  
tdis is discharge-time of transformer inductor current.  
np is the turn ratio between primary and secondary winding.  
R
V
CS is the current-sense resistor.  
CS is the voltage on current-sense resistor.  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
6
AN-6067  
APPLICATION NOTE  
42kHz frequency, the MOSFET’s on-time is determined by  
Frequency Hopping Operation  
V
COMI to modulate the output current.  
A frequency hopping function is built in to further improve  
EMI system performance. The frequency hopping period is  
no longer than 3ms and the PWM switching frequency range  
is 42kHz +/- 2.6kHz.  
CC Regulation  
CV Regulation  
decreasing output impedance  
VCOMI  
VCOMV  
4.5V  
Deep Green Mode  
Charging Sequence  
44.6KHz  
Figure 17. CV/CC Regulation Charging Sequence  
+/- 2.6KHz  
39.4KHz  
Temperature Compensation  
Frequency Hopping Period 3mS  
The PSR controller has built-in temperature compensation  
circuitry to provide constant reliable voltage regulation even  
at a different ambient temperature. This internal positive  
temperature coefficient (PTC) compensation current is used  
to compensate for the temperature due to the forward-  
voltage drop of the diode output. Without temperature  
compensation, the output voltage is distinctly higher in high  
temperatures than in lower temperature condition, as shown  
in Figure 18.  
Figure 15. Gate Signal with Frequency Hopping  
CV / CC Regulation  
Battery chargers are typically designed for two modes of  
operation, constant-voltage charging and constant-current  
charging. The basic charging characteristic is shown in  
Figure 16. When the battery voltage is low, the charger  
operates on a constant current charging. This is the main  
method for charging batteries and most of the charging  
energy is transferred into the batteries. When the battery  
voltage reaches its end-of-charge voltage, the current begins  
to taper-off. The charger then enters the constant voltage  
method of charging. Finally, the charging current continues  
to taper-off until reaching zero.  
high temp.  
Vo  
after compensation at high temp.  
room temp.  
Vo(V)  
CV Regulation  
Io  
Charging  
Sequence  
Figure 18. Output V-I Curve with Temperature  
Compensation  
As shown in Figure 19, the accuracy value of R1 and R2  
determines the voltage regulation amount. The suggested  
deviation for R1 and R2 is a +/-1% tolerance.  
Temperature  
Compensation  
Io(mA)  
PTC  
Figure 16. Basic Charging V-I Characteristic  
As mentioned in the CV regulation region section, the VCOMV  
modulates MOSFET’s on-time and PWM frequency to  
provide enough power to the output load. As shown in  
Figure 17, as the output load increases, VCOMV gradually  
rises until the system shifts into the CC regulation region. At  
the same time, VCOMV increases to 4.5V and the MOSEFT’s  
on time is controlled by VCOMI. However, when power  
system operates in the CC regulation region at a fixed  
Vs  
S / H  
Auxiliary  
Winding  
Vref  
PSR  
Controller  
Figure 19. Temperature Compensation  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
7
AN-6067  
APPLICATION NOTE  
The maximum power dissipation of RIN is:  
Startup Circuitry  
When the power is activated, the input voltage charges the  
hold-up capacitor (C1) via the startup resistors, as shown in  
Figure 20. As the voltage (VDD) reaches the startup voltage  
threshold (VDD-ON), the PSR controller activates and drives  
the entire power supply.  
2
2
(
Vdc,max VDD  
)
Vdc,max  
RIN  
(3)  
P
=
RIN ,MAX  
RIN  
where Vdc,max is the maximum rectified input voltage.  
Vdc  
RIN  
Take a wide-ranging input (90VAC~264VAC) as an example,  
Vdc =100V~380V:  
3802  
1.5×106  
(4)  
P
=
96mW  
RIN ,MAX  
TD_ON  
VDD  
D1  
PSR  
Built-in Slope Compensation  
C1  
Controller  
The sensed voltage across the current sense resistor is used  
for peak-current-mode control and cycle-by-cycle current  
limiting. Within every switching cycle, the PSR controller  
produces a positively sloped, synchronized ramp signal. The  
built-in slope compensation function improves power supply  
stability and prevents peak-current-mode control from  
causing sub-harmonic oscillations.  
GND  
Figure 20. Single-Step Circuit Connected to the  
PSR Controller  
The power-on delay is determined as follows:  
Leading Edge Blanking (LEB)  
VDDON  
TD _ON = −RIN C1 ln 1−  
(2)  
Each time the MOSFET is powered on, a spike, induced by  
the diode reverse recovery and by the output capacitances of  
the MOSFET and diode, appears on the sensed signal. To  
avoid premature termination of the MOSEFT, a leading-  
edge blanking time is introduced in the PSR controller.  
During the blanking period, the current-limit comparator is  
disabled and unable to switch off the gate driver.  
Vac 2 IDDST RIN  
where IDD-ST is the startup current of the PSR controller.  
Due to the low startup current, a large RIN value, such as  
1.5MΩ can be used. With a hold-up capacitor of 4.7µF, the  
power-on delay TD_ON is less than 3s for a 90VAC input.  
If a shorter startup time is required, a two-step startup  
circuit, as shown in Figure 21, is recommended. In this  
circuit, a smaller C1 capacitor can be used to decrease  
startup time without a need for a smaller startup resistor  
(RIN) and increase the power dissipation on the RIN resistor.  
The energy supporting the PSR controller after startup is  
mainly from a larger capacitor C2.  
Under-Voltage Lockout (UVLO)  
The power-on and off thresholds of the PSR controller are  
fixed at 16V/5V. During startup, the hold-up capacitor must  
be charged to 16V through the startup resistor to enable PSR  
controller. The hold-up capacitor continues to supply VDD  
until power can be delivered from the auxiliary winding of  
the main transformer (VDD must not drop below 5V during  
this startup process). This UVLO hysteresis window ensures  
that the hold-up capacitor can adequately supply VDD during  
startup.  
Vdc  
RIN  
VDD Over-Voltage Protection (OVP)  
TD_ON  
VDD over-voltage protection prevents damage due to over-  
voltage conditions. When VDD exceeds 28V due to abnormal  
conditions, PWM output is turned off. Over-voltage  
conditions are usually caused by open feedback loops.  
VDD  
PSR  
C2  
C1  
Controller  
GND  
Over-Temperature Protection (OTP)  
The PSR controller has a built-in temperature sensing circuit  
to shut down the PWM output if the junction temperature  
exceeds 145°C. When the PWM output shuts down, the VDD  
voltage gradually drops to the UVLO voltage. Some of the  
internal circuits shut down and VDD gradually starts  
www.fairchildsemi.com  
Figure 21. Two Steps of Providing Power to the  
PSR Controller  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
8
AN-6067  
APPLICATION NOTE  
increasing again. When VDD reaches 16V, all the internal  
circuits, including the temperature sensing circuit, start  
operating normally. If the junction temperature is still higher  
than 145°C, the PWM controller shuts down immediately.  
This continues until the temperature drops below 120°C.  
For example, a power board for a charger application is  
5V/1A. Short the COMR pin to GND first and measure the  
output voltage from light load to maximum load. If the  
output voltage with cable is 4.7V at 1A, the percentage to  
5V is 6%. Calculate the RCOMR as:  
6
GATE Output  
(6)  
RCOMR  
=
59.5KΩ  
100.8×106  
The PSR controller BiCMOS output stage is a fast totem  
pole gate driver. Cross conduction design elimination was  
used to minimize heat dissipation, increase efficiency, and  
enhance reliability. The output driver is clamped by an  
internal 15V Zener diode for the protection of power  
MOSFET against over-voltage gate signals.  
Choose the approximate value of RCOMR and let the output  
voltage compensate gradually. Figure 23 is RCOMR compared  
to percentage curve for reference.  
12  
10  
8
Brownout Protection  
The PSR controller has a built-in brownout protection  
circuit to shut down the PWM output. As the input voltage  
decreases, the flowing current from VS pin is less than IVS-  
UVP, the PWM output shuts down immediately and enters an  
auto restart mode. The VDD voltage gradually drops to the  
UVLO voltage.  
6
4
2
0
10  
20  
30  
39  
51  
60  
68  
81  
91  
100  
R
COMR (K ohm)  
Figure 23. RCOMR vs. Percentage  
RVS  
Lab Note  
Vs  
Auxiliary  
Before reworking or soldering / desoldering on the power  
supply, discharge the primary capacitors by way of the  
external bleeding resistor. If not, the PWM IC may be  
destroyed by external high-voltage discharge during the  
soldering / desoldering.  
Winding  
IVS-UVP  
PSR  
Controller  
MOS turns on  
Figure 22. Brownout Protection  
Cable Compensation  
The FAN102/FSEZ1216 PWM controller has a cable  
compensation function used to compensate the output  
voltage drop due to output cable loss. Use an external  
resistor connected from COMR pin to GND adjusts the  
amount of cable compensation.  
In CV regulation control, the on-time of MOSFET only  
regulates on-board voltage, not including output cable.  
Different cable wire gauge or length results in different  
output voltage. As previous mentioned in the CC regulation  
control section that can calculate the output current. This  
calculated signal can provide the controller the output load  
condition and determine the amount of cable compensation,  
then rescue output voltage drop. To calculate compensation  
percentage, use the equation below:  
Percentage  
100.8×106  
(5)  
RCOMR  
=
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
9
AN-6067  
APPLICATION NOTE  
Determine Maximum and Minimum Input Voltage  
Application Information  
Figure 26 shows the corrected input voltage waveform. The  
red line shows ripple voltage on the bulk capacitor and the  
minimum and maximum voltage on the bulk capacitor is  
expressed in equations 7 and 8, respectively. The CBULK is  
the input capacitor and a typical value is 2-3µF per watt of  
output power for wide range input voltage (90-264V).  
Transformer Design  
The transformer inductor current must operate in DCM  
under any conditions. A typical output V-I curve is shown in  
Figure 24. For discontinuous current mode operation, the  
transformer inductor should be small enough to meet this  
condition. Point “B” is the lowest output voltage within the  
CC regulation and the widest discharge time of the  
transformer inductor due to the reflected voltage on the  
primary inductor. It is the easiest into CCM condition for  
transformer inductor.  
V
in.min  
Assume  
2.5mS  
Point “A” is the maximum output power of the power  
system. Ensure that the magnetic flux density falls within  
0.25~0.3 Tesla, considered a safe range. The number of  
turns for primary transformer inductor can be determined on  
point “A.” Figure 25 shows the characteristic curve of turn  
ratio and transformer inductance.  
Figure 26. Bridge Rectifier and Bulk Capacitor Voltage  
Waveform  
2Vo Io (1- 0.3)  
η Cbulk 120  
2
Vin.min = 2Vac,min  
-
(7)  
(8)  
V
maximum output power  
o
(determine turn number)  
V
= 2 Vac.max  
in.max  
A
Determine the Turn Ratio  
determine  
The transformer turn ratio (np=Npri/Nsec) is an important  
primary inductor  
B
parameter of the flyback converter; it affects the maximum  
duty ratio when the input voltage is at a minimum value. It  
also influences the voltage stresses on the MOSFET and the  
secondary rectifier. The permissible voltage stresses and the  
maximum voltage stresses on the MOSFET, as well as the  
secondary rectifier, can be expressed as:  
Io  
Figure 24. Critical Operating Points to Determine  
the Transformer  
VDS.max =Vin.max + np (Vo +Vf )  
(9)  
B=0.5V  
B=1V  
B=1.5V  
B=2V  
V
in.max  
VF.max  
=
+Vo  
3.5  
3
(10)  
np  
2.5  
2
The leakage spike due to leakage inductance on the  
MOSFET and rectifier must also be taken into account.  
1.5  
1
Determine Transformer Inductance  
Determine the VDD voltage level and if the output voltage is  
defined. The turn ratio between auxiliary winding and  
secondary winding can be calculated as:  
0.5  
0
Io =1A, Vf = 0.45V  
5
6
7
8
9
10  
11  
12  
13  
14  
15  
VDD +Vfa  
n(turn ratio)  
na =  
(11)  
VO +Vf  
Figure 25. Characteristic Curve of Turn Ratio  
and Inductance  
where VDD is voltage on VDD cap, usually ranging from  
about 15V~20V.  
In the CC regulation region, on point “B,” the power system  
shuts down if the output voltage is too low and the VDD  
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© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
10  
AN-6067  
APPLICATION NOTE  
voltage reaches the turn-off threshold voltage of the PSR  
controller. Therefore, if na was calculated, the Vo,“B” can be  
obtained as:  
Determine Primary Inductance Turn Number  
Based on Faraday’s law and the peak inductor current, the  
minimum turns for the primary inductance is calculated as:  
V + 6.75-V n  
Lp ipk," A"  
fa  
f
a
106  
VO,"B"  
=
(12)  
Npri  
=
(17)  
na  
Bmax A  
e
where:  
where:  
Vfa is forward-voltage of rectifier diode of auxiliary winding.  
Vf is forward-voltage of output diode.  
B
max is the saturation magnetic flux density,  
Ae is the effective area of the core-section.  
6.75V is typically the turn-off threshold voltage of the PSR  
controller.  
The number of turns for the secondary winding is defined as:  
Npri  
The maximum duty ratio can be calculated by using a point  
“B” output condition:  
Nsec  
=
(18)  
np  
np (Vo,"B" +Vf )  
Once the secondary winding has been calculated, the  
number of turns for the auxiliary winding is defined as:  
don.max,"B"  
=
(13)  
V
in.min,"B" + np (Vo,"B" +Vf )  
Naux = na Nsec  
(19)  
The transformer inductance (Lp) is designed specifically for  
DCM operation and a CC tolerance of +/-10% should be  
considered. The transformer inductance can be obtained as:  
Determine the Divider Resistor (R1) and Current-  
Sense Resistor (RS)  
2
η
,"B" Vin.min," B"2 dmax," B"  
Lp =  
(14)  
Once the output voltage VO and auxiliary winding have been  
defined, the feedback signal divider resistor, R1, can be  
calculated as:  
2Vo," B" Io fs  
where:  
η,”B” is the estimated system efficiency of point “B.”  
na  
R = R ⋅  
V +V 1  
(20)  
(
)
1
2
O
f
If no values are available, use 0.45~0.5 as an initial value.  
V
ref  
fs is the PWM frequency.  
where Vref=2.5V, R2 is typically set to 15~20KΩ.  
After the primary inductance is calculated, the maximum  
duty ratio of point “A” can be expressed as:  
As discussed in the Constant Current Output Regulation  
section, the region of constant current output operation can be  
adjusted by the current-sense resistor. After the turn ratio (np)  
has been determined, the relationship between the output  
current IO and current sense resistor Rs is expressed as:  
2VO," A" IO LP  
don.max," A"  
=
(15)  
η
," A" Vin. min," A"2 Ts  
where Ts is the switching period.  
0.111875np  
The primary peak inductor current (IPK) of point “A” at full  
load and low line input voltage condition is:  
RS =  
(21)  
IO  
V
in.min,"A" don.max,"A" TS  
As Figure 27 shows, a design spreadsheet can be used to  
calculate the transformer design and select the power system  
components for a first prototype. A 5V/1A design example  
is shown in Figure 27.  
ipk,"A"  
=
(16)  
Lp  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
11  
AN-6067  
APPLICATION NOTE  
Figure 27. Calculated System Parameter by Design Spreadsheet  
The parameters in Figure 27 can be found in the corresponding components in Figure 28.  
Vdc  
Vdc  
R
in  
- VFa  
+
+ VF  
-
+
VO  
Nsec  
Naux  
Npri  
R1  
+
Vds  
-
VS  
VDD  
na : np :1  
R2  
Vs Cap.  
VDD Cap.  
RS  
Figure 28. Application Circuit  
6
1
Vin  
Primary  
Winding  
Secondary  
Winding  
N2  
N1  
N3  
Transformer Structure  
2
3
MOS 's  
As mentioned in the Constant Voltage Output Regulation  
section, the PSR controller incorporates a proprietary  
control design to achieve CV/CC regulations. A correct  
sampling voltage of the auxiliary winding is critical to the  
CV/CC performance. Therefore, the coupling of the  
auxiliary winding and the secondary winding should be  
precise. The suggested transformer structure is shown in  
Figure 29 and Figure 30. The coupling coefficient between  
the secondary winding and the auxiliary winding can be  
effectively improved by sloughing off the EMI shielding  
between auxiliary winding and secondary winding. Further  
effectiveness is achieved by increasing the coupling area  
through a well-paved the auxiliary winding on the top layer.  
Drain  
8
Auxiliary  
Winding  
4
EMI Shielding  
Figure 29. Transformer Winding  
Auxiliary  
4
3
6
Winding(N3)  
Secondary  
8
Winding(N2)  
(Insulated)  
EMI Shielding  
1
2
Primary  
Winding(N1)  
EMI Shielding  
Figure 30. Recommended Transformer Structure  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
12  
AN-6067  
APPLICATION NOTE  
Effect of the Vs Pin Capacitor  
A VS capacitor with 22~68pF placed closely between Vs pin  
and the GND pin is recommended. The capacitor is used to  
bypass switching induced noise and keep the accuracy of the  
sampled voltage. The value of the capacitor affects the load  
regulation and constant current performance. Figure 31  
illustrates the measured waveform on the Vs pin with a  
different VS capacitor. If a higher value VS capacitor is used,  
the charging time becomes longer and the sampled voltage is  
higher than the actual value. Figure 32 shows the effect on  
the sampled voltage with a different VS capacitor.  
No-Load  
Figure 33 shows a measured Vs pin waveform at a no-load  
condition. As illustrated, the feedback voltage is too narrow.  
Additionally, a large VS capacitor causes the inaccurate  
sampling of the voltage; resulting in the rising of the output  
voltage. Figure 24 shows the influence of the VS capacitor  
on the V-I curve.  
VS  
Gate COMV Vf  
Figure 33. Measured Vs Pin Waveform at No Load  
Vo  
Lower Vs Cap.  
Higher Vs Cap.  
Io  
Figure 34. Comparison of V-I Curve  
with Different Vs Capacitor  
Effect of VDD and Snubber Capacitors  
VDD voltage and snubber capacitors are related to the  
feedback signal inaccuracy and cause output voltage to rise  
at no-load condition.  
Figure 31. Measured Waveform with  
Different VS Capacitor  
If the VDD capacitor is not big enough, the decreasing PWM  
frequency at no-load condition causes VDD voltage to drop  
quickly. In such a condition, the feedback signal is  
dominated by the VDD voltage, but not the secondary output  
voltage. To avoid this, it is recommended the VDD capacitor  
value be larger than 4.7µF(6.8~10µF).  
higher Vs Cap  
lower Vs Cap  
Vs pin waveform  
sampling voltage  
On the other hand, the value of the snubber capacitor also  
affects the output voltage performance. When the MOSEFT  
is turned off, the polarity of the transformer primary side  
inductor is reversed and the energy stored in the transformer  
inductor is delivered to the secondary to supply load current.  
In the meantime, if the output voltage is higher than the  
voltage on the secondary winding (Vsec), the output diode is  
still reversed. The resulting voltage Vpri is then applied to  
the primary inductor, Lp, which charges the snubber  
sampling voltage  
No - Load  
capacitor. The charge time influences the feedback voltage  
signal on the auxiliary winding. It is recommended that the  
snubber capacitor remain under 472pF(332~102pF).  
Figure 32. Effect on Sampling Voltage with  
Different VS Capacitor  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
13  
AN-6067  
APPLICATION NOTE  
Vin  
Ra  
- Vfa +  
+ Vf -  
+
+
+
Vaux  
-
+
Vsec  
VO  
Vpri  
R1  
-
-
VDD  
VS  
SGP100  
na : np :1  
VO >Vsec  
R2  
Vs Cap.  
VDD Cap.  
Figure 35. VDD and Snubber Capacitors Effect on Output Voltage  
Reducing No-Load Output Voltage with a  
“Dummy” Load  
At no-load and very light load conditions, due to the very  
low PWM frequency caused by feedback signal deviations  
and output voltage rises, especially at low-line input voltage  
condition. Increasing the addition of a dummy load can fix  
this problem. Figure 36 shows the effect of a higher and  
lower dummy load on the V-I curve. The level of the  
dummy load is suggested at about 25~100mW.  
lower snubber cap,  
Vo  
higher VDD cap , dummy load  
higher snubber cap,  
lower VDD cap , dummy load  
Io  
Figure 36. Dummy Load Effect on Output Characteristic  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
14  
AN-6067  
APPLICATION NOTE  
PCB Layout Considerations  
High-frequency switching current / voltage make PCB  
layout a very important design issue. Good PCB layout  
minimizes excessive EMI and helps the power supply  
survive during surge/ESD tests.  
Suggestion for the Ground Connections  
GND 3241: May make it possible to avoid common  
impedance interference for the sense signal.  
Regarding the ESD discharge path, the charges go from  
secondary through the transformer stray capacitance to  
GND2 first. Then the charges go from GND2 to GND1 and  
back to the mains. It should be noted that control circuits  
should not be placed on the discharge path.  
General Guidelines  
The numbers in the following guidelines refer to Figure 37.  
To improve EMI performance and reduce line frequency  
ripples, the output of the bridge rectifier should be  
connected to capacitors C1 and C2 first, then to the  
switching circuits.  
5 Should a point-discharge route to bypass the static  
electricity energy. As shown in Figure 38, it is suggested to  
map out this discharge route.  
The high-frequency current loop is in C2 – Transformer –  
MOSFET – R7 – C2. The area enclosed by this current  
loop should be as small as possible.  
Start in secondary GND to the positive terminal of C2, then  
to front terminal of bridge rectifier. If this discharge route is  
connected to the primary GND, it should be connected to the  
negative terminal of C2 (GND1) directly.  
Keep the traces (especially 41) short, direct, and wide.  
High voltage traces related to the drain of MOSFET and  
RCD snubber should be kept far way from control circuits to  
prevent unnecessary interference. If a heatsink is used for  
the MOSFET, connect this heatsink to a ground.  
However, the creepage distance between these two pointed  
ends should be long enough to satisfy the requirements of  
applicable standards.  
As indicated by 3, the ground of the control circuits should  
be connected first, then to other circuitry.  
As indicated by 2, the area enclosed by the transformer  
aux winding, D1 and C3, should also be kept small.  
Place C3 close to the PSR controller for good decoupling.  
R13  
5
5
T1  
BD1  
R8  
C6  
C1  
C2  
L1  
D4  
R1  
D1  
1
R2  
R3  
C3  
U1  
2
D3  
VS  
VDD  
7
3
4
6
5
8
1
2
C5  
R4  
COMI  
GATE  
CS  
R5  
R6  
C8 R10  
COMV  
R7  
C7 R9  
SGND  
PGND  
4
PSR Controller  
3
Figure 37. Layout Consideration  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
15  
AN-6067  
APPLICATION NOTE  
PCB Layout Considerations (Continued)  
Figure 38. PCB Layout Example (5V/1A, 5W Power Board)  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
16  
AN-6067  
APPLICATION NOTE  
Reference Circuits  
C8  
R11  
L2  
R13  
L1  
D4  
T1  
BD1  
R8  
C5  
D3  
C1  
C2  
C9  
C10  
R12  
R1  
D1  
R2  
R3  
C3  
U1  
R4  
VS  
VDD  
7
3
4
6
5
8
1
2
C4  
COMI  
GATE  
CS  
R5  
R6  
C7 R10  
COMV  
R7  
C6 R9  
SGND  
PGND  
Figure 39. Application Circuit FAN100 (5V/1A)  
BOM List  
Symbol Component  
Symbol Component  
R1  
R2  
R3  
R4  
R5  
D4  
C1  
C2  
C3  
C4  
Diode 5A/60V SB560  
Resistor 1.5MΩ 1/2W  
Electrolytic Capacitor 1µF/400V  
Electrolytic Capacitor 10µF/400V  
Electrolytic Capacitor 10µF/50V  
MLCC X7R 22pF  
Resistor 4.7Ω  
Resistor 115KΩ 1%  
Resistor 18KΩ 1%  
Resistor 47Ω  
R6  
R7  
R8  
R9  
C5  
C6  
C7  
C8  
Snubber Capacitor 472pF/1KV  
MLCC X7R 683pF  
Resistor 100Ω  
Resistor 1.4Ω 1/2W 1%  
Resistor 100KΩ 1/2W  
Resistor 200KΩ  
MLCC X7R 103pF  
MLCC 102pF/100V  
R10  
C9  
Electrolytic Capacitor 560uF/10V L-ESR  
Resistor 30KΩ  
Resistor 47Ω  
Resistor 510Ω  
R11  
R12  
C10  
L1  
Electrolytic Capacitor 330µF/10V L-ESR  
Inductor 1mH  
R13  
BD1  
D1  
L2  
Q1  
Inductor 5µH  
WireWound Resistor 18Ω  
Rectifier Diode 1N4007 *4  
Diode 1A/200V FR103  
Fairchild 2A/600V 2N60 TO-251  
FAN100  
U1  
D3  
Diode 1A/1000V 1N4007  
TR1  
EE-16 Lm=1.5mH Pri:Sec:Aux=135:10:33  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
17  
AN-6067  
APPLICATION NOTE  
Reference Circuits (Continued)  
R8  
C8  
L2  
R10  
L1  
D4  
T1  
BD1  
R5  
C5  
D3  
C1  
C2  
C9  
C10  
R9  
R1  
D1  
C3  
R2  
R3  
U1  
VS  
VDD  
6
3
4
2
5
8
1
7
C4  
COMI  
COMV  
DRAIN  
CS  
C7 R7  
R4  
C6 R6  
GND  
N.C.  
Figure 40. Application Circuit FSEZ1016A (FAN100 + MOSFET) (5V/1A)  
BOM List  
Component  
Component  
Symbol  
Symbol  
R1  
R2  
R3  
R4  
R5  
C1  
C2  
C3  
C4  
C5  
Electrolytic Capacitor 1µF/400V  
Electrolytic Capacitor 10µF/400V  
Electrolytic Capacitor 10µF/50V  
MLCC X7R 47pF  
Resistor 1.5MΩ  
Resistor 127KΩ 1%  
Resistor 20KΩ 1%  
Resistor 1.36Ω 1/2W 1%  
Resistor 100KΩ 1/2W  
Snubber Capacitor 472pF/1KV  
R6  
R7  
R8  
R9  
C6  
C7  
C8  
C9  
MLCC X7R 683pF  
Resistor 200KΩ  
Resistor 39KΩ  
Resistor 47Ω  
MLCC X7R 103pF  
MLCC 102pF/100V  
Electrolytic Capacitor 560µF/10V  
Resistor 510Ω  
R10  
BD1  
D1  
C10  
L1  
Electrolytic Capacitor 330µF/10V  
Inductor 1mH  
WireWound Resistor 18Ω  
Rectifier Diode 1N4007 *4  
Diode 1A/200V FR103  
Diode 1A/1000V 1N4007  
Diode 5A/60V SB560  
L2  
Inductor 5µH  
D3  
U1  
FSEZ1016A  
D4  
TR1  
EE-16 Lm=1.5mH Pri:Sec:Aux=135:10:33  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
18  
AN-6067  
APPLICATION NOTE  
Reference Circuits (Continued)  
C9  
R11  
L2  
R13  
L1  
D4  
T1  
BD1  
R8  
C6  
D3  
C1  
C2  
C10  
C11  
R12  
R1  
D1  
C3  
R3  
R4  
U1  
VDD  
VS  
7
3
4
6
5
8
1
2
C5  
COMI  
COMV  
GATE  
CS  
R5  
Q1  
R6  
C8 R10  
R7  
C7 R9  
R2  
C4  
COMR  
GND  
Figure 41. Application Circuit FAN102 (5V/1A)  
BOM List  
Component  
Component  
Component  
Symbol  
R1  
Symbol  
Symbol  
D3  
D4  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
C8  
C9  
Diode 1A/1000V 1N4007  
Diode 5A/60V SB560  
Q1 1A/600V 1N60 TO-251  
Resistor 1.5MΩ 1/2 W  
Resistor 82KΩ 1%  
Resistor 110KΩ 1%  
Resistor 18KΩ 1%  
Resistor 47Ω  
R2  
TR1  
EE-16 Lm=1.5mH Pri:Sec:Aux=135:10:33  
FAN102  
R3  
Electrolytic Capacitor 1µF/400V  
Electrolytic Capacitor 10µF/400V  
Electrolytic Capacitor 10µF/50V  
MLCC 104pF  
U1  
R4  
R5  
R6  
Resistor 100Ω  
R7  
MLCC X7R 22pF  
Resistor 1.4Ω 1/4W 1%  
Resistor 100KΩ 1/2W  
Resistor 200KΩ  
R8  
Snubber Capacitor 472pF/1KV  
MLCC X7R 683pF  
R9  
R10  
R11  
MLCC X7R 103pF  
Resistor 47KΩ  
MLCC 102pF/100V  
Resistor 20Ω  
Electrolytic Capacitor 560µF/10V  
L-ESR  
R12  
R13  
C10  
C11  
Resistor 510Ω  
Electrolytic Capacitor 330µF/10V  
L-ESR  
WireWound Resistor 18Ω  
Rectifier Diode 1N4007 *4  
Diode 1A/200V FR103  
BD1  
D1  
L1  
L2  
Inductor 1mH 1/2W  
Inductor 5µH  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
19  
AN-6067  
APPLICATION NOTE  
Reference Circuits (Continued)  
R8  
C8  
L2  
R10  
L1  
D4  
T1  
BD1  
R5  
C5  
D3  
C1  
C2  
C9  
C10  
R9  
R1  
D1  
C3  
R2  
R3  
U1  
VS  
VDD  
6
3
4
7
5
8
1
C4  
COMI  
COMV  
DRAIN  
C7 R7  
CS  
R4  
C6 R6  
R11  
GND  
COMR  
2
C11  
Figure 42. Application Circuit FSEZ1216 (5V/1A)  
BOM List  
Component  
Component  
Component  
Symbol  
R1  
Symbol  
D4  
Symbol  
U1  
Diode 5A/60V SB560  
FSEZ1216  
Resistor 1.5M Ω  
EE-16 Lm=1.5mH  
Pri:Sec:Aux=135:10:33  
R2  
C1  
Electrolytic Capacitor 1µF/400V  
TR1  
Resistor 110KΩ 1%  
Resistor 18KΩ 1%  
R3  
R4  
R5  
C2  
C3  
C4  
Electrolytic Capacitor 10µF/400V  
Electrolytic Capacitor 10µF/50V  
MLCC X7R 47pF  
Resistor 1.4Ω 1/2W 1%  
Resistor 100KΩ 1/2W  
R6  
R7  
R8  
R9  
C5  
C6  
C7  
C8  
Snubber Capacitor 472pF/1KV  
MLCC X7R 683pF  
Resistor 200KΩ  
Resistor 47KΩ  
Resistor 47Ω  
MLCC X7R 103pF  
MLCC 102pF/100V  
Resistor 510Ω  
R10  
R11  
BD1  
D1  
C9  
C10  
C11  
L1  
Electrolytic Capacitor 560µF/10V  
Electrolytic Capacitor 330µF/10V  
MLCC X7R 104pF  
WireWound Resistor 18Ω  
Resistor 82KΩ 1%  
Rectifier Diode 1N4007 *4  
Diode 1A/200V FR103  
Diode 1A/1000V 1N4007  
Inductor 1mH  
D3  
L2  
Inductor 5µH  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
20  
AN-6067  
APPLICATION NOTE  
Related Datasheets  
FAN100 — Primary-Side Regulation PWM Controller  
FAN102 — Primary-Side Regulation PWM Controller  
FSEZ1016A — Primary-Side Regulation PWM with Integrated Power MOSFET  
FSEZ1216 — Primary-Side Regulation PWM with Integrated Power MOSFET  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE  
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS  
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
© 2008 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 1/26/10  
www.fairchildsemi.com  
21  

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