AN-6208 [FAIRCHILD]

Secondary-Side Synchronous Rectifier (SR) for LLC Resonant Converter; 二次侧同步整流器( SR)的LLC谐振转换器
AN-6208
型号: AN-6208
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Secondary-Side Synchronous Rectifier (SR) for LLC Resonant Converter
二次侧同步整流器( SR)的LLC谐振转换器

转换器
文件: 总10页 (文件大小:471K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
www.fairchildsemi.com  
ANꢀ6208  
SecondaryꢀSide Synchronous Rectifier (SR) for  
LLC Resonant Converter Using FAN6208  
FAN6208 is a synchronous rectification controller for  
Introduction  
isolated LLC or LC resonant converters that can drive two  
individual SR MOSFETs emulating the behavior of rectifier  
diodes. FAN6208 measures the SR conduction time of each  
switching cycle by monitoring the drainꢀtoꢀsource voltage of  
each SR and determines the optimal timing of SR gate  
drive. FAN6208 also uses the change of optoꢀcoupler diode  
current to adaptively shrink the duration of SR gate drive  
signals during load transients to prevent shootꢀthrough. To  
improve lightꢀload efficiency, Green Mode disables the SR  
drive signals, minimizing gate drive power consumption at  
lightꢀload conditions.  
The LLC resonant converter has drawn a lot of attention  
recently due to its advantages over a conventional series  
resonant converter and parallel resonant converter: narrow  
frequency variation over wide load, input variation, and  
Zero Voltage Switching (ZVS) for the entire load range.  
In an LLC resonant converter, rectifier diodes are typically  
used to obtain DC output voltage from the transformer  
secondary winding. The conduction loss of diode rectifier  
contributes significantly to the overall power losses in an  
LLC resonant converter; especially in low output voltage  
applications. The conduction loss of  
a rectifier is  
This application note describes the design procedure for a  
SR circuit using FAN6208. The guidelines for printed  
circuit board (PCB) layout and a design example with  
experiment results are also presented. Figure 1 shows the  
typical application circuit of FAN6208.  
proportional to the product of its forwardꢀvoltage drop and  
the forward conduction current. Using synchronous  
rectification (SR) where the rectifier diode is replaced by  
MOSFET with a small on resistance (RDSON), the forwardꢀ  
voltage drop of a synchronous rectifier can be lower than  
that of a diode rectifier and, consequently, the rectifier  
conduction loss can be reduced.  
Figure 1. Typical Application  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
ANꢀ6208  
APPLICATION NOTE  
LLC Resonance Converter with SR  
Q1 Gate  
Q2 Gate  
Figure 2 shows the simplified schematic of a halfꢀbridge  
LLC resonant converter, where Lm is the magnetizing  
inductance that acts as a shunt inductor, Lr is the series  
resonant inductor, and Cr is the resonant capacitor. Since the  
magnetizing inductor is relatively small, a considerable  
amount of magnetizing current (Im) exists, which freewheels  
in the primary side without being involved in the power  
transfer. The primaryꢀside current (Ip) is sum of the  
magnetizing current and the secondaryꢀside current referred  
to the primary.  
IP  
Im  
Figure 3 shows the typical gain curve of the halfꢀbridge  
LLC resonant converter. To allow Zero Voltage Switching  
(ZVS) for the primaryꢀside switches, gain curves with  
inductive impedance characteristics should be used, where  
the gain decreases as frequency increases. The resonant  
network has a resonant frequency determined by the  
resonance between Lr and Cr. When the switching frequency  
is lower than the resonant frequency (below resonance), the  
half resonance of reflected secondaryꢀside current (diode  
current) finishes before the primaryꢀside switch is turned  
off, as shown in Figure 4. When the switching frequency is  
higher than the resonant frequency (above resonance) the  
primaryꢀside switch is turned off before the half resonance  
of reflected secondaryꢀside current (diode current) is  
completed, as shown in Figure 5.  
ID  
ISR1  
ISR2  
VSR2  
2*Vo  
SR Onꢀtime  
SR1 Gate  
Figure 4. Key Waveforms Below ꢀResonance Operation  
Figure 2. Schematic of LLC Resonant  
Converter with SR  
1
fo  
=
2
π LrCr  
Figure 5. Key Waveforms of AboveꢀResonance  
Operation  
Lr /Cr  
Q =  
Rac  
Figure 3. Typical Gain Curves of LLC  
Resonant Converter  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
2
ANꢀ6208  
APPLICATION NOTE  
Application Circuit  
tSR-ON-DETL  
Figure 6 shows the typical application circuit of FAN6208  
and Figure 7 shows the typical timing diagram of SR gate  
drive signal. FAN6208 senses the drainꢀtoꢀsource voltage of  
each SR to determine the gate drive timing. Once the body  
diode of SR begins conducting, the drainꢀtoꢀsource voltage  
drops to zero, which causes low detection (DETL) pin  
voltage to drop to zero. FAN6208 turns on the MOSFET  
after tONꢀONꢀDETL (about 350ns), when the voltage on DETL  
drops below 2V. As depicted in Figure 8, the turn ꢀon delay  
(after tSRꢀONꢀDETL) is a sum of debounce time (150ns) and  
propagation delay (200ns).  
350ns  
DETL1  
2V  
VDETL1  
tDB  
tPD  
GATE1  
150ns 200ns  
tSRꢀONꢀDETL  
350ns  
DETL1  
GATE1  
2V  
VDETL1  
tDB  
150ns 200ns  
tSRꢀONꢀDETL  
tPD  
FAN6208 measures the SR conduction duration (tDETL),  
during which DETL voltage stays lower than 2V, and uses  
this information to determine the turnꢀoff instant of SR  
gates of the next switching cycle, as shown in Figure 7. The  
turnꢀoff instant is obtained by subtracting a dead time  
(tDEAD) from the measured SR conduction duration of the  
previous switching cycle.  
350ns  
DETL1  
GATE1  
VDETL1  
2V  
tDB  
tPD  
150ns 200ns  
Figure 8. Timing Diagram for Turning On SR  
Figure 6. Application Circuit of FAN6208  
DETL Pin Configuration  
Allowable voltage on the DETL pin is from ꢀ0.3V to 7V.  
Since the maximum voltage of the SR drainꢀtoꢀsource  
voltage is twice that of the output voltage, a diode (DDETL) is  
required for the DETL pin to prevent high voltage. Diode  
1N4148 is typically used for DDETL. Since the DETL  
internal current source is 50ꢁA, RDETL should be determined  
such that the DETL voltage is lower than the low detection  
threshold (2V) with enough margin when the SR conducts.  
Since the forwardꢀvoltage drop of SR can be as low as zero  
when SR current is small, the DETL resistor should be:  
(2 VFD  
50A  
)
RDETL⋅ <  
(1)  
where VFD is the forwardꢀvoltage drop of DETL diode.  
Figure 7. SR Conduction Time Determination  
RDETL larger than 20kꢂ is not typically recommended for  
proper lowꢀvoltage detection on DETL pin.  
RDETL should be determined such that the DETL voltage is  
higher than ꢀ0.3V when the maximum voltage drop occurs  
across SR, such as:  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
3
ANꢀ6208  
APPLICATION NOTE  
max  
The RP pin has an internal constant current source (41.5ꢁA)  
and the pin voltage is determined by the Rp resistor.  
Depending on the RP pin voltage, the Green Mode threshold  
of tDETL is determined as shown in Figure 12. When RRP is  
less than 36Kꢂ, FAN6208 operates in LowꢀFrequency  
Mode, where Green Mode is enabled when tDETL is smaller  
than 3.75ꢁs. When RRP is larger than 36Kꢂ, Highꢀ  
Frequency Mode is selected and Green Mode is enabled for  
tDETL smaller than 1.90ꢁs.  
ISR  
R
VFD 0.3  
A
DS.ON  
(2)  
RDETL  
>
50  
where ISRmax is the maximum current of SR and RDS.ON is  
the maximum onꢀresistance of the SR MOSFET at high  
temperature.  
The RP pin also has two internal thresholds for pinꢀopen /  
short protection. Using RP pin short protection, remote on /  
off control can be implemented as shown in Figure 13  
.
Figure 9. Application Circuit of DETL Pin  
RP Pin Configuration  
The dead time can be programmed using a resistor on the  
RP pin. The relationship between the dead time and SR  
conduction duration (tDETL) for different resistor values on  
the RP pin are given in Figure 10 and Figure 11. Since the  
SR conduction time is shrunk by the protection function  
(gateꢀshrink function) when tDEAD is smaller than 125ns, Rp  
should be properly selected such that the gateꢀshrink  
function does not operate at maximum switching frequency.  
Figure 12.RP Pin Operation  
Original PSON Circuit Disable RP Pin Circuit  
5VB  
RP  
VDDSB  
41.5ꢁA  
RD  
VDDM  
RP  
QRP  
RG  
QPSON  
PSON  
Figure 10.tDEAD vs. tDETL for Different RP (Low Frequency)  
RGS  
5VB  
Figure 13.Application Circuit of RP Pin for Remote  
ON / OFF  
GateꢀShrink Functions  
In normal operation, the turnꢀoff instant is determined by  
subtracting a dead time (tDEAD) from the measured SR  
conduction duration of the previous switching cycle, as  
shown in Figure 7. This allows proper driving timing for the  
SR MOSFETS when the converter is in steady state and the  
switching frequency does not change much. However, this  
control method may cause shootꢀthrough of SR MOSFETs  
when the switching frequency increases fast and switching  
Figure 11.tDEAD vs. tDETL for Different RP (High Frequency)  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
4
ANꢀ6208  
APPLICATION NOTE  
Figure 15.Application Circuit of FD Pin  
transition of the primaryꢀside MOSFETs takes place before  
the turnꢀoff command of the SR is given. To prevent the  
shootꢀthrough problem, FAN6208 has gateꢀshrink functions.  
Gate shrink takes place in the following three conditions:  
1. When an insufficient dead time is detected in the  
previous switching cycle. When the DETL becomes  
HIGH within 125ns of the detection window after SR  
gate is turned off, the SR gate drive signal in the next  
switching cycle is reduced by tSHRINKꢀDT (about 1.25ꢁs)  
to increase the dead time as shown in Figure 14  
.
Figure 16.Gate Shrink by Feedback Detection  
3. When the DETL voltage has ringing around zero. As  
depicted in Figure 17, the drain voltage of SR has  
ringing around zero at lightꢀload condition after the  
switching transition of primaryꢀside switches. When  
DETL voltage rises above 2V within 350ns after DETL  
voltage drops to zero and stays above 2V longer than  
150ns, the gate is shrunk by 1.2ꢁs (tSHRINKꢀRNG), as  
shown in Figure 17.  
Figure 14.Gate Shrink by Insufficient Dead Time  
2. When the feedback information changes fast. FAN6208  
monitors the current through the optoꢀcoupler diode by  
measuring the voltage across the resistor in series with  
optoꢀdiode, as depicted in Figure 15. If the feedback  
current through the opto diode increases by more than  
20% of the feedback current of the previous switching  
cycle, SR gate signal is shrunk by tSHRINKꢀFD (about  
1.4ꢁs) for tDꢀSHRINKꢀFD (about 90ꢁs), shown in Figure 16.  
Figure 17.Gate Shrink by the DETL Voltage Ringing  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
5
ANꢀ6208  
APPLICATION NOTE  
Printed Circuit Board Layout  
In Figure 18, the power traces are marked as bold lines.  
Good PCB layout improves power system efficiency and  
reliability and minimizes EMI.  
As indicated by 4, the ground of the feedback loop  
should be connected to the negative terminal of  
output capacitor CO.  
Trace 5 should be long and far from Vo terminal.  
Keep trace 6 as short as possible.  
As indicated by 7, the source terminals of Q1 and Q2  
are connected to the negative terminal of Co. Keep  
trace 10 short, direct, and wide.  
Guidelines  
For feedback detection, the FD pin should be connected  
to the anode of the opto diode. Connecting the FD pin  
through a resistor can improve surge immunity of the  
system. Keep trace 1 away from any power trace with  
high pulsating current.  
As indicated by 8, the negative terminal of Co should  
be connected to the case directly.  
The control ground (trace 2) and power ground (trace 7)  
should meet at a single point to minimize interference.  
The connecting trace should be as short as possible.  
Figure 18.Layout Considerations  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
6
ANꢀ6208  
APPLICATION NOTE  
Design Example  
The following example is a 12V/300W single output power  
supply with LLC resonant converter topology. As Figure 19  
shows, the FAN7621 controller is used for the LLC resonant  
converter. The integrated CCM PFC controller FAN6982 is  
used for PFC stage.  
Table 1.  
System Specification  
Input Voltage Range  
PFC Output  
90~264VAC  
360~390VDC  
FAN6982  
FAN7621  
12V  
PFC Controller  
Main power Controller  
Output Voltage (Vo)  
Output Power (Po)  
PFC Switching Frequency  
The key system parameters are listed in Table 1 and the Bill  
of Materials (BOM) is summarized in Table 2.  
300W  
65kHz  
The twoꢀlevel PFC output voltage function of FAN6982 is  
used where the typical PFC output voltage is 390V. The  
PFC output voltage is reduced to 360V for lowꢀline and  
lightꢀload condition to improve efficiency of the PFC stage.  
The typical switching frequency (fs) is 65kHz for PFC stage.  
LLC resonant converter Switching Frequency 60~140kHz  
The turn ratio n of TX1 is 13.5, Lm is 1.2mH, Lr is 150ꢁH,  
and Cr is 47nH. 1N4148 is used for D201 & D202 whose  
voltage rating is 100V. 27kꢂ is used for R204 (RRP) for the  
LowꢀFrequency Mode setting.  
Figure 19.Complete Circuit Diagram  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
7
ANꢀ6208  
APPLICATION NOTE  
Table 2. Bill of Materials  
Part  
Value  
Resistor  
Note  
Part  
Value  
Note  
Capacitor  
10ꢂF  
R101  
R102  
R103  
R104  
R105  
R106  
R107  
R108  
R109  
R110  
R201  
R202  
R203  
R204  
R205  
R206  
R207  
R208  
R209  
R210  
R211  
R212  
1/4W  
1/4W  
1/8W  
1/8W  
1/8W  
1/8W  
2W  
C108  
C201  
C202  
C203  
C204  
C205  
C206  
C301  
25V  
16V  
10  
3.3ꢁ  
3.3ꢁ  
10kꢁ  
10kꢁ  
1kꢁ  
3300ꢂF  
3300ꢂF  
16V  
47nF  
50V  
47nF  
50V  
470nF  
25V  
100nF  
50V  
0.2ꢁ  
5.1kꢁ  
9.1kꢁ  
5.6kꢁ  
10kꢁ  
10kꢁ  
10kꢁ  
27kꢁ  
10kꢁ  
10kꢁ  
10kꢁ  
1kꢁ  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
1/8W  
22nF/250V  
Transformer  
Lr =10ꢂH/ Lm =1200ꢂH  
Diode  
YꢀCapacitor  
TX1  
PQ3230  
D101  
D102  
D103  
D201  
D202  
UF1007  
1A/1000V  
1N4148  
1N4148  
1N4148  
1N4148  
Inductor  
L = 150ꢂH  
L = 1.8ꢂH  
MOSFET  
FCPF11N60F  
FCPF11N60F  
FDP025N06  
FDP025N06  
IC  
L101  
L201  
QP2914  
91kꢁ  
1kꢁ  
Q1  
Q2  
Q3  
Q4  
33kꢁ  
24kꢁ  
Capacitor  
C101  
C102  
C103  
C104  
C105  
C106  
C107  
270ꢂF  
0.33ꢂF  
150nF  
47nF  
450V  
50V  
1kV  
1kV  
50V  
50V  
50V  
U1  
U2  
U3  
U4  
FAN7621  
PC817  
LLC Controller  
SR Controller  
12nF  
FAN6208  
TL431  
100pF  
680pF  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
8
ANꢀ6208  
APPLICATION NOTE  
Figure 20 and Figure 21 show the SR gate drive waveforms  
for different RP. As can be seen, the dead time of SR drive  
can be programmed.  
The efficiency test results of the Schottky diode and  
synchronous rectification are shown in Table 3 and Table 4.  
Figure 22 compares the efficiencies of Schottky diode and  
synchronous rectification. As can be seen, 1~2% efficiency  
improvement can be obtained using synchronous  
rectification. Figure 22 also shows how the dead time of SR  
affects the efficiency. By fineꢀtuning the dead time,  
efficiency can be maximized.  
Table 3. Efficiency Measurements at VAC=115V on  
300W PC Power with Schottky Diodes (MBRP3045)  
Output  
Watts(W)  
Load  
Input Watts(W)  
Efficiency  
100%  
50%  
20%  
358.070  
176.38  
73.30  
307.658  
154.91  
62.19  
85.920%  
87.82%  
84.80%  
Table 4. Efficiency Measurements at VAC=115V on  
300W PC Power with SRs (FDP025N06 and  
RRP=30k)  
Input  
Watts  
(W)  
Output  
Watts  
(W)  
vs.  
Efficiency Schottky  
Diode  
Load  
Figure 20.Secondary Side Current and SR  
Gate Signal by RRP=24kꢁ  
100%  
50%  
20%  
347.70  
172.81  
72.41  
307.62  
154.77  
62.21  
88.47%  
89.56%  
85.91%  
+2.55%  
+1.74%  
+1.11%  
Figure 22.Efficiency Analysis  
Figure 21.Secondary Side Current and SR  
Gate Signal by RRP=27kꢁ  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
9
ANꢀ6208  
APPLICATION NOTE  
Related Resources  
FAN6208 — Secondary Synchronous Rectifier Controller for LLC Topology  
FAN7621 — PFM Controller for HalfꢀBridge Resonant Converters  
FAN6982 — CCM Power Factor Correction Controller  
FDP025N06 —FDP025N06 NꢀChannel PowerTrench® MOSFET 60V,265A, 2.5mꢁ  
1N/FDLL 914/A/B / 916/A/B / 4148 / 4448 — Small Signal Diode  
FSFR2100 — Fairchild Power Switch for HalfꢀBridge Resonant Converters  
AN4137 — Design Guidelines for Offꢀline Flyback Converters Using Fairchild Power Switch (FPS)  
ANꢀ4151 — HalfꢀBridge LLC Resonant Converter Design Using FSFRꢀSeries Fairchild Power Switch (FPS)  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE  
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS  
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
© 2010 Fairchild Semiconductor Corporation  
Rev. 1.0.1 • 3/10/11  
www.fairchildsemi.com  
10  

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