TISP6L7591DR [ETC]
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS PROGRAMMABLE OVERVOLTAGE PROTECTORS; 双正向导电的P- GATE闸流体可编程过电压保护
| 型号： | TISP6L7591DR |
| 厂家： | 
ETC |
| 描述： | DUAL FORWARD-CONDUCTING P-GATE THYRISTORS PROGRAMMABLE OVERVOLTAGE PROTECTORS |
| 文件： | 总7页 (文件大小：227K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TISP6L7591
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
PROGRAMMABLE OVERVOLTAGE PROTECTORS
VERSIONS
*RoHS COMPLIANT
AVAILABLE
TISP6L7591 SLIC Protector
Rated for Standard Lightning Wave Shapes
D Package (Top View)
IPP
Wave Shape
Standard
1
8
7
6
5
TIP
VS
PT
A
2
3
4
GND
GND
PR
2/10
GR-1089-CORE ±80
ITU-T K.20 & K.21 ±40
GR-1089-CORE ±30
NC
10/700
10/1000
RING
MD6XAND
Rated for AC Fault Currents
Device Symbol
AC Time ITSM
TIP
PT (8)
(1)
Hz
s
A
0.01 ±5
±3.5
50/60
1
GND
GND
(7)
(6)
V
S (2)
Gate Trigger Current ............................................... 15 mA max.
High VS Voltage ......................................................... -80 V max.
High Holding Current ............................................. 150 mA min.
RING
PR
(5)
(4)
SD6XAEE
............................................ UL Recognized Components
Pin Symbol
Comment
Pin Symbol
Comment
Protected TIP
to SLIC
1
2
3
TIP
VS
Line-side TIP
8
7
6
5
PT
GND
GND
PR
Description
Supply voltage
to Gate
The TISP6L7591 is a dual forward-conducting buffered p-gate
overvoltage protector. It is designed to protect monolithic SLICs
(Subscriber Line Interface Circuits) against overvoltages on the
telephone line caused by lightning, a.c. power contact and
induction. The TISP6L7591 limits voltages that exceed the SLIC
supply rail voltage.
Ground
Ground
No Internal
connection
NC
Protected RING
to SLIC
4
RING
Line-side RING
The SLIC line driver section is typically powered from 0 V (ground)
and a negative voltage, VS, in the region of -20 V to -80 V. The
protector gate is connected to this negative supply. This
references the protection (clipping) voltage to the negative supply
voltage. The negative protection voltage will then track the
negative supply voltage and the overvoltage stress on the SLIC is
minimized.
Note:
Pins 1 and 4 must always be connected to the protection
resistors shown in Figures 2 and 3 (Line Feed Circuitry).
The SLIC can be connected either to the protected
outputs (pins 5 and 8) or to the inputs (pins 1 and 4).
Positive overvoltages are clipped to ground by diode forward conduction. Negative overvoltages are initially clipped close to the
SLIC negative supply rail value. If sufficient current is available from the overvoltage, then the protector will switch into a low voltage on-state
condition. As the overvoltage subsides the high holding current of TISP6L7591 crowbar prevents d.c. latchup.
These monolithic protection devices are fabricated in ion-implanted planar vertical power structures for high reliability and in normal system
operation they are virtually transparent. The TISP6L7591 is available in 8-pin plastic small-outline surface mount package.
How To Order
For Standard
For Lead Free
Termination Finish Termination Finish
Device
Package
Carrier
Order As
Order As
TISP6L7591 D (8-pin Small-Outline) R (Embossed Tape Reeled) TISP6L7591DR
TISP6L7591DR-S
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
MAY 2002 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
Absolute Maximum Ratings, T = 25 °C (Unless Otherwise Noted)
A
Rating
Symbol
(TIP)M, V(RING)M
V(VS)M
Value
-100
-80
Unit
V
Repetitive peak TIP or RING off-state voltage, V(VS)(TIP) = 0, V(VS)(RING) = 0
V
Repetitive peak V voltage, VTIP = 0, VRING = 0
V
S
Non-repetitive peak pulse current (see Notes 1, 2 and 3)
10/1000 µs (Bellcore GR-1089-CORE, open-circuit voltage wave shape 10/1000 µs)
5/320 µs (ITU-T K.20 & K.21, open-circuit voltage wave shape 10/700 µs)
2/10 µs (Bellcore GR-1089-CORE, open-circuit voltage wave shape 2/10 µs)
30
40
80
IPP
A
A
Non-repetitive peak on-state current, 50 Hz to 60 Hz (see Notes 1, 2 and 3)
10 ms
1 s
ITSM
5
3.5
Non-repetitive peak V current, half sine wave 10 ms, cathodes commoned (see Note 1)
I(VS)M
TA
+2
A
S
Operating free-air temperature range
Storage temperature range
-40 to +85
-40 to +125
°C
°C
T
stg
NOTES: 1. Initially the protector must be in thermal equilibrium. The surge may be repeated after the device returns to its initial conditions.
2. These non-repetitive rated currents are peak values for either polarity. The rated current values may be applied either to the Ring
to Ground or to the Tip to Ground terminal pairs. Additionally, both terminal pairs may have their rated current values applied
simultaneously (in this case the Ground terminal current will be twice the rated current value of an individual terminal pair).
3. Supply Voltage, VS, range -20 V to -80 V.
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted)
A
Parameter
Test Conditions
Min
Typ
Max
3
Unit
V
VF
VFP
IGT
IH
Forward voltage
Peak forward voltage
Gate trigger current
Holding current
IP = 5 A, tP = 1 ms
IPP = 30 A, 10/1000
VS = -48 V
15
15
V
0.2
mA
mA
V
tP = 10 ms, VS = -48 V
d.c.
-150
VT
Trip voltage
VS-2.8
-63
VSGL
Dynamic trip voltage
IPP = -30 A, 10/1000, VS = -48 V
V
TA = 25 °C
TA = 70 °C
-5
µA
µA
IRG
dvR/dt
VON
IR
Reverse gate current
VS = -75 V, VTIP = 0, VRING = 0
-50
Critical rate of voltage
rise
TIP or RING lead
±1000
V/µs
IT = -0.5 A, tP = 1 ms
IT = -3.0 A, tP = 1 ms
-3
-4
On-state voltage
V
TA = 25 °C
TA = 70 °C
-5
-50
50
40
µA
µA
pF
pF
Reverse current
(Gate open)
VR = -85 V, IG = 0
VR = -3 V
TIP or RING to GND
off-state capacitance
Coff
f = 1 MHz, Vd = 1 V, IG = 0, (see Note 4)
VR = -48 V
These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured
device terminals are a.c. connected to the guard terminal of the bridge.
NOTE 4:
MAY 2002 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
Parameter Measurement Information
+i
Quadrant I
IPP
Forward
Conduction
Characteristic
ITSM
IP
VF
VR
+v
-v
IR
IH
VON
VSGL
IT
ITSM
Quadrant III
IPP
Switching
Characteristic
-i
PM6XAAZ
Figure 1. Typical Voltage-Current Characteristic of the SLIC Protector
Unless Otherwise Noted, All Voltages are Referenced to the Anode
Letter Symbol Definitions
Symbol
IH
Parameter
Thyristor holding current
IGT
IP
Gate trigger current into VS pin
Pulse current
IPP
IRG
IT
Peak pulse current
Reverse current VS to TIP or RING
TIP or RING current when thyristor is on
Reverse current, TIP or RING to GND
Forward voltage, TIP or RING to GND
Peak forward voltage, TIP or RING to GND
Trip voltage, TIP or RING to VS
Dynamic trip voltage, TIP or RING to VS
Thyristor on voltage at IT
IR
VF
VFP
VT
VSGL
VON
VR
TIP or RING voltage when thyristor is off
Off-state capacitance, TIP or RING to Ground
Coff
MAY 2002 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
APPLICATIONS INFORMATION
TIP
TIP
PT (8)
(1)
Protected
Tip
RPT
GND
(7)
(6)
(5)
VS
V
S (2)
GND
RPR
Protected
Ring
RING
RING
(4)
PR
RPT and RPR must be properly selected
for proper operation and/or response.
AI6XDN
Figure 2. Standard Configuration
IP
TIP (1)
PT (8)
RPT
VMEAS
GND
GND
(7)
-48 V
V
S (2)
(6)
VMEAS
RPR
RING
PR
(4)
(5)
IP
AI6XDO
Figure 3. Test Circuit
MAY 2002 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
MECHANICAL DATA
Device Symbolization Code
Devices will be coded as below.
Device
TISP6L7591D
Symbolization Code
L7591
MAY 2002 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
MECHANICAL DATA
D008 Plastic Small-outline Package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound is
designed to withstand normal soldering temperatures with no deformation and circuit performance characteristics will remain stable when
operated in most high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
D008
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
4.80 - 5.00
(0.189 - 0.197)
8
7
6
5
5.80 - 6.20
(0.228 - 0.244)
INDEX
3.81 - 4.00
(0.150 - 0.157)
1
3
2
4
4.60 - 5.21
(0.181 - 0.205)
0.25 - 0.50
(0.010 - 0.020)
1.35 - 1.75
(0.053 - 0.069)
7 ° NOM
3 Places
x 45 ° N0M
0.102 - 0.203
(0.004 - 0.008)
4 ° 4 °
0.36 - 0.51
7 ° NOM
4 Places
(0.014 - 0.020)
8 Places
0.28 - 0.79
(0.011 - 0.031)
Pin Spacing
1.27
(0.050)
(see Note A)
6 places
0.190 - 0.229
(0.0075 - 0.0090)
0.51 - 1.12
(0.020 - 0.044)
MILLIMETERS
(INCHES)
DIMENSIONS ARE:
MDXXAAE
NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0.15 (0.006).
D. Lead tips to be planar within ±0.051 (0.002).
MAY 2002 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP6L7591 SLIC Protector
MECHANICAL DATA
D008 Tape DImensions
D008 Package (8-pin Small Outline) Single-Sprocket Tape
1.50 - 1.60
(.059 - .063)
3.90 - 4.10
(.154 - .161)
0.40
(.016)
1.95 - 2.05
(.077 - .081)
7.90 - 8.10
(.311 - .319)
0.8
(.03)
MIN.
5.40 - 5.60
(.213 - .220)
11.70 - 12.30
(.461 - .484)
6.30 - 6.50
(.248 - .256)
1.50
(.059)
ø
MIN.
0 MIN.
Cover
Tape
2.0 - 2.2
(.079 - .087)
Carrier Tape
Embossment
Direction of Feed
MILLIMETERS
(INCHES)
DIMENSIONS ARE:
NOTES: A. Taped devices are supplied on a reel of the following dimensions:-
MDXXATC
330 +0.0/-4.0
(12.99 +0.0/-.157)
Reel diameter:
100 ± 2.0
(3.937 ± .079)
Reel hub diameter:
13.0 ± 0.2
(.512 ± .008)
Reel axial hole:
B. 2500 devices are on a reel.
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
MAY 2002 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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