STGD3NB60KD [ETC]

N-CHANNEL 6A - 600V DPAK SHORT CIRCUIT PROOF POWERMESH IGBT ; N沟道6A - 600V DPAK短路保护的PowerMESH IGBT\n
STGD3NB60KD
型号: STGD3NB60KD
厂家: ETC    ETC
描述:

N-CHANNEL 6A - 600V DPAK SHORT CIRCUIT PROOF POWERMESH IGBT
N沟道6A - 600V DPAK短路保护的PowerMESH IGBT\n

晶体 晶体管 电动机控制 双极性晶体管 栅
文件: 总10页 (文件大小:498K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STGD3NB60KD  
N-CHANNEL 6A - 600V - DPAK  
SHORT CIRCUIT PROOF PowerMESH™ IGBT  
TYPE  
V
CES  
V
I (#)  
C
CE(sat) (Max)  
@25°C  
@100°C  
STGD3NB60KD  
600 V  
< 2.8 V  
6 A  
HIGH INPUT IMPEDANCE (VOLTAGE DRIVEN)  
LOW GATE CHARGE  
OFF LOSSES INCLUDE TAIL CURRENT  
HIGH FREQUENCY OPERATION  
SHORT CIRCUIT RATED  
LATCH CURRENT FREE OPERATION  
CO-PACKAGED WITH TURBOSWITCH™  
ANTIPARALLEL DIODE  
3
1
DPAK  
DESCRIPTION  
INTERNAL SCHEMATIC DIAGRAM  
Using the latest high voltage technology based on a  
patented strip layout, STMicroelectronics has  
designed an advanced family of IGBTs, the  
PowerMESH IGBTs, with outstanding  
performances. The suffix “K” identifies a family  
optimized for high frequency motor control  
applications with short circuit withstand capability.  
APPLICATIONS  
HIGH FREQUENCY MOTOR CONTROLS  
SMPS and PFC  
ORDERING INFORMATION  
SALES TYPE  
MARKING  
PACKAGE  
DPAK  
PACKAGING  
STGD3NB60KDT4  
GD3NB60KD  
TAPE & REEL  
September 2003  
1/10  
STGD3NB60KD  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
600  
20  
Unit  
V
V
Collector-Emitter Voltage (V = 0)  
CES  
GS  
V
ECR  
Emitter-Collector Voltage  
Gate-Emitter Voltage  
V
V
±20  
10  
V
GE  
I
Collector Current (continuous) at T = 25°C(#)  
A
C
C
I
Collector Current (continuous) at T = 100°C(#)  
6
A
C
C
I
( )  
Collector Current (pulsed)  
Short Circuit Withstand  
24  
A
CM  
Tsc  
10  
µs  
W
P
Total Dissipation at T = 25°C  
50  
TOT  
C
Derating Factor  
0.4  
W/°C  
T
Storage Temperature  
Operating Junction Temperature  
stg  
–55 to 150  
°C  
T
j
( ) Pulse width limited by safe operating area  
THERMAL DATA  
Rthj-case  
Rthj-amb  
Thermal Resistance Junction-case Max  
Thermal Resistance Junction-ambient Max  
2.5  
°C/W  
°C/W  
100  
ELECTRICAL CHARACTERISTICS (T  
= 25 °C UNLESS OTHERWISE SPECIFIED)  
CASE  
OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
Collector-Emitter Breakdown  
Voltage  
I
= 250 µA, V = 0  
600  
V
BR(CES)  
C
GE  
I
Collector cut-off  
(V = 0)  
GE  
V
V
V
= Max Rating, T = 25 °C  
50  
µA  
µA  
nA  
CES  
CE  
C
= Max Rating, T = 125 °C  
100  
CE  
GE  
C
I
Gate-Emitter Leakage  
= ±20V , V = 0  
±100  
GES  
CE  
Current (V = 0)  
CE  
ON (1)  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
7
Unit  
V
V
GE(th)  
V
V
V
= V , I = 250 µA  
Gate Threshold Voltage  
5
CE  
GE  
GE  
GE  
C
V
Collector-Emitter Saturation  
Voltage  
= 15V, I = 3 A  
2.4  
1.9  
2.8  
V
CE(sat)  
C
= 15V, I = 3 A, Tj =125°C  
V
C
(#) Calculated according to the iterative formula:  
T
– T  
C
JMAX  
--------------------------------------------------------------------------------------  
(T ) =  
C
I
C
R
× V  
(T , I )  
CESAT(MAX) C C  
THJ – C  
2/10  
STGD3NB60KD  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
g
fs  
V
= 25 V I =3 A  
Forward Transconductance  
2.4  
S
CE  
, C  
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
V
= 25V, f = 1 MHz, V = 0  
220  
50  
5.6  
pF  
pF  
pF  
ies  
CE  
GE  
C
oes  
C
res  
Q
Total Gate Charge  
Gate-Emitter Charge  
Gate-Collector Charge  
V
V
= 480V, I = 3 A,  
= 15V  
19  
14  
3.3  
8
nC  
nC  
nC  
g
CE  
GE  
C
Q
ge  
Q
gc  
tscw  
Short Circuit Withstand Time  
V
= 0.5 BVces , V = 15 V,  
10  
µs  
ce  
GE  
Tj = 125°C , R = 10 Ω  
G
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time  
Rise Time  
V
R
= 480 V, I = 3 A  
CC C  
13.5  
4.5  
ns  
ns  
d(on)  
t
r
= 10, V = 15 V  
GE  
G
(di/dt)  
Turn-on Current Slope  
V
V
= 480 V, I = 7 A, R =10Ω  
= 15 V,Tj = 125°C  
500  
A/µs  
on  
CC  
GE  
C
G
Eon  
Turn-on Switching Losses  
30  
µJ  
SWITCHING OFF  
Symbol  
Parameter  
Cross-over Time  
Test Conditions  
Min.  
Typ.  
86  
Max.  
Unit  
ns  
ns  
ns  
ns  
µJ  
µJ  
ns  
ns  
ns  
ns  
µJ  
µJ  
t
V
= 480 V, I =3 A,  
c
cc  
C
R
= 10 , V = 15 V  
GE  
GE  
t (V  
)
off  
Off Voltage Rise Time  
Delay Time  
20  
r
t (  
d off  
)
32  
t
f
Fall Time  
85  
E
off  
(**)  
Turn-off Switching Loss  
Total Switching Loss  
Cross-over Time  
Off Voltage Rise Time  
Delay Time  
50  
E
78  
ts  
t
V
= 480 V, I = 3 A,  
190  
55  
c
cc  
C
R
= 10 , V = 15 V  
GE  
GE  
t (V  
)
off  
r
Tj = 125 °C  
t (  
d off  
)
90  
t
f
Fall Time  
130  
110  
140  
E
off  
(**)  
Turn-off Switching Loss  
Total Switching Loss  
E
ts  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by max. junction temperature.  
(**)Losses include Also the Tail (Jedec Standardization)  
COLLECTOR-EMITTER DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
I
Forward Current  
1.5  
12  
A
A
f
Forward Current pulsed  
Forward On-Voltage  
I
fm  
V
I = 1.5 A  
I = 1.5 A, Tj = 125 °C  
f
2.1  
1.6  
1.3  
V
V
f
f
t
Q
I = 1.5 A ,V = 35 V,  
Tj = 125°C, di/dt = 100 A/µs  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
95  
110  
2.7  
ns  
nC  
A
rr  
f
R
rr  
I
rrm  
3/10  
STGD3NB60KD  
Thermal Impedance  
Transfer Characteristics  
Output Characteristics  
Transconductance  
Collector-Emitter On Voltage vs Temperature  
4/10  
STGD3NB60KD  
Collector-Emitter On Voltage vs Collettor Current Gate Threshold vs Temperature  
Capacitance Variations  
Normalized Breakdown Voltage vs Temperature  
Gate Charge vs Gate-Emitter Voltage  
Total Switching Losses vs Gate Resistance  
5/10  
STGD3NB60KD  
Total Switching Losses vs Temperature  
Emitter-collector Diode Characteristics  
Total Switching Losses vs Collector Current  
Switching Off Safe Operating Area  
6/10  
STGD3NB60KD  
Fig. 1: Gate Charge test Circuit  
Fig. 2: Test Circuit For Inductive Load Switching  
7/10  
STGD3NB60KD  
TO-252 (DPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
2.20  
0.90  
0.03  
0.64  
5.20  
0.45  
0.48  
6.00  
6.40  
4.40  
9.35  
TYP.  
MAX.  
2.40  
1.10  
0.23  
0.90  
5.40  
0.60  
0.60  
6.20  
6.60  
4.60  
10.10  
MIN.  
0.087  
0.035  
0.001  
0.025  
0.204  
0.018  
0.019  
0.236  
0.252  
0.173  
0.368  
MAX.  
0.094  
0.043  
0.009  
0.035  
0.213  
0.024  
0.024  
0.244  
0.260  
0.181  
0.398  
A
A1  
A2  
B
B2  
C
C2  
D
E
G
H
L2  
L4  
V2  
0.8  
0.031  
0.60  
0o  
1.00  
8o  
0.024  
0o  
0.039  
0o  
P032P_B  
8/10  
STGD3NB60KD  
DPAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
All dimensions  
are in millimeters  
All dimensions are in millimeters  
TAPE AND REEL SHIPMENT (suffix ”T4”)*  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
16.4  
50  
0.059  
13.2 0.504 0.520  
0.795  
18.4 0.645 0.724  
1.968  
22.4  
0.881  
BASE QTY  
BULK QTY  
2500  
TAPE MECHANICAL DATA  
2500  
mm  
MIN. MAX. MIN. MAX.  
6.8 0.267 0.275  
10.4 10.6 0.409 0.417  
12.1 0.476  
inch  
DIM.  
A0  
B0  
B1  
D
7
1.5  
1.5  
1.6 0.059 0.063  
0.059  
D1  
E
1.65 1.85 0.065 0.073  
7.4 7.6 0.291 0.299  
2.55 2.75 0.100 0.108  
F
K0  
P0  
P1  
P2  
R
3.9  
7.9  
1.9  
40  
4.1 0.153 0.161  
8.1 0.311 0.319  
2.1 0.075 0.082  
1.574  
W
15.7  
16.3 0.618 0.641  
* on sales type  
9/10  
STGD3NB60KD  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2003 STMicroelectronics - Printed in Italy - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco  
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.  
© http://www.st.com  
10/10  

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