STGD3NC60HD [STMICROELECTRONICS]

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STGD3NC60HD
型号: STGD3NC60HD
厂家: ST    ST
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STGD3NC60HD  
N-CHANNEL 3A - 600V DPAK  
Very Fast PowerMESH™ IGBT  
TARGET SPECIFICATION  
Table 1: General Features  
Figure 1: Package  
TYPE  
V
V
I
C
CES  
CE(sat)  
(Max) @25°C @100°C  
STGD3NC60HDT4 600 V  
< 2.5 V 6 A  
LOWER ON-VOLTAGE DROP (V  
)
cesat  
OFF LOSSES INCLUDE TAIL CURRENT  
LOSSES INCLUDE DIODE RECOVERY  
ENERGY  
3
1
LOWER C  
/C  
RATIO  
RES IES  
DPAK  
HIGH FREQUENCY OPERATION  
VERY SOFT ULTRA FAST RECOVERY ANTI  
PARALLEL DIODE  
NEW GENERATION PRODUCTS WITH  
TIGHTER PARAMETER DISTRIBUTION  
Figure 2: Internal Schematic Diagram  
DESCRIPTION  
Using the latest high voltage technology based on  
a patented strip layout, STMicroelectronics has  
designed an advanced family of IGBTs, the Pow-  
erMESH IGBTs, with outstanding performances.  
The suffix "H" identifies a family optimized for high  
frequency applications in order to achieve very  
high switching performances (reduced tfall) man-  
taining a low voltage drop.  
APPLICATIONS  
HIGH FREQUENCY INVERTERS  
SMPS AND PFC IN BOTH HARD SWITCH  
AND RESONANT TOPOLOGIES  
MOTOR DRIVERS  
Table 2: Order Code  
PART NUMBER  
MARKING  
PACKAGE  
PACKAGING  
STGD3NC60HDT4  
GD3NC60HD  
DPAK  
TAPE & REEL  
Rev. 1  
February 2005  
1/9  
This is a preliminary information on a new product foreseen to be developed. Details are subjet to change without notice  
STGD3NC60HD  
Table 3: Absolute Maximum ratings  
Symbol  
Parameter  
Value  
600  
20  
Unit  
V
V
Collector-Emitter Voltage (V = 0)  
CES  
GS  
V
Emitter-Collector Voltage  
Gate-Emitter Voltage  
V
ECR  
V
GE  
±20  
10  
V
I
C
Collector Current (continuous) at T = 25°C (#)  
A
C
I
C
Collector Current (continuous) at T = 100°C (#)  
6
A
C
I
( )  
Collector Current (pulsed)  
24  
A
CM  
I
Diode RMS Forward Current at T = 25°C  
TBD  
50  
A
F
C
P
Total Dissipation at T = 25°C  
W
W/°C  
TOT  
C
Derating Factor  
0.40  
T
Storage Temperature  
Operating Junction Temperature  
stg  
55 to 150  
°C  
T
j
( ) Pulse width limited by max. junction temperature.  
Table 4: Thermal Data  
Min.  
Typ.  
Max.  
2.5  
Rthj-case  
Rthj-amb  
Thermal Resistance Junction-case  
Thermal Resistance Junction-ambient  
°C/W  
°C/W  
°C  
100  
T
Maximum Lead Temperature for Soldering Purpose  
(1.6 mm from case, for 10 sec.)  
275  
L
ELECTRICAL CHARACTERISTICS (T  
=25°C UNLESS OTHERWISE SPECIFIED)  
CASE  
Table 5: Main Parameters  
Symbol  
Parameter  
Test Conditions  
= 1 mA, V = 0  
Min.  
Typ.  
Max.  
Unit  
V
Collector-Emitter Breakdown  
Voltage  
I
C
600  
V
BR(CES)  
GE  
I
Collector cut-off Current  
(V = 0)  
GE  
V
V
= Max Rating, T = 25 °C  
10  
1
µA  
mA  
CES  
GES  
CE  
C
= Max Rating, T = 125 °C  
CE  
C
I
Gate-Emitter Leakage  
V
GE  
= ± 20V , V = 0  
±100  
nA  
CE  
Current (V = 0)  
CE  
V
V
= V , I = 250 µA  
Gate Threshold Voltage  
3.75  
5.75  
2.5  
V
GE(th)  
CE  
GE  
C
V
Collector-Emitter Saturation  
Voltage  
V
V
= 15V, I = 3 A  
V
V
1.9  
1.7  
CE(sat)  
GE  
C
= 15V, I = 3 A, Tc= 125°C  
GE  
C
(#) Calculated according to the iterative formula:  
T
– T  
JMAX  
-------------------------------------------------------------------------------------------------  
(T ) =  
C
I
C
C
R
× V  
(T , I )  
THJ – C  
CESAT(MAX) C C  
2/9  
STGD3NC60HD  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
Table 6: Dynamic  
Symbol  
(1)  
Parameter  
Forward Transconductance  
Input Capacitance  
Test Conditions  
Min.  
Typ.  
TBD  
320  
28  
Max.  
Unit  
S
g
fs  
V
V
= 15 V I = 3 A  
CE  
, C  
C
C
= 25 V, f= 1 MHz, V = 0  
pF  
pF  
pF  
ies  
CE  
GE  
Output Capacitance  
oes  
C
Reverse Transfer  
Capacitance  
7.2  
res  
Q
Total Gate Charge  
Gate-Emitter Charge  
Gate-Collector Charge  
V
V
= 390 V, I = 3 A,  
= 15 V  
15  
TBD  
TBD  
TBD  
nC  
nC  
nC  
g
CE  
C
Q
ge  
Q
gc  
GE  
(see Figure 5)  
I
CL  
Turn-Off SOA Minimum  
Current  
V
R
= 480 V , Tj = 150°C  
TBD  
A
clamp  
= 10 Ω, V = 15 V  
G
GE  
(1) Pulsed: Pulse duration= 300 µs, duty cycle 1.5%  
Table 7: Switching On  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time  
Current Rise Time  
Turn-on Current Slope  
V
= 390 V, I = 3 A  
ns  
ns  
A/µs  
TBD  
TBD  
TBD  
d(on)  
CC  
C
t
r
R = 10 , V = 15V, Tj= 25°C  
G GE  
(see Figure 3)  
(di/dt)  
on  
t
Turn-on Delay Time  
Current Rise Time  
Turn-on Current Slope  
V
= 390 V, I = 3 A  
TBD  
TBD  
TBD  
ns  
ns  
A/µs  
d(on)  
CC  
C
t
r
R = 10 , V = 15V, Tj= 125°C  
G GE  
(see Figure 3)  
(di/dt)  
on  
Table 8: Switching Off  
Symbol  
Parameter  
Test Conditions  
= 390 V, I = 3 A,  
= 10 , V = 15 V  
GE  
Min.  
Typ.  
TBD  
TBD  
70  
Max.  
Unit  
ns  
t (V  
)
off  
V
cc  
Off Voltage Rise Time  
Turn-off Delay Time  
Current Fall Time  
r
C
R
G
t (  
d off  
)
ns  
T = 25 °C  
(see Figure 3)  
J
t
f
ns  
t (V  
)
V
R
= 390 V, I = 3 A,  
= 10 , V = 15 V  
GE  
Off Voltage Rise Time  
Turn-off Delay Time  
Current Fall Time  
TBD  
TBD  
TBD  
ns  
r
off  
cc C  
G
t (  
d off  
)
ns  
Tj = 125 °C  
(see Figure 3)  
t
f
ns  
Table 9: Switching Energy  
Symbol  
Parameter  
Test Conditions  
= 390 V, I = 3 A  
Min.  
Typ.  
Max  
Unit  
Eon (2)  
Turn-on Switching Losses  
Turn-off Switching Loss  
Total Switching Loss  
TBD  
TBD  
TBD  
µJ  
µJ  
µJ  
V
CC  
C
E
off  
(3)  
R = 10 , V = 15V, Tj= 25°C  
G
GE  
E
ts  
(see Figure 3)  
Eon (2)  
Turn-on Switching Losses  
Turn-off Switching Loss  
Total Switching Loss  
TBD  
TBD  
TBD  
µJ  
µJ  
µJ  
V
= 390 V, I = 3 A  
CC  
C
E
off  
(3)  
R = 10 , V = 15V, Tj= 125°C  
(see Figure 3)  
G
GE  
E
ts  
(2) Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in a package with a co-pack  
diode, the co-pack diode is used as external diode. IGBTs & DIODE are at the same temperature (25°C and 125°C)  
(3) Turn-off losses include also the tail of the collector current.  
3/9  
STGD3NC60HD  
Table 10: Collector-Emitter Diode  
Symbol  
Parameter  
Test Condiction  
Min.  
Typ.  
Max.  
Unit  
2.1  
V
Forward On-Voltage  
If = 1.5 A  
If = 1.5 A, Tj = 125 °C  
1.6  
1.3  
V
V
f
t
t
Q
Reverse Recovery Time  
If = 1.5 A, V = 40 V,  
TBD  
TBD  
TBD  
TBD  
TBD  
ns  
ns  
nC  
A
rr  
R
T = 25 °C, di/dt = 100 A/µs  
a
j
Reverse Recovery Charge  
Reverse Recovery Current  
Softness factor of the diode  
(see Figure 6)  
rr  
I
rrm  
S
t
t
Q
Reverse Recovery Time  
If = 1.5 A, V = 40 V,  
TBD  
TBD  
TBD  
TBD  
TBD  
ns  
ns  
nC  
A
rr  
R
T = 125 °C, di/dt = 100 A/µs  
a
j
Reverse Recovery Charge  
Reverse Recovery Current  
Softness factor of the diode  
(see Figure 6)  
rr  
I
rrm  
S
4/9  
STGD3NC60HD  
Figure 3: Test Circuit for Inductive Load  
Switching  
Figure 5: Gate Charge Test Circuit  
Figure 6: Diode Recovery Time Waveforms  
Figure 4: Switching Waveforms  
5/9  
STGD3NC60HD  
TO-252 (DPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
2.20  
0.90  
0.03  
0.64  
5.20  
0.45  
0.48  
6.00  
6.40  
4.40  
9.35  
TYP.  
MAX.  
2.40  
1.10  
0.23  
0.90  
5.40  
0.60  
0.60  
6.20  
6.60  
4.60  
10.10  
MIN.  
0.087  
0.035  
0.001  
0.025  
0.204  
0.018  
0.019  
0.236  
0.252  
0.173  
0.368  
MAX.  
0.094  
0.043  
0.009  
0.035  
0.213  
0.024  
0.024  
0.244  
0.260  
0.181  
0.398  
A
A1  
A2  
B
B2  
C
C2  
D
E
G
H
L2  
L4  
V2  
0.8  
0.031  
0.60  
0o  
1.00  
8o  
0.024  
0o  
0.039  
0o  
P032P_B  
6/9  
STGD3NC60HD  
DPAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
All dimensions  
are in millimeters  
All dimensions are in millimeters  
TAPE AND REEL SHIPMENT (suffix ”T4”)*  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
16.4  
50  
0.059  
13.2 0.504 0.520  
0.795  
18.4 0.645 0.724  
1.968  
22.4  
0.881  
BASE QTY  
BULK QTY  
2500  
TAPE MECHANICAL DATA  
2500  
mm  
MIN. MAX. MIN. MAX.  
6.8 0.267 0.275  
10.4 10.6 0.409 0.417  
12.1 0.476  
inch  
DIM.  
A0  
B0  
B1  
D
7
1.5  
1.5  
1.6 0.059 0.063  
0.059  
D1  
E
1.65 1.85 0.065 0.073  
7.4 7.6 0.291 0.299  
2.55 2.75 0.100 0.108  
F
K0  
P0  
P1  
P2  
R
3.9  
7.9  
1.9  
40  
4.1 0.153 0.161  
8.1 0.311 0.319  
2.1 0.075 0.082  
1.574  
W
15.7  
16.3 0.618 0.641  
* on sales type  
7/9  
STGD3NC60HD  
Table 11: Revision History  
Date  
Revision  
Description of Changes  
11-Feb-2005  
1
First release  
8/9  
STGD3NC60HD  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
All other names are the property of their respective owners  
© 2005 STMicroelectronics - All Rights Reserved  
STMicroelectronics group of companies  
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
9/9  

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