DMN3730UFB4-7B [DIODES]

30V N-CHANNEL ENHANCEMENT MODE MOSFET; 30V N沟道增强型MOSFET
DMN3730UFB4-7B
型号: DMN3730UFB4-7B
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

30V N-CHANNEL ENHANCEMENT MODE MOSFET
30V N沟道增强型MOSFET

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DMN3730UFB4  
30V N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
0.4mm ultra low profile package for thin application  
0.6mm2 package footprint, 10 times smaller than SOT23  
Low VGS(th), can be driven directly from a battery  
Low RDS(on)  
“Lead Free”, RoHS Compliant (Note 1)  
Halogen and Antimony Free. "Green" Device (Note 2)  
ESD Protected Gate 2kV  
ID  
V(BR)DSS  
RDS(on)  
TA = 25°C  
0.9A  
0.7A  
460mΩ @ VGS= 4.5V  
560mΩ @ VGS= 2.5V  
30V  
Qualified to AEC-Q101 Standards for High Reliability  
Mechanical Data  
Description and Applications  
This MOSFET has been designed to minimize the on-state resistance  
(RDS(on)) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Case: DFN1006H4-3  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish – NiPdAu over Copper leadframe. Solderable  
per MIL-STD-202, Method 208  
Load switch  
Portable applications  
Power Management Functions  
Weight: 0.001 grams (approximate)  
Drain  
DFN1006H4-3  
Bottom View  
Body  
Diode  
Gate  
S
D
Gate  
Protection  
Diode  
G
Source  
ESD PROTECTED TO 2kV  
Top View  
Equivalent Circuit  
Ordering Information (Note 3)  
Part Number  
DMN3730UFB4-7  
DMN3730UFB4-7B  
Marking  
NF  
NF  
Reel size (inches)  
Tape width (mm)  
Quantity per reel  
3000  
7
7
8
8
10,000  
Notes:  
1. No purposefully added lead  
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.  
3. For packaging details, go to our website at http://www.diodes.com.  
Marking Information  
NF = Product Type Marking Code  
Dot Denotes Drain Side  
NF  
1 of 6  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN3730UFB4  
Document number: DS35017 Rev. 3 - 2  
DMN3730UFB4  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
30  
Unit  
V
Gate-Source Voltage  
±8  
VGSS  
(Note 5)  
0.91  
0.73  
0.75  
3
ID  
Continuous Drain Current  
Pulsed Drain Current  
V
GS = 4.5V TA = 70°C (Note 5)  
A
(Note 4)  
(Note 6)  
IDM  
Thermal Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
Symbol  
Value  
0.69  
0.47  
Unit  
(Note 5)  
Power Dissipation  
(Note 4)  
W
PD  
(Note 5)  
Thermal Resistance, Junction to Ambient  
(Note 4)  
Operating and Storage Temperature Range  
180  
258  
-55 to +150  
°C/W  
°C  
RθJA  
TJ, TSTG  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
30  
-
-
-
-
-
V
BVDSS  
IDSS  
VGS = 0V, ID = 10μA  
1
3
μA  
μA  
VDS = 30V, VGS = 0V  
VGS = ±8V, VDS = 0V  
-
IGSS  
ON CHARACTERISTICS  
Gate Threshold Voltage  
0.45  
-
-
-
0.95  
460  
560  
730  
-
V
VGS(th)  
RDS(on)  
VDS = VGS, ID = 250μA  
V
GS = 4.5V, ID = 200mA  
mΩ  
Static Drain-Source On-Resistance (Note 7)  
VGS = 2.5V, ID = 100mA  
VGS = 1.8V, ID = 75mA  
VDS = 3V, ID = 10mA  
VGS = 0V, IS = 300mA  
Forward Transfer Admittance  
Diode Forward Voltage (Note 7)  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
40  
-
-
mS  
V
|Yfs|  
VSD  
0.7  
1.2  
-
-
-
-
-
-
-
-
-
-
-
64.3  
6.1  
4.5  
70  
-
-
-
-
-
-
-
-
-
-
-
pF  
pF  
pF  
Ω
Ciss  
Coss  
Crss  
Rg  
VDS = 25V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VDS = 0V, VGS = 0V, f = 1MHz  
1.6  
0.2  
0.2  
3.5  
2.8  
38  
Total Gate Charge  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
Qg  
V
GS = 4.5V, VDS = 15V,  
Gate-Source Charge  
Qgs  
Qgd  
tD(on)  
tr  
ID = 1A  
Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
VDS = 10V, ID = 1A  
VGS = 10V, RG = 6Ω  
Turn-Off Delay Time  
tD(off)  
tf  
13  
Turn-Off Fall Time  
Notes:  
4. For a device surface mounted on a minimum recommended pad layout of an FR4 PCB, in still air conditions; the device is measured when operating in  
steady-state condition.  
5. Same as note 4, except the device measured at t 10 sec.  
6. Same as note 4, except the device is pulsed at duty cycle of 1% for a pulse width of 10μs.  
7. Measured under pulsed conditions to minimize self-heating effect. Pulse width 300μs; duty cycle 2%  
8. For design aid only, not subject to production testing.  
2 of 6  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN3730UFB4  
Document number: DS35017 Rev. 3 - 2  
DMN3730UFB4  
2.0  
1.5  
2.0  
1.5  
V
= 10V  
GS  
V
= 4.5V  
V
= 5V  
GS  
DS  
V
= 3.0V  
GS  
V
= 2.5V  
GS  
V
= 2.0V  
GS  
V
= 1.5V  
GS  
1.0  
1.0  
0.5  
0
0.5  
0
T
A
= 150°C  
T
= 85°C  
A
T
= 125°C  
A
T
= 25°C  
A
T
= -55°C  
A
0
1
2
3
4
5
0
0.5  
1
1.5  
2
2.5  
3
VDS, DRAIN-SOURCE VOLTAGE (V)  
VGS, GATE-SOURCE VOLTAGE (V)  
Fig. 2 Typical Transfer Characteristic  
Fig. 1 Typical Output Characteristic  
0.8  
0.6  
0.8  
0.6  
V
= 4.5V  
GS  
T
= 150°C  
A
T
= 125°C  
A
V
= 1.8V  
GS  
T
= 85°C  
A
V
V
= 2.5V  
= 4.5V  
0.4  
0.4  
GS  
T
= 25°C  
GS  
A
T = -55°C  
A
0.2  
0
0.2  
0
0
0.4  
0.8  
1.2  
1.6  
2
0
0.25  
0.5  
ID, DRAIN CURRENT (A)  
Fig. 4 Typical On-Resistance  
vs. Drain Current and Temperature  
0.75  
1
1.25  
1.5  
ID, DRAIN-SOURCE CURRENT (A)  
Fig. 3 Typical On-Resistance  
vs. Drain Current and Gate Voltage  
0.8  
0.6  
0.4  
1.6  
V
= 4.5V  
GS  
I
= 1.0A  
D
1.4  
1.2  
1.0  
V
= 2.5V  
GS  
I
= 500mA  
D
V
= 2.5V  
GS  
I
= 500mA  
D
V
= 4.5V  
= 1.0A  
GS  
I
D
0.2  
0
0.8  
0.6  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 5 On-Resistance Variation with Temperature  
50  
75 100 125 150  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 6 On-Resistance Variation with Temperature  
3 of 6  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN3730UFB4  
Document number: DS35017 Rev. 3 - 2  
DMN3730UFB4  
1.2  
1.0  
2.0  
1.6  
T
= 25°C  
A
0.8  
0.6  
1.2  
0.8  
I
= 1mA  
D
I
= 250µA  
D
0.4  
0.4  
0
0.2  
0
-50 -25  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 7 Gate Threshold Variation vs. Ambient Temperature  
0
25  
50  
75 100 125 150  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Fig. 8 Diode Forward Voltage vs. Current  
100  
10,000  
1,000  
100  
C
iss  
T
= 150°C  
= 125°C  
A
T
A
C
oss  
10  
C
rss  
T
= 85°C  
A
10  
1
T
= 25°C  
A
f = 1MHz  
1
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
VDS, DRAIN-SOURCE VOLTAGE (V)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 10 Typical Leakage Current  
vs. Drain-Source Voltage  
Fig. 9 Typical Total Capacitance  
8
6
V
= 15V  
= 1A  
DS  
I
D
4
2
0
0
0.5  
1
1.5  
2
2.5  
3
Qg, TOTAL GATE CHARGE (nC)  
Fig. 11 Gate-Charge Characteristics  
4 of 6  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN3730UFB4  
Document number: DS35017 Rev. 3 - 2  
DMN3730UFB4  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
R
(t) = r(t) * R  
θJA  
θJA  
R
= 253°C/W  
D = 0.02  
θJA  
0.01 D = 0.01  
P(pk)  
T
t
1
t
2
D = 0.005  
- T = P * R (t)  
J
A
θJA  
Duty Cycle, D = t /t  
1
2
D = Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t1, PULSE DURATION TIME (s)  
Fig. 12 Transient Thermal Response  
Package Outline Dimensions  
A
DFN1006H4-3  
Dim Min  
Max  
0.40  
0.05 0.02  
Typ  
A1  
A
A1  
b1  
b2  
D
0
D
0.10 0.20 0.15  
0.45 0.55 0.50  
0.95 1.075 1.00  
0.55 0.675 0.60  
b1  
E
e
0.35  
e
b2  
E
L1  
L2  
L3  
0.20 0.30 0.25  
0.20 0.30 0.25  
0.40  
All Dimensions in mm  
L2  
L3  
L1  
Suggested Pad Layout  
C
Dimensions Value (in mm)  
X1  
G2  
Z
G1  
G2  
X
X1  
Y
1.1  
0.3  
0.2  
0.7  
0.25  
0.4  
0.7  
X
C
G1  
Y
Z
5 of 6  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN3730UFB4  
Document number: DS35017 Rev. 3 - 2  
DMN3730UFB4  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2010, Diodes Incorporated  
www.diodes.com  
6 of 6  
www.diodes.com  
December 2010  
© Diodes Incorporated  
DMN3730UFB4  
Document number: DS35017 Rev. 3 - 2  

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