MMBT2222ALT1G [COMCHIP]

General Purpose Transistors NPN Silicon; 通用晶体管NPN硅
MMBT2222ALT1G
型号: MMBT2222ALT1G
厂家: COMCHIP TECHNOLOGY    COMCHIP TECHNOLOGY
描述:

General Purpose Transistors NPN Silicon
通用晶体管NPN硅

晶体 晶体管
文件: 总6页 (文件大小:86K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MMBT2222LT1,  
MMBT2222ALT1  
MMBT2222ALT1 is a Preferred Device  
General Purpose Transistors  
NPN Silicon  
http://onsemi.com  
Features  
Pb−Free Packages are Available  
COLLECTOR  
3
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
1
BASE  
CollectorEmitter Voltage  
V
CEO  
V
CBO  
V
EBO  
Vdc  
MMBT2222LT1  
30  
40  
MMBT2222ALT1  
2
EMITTER  
CollectorBase Voltage  
EmitterBase Voltage  
Vdc  
Vdc  
MMBT2222LT1  
MMBT2222ALT1  
60  
75  
3
MMBT2222LT1  
MMBT2222ALT1  
5.0  
6.0  
1
Collector Current − Continuous  
I
600  
mAdc  
C
2
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
SOT−23  
CASE 318  
STYLE 6  
Total Device Dissipation FR5 Board  
P
D
(Note 1) T = 25°C  
225  
1.8  
mW  
mW/°C  
A
Derate above 25°C  
Thermal Resistance, Junction−to−Ambient  
R
q
JA  
556  
°C/W  
Total Device Dissipation Alumina  
P
MARKING DIAGRAM  
D
Substrate (Note 2) T = 25°C  
300  
2.4  
mW  
mW/°C  
A
Derate above 25°C  
Thermal Resistance, Junction−to−Ambient  
R
417  
°C/W  
°C  
q
JA  
Junction and Storage Temperature Range T , T  
−55 to +150  
xxx M G  
J
stg  
G
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1
xxx = 1P or M1B  
1. FR5 = 1.0 0.75 0.062 in.  
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.  
M
= Date Code*  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 6  
MMBT2222LT1/D  
 
MMBT2222LT1, MMBT2222ALT1  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
CollectorEmitter Breakdown Voltage (I = 10 mAdc, I = 0)  
MMBT2222  
MMBT2222  
MMBT2222  
MMBT2222A  
V
30  
40  
Vdc  
Vdc  
Vdc  
C
B
(BR)CEO  
(BR)CBO  
(BR)EBO  
MMBT2222A  
CollectorBase Breakdown Voltage (I = 10 mAdc, I = 0)  
V
V
60  
75  
C
E
MMBT2222A  
EmitterBase Breakdown Voltage (I = 10 mAdc, I = 0)  
5.0  
6.0  
E
C
MMBT2222A  
Collector Cutoff Current (V = 60 Vdc, V  
= 3.0 Vdc)  
I
10  
nAdc  
CE  
EB(off)  
CEX  
Collector Cutoff Current (V = 50 Vdc, I = 0)  
MMBT2222  
MMBT2222A  
MMBT2222  
MMBT2222A  
I
0.01  
0.01  
10  
mAdc  
CB  
E
CBO  
(V = 60 Vdc, I = 0)  
CB  
E
(V = 50 Vdc, I = 0, T = 125°C)  
CB  
E
A
(V = 60 Vdc, I = 0, T = 125°C)  
10  
CB  
E
A
Emitter Cutoff Current (V = 3.0 Vdc, I = 0)  
MMBT2222A  
MMBT2222A  
I
EBO  
100  
20  
nAdc  
nAdc  
EB  
C
Base Cutoff Current (V = 60 Vdc, V  
= 3.0 Vdc)  
I
BL  
CE  
EB(off)  
ON CHARACTERISTICS  
DC Current Gain  
h
FE  
(I = 0.1 mAdc, V = 10 Vdc)  
35  
50  
75  
35  
100  
50  
30  
40  
300  
C
CE  
CE  
CE  
CE  
CE  
CE  
CE  
(I = 1.0 mAdc, V = 10 Vdc)  
C
(I = 10 mAdc, V = 10 Vdc)  
C
(I = 10 mAdc, V = 10 Vdc, T = −55°C)  
MMBT2222A only  
C
A
(I = 150 mAdc, V = 10 Vdc) (Note 3)  
C
(I = 150 mAdc, V = 1.0 Vdc) (Note 3)  
C
(I = 500 mAdc, V = 10 Vdc) (Note 3)  
C
MMBT2222  
MMBT2222A  
CollectorEmitter Saturation Voltage (Note 3)  
(I = 150 mAdc, I = 15 mAdc)  
V
Vdc  
Vdc  
CE(sat)  
BE(sat)  
MMBT2222  
MMBT2222A  
0.4  
0.3  
C
B
(I = 500 mAdc, I = 50 mAdc)  
MMBT2222  
MMBT2222A  
1.6  
1.0  
C
B
BaseEmitter Saturation Voltage (Note 3)  
(I = 150 mAdc, I = 15 mAdc)  
V
MMBT2222  
MMBT2222A  
0.6  
1.3  
1.2  
C
B
(I = 500 mAdc, I = 50 mAdc)  
MMBT2222  
MMBT2222A  
2.6  
2.0  
C
B
SMALLSIGNAL CHARACTERISTICS  
CurrentGain − Bandwidth Product (Note 4)  
f
MHz  
T
(I = 20 mAdc, V = 20 Vdc, f = 100 MHz)  
MMBT2222  
MMBT2222A  
250  
300  
C
CE  
Output Capacitance  
C
pF  
pF  
obo  
(V = 10 Vdc, I = 0, f = 1.0 MHz)  
CB  
8.0  
E
Input Capacitance  
C
ibo  
(V = 0.5 Vdc, I = 0, f = 1.0 MHz)  
MMBT2222  
MMBT2222A  
30  
25  
EB  
C
Input Impedance  
h
kW  
ie  
re  
fe  
(I = 1.0 mAdc, V = 10 Vdc, f = 1.0 kHz)  
MMBT2222A  
MMBT2222A  
2.0  
0.25  
8.0  
1.25  
C
CE  
CE  
(I = 10 mAdc, V = 10 Vdc, f = 1.0 kHz)  
C
−4  
Voltage Feedback Ratio  
h
h
X 10  
(I = 1.0 mAdc, V = 10 Vdc, f = 1.0 kHz)  
MMBT2222A  
MMBT2222A  
8.0  
4.0  
C
CE  
CE  
(I = 10 mAdc, V = 10 Vdc, f = 1.0 kHz)  
C
SmallSignal Current Gain  
(I = 1.0 mAdc, V = 10 Vdc, f = 1.0 kHz)  
MMBT2222A  
MMBT2222A  
50  
75  
300  
375  
C
CE  
CE  
(I = 10 mAdc, V = 10 Vdc, f = 1.0 kHz)  
C
Output Admittance  
h
oe  
mmhos  
(I = 1.0 mAdc, V = 10 Vdc, f = 1.0 kHz)  
MMBT2222A  
MMBT2222A  
5.0  
25  
35  
200  
C
CE  
CE  
(I = 10 mAdc, V = 10 Vdc, f = 1.0 kHz)  
C
http://onsemi.com  
2
C * < 10 pF  
S
−2 V  
                                      
MMBT2222LT1, MMBT2222ALT1  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Max  
Unit  
SMALLSIGNAL CHARACTERISTICS  
Collector Base Time Constant  
rb, C  
NF  
ps  
c
(I = 20 mAdc, V = 20 Vdc, f = 31.8 MHz)  
MMBT2222A  
MMBT2222A  
150  
4.0  
E
CB  
Noise Figure  
(I = 100 mAdc, V = 10 Vdc, R = 1.0 kW, f = 1.0 kHz)  
dB  
C
CE  
S
SWITCHING CHARACTERISTICS (MMBT2222A only)  
Delay Time  
t
t
10  
25  
d
(V = 30 Vdc, V  
= 0.5 Vdc,  
BE(off)  
B1  
CC  
ns  
ns  
I
= 150 mAdc, I = 15 mAdc)  
C
Rise Time  
Storage Time  
Fall Time  
t
r
225  
60  
s
(V = 30 Vdc, I = 150 mAdc,  
CC  
C
I
= I = 15 mAdc)  
B2  
B1  
t
f
3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.  
4. f is defined as the frequency at which |h | extrapolates to unity.  
T
fe  
SWITCHING TIME EQUIVALENT TEST CIRCUITS  
+ꢀ30 V  
200  
+ꢀ30 V  
1.0 to 100 ms,  
DUTY CYCLE 2.0%  
1.0 to 100 ms,  
DUTY CYCLE 2.0%  
200  
+16 V  
0
+16 V  
0
1 k  
−14 V  
1 kW  
C * < 10 pF  
S
< 20 ns  
< 2 ns  
1N914  
−ꢀ4 V  
Scope rise time < 4 ns  
*Total shunt capacitance of test jig, connectors, and oscilloscope.  
Figure 1. Turn−On Time  
Figure 2. Turn−Off Time  
1000  
700  
T = 125°C  
J
500  
300  
200  
25°C  
100  
70  
−55°C  
50  
30  
20  
V
V
= 1.0 V  
= 10 V  
CE  
CE  
10  
0.1  
0.2 0.3  
0.5 0.7 1.0  
2.0 3.0  
5.0 7.0 10  
20 30  
50 70 100  
200 300  
500 700 1.0 k  
I , COLLECTOR CURRENT (mA)  
C
Figure 3. DC Current Gain  
http://onsemi.com  
3
MMBT2222LT1, MMBT2222ALT1  
1.0  
0.8  
T = 25°C  
J
0.6  
0.4  
0.2  
0
I = 1.0 mA  
C
10 mA  
150 mA  
500 mA  
0.005  
0.01  
0.02 0.03  
0.05  
0.1  
0.2 0.3  
0.5  
1.0  
2.0 3.0  
5.0  
10  
20 30  
50  
I , BASE CURRENT (mA)  
B
Figure 4. Collector Saturation Region  
200  
100  
500  
V
I /I = 10  
= 30 V  
I /I = 10  
C B  
CC  
300  
T = 25°C  
J
C B  
t= t − 1/8 t  
f
s
s
200  
I = I  
B1 B2  
70  
50  
t @ V = 30 V  
CC  
r
t @ V  
T = 25°C  
J
= 2.0 V  
= 0  
d
t @ V  
EB(off)  
EB(off)  
100  
70  
d
30  
20  
t
f
50  
30  
20  
10  
7.0  
5.0  
10  
3.0  
2.0  
7.0  
5.0  
5.0 7.0 10  
20 30  
50 70 100  
200 300 500  
5.0 7.0 10  
20 30  
50 70 100  
200 300 500  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 5. TurnOn Time  
Figure 6. TurnOff Time  
10  
10  
R = OPTIMUM  
S
R = SOURCE  
f = 1.0 kHz  
S
R = RESISTANCE  
I = 1.0 mA, R = 150 W  
S
C
8.0  
8.0  
S
500 mA, R = 200 W  
S
I = 50 mA  
C
100 mA, R = 2.0 kW  
S
100 mA  
500 mA  
1.0 mA  
50 mA, R = 4.0 kW  
S
6.0  
4.0  
2.0  
0
6.0  
4.0  
2.0  
0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20  
50 100  
50 100 200  
500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k  
R , SOURCE RESISTANCE (OHMS)  
f, FREQUENCY (kHz)  
S
Figure 7. Frequency Effects  
Figure 8. Source Resistance Effects  
http://onsemi.com  
4
MMBT2222LT1, MMBT2222ALT1  
30  
20  
500  
V
= 20 V  
CE  
T = 25°C  
J
300  
200  
C
eb  
10  
7.0  
5.0  
100  
C
cb  
3.0  
2.0  
70  
50  
30  
I , COLLECTOR CURRENT (mA)  
50 70 100  
0.1 0.2 0.3 0.5 0.7 1.0  
2.0 3.0 5.0 7.0 10  
20 30 50  
1.0  
2.0 3.0  
5.0 7.0 10  
20  
REVERSE VOLTAGE (VOLTS)  
C
Figure 9. Capacitances  
Figure 10. Current−Gain Bandwidth Product  
1.0  
+0.5  
0
T = 25°C  
J
R
for V  
CE(sat)  
0.8  
q
VC  
V
@ I /I = 10  
C B  
BE(sat)  
BE(on)  
−ꢀ0.5  
−ꢀ1.0  
1.0 V  
0.6  
0.4  
0.2  
0
V
@ V = 10 V  
CE  
−ꢀ1.5  
R
for V  
BE  
−ꢀ2.0  
−ꢀ2.5  
q
VB  
V
@ I /I = 10  
C B  
CE(sat)  
0.1 0.2 0.5 1.0 2.0 5.0 10 20  
50 100 200 500 1.0 k  
0.1 0.2  
0.5 1.0 2.0  
5.0 10 20  
50 100 200 500  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 11. “On” Voltages  
Figure 12. Temperature Coefficients  
ORDERING INFORMATION  
Device  
Specific Marking Code  
Package  
SOT−23  
Shipping  
MMBT2222LT1  
M1B  
3000 / Tape & Reel  
MMBT2222LT1G  
M1B  
SOT−23  
(Pb−Free)  
3000 / Tape & Reel  
MMBT2222ALT1  
1P  
1P  
SOT−23  
3000 / Tape & Reel  
3000 / Tape & Reel  
MMBT2222ALT1G  
SOT−23  
(Pb−Free)  
MMBT2222LT3  
M1B  
M1B  
SOT−23  
10,000 / Tape & Reel  
10,000 / Tape & Reel  
MMBT2222LT3G  
SOT−23  
(Pb−Free)  
MMBT2222ALT3  
1P  
1P  
SOT−23  
10,000 / Tape & Reel  
10,000 / Tape & Reel  
MMBT2222ALT3G  
SOT−23  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
5
MMBT2222LT1, MMBT2222ALT1  
PACKAGE DIMENSIONS  
SOT−23 (TO−236)  
CASE 318−08  
ISSUE AN  
NOTES:  
D
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
SEE VIEW C  
2. CONTROLLING DIMENSION: INCH.  
3. MAXIMUM LEAD THICKNESS INCLUDES  
LEAD FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS OF  
BASE MATERIAL.  
4. 318−01 THRU −07 AND −09 OBSOLETE,  
NEW STANDARD 318−08.  
3
H
E
E
c
1
2
MILLIMETERS  
INCHES  
NOM  
DIM  
A
A1  
b
c
D
E
e
L
L1  
MIN  
0.89  
0.01  
0.37  
0.09  
2.80  
1.20  
1.78  
0.10  
0.35  
2.10  
NOM  
1.00  
0.06  
0.44  
0.13  
2.90  
1.30  
1.90  
0.20  
0.54  
2.40  
MAX  
1.11  
0.10  
0.50  
0.18  
3.04  
1.40  
2.04  
0.30  
0.69  
2.64  
MIN  
MAX  
0.044  
0.004  
0.020  
0.007  
0.120  
0.055  
0.081  
0.012  
0.029  
0.104  
b
0.25  
0.035  
0.001  
0.015  
0.003  
0.110  
0.047  
0.070  
0.004  
0.014  
0.083  
0.040  
0.002  
0.018  
0.005  
0.114  
0.051  
0.075  
0.008  
0.021  
0.094  
e
q
A
L
A1  
L1  
VIEW C  
H
E
STYLE 6:  
PIN 1. BASE  
2. EMITTER  
3. COLLECTOR  
SOLDERING FOOTPRINT*  
0.95  
0.037  
0.95  
0.037  
2.0  
0.079  
0.9  
0.035  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
0.8  
0.031  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
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Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MMBT2222LT1/D  

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