AOL1420 [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOL1420
型号: AOL1420
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总5页 (文件大小:125K)
中文:  中文翻译
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AOL1420  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOL1420 uses advanced trench technology to  
provide excellent RDS(ON), low gate charge and low  
gate resistance. This device is ideally suited for use  
as a low side switch in CPU core power conversion.  
Standard Product AOL1420 is Pb-free (meets ROHS  
& Sony 259 specifications). AOL1420L is a Green  
Product ordering option. AOL1420 and AOL1420L  
are electrically identical.  
VDS (V) = 30V  
ID = 85A (VGS = 10V)  
RDS(ON) < 3.7m(VGS = 10V)  
RDS(ON) < 5.5m(VGS = 4.5V)  
Ultra SO-8TM Top View  
Fits SOIC8  
footprint !  
D
S
D
Bottom tab  
connected to  
drain  
G
S
G
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
30  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current B,G  
±20  
85  
V
TC=25°C G  
TC=100°C B  
ID  
63  
IDM  
Pulsed Drain Current  
Continuous Drain  
Current G  
150  
18  
A
TA=25°C  
TA=70°C  
IDSM  
IAR  
14  
Avalanche Current C  
30  
A
C
Repetitive avalanche energy L=0.1mH  
EAR  
112  
100  
50  
mJ  
TC=25°C  
PD  
W
Power Dissipation B  
TC=100°C  
TA=25°C  
2.1  
1.3  
PDSM  
W
Power Dissipation A  
TA=70°C  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
Max  
Units  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Case C  
19.6  
25  
°C/W  
t 10s  
RθJA  
Steady-State  
Steady-State  
50  
60  
°C/W  
°C/W  
RθJC  
0.9  
1.5  
Alpha & Omega Semiconductor, Ltd.  
AOL1420  
Electrical Characteristics (T =25°C unless otherwise noted)  
J
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250μA, VGS=0V  
30  
V
VDS=24V, VGS=0V  
1
5
IDSS  
Zero Gate Voltage Drain Current  
μA  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±20V  
100  
3
nA  
V
VGS(th)  
ID(ON)  
VDS=VGS ID=250μA  
1
1.8  
V
GS=10V, VDS=5V  
GS=10V, ID=20A  
85  
A
V
2.9  
4.4  
3.7  
5.5  
5.5  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
mΩ  
S
VGS=4.5V, ID=20A  
VDS=5V, ID=20A  
IS=1A,VGS=0V  
4.4  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
106  
0.72  
1
V
Maximum Body-Diode Continuous Current  
85  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
3200 3840  
590  
pF  
pF  
pF  
Ω
VGS=0V, VDS=15V, f=1MHz  
GS=0V, VDS=0V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
414  
V
0.54  
0.7  
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
Qg(4.5V) Total Gate Charge  
63  
33  
76  
40  
nC  
nC  
nC  
nC  
ns  
VGS=4.5V, VDS=15V, ID=20A  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
8.6  
17.6  
12  
Gate Drain Charge  
Turn-On DelayTime  
VGS=10V, VDS=15V, RL=0.75Ω,  
Turn-On Rise Time  
15.5  
40  
ns  
RGEN=3Ω  
tD(off)  
tf  
Turn-Off DelayTime  
ns  
Turn-Off Fall Time  
14  
ns  
trr  
IF=20A, dI/dt=100A/μs  
IF=20A, dI/dt=100A/μs  
34  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
41  
ns  
Qrr  
30  
nC  
A: The value of R qJA is measured with the device in a still air environment with T A =25°C.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The R qJA is the sum of the thermal impedence from junction to case R qJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 ms pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming  
a maximum junction temperature of TJ(MAX)=175°C.  
G. The maximum current rating is limited by bond-wires.  
Rev0: August 2005  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
AOL1420  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
60  
150  
VDS=5V  
50  
125  
100  
75  
50  
25  
0
10V  
40  
30  
20  
10  
0
4.0V  
125°C  
25°C  
3.5V  
2
VGS=3V  
1.5  
2
2.5  
3
3.5  
4
4.5  
0
1
3
4
5
V
GS(Volts)  
V
DS (Volts)  
Figure 2: Transfer Characteristics  
Fig 1: On-Region Characteristics  
8
7
6
5
4
3
1.6  
ID=20A  
1.4  
1.2  
1
VGS=10V  
VGS=4.5V  
VGS=4.5V  
VGS=10V  
2
0
0.8  
10  
20  
30  
40  
50  
60  
0
25  
50  
75  
100  
125  
150  
175  
ID (A)  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction  
Temperature  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
8
6
4
2
0
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
125°C  
25°C  
ID=20A  
25°C  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10  
VSD (Volts)  
VGS (Volts)  
Figure 6: Body-Diode Characteristics  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AOL1420  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
5000  
10  
8
VDS=15V  
ID=20A  
4000  
3000  
2000  
1000  
0
Ciss  
6
4
Coss  
2
Crss  
0
0
10  
20  
30  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
40  
50  
60  
70  
0
5
10  
15  
DS (Volts)  
20  
25  
30  
V
Figure 8: Capacitance Characteristics  
1000  
100  
10  
1000  
800  
600  
400  
200  
0
TJ(Max)=175°C  
TC=25°C  
10μs  
100μs  
RDS(ON)  
limited  
1ms  
10ms  
DC  
TJ(Max)=175°C  
TC=25°C  
1
0.1  
0.0001 0.001 0.01  
0.1  
1
10  
100  
0.1  
1
10  
100  
Pulse Width (s)  
VDS (Volts)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TC+PDM.ZθJC.RθJC  
RθJA=1.5°C/W  
1
0.1  
0.01  
PD  
Ton  
T
Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
0.1  
1
10  
100  
Alpha & Omega Semiconductor, Ltd.  
AOL1420  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
TA=25°C  
L ID  
tA  
=
BV VDD  
0.00001  
0.0001  
Time in avalanche, tA (s)  
Figure 12: Single Pulse Avalanche capability  
0.001  
0.01  
0
25  
50  
75  
CASE (°C)  
Figure 13: Power De-rating (Note B)  
100  
125  
150  
175  
T
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
0.01  
0.1  
1
10  
100  
1000  
0
25  
50  
75  
CASE (°C)  
Figure 14: Current De-rating (Note B)  
100  
125  
150  
175  
T
Pulse Width (s)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
10  
1
0.1  
D=Ton/T  
0.01  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=60°C/W  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
1
10  
100  
1000  
Alpha & Omega Semiconductor, Ltd.  

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