AOL1424 [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOL1424
型号: AOL1424
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总5页 (文件大小:121K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOL1424  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOL1424 uses advanced trench technology to  
provide excellent RDS(ON), low gate charge and  
operation with gate voltages as low as 4.5V,while  
retaining a 20V VGS(MAX) rating. It is ESD  
protected.This device is suitable for use as a load  
switch. Standard Product AOL1424 is Pb-free (meets  
ROHS & Sony 259 specifications).  
VDS (V) = 30V  
ID = 70A (VGS = 10V)  
R
DS(ON) < 5.4m(VGS = 10V)  
DS(ON) < 8m(VGS = 4.5V)  
R
ESD Protected  
UIS Tested!  
Rg, Ciss,Coss,Crss Tested  
UltraSO-8TM Top View  
Fits SOIC8  
footprint !  
D
D
Bottom tab  
G
connected to  
drain  
S
S
G
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
30  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current B  
±20  
V
A
TC=25°C  
70  
TC=100°C  
ID  
50  
Pulsed Drain Current C  
IDM  
120  
TA=25°C  
TA=70°C  
23  
Continuous Drain  
Current A  
A
IDSM  
IAR  
18  
Avalanche CurrentH  
30  
A
Repetitive avalanche energy L=0.3mH H  
EAR  
135  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
50  
PD  
W
25  
TA=25°C  
5
3
PDSM  
W
Power Dissipation A  
TA=70°C  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
20  
Max  
24  
Units  
°C/W  
°C/W  
°C/W  
A
t 10s  
Maximum Junction-to-Ambient  
Maximum Junction-to-Ambient  
Maximum Junction-to-Case D  
RθJA  
A
Steady-State  
Steady-State  
45  
55  
RθJC  
2.5  
3.0  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOL1424  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250µA, VGS=0V  
30  
V
VDS=30V, VGS=0V  
1
5
IDSS  
Zero Gate Voltage Drain Current  
µA  
µA  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±16V  
10  
2.5  
VGS(th)  
ID(ON)  
VDS=VGS ID=250µA  
1.4  
1.8  
V
A
VGS=10V, VDS=5V  
120  
V
GS=10V, ID=20A  
4.5  
6.3  
6.5  
67  
5.4  
7.6  
8.0  
mΩ  
mΩ  
RDS(ON)  
TJ=125°C  
Static Drain-Source On-Resistance  
VGS=4.5V, ID=20A  
VDS=5V, ID=20A  
IS=1A,VGS=0V  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
S
V
A
0.7  
1.0  
70  
Maximum Body-Diode Continuous Current  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1803 2170  
pF  
pF  
pF  
VGS=0V, VDS=15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
387  
238  
VGS=0V, VDS=0V, f=1MHz  
1.3  
2
SWITCHING PARAMETERS  
Qg(10V)  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
36  
19  
48  
nC  
nC  
nC  
nC  
ns  
Qg(4.5V)  
Qgs  
Qgd  
tD(on)  
tr  
V
GS=10V, VDS=15V, ID=20A  
3.9  
8.7  
7.6  
6.4  
27  
ns  
VGS=10V, VDS=15V, RL=0.75,  
R
GEN=3Ω  
tD(off)  
tf  
ns  
8.5  
27  
ns  
trr  
IF=20A, dI/dt=100A/µs  
IF=20A, dI/dt=100A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
33  
ns  
Qrr  
17  
nC  
A: The value of R  
is measured with the device in a still air environment with TA =25°C. The power dissipation PDSM and current rating IDSM are  
θJA  
based on TJ(MAX)=150°C, using t 10s junction-to-ambient thermal resistance.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=175°C.  
G. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T=25°C. The SOA  
A
curve provides a single pulse rating.  
H. EAR and IAR ratings are based on low frequency and duty cycles such that Tj(start)=25C for each pulse.  
Rev3: July 2007  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOL1424  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
120  
90  
60  
30  
0
30  
25  
20  
15  
10  
5
10V  
4.5V  
6V  
4V  
5V  
VDS=5V  
125°  
VGS=3.5V  
-40°C  
25°C  
3V  
0
0
1
2
3
4
5
1
1.5  
2
2.5  
3
3.5  
4
VDS (Volts)  
V
GS(Volts)  
Figure 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
10  
8
1.8  
1.6  
1.4  
1.2  
1
VGS=10V  
ID=20A  
VGS=4.5V  
VGS=4.5V  
ID=20A  
6
4
0.8  
0.6  
VGS=10V  
2
0
5
10  
15  
D (A)  
20  
25  
30  
-60 -30  
0
30  
60  
90 120 150 180  
I
Temperature (°C)  
Figure 4: On-Resistance vs. Junction  
Temperature  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
15  
10  
5
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
ID=20A  
125°C  
125°C  
25°C  
-40°C  
25°C  
0
0.0  
0.2  
0.4  
0.6  
SD (Volts)  
Figure 6: Body-Diode Characteristics  
0.8  
1.0  
1.2  
1.4  
2
3
4
5
6
7
8
9
10  
V
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOL1424  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
3500  
10  
8
3000  
2500  
2000  
1500  
1000  
500  
VDS=15V  
ID=20A  
Ciss  
6
4
Coss  
2
Crss  
0
0
0
10  
20  
30  
40  
0
5
10  
15  
VDS (Volts)  
20  
25  
30  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
1000.0  
100.0  
10.0  
1.0  
140  
120  
100  
80  
60  
40  
20  
0
10µs  
TJ(Max)=175°C  
TC=25°C  
RDS(ON)  
limited  
100µ  
1m  
DC  
10ms  
0.1  
TJ(Max)=175°C  
TC=25°C  
0.1  
0.0  
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
V
DS (Volts)  
Figure 9: Maximum Forward Biased  
Safe Operating Area (Note F)  
10  
1
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
T
J,PK=TC+PDM.ZθJC.RθJC  
RθJC=3°C/W  
PD  
0.1  
Ton  
T
Single Pulse  
0.0001  
0.01  
0.00001  
0.001  
0.01  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
0.1  
1
10  
100  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOL1424  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
80  
60  
50  
40  
30  
20  
10  
0
60  
40  
20  
0
0
25  
50  
75  
TCASE (°C)  
Figure 12: Power De-rating (Note B)  
100  
125  
150  
175  
0
25  
50  
75  
CASE (°C)  
Figure 13: Current De-rating (Note B)  
100  
125  
150  
175  
T
140  
120  
100  
80  
60  
40  
20  
0
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 14: Single Pulse Power Rating Junction-to-Ambient (Note G)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
0.1  
PD  
D=Ton/T  
0.01  
Single Pulse  
Ton  
10  
T
J,PK=TA+PDM.ZθJA.RθJA  
T
RθJA=55°C/W  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
Pulse Width (s)  
Figure 15: Normalized Maximum Transient Thermal Impedance (Note G)  
1
100  
1000  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  

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