AO4410_10 [AOS]
30V N-Channel MOSFET; 30V N沟道MOSFET型号: | AO4410_10 |
厂家: | ALPHA & OMEGA SEMICONDUCTORS |
描述: | 30V N-Channel MOSFET |
文件: | 总5页 (文件大小:185K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AO4410
30V N-Channel MOSFET
General Description
Product Summary
The AO4410 uses advanced trench technology to
provide excellent RDS(ON), shoot-through immunity,
body diode characteristics and ultra-low gate
resistance. This device is ideally suited for use as a
low side switch in Notebook CPU core power
conversion.
VDS (V) = 30V
ID = 18A
(VGS = 10V)
RDS(ON) < 5.5mΩ (VGS = 10V)
DS(ON) < 6.2mΩ (VGS = 4.5V)
R
100% UIS Tested
100% Rg Tested
SOIC-8
D
Top View
Bottom View
D
D
D
D
G
G
S
S
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Maximum
Units
Drain-Source Voltage
VDS
30
±12
18
V
Gate-Source Voltage
VGS
V
A
TA=25°C
TA=70°C
Continuous Drain
Current AF
ID
15
Pulsed Drain Current B
IDM
80
TA=25°C
TA=70°C
3
PD
W
Power Dissipation
Avalanche Current B
2.1
A
mJ
°C
IAR
30
Repetitive avalanche energy 0.3mH B
EAR
135
-55 to 150
Junction and Storage Temperature Range
TJ, TSTG
Thermal Characteristics
Parameter
Symbol
Typ
31
Max
40
Units
°C/W
°C/W
°C/W
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
t ≤ 10s
RθJA
Steady-State
Steady-State
59
75
Maximum Junction-to-Lead C
RθJL
16
24
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
STATIC PARAMETERS
ID=250µA, VGS=0V
BVDSS
Drain-Source Breakdown Voltage
30
V
V
DS=30V, VGS=0V
1
5
IDSS
Zero Gate Voltage Drain Current
µA
TJ=55°C
VDS=0V, VGS= ±12V
VDS=VGS ID=250µA
VGS=4.5V, VDS=5V
IGSS
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
100
1.5
nA
V
VGS(th)
ID(ON)
0.8
80
1.1
A
V
GS=10V, ID=18A
4.7
6.4
5.5
7.4
6.2
mΩ
RDS(ON)
Static Drain-Source On-Resistance
TJ=125°C
VGS=4.5V, ID=15A
VDS=5V, ID=18A
IS=1A,VGS=0V
5.2
mΩ
S
gFS
VSD
IS
Forward Transconductance
Diode Forward Voltage
102
0.64
1
V
Maximum Body-Diode Continuous Current
4.5
A
DYNAMIC PARAMETERS
Ciss
Coss
Crss
Rg
Input Capacitance
9130 10500
625
pF
pF
pF
Ω
VGS=0V, VDS=15V, f=1MHz
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
387
0.4
542
0.8
VGS=0V, VDS=0V, f=1MHz
VGS=10V, VDS=15V, ID=18A
0.2
SWITCHING PARAMETERS
Qg(4.5V) Total Gate Charge
72.4
13.4
16.8
11
85
nC
nC
nC
ns
ns
ns
ns
Qgs
Qgd
tD(on)
tr
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
15
11
V
GS=10V, VDS=15V, RL=0.83Ω,
GEN=3Ω
7
R
tD(off)
tf
99
135
19.5
40
13
trr
IF=18A, dI/dt=100A/µs
IF=18A, dI/dt=100A/µs
33
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
ns
Qrr
22.2
30
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with
T A=25°C. The value in any given application depends on the user's specific board design.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
SOA curve provides a single pulse rating.
F. The current rating is based on the t≤ 10s junction to ambient thermal resistance rating.
Rev7: Nov 2010
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100000
5
4
3
2
1
0
VDS=15V
ID=18A
Ciss
10000
1000
100
Coss
Crss
0
10
20
30
40
Qg (nC)
Figure 7: Gate-Charge Characteristics
50
60
70
80
90
0
5
10
15
VDS (Volts)
20
25
30
Figure 8: Capacitance Characteristics
100.0
10.0
1.0
100
RDS(ON)
limited
TJ(Max)=150°C
TA=25°C
10µs
100µs
80
60
40
20
0
1ms
10ms
0.1s
1s
10s
DC
TJ(Max)=150°C
TA=25°C
0.001
0.01
0.1
1
10
100
1000
0.1
Pulse Width (s)
0.1
1
10
100
Figure 10: Single Pulse Power Rating Junction-to-
Ambient (Note E)
V
DS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
10
1
D=Ton/T
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=40°C/W
0.1
PD
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
60
50
40
30
20
10
0
60
50
40
30
20
10
0
10V
2.5V
VDS=5V
VGS=2V
125°C
25°C
2
0
1
2
3
4
5
0
0.5
1
1.5
2.5
VDS (Volts)
VGS(Volts)
Fig 1: On-Region Characteristics
Figure 2: Transfer Characteristics
6.0
5.5
5.0
4.5
4.0
1.6
1.4
1.2
1
VGS=4.5V
ID=18A
VGS=4.5V
VGS=10V
VGS=10V
0.8
0
10
20
30
40
50
60
0
25
50
75
100
125
150
175
ID (A)
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
16
1.0E+02
1.0E+01
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
1.0E-05
12
8
ID=18A
125°C
125°C
25°C
4
25°C
0
0.0
0.2
0.4
VSD (Volts)
Figure 6: Body-Diode Characteristics
0.6
0.8
1.0
0
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
Gate Charge Test Circuit &Waveform
Vgs
Qg
10V
+
VDC
+
Qgs
Qgd
Vds
VDC
-
-
DUT
Vgs
Vds
Ig
Charge
Resistive Switching TestCircuit& Waveforms
RL
Vds
90%
10%
+
DUT
Vdd
Vgs
VDC
Rg
-
Vgs
Vgs
t d(on)
t
r
t d(off)
t
f
t on
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
EAR=1/2 LI
AR
BVDSS
Vds
Id
Vds
+
Vgs
Vdd
IAR
Vgs
VDC
Id
Rg
-
DUT
Vgs
Vgs
Diode RecoveryTest Circuit &Waveforms
Qrr=- Idt
Vds +
Vds -
Ig
DUT
Vgs
Isd
trr
L
IF
Isd
dI/dt
+
IRM
Vdd
Vgs
VDC
Vdd
-
Vds
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
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