AM2304E3VR [AITSEMI]

N-CHANNEL ENHANCEMENT MODE MOSFET;
AM2304E3VR
型号: AM2304E3VR
厂家: AiT Semiconductor    AiT Semiconductor
描述:

N-CHANNEL ENHANCEMENT MODE MOSFET

文件: 总9页 (文件大小:461K)
中文:  中文翻译
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AM2304  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
N-CHANNEL ENHANCEMENT MODE MOSFET  
DESCRIPTION  
FEATURES  
AM2304 is available in a SOT-23 package.  
30V/5.1A  
R
R
DS(ON)= 25mΩ(max.) @ VGS= 10V  
DS(ON)= 35mΩ(max.) @ VGS= 4.5V  
Reliable and Rugged  
Available in a SOT-23 package.  
ORDERING INFORMATION  
APPLICATION  
Power Management in Notebook Computer,  
Portable Equipment and Battery Powered  
Package Type  
SOT-23  
Part Number  
AM2304E3R  
AM2304E3VR  
Systems.  
E3  
Load Switch  
V: Halogen free Package  
R: Tape & Reel  
PIN DESCRIPTION  
Note  
AiT provides all RoHS products  
Suffix “ V “ means Halogen free Package  
N-Channel MOSFET  
REV2.0  
- DEC 2013 RELEASED, NOV 2014 UPDATED -  
- 1 -  
AM2304  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
N-CHANNEL ENHANCEMENT MODE MOSFET  
PIN DESCRIPTION  
Top View  
Pin #  
Symbol  
Function  
Gate  
1
2
3
G
S
D
Source  
Drain  
REV2.0  
- DEC 2013 RELEASED, NOV 2014 UPDATED -  
- 2 -  
AM2304  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
N-CHANNEL ENHANCEMENT MODE MOSFET  
ABSOLUTE MAXIMUM RATINGS  
TA = 25, unless otherwise noted  
V
DSS, Drain-Source Voltage  
30V  
±20V  
VGSS, Gate-Source Voltage  
TA=25℃  
TA=70℃  
VGS=10V  
5.1A  
ID, Continuous Drain Current  
4.1A  
IDM, 300μs Pulsed Drain Current  
IS, Diode Continuous Forward Current  
TJ, Maximum Junction Temperature  
TSTG, Storage Temperature Range  
20A  
1.5A  
150℃  
-55~150℃  
1W  
TA=25℃  
PD, Maximum Power Dissipation  
TA=70℃  
0.64W  
90°C/W  
125°C/W  
t 10sec.  
RθJANOTE1, Thermal Resistance-Junction to Ambient  
Steady state  
Stress beyond above listed “Absolute Maximum Ratings” may lead permanent damage to the device. These are stress ratings only and  
operations of the device at these or any other conditions beyond those indicated in the operational sections of the specifications are not  
implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
NOTE1: Surface Mounted on 1in2 pad area, t 10sec.  
REV2.0  
- DEC 2013 RELEASED, NOV 2014 UPDATED -  
- 3 -  
AM2304  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
N-CHANNEL ENHANCEMENT MODE MOSFET  
ELECTRICAL CHARACTERISTICS  
TA = 25, unless otherwise noted  
Parameter  
Symbol  
Conditions  
Min  
Typ.  
Max  
Units  
Static Characteristics  
Drain-Source Breakdown Voltage  
BVDSS  
IDSS  
VGS=0V,IDS=250μA  
30  
-
-
-
-
1
V
VDS=24V,VGS=0V  
Zero Gate Voltage Drain Current  
μA  
TJ=85°C  
30  
Gate Threshold Voltage  
Gate Leakage Current  
VGS(th)  
IGSS  
VDS=VGS,IDS=250μA  
VGS=±20V, VDS=0V  
VGS=10V,IDS=8A  
VGS=4.5V,ID=5A  
1.3  
1.8  
-
2.5  
±100  
25  
V
-
-
-
nA  
21  
27  
RDS(ON)  
NOTE2  
Drain-Source On-state Resistance  
mΩ  
35  
Diode Characteristics  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Dynamic Characteristics NOTE3  
Gate Resistance  
NOTE2  
VSD  
ISD=1A,VGS=0V  
-
-
-
0.75  
12.8  
3.8  
1.1  
V
trr  
-
-
ns  
nC  
ISD=8A, dlSD/dt=100A/μs  
Qrr  
RG  
CISS  
COSS  
CRSS  
tD(ON)  
tR  
VGS=0V,VDS=0V,F=1MHz  
VGS=0V,  
-
-
-
-
-
-
-
-
1.5  
410  
70  
41  
6
-
-
W
Input Capacitance  
Output Capacitance  
VDS=15V,  
-
pF  
Frequency=1.0MHz  
Reverse Transfer Capacitance  
Turn-on Delay Time  
-
10  
13  
20  
5
VDD=15V, RL=15Ω  
IDS=1A, VGEN=10V,  
RG=6Ω  
Turn-on Rise Time  
9
ns  
Turn-off Delay Time  
tD(OFF)  
tF  
14  
3.2  
Turn-off Fall Time  
Gate Charge Characteristics NOTE3  
VGS=4.5V  
VGS=10V  
-
-
-
-
-
4
8
-
-
-
-
-
VDS=30V,  
VGS=8V,  
Total Gate Charge  
QG  
Gate-Source Charge  
Gate-Drain Charge  
QGS  
QGD  
QGth  
1.5  
1.5  
0.75  
nC  
VDS=30V, VGS=10V,  
IDS=8A  
Threshold Gate Charge  
NOTE2: Pulse test; pulse width300μs, duty cycle2%.  
NOTE3: Guaranteed by design, not subject to production testing.  
REV2.0  
- DEC 2013 RELEASED, NOV 2014 UPDATED -  
- 4 -  
AM2304  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
N-CHANNEL ENHANCEMENT MODE MOSFET  
TYPICAL CHARACTERISTICS  
1. Power Dissipation  
2. Drain Current  
3. Safe Operation Area  
4. Thermal Transient Impedance  
5. Output Characteristics  
6. Drain-Source On Resistance  
REV2.0  
- DEC 2013 RELEASED, NOV 2014 UPDATED -  
- 5 -  
AM2304  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
N-CHANNEL ENHANCEMENT MODE MOSFET  
7. Gate-Source On Resistance  
8. Gate Threshold Voltage  
9. Drain-Source On Resistance  
10. Source-Drain Diode Forward  
11. Capacitance  
12. Gate Charge  
REV2.0  
- DEC 2013 RELEASED, NOV 2014 UPDATED -  
- 6 -  
AM2304  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
N-CHANNEL ENHANCEMENT MODE MOSFET  
DETAILED INFORMATION  
Avalanche Test Circuit and Waveforms  
Switching Time Test Circuit and Waveforms  
REV2.0  
- DEC 2013 RELEASED, NOV 2014 UPDATED -  
- 7 -  
AM2304  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
N-CHANNEL ENHANCEMENT MODE MOSFET  
PACKAGE INFORMATION  
Dimension in SOT-23 Package (Unit: mm)  
SYMBOL  
MIN  
-
MAX  
1.200  
0.800  
1.120  
0.500  
0.220  
3.100  
3.000  
1.800  
A
A1  
A2  
b
0.000  
0.900  
0.300  
0.080  
2.700  
2.600  
1.400  
c
D
E
E1  
e
0.950(BSC)  
1.900(BSC)  
e1  
L
0.300  
0°  
0.600  
8°  
θ
NOTE: Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed  
10 mil per side.  
REV2.0  
- DEC 2013 RELEASED, NOV 2014 UPDATED -  
- 8 -  
AM2304  
AiT Semiconductor Inc.  
www.ait-ic.com  
MOSFET  
N-CHANNEL ENHANCEMENT MODE MOSFET  
IMPORTANT NOTICE  
AiT Semiconductor Inc. (AiT) reserves the right to make changes to any its product, specifications, to  
discontinue any integrated circuit product or service without notice, and advises its customers to obtain the  
latest version of relevant information to verify, before placing orders, that the information being relied on is  
current.  
AiT Semiconductor Inc.'s integrated circuit products are not designed, intended, authorized, or warranted to  
be suitable for use in life support applications, devices or systems or other critical applications. Use of AiT  
products in such applications is understood to be fully at the risk of the customer. As used herein may involve  
potential risks of death, personal injury, or servere property, or environmental damage. In order to minimize  
risks associated with the customer's applications, the customer should provide adequate design and  
operating safeguards.  
AiT Semiconductor Inc. assumes to no liability to customer product design or application support. AiT  
warrants the performance of its products of the specifications applicable at the time of sale.  
REV2.0  
- DEC 2013 RELEASED, NOV 2014 UPDATED -  
- 9 -  

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