AD7284WBSWZ [ADI]
8-Channel, Li-Ion, Battery Monitoring System;
| 型号： | AD7284WBSWZ |
| 厂家： | 
ADI |
| 描述： | 8-Channel, Li-Ion, Battery Monitoring System 电池 监控 |
| 文件： | 总49页 (文件大小：927K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
8-Channel, Li-Ion,
Battery Monitoring System
Data Sheet
AD7284
FEATURES
FUNCTIONAL BLOCK DIAGRAM
V
CB1 TO CB8
DD
8 analog input channels, integrated secondary monitor
3 mV maximum cell voltage accuracy, TUE, 14-bit ADC
Very low measurement latency across 96 cells
Stack voltage measurement
CELL BALANCE
INTERFACE
DAISY-CHAIN
INTERFACE
D_UP
D_UP
TEMP
16 mV typical battery stack voltage (TUE) accuracy
Cell balancing interface, with individually programmable
on time
5V REG
V
REG5
VPIN0 TO VPIN8
+
MUX
ADC
–
AV
DV
CC
VPAUX1 TO VPAUX4
CC
V
REFBUF
V
DRIVE
4 auxiliary analog input channels, 14-bit ADC
Suitable for thermistor inputs and external diagnostics
Buffered reference output for ratiometric measurements
Internal temperature sensor
REF1
CLK1
V
REF1
CONTROL
LOGIC
REGISTERS
AND TIMERS
GPOP1
GPOP2
MASTER
RESET
REFGND1/REFGND2
CLK2
REF2
V
REF2
V
DD operating range: 10 V to 40 V
SCLK
SDI
MUX
VSIN0 TO VSIN8
ADC
On-chip 5 V regulator
Watchdog timer
SPI
INTERFACE
SDO
CS
IDD matching current: 100 µA
C
CM
AD7284
D_DWN
D_DWN
Robust, proprietary daisy-chain interface
SPI to host controller
DAISY-CHAIN
INTERFACE
CRC protection on read and write commands
2 general-purpose outputs
64-lead low profile quad flat package, exposed pad (LQFP_EP)
Junction temperature range: −30°C to +120°C
Qualified for automotive applications
V
AGND1/ DGND
AGND2
SS
Figure 1.
APPLICATIONS
Li-Ion battery monitoring
Electric and hybrid electric vehicles
Stationary power applications
There are two on-chip 2.5 V voltage references: one reference
for the primary measurement path, and one for the secondary
measurement path.
GENERAL DESCRIPTION
The AD7284 contains all the functions required for the general-
purpose monitoring of stacked Li-Ion batteries, as used in
hybrid electric vehicles and battery backup applications.
The AD7284 operates from one VDD supply, ranging from 10 V
to 40 V. The device provides eight differential analog input
channels to accommodate large common-mode signals across
the full VDD range. Each channel allows an input signal range,
VPINx − VPIN(x − 1) and VSINx – VSIN(x − 1), of 0 V to 5 V,
where x = 0 to 8. The input pins assume a series stack of eight
cells. The AD7284 includes four auxiliary ADC input channels
that can be used for temperature measurement or system
diagnostics.
The AD7284 has multiplexed cell voltage and auxiliary, analog-
to-digital converter (ADC) measurement channels supporting
four to eight cells of battery management. The device provides a
maximum total unadjusted error, TUE, (cell voltage accuracy) of
±± mV that includes all the internal errors from input to
output. The primary ADC resolution is 14 bits.
The AD7284 also includes an integrated secondary measurement
path that validates the data on the primary ADC. Other diagnostic
features include the detection of open inputs, communication,
and power supply related faults.
The AD7284 has a differential daisy-chain interface that allows
multiple devices to be stacked without the need for individual
device isolation. By design, this interface allows both device
to device communication within the same module and
communication between devices on different modules.
The AD7284 cell balancing interface outputs control the
external field effect transistors (FETs) to allow discharging of
individual cells.
Rev. A
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Tel: 781.329.4700
Technical Support
©2017 Analog Devices, Inc. All rights reserved.
www.analog.com
AD7284
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Modes of Operation................................................................... 25
Active Mode, Power-Up ............................................................ 25
Reset............................................................................................. 26
Power-Down ............................................................................... 26
Watchdog Timer............................................................................. 28
Serial Peripheral Interface (SPI)................................................... 29
Register Write and Register Read Operations............................ 29
Conversion Data Readback Operation.................................... 30
CRC Pseudocode Examples...................................................... 31
Daisy-Chain Interface.................................................................... 32
Daisy-Chain Physical Interface ................................................ 32
Daisy-Chain Protocol ................................................................ 32
Daisy-Chain Debug Mode ........................................................ 32
Register Map ................................................................................... 33
Page Addressing.......................................................................... 33
Page 0 Addresses......................................................................... 35
Page 1 Addresses......................................................................... 36
Registers Common to Page 0 and Page 1................................ 40
Examples of Interfacing with the AD7284 .................................. 41
Register Write and Register Read Operations Examples...... 41
Conversion Data Readback Operation Examples.................. 42
Applications Information.............................................................. 44
Typical Connection Diagrams.................................................. 44
Hot Plug....................................................................................... 47
Service Disconnect (SD) ........................................................... 47
Transformer Configuration ...................................................... 48
Outline Dimensions....................................................................... 49
Ordering Guide .......................................................................... 49
Automotive Products................................................................. 49
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
ADC Timing Specifications ........................................................ 6
Serial Peripheral Interface (SPI) Timing Specifications.......... 7
Absolute Maximum Ratings............................................................ 8
Thermal Data................................................................................ 8
Thermal Resistance ...................................................................... 8
ESD Caution.................................................................................. 8
Pin Configuration and Function Descriptions............................. 9
Typical Performance Characteristics ........................................... 11
Terminology .................................................................................... 14
Theory of Operation ...................................................................... 15
Circuit Information.................................................................... 15
Converter Operation.................................................................. 16
Internal Temperature Sensor .................................................... 17
Auxiliary ADC Inputs................................................................ 17
Voltage References...................................................................... 17
Cell Connections ........................................................................ 18
ADC Conversions Sequence..................................................... 19
Converting with a Single AD7284............................................ 20
Converting with a Chain of AD7284 Devices......................... 21
Conversion Data Readback....................................................... 22
Cell Balancing Outputs.............................................................. 23
Open Input Detection................................................................ 24
Power Management........................................................................ 25
AD7284 Supplies......................................................................... 25
REVISION HISTORY
5/2017—Revision A: Initial Version
Rev. A | Page 2 of 49
Data Sheet
AD7284
SPECIFICATIONS
VDD = 10 V to 40 V, V SS = 0 V, DV CC = AVCC = VREG5, VDRIVE = ±.0 V to 5.5 V, unless otherwise noted. TJ = −±0°C to +120°C, where TJ is
the junction temperature, unless otherwise noted. See the Thermal Data section for more details.
Table 1.
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
PRIMARY ADC DC ACCURACY
(VPIN0 to VPIN8)
Resolution1
14
Bits
LSB
LSB
mV
No missing codes, 305 µV/LSB
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
ADC Unadjusted Error1
TUE2, 3
1.4
0.8
1
VPINx − VPIN(x − 1) Range
2 V to 3.6 V
2 V to 4.3 V
0 V to 5 V1
1
1
1
3
5
10
mV
mV
mV
10°C ≤ TJ ≤ 75°C
−10°C ≤ TJ ≤ +105°C
PRIMARY ADC CELL VOLTAGE INPUTS
(VPIN0 to VPIN8)
Pseudo Differential Input Voltage
Range
VPINx − VPIN(x − 1)
Static Leakage Current
Dynamic Leakage Current
0
5
V
nA
nA
30
3
100
Convert start command
issued every 100 ms
Input Capacitance
15
pF
PRIMARY ADC DC ACCURACY
(VPAUX1 to VPAUX4)
Resolution
14
Bits
LSB
LSB
mV
No missing codes, 305 µV/LSB
INL1
1.5
0.8
2
DNL1
ADC Unadjusted Error1
TUE2
VPINx − VPIN(x − 1) Range
0 V to 2.5 V1
0 V to 5 V1
2
2
5
10
mV
mV
−10°C ≤ TJ ≤ +105°C
PRIMARY ADC AUXILIARY INPUTS
(VPAUX1 to VPAUX4)
Input Voltage Range1
Static Leakage Current
Dynamic Leakage Current
0
5
V
nA
nA
80
3
100
Convert start command
issued every 100 ms
Input Capacitance
PRIMARY ADC DC ACCURACY (VSTK4)
Resolution1
15
pF
14
Bits
No missing codes, 4.88 mV/LSB
TUE2
Battery Stack Voltage (VSTK) Range
10 V to 28.8 V1
10 V to 40 V1
16
16
24
50
mV
mV
10°C ≤ TJ ≤ 75°C
VSTK Voltage Accuracy
VSTK Range
Relative to the sum of the cells
10°C ≤ TJ ≤ 75°C
10 V to 28.8 V1
2
2
15
30
mV
mV
10 V to 40 V1
Rev. A | Page 3 of 49
AD7284
Data Sheet
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
SECONDARY ADC DC ACCURACY
(VSIN0 to VSIN8)
Resolution
INL
DNL
TUE2, 3
10
Bits
LSB
LSB
mV
No missing codes, 4.88 mV/LSB
1
0.8
15
25
SECONDARY ADC CELL VOLTAGE
INPUTS (VSIN0 to VSIN8)
Pseudo Differential Input Voltage
VINx − VIN(x − 1)
0
5
V
Static Leakage Current
Dynamic Leakage Current
5
3
100
nA
nA
Convert start command
issued every 100 ms
Input Capacitance
15
pF
REFERENCE (VREF1, VREF2
Reference Voltage
Reference Temperature Coefficient
)
2.5
3
V
ppm/°C
Included in the TUE
specification
Output Voltage Hysteresis
Long-Term Drift5
160
320
ppm
ppm/
Primary reference
2000 hours
Turn On Settling Time
5
ms
CREF1 = 1 µF//100 nF,
CREF2 = 1 µF//100 nF
REFERENCE BUFFER OUTPUT (VREFBUF
Output Voltage Accuracy
Output Current
Load Regulation
Turn On Settling Time
)
−4.5
4.8
1
+4.5
1
mV
mA
mV/mA
ms
Relative to VREF1 output voltage
CREFBUF = 1 µF
0.25
5
REGULATOR OUTPUT (VREG5
Output Voltage
)
5
5.2
V
Output Current
2
mA
Line Regulation
Load Regulation
Internal Short-Circuit Protection Limit
CELL BALANCING OUTPUTS6
Output Voltage
0.5
0.5
30
mV/V
mV/mA
mA
CB1 to CB8 output
ISOURCE = 20 µA
High, VOH
3.7
5
5.3
V
Low, VOL
0
0.09
V
Ramp-Up and Ramp-Down Time
INTERNAL TEMPERATURE SENSOR
100
µs
For a 80 pF load
Measures junction
temperature
−30°C ≤ TJ ≤ +120°C
Accuracy1
3
°C
Resolution
0.03125
°C/LSB
LOGIC INPUTS (EXCEPT RESET)
Input Voltage
High, VINH
VDRIVE × 0.7
V
Low, VINL
VDRIVE × 0.3
V
Input Current, IIN
Input Capacitance, CIN
10
5
µA
pF
Rev. A | Page 4 of 49
Data Sheet
AD7284
Parameter
LOGIC OUTPUTS
Output Voltage
High, VOH
Min
Typ
Max
Unit
Test Conditions/Comments
VDRIVE × 0.9
V
V
ISOURCE = 200 µA
ISINK = 200 µA
Low, VOL
0.4
Floating State
Leakage Current
Output Capacitance
RESET
1
5
µA
pF
tRESET
100
10
ns
Pulse width to reset or wake
up the AD7284 (VDRIVE high)
Leakage Current
60
µA
POWER REQUIREMENTS
VDD Operating Range
40
V
Current Consumption on the
Applies to master and slave
configurations
V
DD Pin (IDD)
IDD During Conversion
IDD During Conversion Data
Readback
14
15
15
16.5
17
18
mA
mA
Continuous readback
IDD During Cell Balancing
13
12
14
13
14
16
14
15
mA
mA
mA
Device in partial power-down
To support transformer-
based communications
IDD Idle
IDD Partial Power-Down Mode
IDD Full Power-Down Mode
IDD Matching Current
11
22
12
30
100
14
40
mA
µA
µA
Similar supply and
temperature conditions
across devices
TXIBAL
IDIODE
RXIBAL
−3.9
−0.39
−4.5
−0.35
0.12
−4.9
−0.32
0.56
mA
mA
mA
mA
Bit D6 in Control Register 2
Bit D5 in Control Register 2
Bit D4 in Control Register 2
Bit D3 in Control Register 2
IMASTER
−3.5
3.0
−4.0
−4.5
Master Configuration Only
VDRIVE
5.5
V
Typically 3.3 V or 5 V
VDRIVE Threshold
IDRIVE
0.8
15
V
µA
To wake up the master device
1 Guaranteed by design and/or characterization.
2 TUE includes the INL of the ADC, the gain and offset errors of the input channels, as well as the reference error; that is, the difference between the ideal and actual
reference voltage and the temperature coefficient of the reference.
3 These specifications assume that all cells are in the same input voltage range, for example, VPINx – VPIN(x – 1) range = 2 V to 3.6 V.
4 VSTK, the battery stack voltage, is scaled down internally by a factor of 16 before being applied to the ADC for measurement.
5 Data generated from high temperature operating life (HTOL) reliability testing.
6 For CB1 to CB5, the CBx output can be set to 0 V to 5 V with respect to the negative terminal of the cell being balanced. For CB6 to CB8, the CBx output can be set to
0 V to −5 V with respect to the positive terminal of the cell being balanced.
Rev. A | Page 5 of 49
AD7284
Data Sheet
ADC TIMING SPECIFICATIONS
Table 2. ADC Timing for Three Devices in a Chain
Parameter1
tCONV
Min
Typ
1040
400
Max
Unit
Description
ns
ns
ns
ns
ns
µs
ADC conversion time
tACQ
ADC acquisition time, Bits[D1:D0] of Control Register 2 set to 00
ADC acquisition time, Bits[D1:D0] of Control Register 2 set to 01
ADC acquisition time, Bits[D1:D0] of Control Register 2 set to 10
ADC acquisition time, Bits[D1:D0] of Control Register 2 set to 11
Delay from rising edge of CS (conversion command issued) to the first conversion
Propagation delay between two devices in the daisy chain
800
1600
3200
33.6
100
tSTART
tDELAY
32
35
ns
1 All input signals are specified with tRISE = tFALL = 5 ns (10% to 90% of VDRIVE) and timed from a voltage level of 1.6 V. All timing specifications given are with a 25 pF load
capacitance.
TO INITIATE A CONVERSION,
SET B0 HIGH IN THE
ADCFUNC REGISTER
CS HELD HIGH
DURING ADC CONVERSIONS
CS
tACQ
tSTART
tCONV
INTERNAL ADC
CONVERSIONS
PART 1
DUMMY
CONVERSION
INTERNAL TEMPERATURE
SENSOR
CELL 8
CELL7
tDELAY
tDELAY
INTERNAL ADC
CONVERSIONS
PART 2
DUMMY
CONVERSION
INTERNAL TEMPERATURE
SENSOR
CELL 16
CELL 15
tDELAY
tDELAY
tDELAY
INTERNAL ADC
CONVERSIONS
PART 3
DUMMY
CONVERSION
INTERNAL TEMPERATURE
SENSOR
CELL 24
CELL 23
Figure 2. ADC Timing Diagram for Three Devices in a Chain
Rev. A | Page 6 of 49
Data Sheet
AD7284
SERIAL PERIPHERAL INTERFACE (SPI) TIMING SPECIFICATIONS
Table 3.
Parameter1 Min
Typ
500
7252
7252
Max Unit Description
fSCLK
kHz
kHz
kHz
ns
Frequency of the serial read clock on the SCLK pin for write and read registers
Frequency of the serial read clock on the SCLK pin for write registers only
Frequency of the serial read clock on the SCLK pin for read conversion data on slave devices
CS falling edge to SCLK rising edge
Delay from CS falling edge to SDO active
SDI setup time prior to SCLK falling edge
SDI hold time after SCLK falling edge
Data access time after SCLK rising edge
SCLK to data valid hold time
t1
t2
t3
t4
t5
t6
t7
t8
t9
200
3
4
20
40
ns
10
10
ns
ns
ns
ns
20
0.5 × tSCLK
0.5 × tSCLK
100
ns
SCLK high pulse width
ns
SCLK low pulse width
ns
CS rising edge to SCLK rising edge
5
t10
t11
t12
10
ns
CS rising edge to SDO high impedance
CS high time
400
ns
1.5
ns
Time from falling edge of last SCLK to rising edge of CS
1 All input signals are specified with tRISE = tFALL = 5 ns (10% to 90% of VDRIVE) and timed from a voltage level of 1.6 V. All timing specifications given are with a 25 pF load
capacitance.
2 Setting Bit D26 of the register address (see the Register Address section and Table 10) to 1 allows SCLK to increase to 725 kHz, as described in the Register Write and
Register Read Operations section.
3 Guaranteed by design and/or characterization.
4 Time required for the output to cross 0.4 V or 2.4 V.
5 t10 applies when using a continuous SCLK signal. Guaranteed by design.
t12
CS
t11
t9
t7
t1
1
2
3
4
32
SCLK
SDO
SDI
t8
t10
t2
t5
MSB
MSB – 1
LSB
TRISTATE
TRISTATE
t3
t4
MSB
t6
MSB – 1
LSB
CS
Figure 3. SPI Timing Diagram for a 32-Bit Frame
Rev. A | Page 7 of 49
AD7284
Data Sheet
ABSOLUTE MAXIMUM RATINGS
The absolute maximum ratings are defined with respect to the
normal operating specifications and not to other maximum
rating specifications. The mnemonics listed in the rating column
refer to the values as defined in the Specifications section only.
The IPC 2221 industrial standard recommends the use of
conformal coating on high voltage pins.
THERMAL DATA
The junction temperature (TJ) refers to the temperature of the
silicon die within the package of the device when the device is
powered. The AD7284 parameters are specified over a junction
temperature range of −±0°C to +120°C.
Table 4.
Parameter
Rating
VDD
VSS1 − 0.3 V to VSS + 48 V
VSS − 0.3 V to VDD + 0.3 V
VSS − 0.3 V to VSS + 6 V
−0.3 V to +0.3 V
MASTER
VDRIVE, VREG5
The absolute maximum junction temperature of the AD7284
is 150°C. The AD7284 may be damaged when the junction
temperature limit is exceeded. Monitoring of the junction
temperature, or the ambient temperature in conjunction with
an accurate thermal model, guarantees that TJ is within the
specified temperature limits.
2
ADCGND1 to ADCGND2 to VSS
VPIN0, VSIN0
VPIN1 to VPIN7, VSIN1 to VSIN7
VPIN8, VSIN8
VSS − 0.3 V to VSS + 0.3 V
VSS −0.3 V to VDD + 0.3 V
VDD −0.3 V to VDD +1 V
Pseudo Differential Input Voltage3
VPINx − VPIN(x − 1)
VPAUX1 to VPAUX4
CB1
Measure the junction temperature using the internal temperature
sensor.
−0.3 V to +6 V
VSS − 0.3 V to VREG5 + 0.3 V
VSS − 0.3 V to VREG5 + 0.3 V
VSS to VDD
Use the junction temperature (TJ) and the power dissipation
(PD) to calculate the ambient temperature (TA) by
CB2 to CB7
CB8
VDD − 6 V to VDD
TA = TJ − (PD × θJA)
Relative Input/Output Voltages
CBx − VPINx − 1, x = 2 to 5
CBx − VPINx, x = 6 to 8
D_UP, D_UP
where θJA is the junction to ambient thermal resistance of the
package.
−0.3 V to +6 V
−6 V to +0.3 V
THERMAL RESISTANCE
VSS − 0.3 V to VDD + 7 V
VSS − 0.3 V to VREG5 + 0.3 V
VSS − 0.3 V to VDRIVE + 0.3 V
VSS − 0.3 V to VDRIVE + 0.3 V
VSS − 0.3 V to VREG5 +0.3 V
D_DWN, D_DWN
The AD7284 is in a 64-lead LQFP_EP package with an exposed
pad. The exposed pad is added for thermal performance purposes.
Digital Input Voltage
Digital Output Voltage
Analog Outputs (VREF1, VREFBUF, CCM
ESD Human Body Model (HBM) Rating
ANSI/ESDA/JEDEC JS-001-2010
(Standard HBM), All Pins
Operating Junction Temperature Range −40°C to +120°C
Absolute Maximum Junction
Temperature
Storage Temperature
Reflow Profile
Thermal performance is directly linked to PCB design and
operating environment. Close attention to PCB thermal design
is required.
)
2.5 kV
Table 5. Thermal Resistance1
Package Type
2
θJA
Unit
150°C
SW-64-2
32
°C/W
1 Thermal impedance values take into account the localized heat distribution
on the die.
150°C
J-STD 20 (JEDEC)
2 Test Condition 1: thermal impedance simulated values are based on a JEDEC 2S2P
thermal test board with 25 thermal vias. See the JEDEC51 standard.
1 VSS, DGND, AGND1, AGND2, REFGND1, and REFGND2 are internally shorted
on chip and must be connected together on the printed circuit board (PCB).
See the pin descriptions of these pins in the Pin Configuration and Function
Descriptions section for additional information.
ESD CAUTION
2 VREG5, AVCC, and DVCC are internally shorted on chip and must be connected
together on the PCB. See the pin descriptions of these pins in the Pin
Configuration and Function Descriptions section for additional information.
3 Applies to primary and secondary analog voltage inputs; x = 1 to 8.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. A | Page 8 of 49
Data Sheet
AD7284
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
V
V
V
REF2
DD
2
3
DNC
DD
VPIN8
VPIN7
VPIN6
VPIN5
VPIN4
VPIN3
VPIN2
VPIN1
VPIN0
MASTER
DGND
4
5
GPOP1
GPOP2
6
7
DV
C
CC
AD7284
TOP VIEW
(Not to Scale)
8
CM
9
RESET
10
11
12
13
14
15
16
V
DRIVE
CS
V
V
SCLK
SDI
SS
SS
AGND1
CB1
SDO
D_DWN
D_DWN
CB2
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
NOTES
1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THESE PINS.
2. THE EXPOSED PAD IS PROVIDED FOR THERMAL PURPOSES AND MUST BE SOLDERED DOWN TO THE BOARD.
THE EXPOSED PAD IS INTERNALLY CONNECTED TO V ON THE DIE AND MUST BE CONNECTED TO THE
SS
V
PIN OF THE DEVICE ON THE PCB.
SS
Figure 4. Pin Configuration
Table 6. Pin Function Descriptions
Pin No.
Mnemonic
Description
1, 2
VDD
Positive Power Supply Voltage. These pins are connected to the top of the battery stack. Place 4.6 µF to
4.8 µF decoupling capacitors on the VDD pins. It is also recommended that a current limiting resistor be
connected between VDD and the top of the stack.
3 to 11
VPIN8 to VPIN0
Primary Analog Voltage Inputs for Monitoring Up to Eight Cells. Connect VPIN0 to the base of the series
of the connected battery cells and, therefore, to the bottom of Cell 1. Connect VPIN1 to the top of Cell 1,
connect VPIN2 to the top of Cell 2, and so on.
12, 13
14, 51
VSS
Negative Power Supply Voltage. These pins are connected to the bottom of the battery stack. These
inputs must be at the same potential as all the analog and digital grounds of the device.
Analog Ground Pins. These pins are the ground reference point for most of the analog circuitry on the
AD7284. These inputs must be at the same potential as VSS.
Cell Balance Outputs for Balancing Up to Eight Cells. These pins provide a voltage output that can supply
the gate drive of an external cell balancing transistor. The CB1 to CB5 outputs provide a 0 V to 5 V voltage
output referenced to the absolute voltage of the negative terminal of the battery cell that is being
balanced. The CB6 to CB8 outputs provide a 0 V to −5 V voltage output referenced to the absolute
voltage of the positive terminal of the battery cell that is being balanced.
AGND1, AGND2
CB1 to CB8
15 to 18,
57 to 60
19 to 23,
61 to 64
VSIN0 to VSIN8
Secondary Analog Voltage Inputs for Monitoring Up to Eight Cells. These pins can connect directly to the
corresponding primary analog voltage inputs, or they can connect separately to the battery cells. If
connected separately to the battery cells, connect VSIN0 to the base of the series connected battery cells
and, therefore, to the bottom of Cell 1. Connect VSIN1 to the top of Cell 1, connect VSIN2 to the top of
Cell 2, and so on.
24, 49
25, 50
26
ADCGND1,
ADCGND2
REFGND1,
REFGND2
Analog Grounds for the Primary and Secondary ADCs. These pins must be at the same potential as VSS.
Reference Grounds. These pins are the ground reference points for the primary and secondary internal
band gap references. These pins must be at the same potential as VSS.
2.5 V Reference Buffer Output Voltage. A 1 µF decoupling capacitor connected to REFGND1 is recommended
on this pin.
VREFBUF
Rev. A | Page 9 of 49
AD7284
Data Sheet
Pin No.
Mnemonic
Description
27
VREF1
2.5 V Primary Reference Output Voltage. A 1 µF capacitor in parallel with a 100 nF decoupling capacitor
connected to REFGND1 is recommended on this pin. VREF1 can be driven from an external reference, but
it must not be used to drive any other circuit.
28 to 31
32
VPAUX1 to
VPAUX4
AVCC
Primary Auxiliary ADC Inputs (0 V to 5 V, Single-Ended). If any of these inputs are not required in the
application, it is recommended that these pins be connected to VREG5 or VSS through a 10 kΩ resistor.
Analog Supply Voltage. Decouple this supply pin to AGND1 with a 100 nF decoupling capacitor and
connect this pin to the VREG5 output pin.
33, 34
D_DWN, D_DWN Daisy-Chain Lower Interface Ports. On slave devices, terminate these pins with a 50 Ω resistor connected
to the CCM pin. These pins are connected to the D_UP and D_UP pins on the AD7284 device below it in
the daisy chain. On a master device, these pins are not used; connect these pins to VSS via a 1 kΩ resistor
instead.
35
36
37
38
39
SDO
Serial Data Output When Master Device. On a slave AD7284 device, this pin is not used and can be left
unconnected.
Serial Data Input When Master Device. On a slave AD7284 device, this pin is not used and can be pulled
low to DGND via a 1 kΩ resistor.
Serial Clock Input When Master Device. On a slave AD7284 device, this pin is not used and can be pulled
low to DGND via a 1 kΩ resistor.
Chip Select Input When Master Device. On a slave AD7284 device, this input is not used and can be
connected to VSS via a 1 kΩ resistor.
Digital Input/Output Supply Input. On a master device, connect an external voltage supply to the VDRIVE pin.
The voltage supplied at this pin determines the voltage at which the SPI interface operates. Decouple
this pin to DGND with a 100 nF decoupling capacitor. On a master device, pulling VDRIVE low powers down
the device unless an active power-down timer is running. After the expiration of the power-down timer,
SDI
SCLK
CS
VDRIVE
the device powers down. On a slave device, connect the VDRIVE pin to VREG5
.
40
RESET
Digital Input. An active high signal causes the device to reset to the power-on state. This input is internally
pulled down. When this input is not used, an external 1 kΩ pull-down resistor to DGND is recommended.
41
CCM
Common-Mode Decoupling Capacitor Port. This pin supplies a 2 V level used for the daisy-chain
common mode. A 1 µF decoupling capacitor to VSS is required on this pin.
42
DVCC
Digital Supply Voltage. Connect the DVCC supply pin to the VREG5 output pin. Decouple this digital supply
to DGND with a 100 nF decoupling capacitor.
43, 44
45
GPOP2, GPOP1
DGND
General-Purpose Outputs. These pins provide a voltage output level of 0 V for a low signal and a voltage
output level of VDRIVE for a high signal.
Digital Ground. This pin is the ground reference point for all digital circuitry on the AD7284. This pin must
be at the same potential as VSS.
46
MASTER
Voltage Input. When the AD7284 acts as a master, connect this pin to the VDD supply pin through a 10 kΩ
resistor. When the AD7284 acts as a slave, connect this pin to the VSS supply pin of the same AD7284 device
through a 10 kΩ resistor.
47, 52, 54
48
DNC
VREF2
Do Not Connect. Do not connect to these pins.
2.5 V Secondary Reference Output Voltage. A 1 µF capacitor in parallel with a 100 nF decoupling
capacitor to REFGND2 is recommended on this pin. VREF2 can not be driven externally and must not be
used to drive any other circuit.
53
VREG5
5 V Analog Voltage Output. The internally generated VREG5 voltage provides the supply voltage for the
ADC core. A 100 nF decoupling capacitor to AGND2 is required on the VREG5 pin.
55, 56
D_UP, D_UP
Daisy-Chain Upper Interface Ports. Terminate these pins with a 50 Ω resistor connected to the VDD pin
directly for configurations using transformer isolation or via a capacitor when using the direct coupled
configuration. The D_UP pin is connected to the D_DWN pin of the AD7284 device above it in the daisy
chain, and the D_UP pin is connected to the D_DWN pin of the AD7284 device above it in the daisy chain.
Exposed Pad
Exposed Pad. The exposed pad is provided for thermal purposes and must be soldered down to the
board. The exposed pad is internally connected to VSS on the die and must be connected to the VSS pin of
the device on the PCB.
Rev. A | Page 10 of 49
Data Sheet
AD7284
TYPICAL PERFORMANCE CHARACTERISTICS
600
3
2
500
400
300
200
100
1
0
–1
–2
–3
0
–40
–20
0
20
40
60
80
100
120
140
13103 13104 13105 13106 13107 13108 13109
JUNCTION TEMPERATURE (°C)
CODE
Figure 5. Typical Code Noise for VPIN1 Through VPIN8, VDD = 32 V, TJ = 60°C
Figure 8. TUE vs. Junction Temperature, Preassembly, VDD = 18 V
600
500
400
300
200
100
0
3
2
1
0
–1
–2
–3
–40
–20
0
20
40
60
80
100
120
140
6551
6552
6553
6554
6555
6556
6557
JUNCTION TEMPERATURE (°C)
CODE
Figure 6. Typical Code Noise for VSTK, VDD = 32 V, TJ = 60°C
Figure 9. TUE vs. Junction Temperature, Postassembly, VDD = 18 V
3.0
2.5
2.0
1.5
1.0
0.5
0
5
4
3
DUT 1
DUT 2
DUT 3
DUT 4
DUT 5
2
1
0
–1
–2
–3
–4
–5
–40
–20
0
20
40
60
80
100
120
140
–40
–20
0
20
40
60
80
100
120
140
INTERNAL TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 7. Error vs. Internal Temperature for Various Devices Under Test (DUT)
Figure 10. TUE vs. Junction Temperature, Preassembly, VDD = 32 V
Rev. A | Page 11 of 49
AD7284
Data Sheet
5
5.20
5.15
5.10
5.05
5.00
4.95
4.90
4.85
4.80
4
3
10.0V
18.0V
25.6V
32.0V
39.8V
2
1
0
–1
–2
–3
–4
–5
–40
–20
0
20
40
60
80
100
120
140
–40
–20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 11. TUE vs. Junction Temperature, Postassembly, VDD = 32 V
Figure 14. Preassembly 5 V Voltage Regulator Output (VREG5) vs. Junction
Temperature
5.20
2.505
5.15
2.503
10.0V
18.0V
25.6V
32.0V
39.8V
5.10
5.05
5.00
4.95
4.90
4.85
4.80
10.0V
18.0V
25.6V
32.0V
39.8V
2.501
2.499
2.497
2.495
–40
–20
0
20
40
60
80
100
120
–40
–20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 15. Postassembly 5 V Voltage Regulator Output (VREG5) vs. Junction
Temperature
Figure 12. Preassembly Primary Voltage Reference, VREF1 vs. Junction
Temperature
2.505
2.505
10.0V
2.503
2.501
2.499
2.497
2.495
2.503
18.0V
25.6V
32.0V
39.8V
10.0V
25.6V
32.0V
39.8V
2.501
2.499
2.497
2.495
–40
–20
0
20
40
60
80
100
120
–40
–20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 13. Postassembly Primary Voltage Reference, VREF1 vs. Junction
Temperature
Figure 16. Preassembly Buffered Voltage Reference, VREF1 vs. Junction
Temperature
Rev. A | Page 12 of 49
Data Sheet
AD7284
2.503
2.502
2.501
2.500
2.499
2.498
2.497
2.505
2.503
2.501
2.499
2.497
2.495
10.0V
18.0V
25.6V
32.0V
39.8V
0
100
200
300
400
500
600
–40
–20
0
20
40
60
80
100
120
TIME (Hours)
JUNCTION TEMPERATURE (°C)
Figure 18. VREF1 vs. Time,
0 Hours to 500 Hours Accelerated Lifetime Drift (HTOL)
Figure 17. Postassembly Buffered Voltage Reference, VREF1 vs.
Junction Temperature
Rev. A | Page 13 of 49
AD7284
Data Sheet
TERMINOLOGY
Differential Nonlinearity (DNL)
Output Voltage Hysteresis
DNL is the difference between the measured and the ideal
1 LSB change between any two adjacent codes in the ADC.
Output voltage hysteresis, or thermal hysteresis, is defined as
the absolute maximum change of the reference output voltage
after the device is cycled through temperature from either
T_HYS+ or T_HYS−, where
Integral Nonlinearity (INL)
INL is the maximum deviation from a straight line passing
through the endpoints of the ADC transfer function. The
endpoints of the transfer function are zero scale (a point 1 LSB
below the first code transition) and full scale (a point 1 LSB above
the last code transition).
T_HYS+ = 25°C to TMAX to 25°C
T_HYS− = 25°C to TMIN to 25°C
It is expressed in ppm using the following equation:
VREF (25°C) −VREF
Offset Code Error
(T _ HYS)
V
HYS (ppm) =
× 106
Offset code error applies to straight binary output coding. It is
the deviation of the first code transition (00 … 000) to (00 …
001) from the ideal, that is, AGND + 1 LSB.
VREF
(25°C)
where:
V
V
REF (25°C) = VREF at 25°C.
REF (T_HYS) is the maximum change of VREF at T_HYS+ or
Gain Error
Gain error applies to straight binary output coding. It is the
deviation of the last code transition (111 … 110) to (111 … 111)
from the ideal (that is 2 × VREF1 − 1 LSB) after adjusting for the
offset error.
T_HYS−.
Static Leakage Current
Static leakage current is the current that is measured on the cell
voltage and/or the auxiliary ADC inputs when the device is
static, that is, not converting.
ADC Unadjusted Error
ADC unadjusted error includes INL errors, as well as offset and
gain errors of the ADC and measurement channel.
Dynamic Leakage Current
Dynamic leakage current is the current measured on the cell
voltage and/or the auxiliary ADC inputs, when converting, with
the static leakage current subtracted. The dynamic leakage
current is specified with a convert start command issued every
100 ms. Calculate the dynamic leakage current for a different
conversion using the following equation:
Total Unadjusted Error (TUE)
TUE is the maximum deviation of the output code from the
ideal. TUE includes INL errors, offset and gain errors, and
reference errors. Reference errors include the difference
between the actual and ideal reference voltage (that is, 2.5 V)
and the reference voltage temperature coefficient.
I
× f
Reference Voltage Temperature Coefficient
DYN (A) CNVST (B)
I
=
DYN (B)
The reference voltage temperature coefficient (tempco) is
derived from the maximum and minimum reference output
voltage (VREF) measured between TMIN and TMAX. It is expressed
in ppm/°C using the following equation:
f
CNVST (A)
where:
DYN (B) is the dynamic leakage at the desired convert start
frequency, fCNVST (B)
DYN (A) is the dynamic leakage at convert start frequency, fCNVST (A).
I
.
VREF (MAX) −VREF (MIN)
×106
Tempco VREF (ppm/°C) =
I
2.5 V ×(TMAX −TMIN
)
where:
VREF (MAX) is the maximum VREF between TMIN and TMAX
.
V
REF (MIN) is the minimum VREF between TMIN and TMAX
.
T
T
MAX = 120°C.
MIN = −±0°C.
Rev. A | Page 14 of 49
Data Sheet
AD7284
THEORY OF OPERATION
The AD7284 provides eight outputs to control external transistors
as part of a cell balancing circuit. The CB1 to CB5 outputs
provide a 0 V to 5 V output voltage referenced to the absolute
voltage of the negative terminal of the battery cell that is being
balanced. The CB6 to CB8 outputs provide a 0 V to −5 V output
voltage referenced to the absolute voltage of the positive
terminal of the battery cell that is being balanced.
CIRCUIT INFORMATION
The AD7284 is an Li-Ion battery monitoring device that can
monitor eight series connected Li-Ion battery cells and four
additional voltage inputs.
The AD7284 consists of a primary measurement path and a
secondary measurement path, allowing the host microcontroller to
perform a comparison of the two sets of acquired data.
The AD7284 features a differential daisy-chain interface. A
chain of AD7284 devices can monitor the cell voltages and
temperatures of a larger number of cells, as shown in Figure 19.
The conversion data from each AD7284 in the chain passes
through the master device to the system controller via a single
SPI interface. Control data can be similarly passed via the single
SPI interface to the master AD7284 device and up the differential
daisy-chain interface to each individual AD7284 device in the
daisy chain.
Take the VDD and VSS supplies required by the AD7284 from the
battery cells being monitored by the device. An internal VREG5 rail
is generated to provide power for the internal AD7284 core.
The AD7284 includes two on-chip 2.5 V reference output voltages,
V
REF1 and VREF2. Additionally, the VREFBUF analog output voltage
provides a buffered version of the VREF1 primary reference to
allow the connection of external thermistors and to provide a
ratiometric temperature measurement using the four primary
auxiliary inputs, VPAUX1 to VPAUX4.
+HV
BATTERY
PACKS
The primary measurement path consists of a voltage input
multiplexer and a successive approximation register (SAR) ADC,
providing 14 bits of resolution. The primary analog voltage inputs,
VPIN0 to VPIN8, with a set of external filtering components,
allow the individual voltage monitoring of eight cells, plus a
stack voltage measurement. The primary auxiliary inputs,
VPAUX1 to VPAUX4, can monitor temperatures or be used for
external diagnostics. The primary measurement path also
measures VREG5, VREF2, and the internal temperature sensor. The
AD7284
SLAVE N
AD7284
V
REF2 measurement allows the host microcontroller to verify the
SLAVE 1
operation of the primary measurement path.
The secondary measurement path consists of a voltage input
multiplexer and a SAR ADC providing 10 bits of resolution.
The secondary analog voltage inputs, VSIN0 to VSIN8, allow
a second set of voltage measurements on the eight cells. The
secondary analog voltage inputs can connect with a second set of
external filtering components, or these inputs can connect
directly to VPIN0 to VPIN8 on the primary measurement path
to minimize the use of external components, if desired. The
secondary measurement path also measures VREG5 and VREF1. The
2-WIRE DAISY CHAIN
SPI
AD7284
HOST
MICROCONTROLLER
MASTER
–HV
VREF1 measurement allows the host microcontroller to verify the
Figure 19. Simplified System Diagram with Multiple AD7284 Devices
(Additional Circuitry Omitted for Clarity)
operation of the secondary measurement ADC.
The AD7284 also has a VDRIVE feature to control the voltage at
which the serial interface operates. VDRIVE allows the AD7284 to
interface to both the ±.± V and the 5 V processors.
In the event of communication loss, a watchdog timer places
the unresponsive devices in the chain into power-down mode.
Rev. A | Page 15 of 49
AD7284
Data Sheet
Converter Configurations
CONVERTER OPERATION
The two converters on the AD7284 are SAR ADCs. They are
composed of a comparator, SAR control logic, and two
capacitive digital-to-analog converters (DACs).
The primary and secondary conversion paths of the AD7284
each consist of an input multiplexer and a SAR ADC.
Multiplexer Configuration
Figure 22 shows a simplified schematic of the SAR ADC. During
the acquisition phase, the SW1, SW2, and SW± switches are
closed. The sampling capacitor array, CS, acquires the signal on
the input during this phase.
Each multiplexer selects a pair of analog inputs to convert:
VPIN0 to VPIN8 for the primary path and VSIN0 to VSIN8 for
the secondary path. The voltage of each individual cell is
measured by converting the difference between the adjacent
analog inputs, that is, VPIN1 − VPIN0, VPIN2 − VPIN1, and
so on (see Figure 20 and Figure 21).
CAPACITIVE
DAC
COMPARATOR
C
S
VxIN8
ADC V
ADC V
IN+
IN–
SW1
SW2
CONTROL
LOGIC
SW4
C
SW3
VxIN7
VxIN6
S
ADC V
ADC V
IN+
IN–
VxIN5
VxIN4
VxIN3
VxIN2
VxIN1
VxIN0
CAPACITIVE
DAC
NOTES
1. THE CONVERTER INPUTS ARE ADC V
AND ADC V
.
IN–
IN+
Figure 22. SAR ADC Configuration During the Acquisition Phase
When the ADC starts a conversion, SW1, SW2, and SW± open,
and SW4 closes, causing the comparator to become unbalanced
(see Figure 2±). The control logic and capacitive DACs add and
subtract fixed amounts of charge to return the comparator to a
balanced condition. When the comparator is rebalanced, the
conversion is complete. The control logic generates the ADC
output code. This output code is then stored in the appropriate
register for the converted input.
Figure 20. Multiplexer Configuration During VxIN8 to VxIN7 Sampling (Cell 8)
VxIN8
VxIN7
VxIN6
CAPACITIVE
DAC
ADC V
ADC V
IN+
IN–
COMPARATOR
C
S
ADC V
ADC V
VxIN5
VxIN4
VxIN3
VxIN2
VxIN1
VxIN0
IN+
IN–
SW1
SW2
CONTROL
LOGIC
SW4
SW3
C
S
CAPACITIVE
DAC
NOTES
1. THE CONVERTER INPUTS ARE ADC V
AND ADC V
.
IN–
IN+
Figure 23. SAR ADC Configuration During the Conversion Phase
Transfer Function
Figure 21. Multiplexer Configuration During VxIN7 to VxIN6 Sampling (Cell 7)
The conversion data readback for each voltage measurement
consists of 14 bits. The output coding of the AD7284 primary
measurement path is in 14-bit, straight binary format. The output
coding of the AD7284 secondary measurement path is in 10-bit,
straight binary format. The result is inverted so that it is easily
distinguished from the primary measurement and is preceded
by four data bits set to 0000.
Rev. A | Page 16 of 49
Data Sheet
AD7284
The LSB size is dependent on whether the primary measurement
path or the secondary measurement is used. The analog input
range of the voltage inputs is 0 V to 5 V. The designed code
transitions occur at successive integer LSB values (that is, 1 LSB,
2 LSBs, and so on). The ideal transfer characteristic is shown in
Figure 24.
AUXILIARY ADC INPUTS
The AD7284 provides four single-ended analog inputs to the
primary ADC, VPAUX1 to VPAUX4. The input voltage range is
0 V to 5 V with respect to VSS. These inputs can convert other
voltages within the system, such as converting the voltage
output of a thermistor temperature measurement circuit.
Table 7. LSB Size for the Analog Input Range
VOLTAGE REFERENCES
Measurement
Path
The AD7284 contains two identical 1.2 V band gap voltage
references. These references are internally buffered and gained
to provide 2.5 V reference voltages to the primary (VREF1) and
secondary (VREF2) ADCs, as shown in Figure 25.
Input Range Full-Scale Range1 LSB Size
Primary
Secondary
0 V to 5 V
0 V to 5 V
5 V/16,384
5 V/1,024
305 µV
4.88 mV
1 The 16,384 and 1,024 values in this column represent the number of codes
available for each ADC.
The provision of two reference voltages is a diagnostic feature
and enables validation of the behavior of the measurement
paths and the references. For example, the secondary ADC
measures the primary reference, VREF1. Similarly, the primary
111...111
111...110
ADC measures the secondary reference, VREF2
.
111...000
011...111
An external 2.5 V reference can overdrive the reference for the
primary path, VREF1. When an external reference is used, set
Bit D4 of Control Register 1 to disable the VREF1 buffer. The
secondary measurement path measures the external reference
in this case.
000...010
000...001
000...000
AGNDx + 1LSB
5V – 1LSB
ANALOG INPUT
The primary reference is further buffered and provided as a
reference output, VREFBUF, to bias external thermistors. This
buffer is capable of driving currents up to 1 mA, allowing the
user to connect up to four 10 kΩ thermistor circuits in parallel.
The primary conversion includes a measure of this voltage level.
Figure 24. Ideal Transfer Characteristic
INTERNAL TEMPERATURE SENSOR
The AD7284 contains an on-chip temperature sensor. The
temperature measurement updates with each conversion
request and is provided as part of each conversion frame.
Decouple the VREFBUF pin to ADCGND1 using a 1 μF capacitor.
Decouple the VREF1 pin to ADCGND1 using a 1 μF capacitor
with a 100 nF capacitor in parallel. Decouple the VREF2 pin to
ADCGND2 using a 1 μF capacitor with 100 nF capacitor in
parallel.
The temperature sensor measures the junction temperatures in
the −±0°C to +120°C range with a typical accuracy of ±±°C.
The output coding of the temperature sensor is twos complement,
with a resolution of ±2 LSB/°C. Code 0 corresponds to 25°C
(junction temperature).
Larger decoupling capacitors can be used to decouple VREF1 and
V
REF2; however, this results in the reference taking longer to
power up. The turn on settling time is typically 5 ms with the
recommended decoupling capacitor values.
REFERENCE BUFFER
V
REFBUF
+1
1µF
REFGND1
LOW
PRIMARY
ADC
ADCGND1
VOLTAGE
MULTIPLEXER
2.5V
EXTERNAL
2.5V
PRIMARY
BAND GAP
SW
V
REF1
REF2
V
REF
1.2V
100nF
ADCGND1
1µF
REFGND2
SECONDARY
2.5V
V
BAND GAP
1.2V
1µF
100nF
LOW
SECONDARY
ADC
VOLTAGE
MULTIPLEXER
ADCGND2
Figure 25. Internal References and Optional External Reference
Rev. A | Page 17 of 49
AD7284
Data Sheet
The analog voltage inputs must be filtered externally with a
CELL CONNECTIONS
single-ended low-pass filter approach. The resistors, RF, in
series with the VPIN0 to VPIN8 and VSIN0 to VSIN8 inputs
provide protection for the analog inputs in the event of an
overvoltage or undervoltage condition on those inputs (for
example, if any of the cell voltage inputs are incorrectly shorted
to VDD or VSS). The resistors also provide protection during the
initial connection of the daisy chain of AD7284 devices to the
battery stack. The CF capacitors, in conjunction with the RF
resistors, act as a low-pass filter. CF capacitor values between
100 nF and 1 µF are recommended. The cutoff frequency of the
low-pass filter when using an RF of 1 kΩ and a CF capacitor of
1 µF is 160 Hz. The cutoff frequency of the low-pass filter when
using a CF capacitor of 100 nF is 1600 Hz.
The AD7284 can monitor four to eight battery cells connected
in series.
Typical Eight Cell Configuration
Figure 26 shows the typical connections to the AD7284 supply
and cell monitoring inputs in an eight cell configuration.
R
VDD
TRANSIENT
PROTECTION
V
V
DD
C
DD
VDD
100nF
R
R
R
R
R
R
R
R
R
F
F
F
F
F
F
F
F
F
VPIN8
VPIN7
VPIN6
VPIN5
VPIN4
VPIN3
VPIN2
VPIN1
VPIN0
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
CELL 8
CELL 7
CELL 6
CELL 5
CELL 4
CELL 3
CELL 2
CELL 1
The time constant of the RF and CF filters on the primary and
secondary paths must match the time constant on the VDD pins
fairly closely (for example, 100 nF (CF) and 1 kΩ (RF) on the
inputs, and 4.7 µF (CVDD) and 20 Ω (RVDD) on VDD).
Connection to Fewer Voltage Cells
While the AD7284 provides eight input channels for battery cell
voltage measurement, it can also be used in applications that
require fewer than eight cell voltage measurements. When used
in this manner, ensure that the sum of the individual cell voltages
still exceeds the minimum VDD supply voltage (10 V).
The minimum number of cells connected to each AD7284 is
four. Figure 27 shows the recommended connections to
monitor four cells. The unused inputs are connected together
and connected between Cell 2 and Cell ± via a resistor. The
resistor minimizes the leakage from the unused inputs.
C
C
F
AD7284
R
F
VSIN8
VSIN7
VSIN6
VSIN5
VSIN4
VSIN3
VSIN2
F
C
C
C
C
F
Irrespective of how many cells are connected, the AD7284
acquires and converts all eight voltages. All conversion results
are available for readback; results of the unused voltage channels
are zero.
C
F
F
F
F
F
C
F
C
VPIN8
VSIN1
VSIN0
VPIN7
VPIN6
F
C
V
V
SS
VPIN5
SS
VPIN4
VPIN3
VPIN2
VPIN1
VPIN0
AD7284
Figure 26. Typical Cells and Supply Connections (Additional Circuitry
Omitted for Clarity)
A series resistor, RVDD (10 Ω to 40 Ω), is recommended from the
top of the battery into the VDD supply pins. The total decoupling
capacitors on the supply pins, CVDD, must be 4.7 µF.
Figure 27. Typical Connection with Minimum Cells Connected (Additional
Circuitry Omitted for Clarity)
Rev. A | Page 18 of 49
Data Sheet
AD7284
Connection of Unused Secondary Channel Inputs
The secondary path consists of 10 measurements available in
the following order:
In applications where the secondary path is not used, connect
the VSINx pins directly to the corresponding VPINx pins.
1. Cell Voltage 1 to Cell Voltage 8.
2. Primary path reference voltage.
By default, the two ADCs convert simultaneously. To minimize
the discharge of the CF capacitor during the acquisition phase,
enable the delay mode between conversions. The ADC delay
mode is controlled by Control Register ±, Bit 6.
±.
V
REG5 voltage scaled by 4/5.
To read back one measurement from the secondary path, all
10 measurements must be read back for each device (see the
Conversion Data Readback section).
Acquisition Time
The results are read back via the 4-wire SPI.
The time required to acquire an input signal depends on how
quickly the sampling capacitor is charged. This, in turn, depends
on the input impedance and any external components placed on
the analog inputs. The default acquisition time of the AD7284 on
initial power-up is 400 ns. To accommodate the use of alternative
input filter configurations, the acquisition time can be set to
400 ns, 800 ns, 1600 ns, or ±200 ns using Bits[D1:D0] in
Control Register 2 (see Table 22).
Internal Voltage Measurements
Table 8 and Table 9 show the range of the expected measured
reference values that are returned on each measurement cycle.
Detecting one of these values outside of the indicated range
indicates a fault condition.
Table 8. Primary Internal Voltage Measurement
Parameter
Min
Max
Unit
Register
0x12
0x13
0x1C
0x1D
Calculate the minimum acquisition time required, tACQ, by
VREF2
VREG5 × 2/3
VREFBUF
2.485
3.200
2.486
3.200
2.515
3.421
2.514
3.421
V
V
V
V
t
ACQ = 10 × ((RSOURCE + R) × C)
where:
SOURCE includes any extra source impedance on the analog
R
VREG5 × 2/3
input between the external capacitors and the input pins. It does
not include any extra source impedance, for example, the 1 kΩ
series resistors, which are between the battery cells and the
external capacitors.
R is the internal switch and path resistance, typically 620 Ω.
C is the sampling capacitance, typically 15 pF.
Table 9. Secondary Internal Voltage Measurement
Parameter
Min
Max
Unit
Register
VREF1
VREG5 × 4/5
2.475
3.865
2.525
4.135
V
V
0x31
0x34
ADC CONVERSIONS SEQUENCE
Upon completion of a conversion sequence, the primary and
secondary path measurements are available for read back. The
primary path measurements must be read first. Reading the
secondary path measurements is optional.
The primary path consists of 18 measurements available in the
following order:
1. Cell Voltage 1 to Cell Voltage 8.
2. Stack voltage scaled down by 16.
±. Secondary path reference voltage.
4.
V
REG5 voltage scaled by 2/±.
5. Primary Auxiliary Input 1 to Primary Auxiliary Input 4.
6. Reference buffer output voltage.
7. Repeated VREG5 voltage scaled by 2/±.
8. Internal temperature sensor.
All 18 measurements must be read back on each device as
described in the Conversion Data Readback section.
Rev. A | Page 19 of 49
AD7284
Data Sheet
Similarly, calculate the conversion time for eight cell voltages by
CONVERTING WITH A SINGLE AD7284
Conversion Time per Eight Primary Cells = (tACQ + tCONV) × 9
where the 9th conversion is the dummy conversion.
Conversions are initiated on the AD7284 by setting Bit D0 high
in the ADC functional control register. A single conversion
command initiates conversions on all channels of the AD7284.
The conversions on the primary measurement path and the
secondary measurement path occur in parallel, as shown in
Figure 28. As described in the Converter Operation section, the
voltage of each individual battery cell is measured by converting
the difference between the adjacent analog inputs. The first
conversion starts tSTART after the conversion start command.
This conversion is a dummy conversion that has the same
timing as a normal conversion and provides additional acquisition
time for the first cell conversion. The first cell converted is Cell 8
(VPIN8 − VPIN7), then Cell 7 (VPIN7 − VPIN6), and so on, as
shown in Figure 28.
The device conversion time includes the internal temperature
sensor channel, which requires a longer acquisition and conversion
time (typically 276 µs). Therefore, calculate the conversion time
per device by
Conversion Time per Device = tSTART + ((tACQ + tCONV) × 18) + 276 µs
where:
CS
to the dummy
t
START is the time between the rising edge of
conversion. See Table 2.
ACQ is the analog input acquisition time. See Table 2.
CONV is the conversion time. See Table 2.
Factor 18 is the one dummy conversion plus seventeen
measurements.
t
t
Calculate the conversion time per channel by
Conversion Time per Channel = tACQ + tCONV
With an acquisition time set to 400 ns, the conversion time per
device is typically ±±6 µs.
TO INITIATE A CONVERSION,
SET BIT D0 HIGH IN THE
ADCFUNC REGISTER
CS HELD HIGH
DURING ADC CONVERSIONS
CS
tACQ
tSTART
tCONV
INTERNAL PRIMARY
ADC CONVERSIONS
DUMMY
CONVERSION
INTERNAL TEMPERATURE
SENSOR
CELL 8
CELL7
CELL6
INTERNAL SECONDARY
ADC CONVERSIONS
DUMMY
CONVERSION
CELL 8
CELL7
LDO
Figure 28. ADC Conversions with a Single Device
Rev. A | Page 20 of 49
Data Sheet
AD7284
The latency across all cells is the delay between the start of
CONVERTING WITH A CHAIN OF AD7284 DEVICES
converting the first cell and the start of converting on the last
cell of a battery stack, as shown in Figure ±0. Calculate this
latency by
The AD7284 provides a daisy-chain interface that allows up
to ±0 AD7284 devices to stack. One feature of the daisy-chain
interface is the ability to initiate conversions on all devices in
the daisy-chain stack with a single convert start command. The
convert start command transfers up the daisy chain from the
master device to each AD7284 in turn. The delay time between
each AD7284 is tDELAY, as shown in Figure 29. Note that this
diagram is simplified to show the primary measurement path
only.
Latency Across All Cells = (Conversion Time of Seven Cells) +
((N − 1) × tDELAY
)
With an acquisition time set to 400 ns, the latency across 96 cells is
typically 1± µs.
Calculate the total conversion time for all channels by
Total Conversion Time = (Conversion Time per Device) +
((N − 1) × tDELAY
where:
N is the number of AD7284 devices in the daisy chain.
DELAY is the delay time when transferring the convert start
)
t
command between adjacent AD7284 devices, as specified in
Table 2.
TOTAL CONVERSION TIME = (CONVERSION TIME PER DEVICE) + ((N – 1) × tDELAY
)
INTERNAL ADC
DUMMY
INTERNAL TEMPERATURE
SENSOR
CONVERSIONS
PART 1
CONVERSION
INTERNAL ADC
CONVERSIONS
PART 2
DUMMY
CONVERSION
INTERNAL TEMPERATURE
SENSOR
INTERNAL ADC
CONVERSIONS
PART 3
INTERNAL TEMPERATURE
SENSOR
DUMMY
CONVERSION
Figure 29. ADC Conversions with a Chain of Three Devices
LATENCY ACROSS ALL CELLS =
(CONVERSION TIME OF SEVEN CELLS) + ((N – 1) ×tDELAY
)
INTERNAL ADC
CONVERSIONS
PART 1
DUMMY
CONVERSION
CELL 8
CELL 7
CELL 2
CELL 1
tDELAY
INTERNAL ADC
CONVERSIONS
PART 2
DUMMY
CONVERSION
CELL 16
CELL 15
CELL 10
CELL 9
(N – 2) × tDELAY
7 CONVERSIONS
CELL (N × 8) – 1
INTERNAL ADC
CONVERSIONS
PART N
DUMMY
CONVERSION
CELL (N × 8)
CELL (N × 8) – 6 CELL (N × 8) – 7
Figure 30. Latency Across All Cells
Rev. A | Page 21 of 49
AD7284
Data Sheet
Following a conversion, the primary conversion data for all
CONVERSION DATA READBACK
devices in the daisy chain is available for readback. To enable
secondary conversion data readback, a command is issued as
shown in Figure ±2. This is the only ±2-bit command that can
be issued while in 64-bit mode.
A sequence with ADC conversions and a readback operation is
shown in Figure ±1. The user issues a command to the device to
start the conversion. The conversion data is available for read
back when the channel acquisition and conversion times complete.
The data returned from a conversion results readback operation
is contained within multiple 64-bit packs, as described in the
Conversion Data Readback Operation section.
The sequence to read back primary and secondary data is
described in the Example 5: Convert and Read All Conversion
Data section.
TO INITIATE A NEW CONVERSION,
EXIT 64-BIT MODE USING BIT D2
OF THE ADC FUNCTIONAL CONTROL
REGISTER IN THE LAST FRAME
FOLLOWED BY THE
TO INITIATE A CONVERSION,
ISSUE A CONVERT START
COMMAND TO
ADC FUNCTIONAL CONTROL
REGISTER BIT D0
CS HELD HIGH
DURING
ADC CONVERSIONS
CS USED TO FRAME
DATA READBACK
FROM CHAIN
CONVERT START COMMAND
CS
tSTART
tSTART
INTERNAL ADC
CONVERSIONS
CELL CELL
CELL CELL
8
7
8
7
DUMMY
CONVERSION
DATA READBACK, ALL DEVICES
ALL PRIMARY*
SERIAL READ
OPERATION
DEVICE ENTERS 64-BIT INTERFACE MODE
*NOTE: ONLY PRIMARY READBACK SHOWN HERE
Figure 31. ADC Conversions and Readback of Primary Data and Initiation of a Second Conversion
TO INITIATE A CONVERSION,
ISSUE A CONVERT START
COMMAND TO ADC
FUNCTIONAL CONTROL
REGISTER BIT D0
TO READ BACK SECONDARY DATA,
CS USED TO FRAME
DATA READBACK
FROM CHAIN
ISSUE A COMMAND TO LOAD THE SECONDARY DATA HERE BY
SETTING BIT D1 OF THE ADC FUNCTIONAL CONTROL REGISTER
IN LAST 32-BIT WORD OF PRIMARY READBACK
CS HELD HIGH
DURING ADC CONVERSIONS
CS
tSTART
INTERNAL ADC
CONVERSIONS
CELL CELL
8
7
TO EXIT 64-BIT MODE, SET BIT D2 OF THE ADC
FUNCTIONAL CONTROL REGISTER IN LAST 32-BIT
WORD OF READBACK
DUMMY
CONVERSION
DATA READBACK, ALL DEVICES
SERIAL READ
OPERATION
ALL PRIMARY
ALL SECONDARY
DEVICE ENTERS 64-BIT INTERFACE MODE
Figure 32. ADC Conversions and Readback of Primary and Secondary Data and Exit of 64-Bit Readback Mode
Rev. A | Page 22 of 49
Data Sheet
AD7284
The simplified internal configuration of the cell balance circuit
(CB1 to CB5) is shown in Figure ±4.
CELL BALANCING OUTPUTS
The AD7284 provides eight cell balance outputs that can drive
the gates of the external transistors as part of a cell balancing
circuit. The cell balance feature can be used while converting
cell voltage measurements; however, the accuracy of the
conversions degrades. Cell balancing is also available while
the AD7284 is in partial power-down mode.
V
DD
AD7284
40µA
125nA
R
F
VPINx
C
F
SW2
SW1
10kΩ
CBx
Cell Balance Connections
CELL (x)
As shown in Figure ±±, five of the cell balance outputs (CB1
to CB5) are capable of driving an N channel, metal oxide
semiconductor field effect transistor (MOSFET), while the
other three (CB6 to CB8) drive a P channel MOSFET. These
outputs are designed to drive 20 μA (typical) into the external
FET, enabling turn on within 100 μs.
R
F
VPIN(x – 1)
C
F
5µA
SW3
V
SS
Figure 34. Simplified Internal Configuration of the
Cell Balancing Circuit (CB1 to CB5)
R
F
VPIN8
When cell balancing is disabled, SW1 is closed, SW2 and SW±
are open, the negative channel metal oxide semiconductor
(NMOS) switch is on, and the CBx pin is pulled to VPIN(x − 1).
When enabled, SW1 is open, SW2 and SW± are closed, the
NMOS switch is off, and the CBx voltage increases as current
charges the gate of an external FET. The internal clamp ensures
that CBx stays within approximately 5 V of VPIN(x − 1) and
provides a path for some of the 40 µA out of VPIN(x − 1),
which causes a voltage drop on VPIN(x − 1). The voltage drop
depends on the value of the input resistor. CB6 to CB8 use an
equivalent positive channel metal oxide semiconductor (PMOS)
circuit.
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
10kΩ
CELL 8
CELL 7
CELL 6
CELL 5
CELL 4
CELL 3
CELL 2
CELL 1
CB8
R
F
VPIN7
10kΩ
CB7
R
F
VPIN6
10kΩ
CB6
R
F
VPIN5
10kΩ
CB5
R
F
VPIN4
AD7284
10kΩ
Cell Balance Outputs Interface
CB4
R
F
Three bits are used to control the cell balancing feature:
VPIN3
•
The cell balance power-down bit, CBPDB, in Control
Register 1 (see Table 21) controls the cell balance output
drivers. The default value of this bit at power-up is 0, and
the drivers are disabled. Turn off the drivers when cell
balancing is not used to reduce power consumption and
maintain accuracy on cell monitoring.
10kΩ
CB3
R
F
VPIN2
10kΩ
CB2
R
F
VPIN1
10kΩ
•
The general output enable bit, GOE_CB, in Control
Register ± (see Table 24) allows the host microcontroller/
DSP to control the state of all cell balance outputs with one
write command while still maintaining the current state of
the cell balance control register. The default value of this
bit at power-up is 0, which corresponds to the cell balance
outputs off state.
CB1
R
F
VPIN0
Figure 33. Cell Balancing Configuration
In an application with two or more AD7284 devices in a directly
connected daisy chain, it is recommended to place 10 kΩ series
resistors between the CBx outputs of the AD7284 and the gates
of the external cell balancing transistors. These resistors, in
conjunction with the internal 5 V clamps, help protect the
CBx outputs and gates of the external cell balancing transistors
during the initial connection of the monitoring circuitry to the
battery stack.
•
The cell balance bits, CBx, in the cell balance control
register (see Table 26) allow the user to individually
configure the state of the cell balance output. The default
value of this register at power-up is 0x00, and each of the
cell balance outputs are disabled.
To enable cell balancing on one or multiple cells, the CBPDB bit,
the GOE_CB bit, and the corresponding CBx bit(s) must be set
to 1.
Rev. A | Page 23 of 49
AD7284
Data Sheet
Programmable On Time
Open Input Sense
To enable individual programmable on times, activate the
corresponding CBx output(s) as described in the Cell Balance
Outputs Interface section. Programming an on time for a
disabled CBx output has no effect.
The open input sense (OIS) technique allows the detection of an
open wire at the board edge or at the device input.
When enabled, the OIS diagnostics cause a small current to sink
(or source, in the case of VPIN0 and VSIN0) from the selected
primary or secondary voltage sense pin. A delay is also introduced
between the primary and secondary conversions. If an input
wire disconnects, the OIS current sources from or sinks into the
input filter capacitor, causing the input voltage to shift. This
shift is seen as a difference between the primary and secondary
measurements.
The AD7284 offers eight cell balance timer (CBTx) registers to
individually program the on time of the CBx output pins. On
times of 0 minutes (the output stays turned on) to 8.5 hours
can be programmed with a two minute resolution. All CBTx
registers are 0x00 by default. The values programmed in the
CBTx registers are compared with a single timer. The default
value of the timer is 0x00. The current value of the timer is
available in the current cell balance count state (CBCNT)
register.
The size of the voltage shift depends on the size of the input
filter capacitor, the delay between primary and secondary
measurements (1000 μs), and the OIS current (100 μA).
The timer starts from 0x00 when a CBTx register is written to.
When the value in the timer reaches the value of any of the
CBTx registers, the corresponding CBx output is switched off.
The timer stops when the largest value programmed in the
enabled CBTx registers is equal to the timer. CBTx registers
settings are maintained following a timeout event.
For a 100 nF filter capacitor, a shift of 500 mV is expected. If
the input pins are connected correctly, a voltage drop of
approximately 100 mV is measured between the primary
and secondary inputs when using a 1 kΩ input resistor, RF.
Cell Balance Sense
An alternative method is using the cell balance function.
This technique is useful for detecting board edge open wire
conditions. When enabled, a cell balance FET that is off for the
first conversion is switched on for the second conversion. If the
input wire disconnects, the enabled FET causes the input that
disconnected to pull toward the pin on the opposite side of the
enabled FET.
The timer restarts from 0x00 on a write to any of the active
CBTx registers. Writing zero causes the corresponding cell
balance output to switch off and the timer to restart. A write to
the CBCTRL register while the timer is active causes the timer
to restart from 0x00. The CBCNT register can adjust the values
of previously enabled cell balance timers. Individual or all CBx
output(s) can be switched off before the timer reaches its or
their programmed value(s) by disabling the CBx output(s) as
described in the Cell Balance Outputs Interface section.
Sequence of Operations
To perform an open wire diagnostic on an input, use the
following procedure:
The cell balance timer is independent of the power-down timer.
Use the power-down timer to allow cell balancing to occur for a
set time before powering down the AD7284.
1. Enable the OISx bit for the cell connection under investigation
using the OISCTRL control register and/or the OISGPOP
control register, or set the appropriate cell balance enable
bit in the cell balance control register.
2. In the Control ± register, select the appropriate input
sense function via the IN_SNSE bits, set the ADC delay
bit (ADCDLY), and select the conversion order with the
ADCORDR bit. If not in delay mode, the GOE_x bits gate
the respective cell balance or the OISCTRL register
settings.
Note that the power-down timer can be used instead of the
watchdog timer when using the cell balancing timer to prevent
the need to service the watchdog timer.
OPEN INPUT DETECTION
Two methods are available to detect an open wire condition
between the cell and an ADCs input pin: open input sense
and cell balance sense. These methods require the use of the
secondary path and independent filters on the ADC inputs.
±. Set the CBPDB bit in Control Register 1 for the cell balance
method.
4. Initiate a conversion and read back the primary and
secondary data.
The host controller initiates the diagnostic request. It then reads
back conversion results from primary and secondary inputs
from which it is possible to determine an open input condition.
Rev. A | Page 24 of 49
Data Sheet
AD7284
POWER MANAGEMENT
AD7284 SUPPLIES
MODES OF OPERATION
The AD7284 is powered from the cell stack. The device
connects to the cell stack positive terminal (+HV) through the
The three modes of operation for the AD7284 include the
following: active mode (power-up), software partial power-
down mode, and hardware full power-down mode.
V
V
DD pin and the cell stack negative terminal (−HV) through the
SS pin. An internal regulator generates a 5 V supply (VREG5) for
In active mode, the AD7284 can be idle or perform the
following tasks:
the internal core of the AD7284, as shown in Figure ±5.
+HV
•
•
•
•
ADC conversions.
Conversion data readback.
Register read and write.
Cell balancing (cell balancing and register reads or writes,
can also be performed in partial power-down mode).
BATTERY
PACK
V
V
AV
DV
V
DRIVE
DD
REG5
CC
CC
VPIN8
VPIN7
VPIN6
5V
REG
POWER-ON
RESET
ANALOG
The current consumption is specified in Table 1.
SERIAL
INTERFACE
DIGITAL
ACTIVE MODE, POWER-UP
VPIN2
VPIN1
Connect the VDRIVE pin on the AD7284 master device to an
external voltage supply. A rising edge on the VDRIVE supply
signals the AD7284 master device to power up. If VDRIVE is
already held high, an alternate method of powering up the
master is via a pulse of 100 ns minimum on the RESET pin.
AD7284
V
AGNDx* DGND
SS
VPIN0
–HV
*6 × ANALOG GROUND PINS
Figure 35. Power Supply Overview (External Circuitry Omitted for Clarity)
Power-Up Time
A total decoupling capacitance of 4.7 µF is recommended on the
The time required for an AD7284 master device to power up
and to receive SPI communications is typically 200 μs with a
total capacitance of ±00 nF on VREG5 (100 nF on each pin). The
time required to perform accurate ADC conversions is typically
5 ms. These figures apply when VREF1 and VREF2 are decoupled
with a 1 µF in parallel with 100 nF.
V
DD pins. Optionally, use 2.2 µF in parallel with 100 nF on each
of the VDD pins.
It is required that 100 nF be present on the regulator output pin,
V
REG5, and on each of the low voltage supplies, AVCC and DVCC.
Connect these three pins together on the PCB.
The AD7284 slave devices power up through a slave wake-up
signal that is automatically transmitted through the daisy chain.
The master device transmits the slave wake-up signal to the first
slave device, the first slave device transmits the wake-up signal
to the device above it in the daisy chain, and so on. Each device
transmits a slave wake-up signal typically within 100 μs of
receiving its own wake-up signal. The time required for a slave
device to power up and perform accurate ADC conversions is
typically 5 ms (see Figure ±6).
VDRIVE
For the master device only, an external VDRIVE supply is required
to power the digital input/output pins to ensure interface
compatibility with host supplies operating at ±.± V or 5 V.
Therefore, do not drive the digital input pins when VDRIVE is low.
VDRIVE is also an integral part of the power-up/power-down scheme
within the AD7284, as described in the Active Mode, Power-Up
section and the Power-Down section. Pulling VDRIVE low places
the AD7284 into the lowest power mode, unless an active
power-down timer is running.
Calculate the total power-up time for a chain of AD7284
devices connected in the direct current configuration by
A 100 nF decoupling capacitor is recommended on the VDRIVE
pin for the master device only.
Total Power-Up Time = 5 ms + ((N − 1) × 100 μs)
where N is the number of AD7284 devices in the daisy chain.
Connect the VDRIVE pin on each slave device to its own
On slave devices, connect VDRIVE directly to VREG5 at all times. In
this configuration, all currents supplied by the low voltage pins,
such as VREFBUF, GPOP1, and GPOP2, are supplied by the internal
regulator. This regulator delivers 2 mA typically for use external
to the AD7284.
V
REG5 pin.
Multiple dummy register writes are required to wake up the
chain in a configuration with an isolated daisy chain.
Rev. A | Page 25 of 49
AD7284
Data Sheet
ALL DEVICES IN DAISY CHAIN
IN POWERED DOWN STATE
POWER-DOWN
The following features are available to allow flexible power
savings on the AD7284:
BRING V
TO MASTER
DRIVE
USER
DEVICE HIGH
•
•
•
A software (partial) power-down option.
A hardware (full) power-down option.
A power-down timer that controls when the device enters
hardware power-down mode.
MASTER REGULATOR
POWERS UP
Software (Partial) Power-Down Mode
MASTER SENDS
WAKE UP SIGNAL TO SLAVE1
AFTER 100µs
During software (partial) power-down mode, cell balancing and
register reads or writes can be performed. The registers stay
configured and the primary reference and LDO stay powered up
to ensure accurate measurements can be performed immediately
after wake up. Additionally, the watchdog timer remains active,
as does the daisy chain so that communication is available to
wake up the device.
SLAVE1 REGULATOR
POWERS UP
SLAVE1 SENDS
WAKE UP SIGNAL TO SLAVE2
AFTER 100µs
DEVICE
Hardware (Full) Power-Down Mode
In hardware (full) power-down mode, the regulator powers off.
When placing the device into full power-down mode, all digital
inputs on the AD7284 master device must return to 0 V within a
similar timescale to VDRIVE going low.
SLAVE(x) REGULATOR
POWERS UP
SLAVE(x) SENDS
WAKE UP SIGNAL TO SLAVE(x + 1)
AFTER 100µs
Power-Down Timer
The power-down timer register allows the user to configure a
set time after which the AD7284 enters hardware power-down
mode.
ALL DEVICES IN THE SYSTEM
ARE POWERED UP
DEVICES READY TO CONVERT IN:
TIME = 5ms + ((N – 1) × 100µs)
The power-down timer can be set to 0 hours to 8.5 hours, with
a resolution of two minutes, and the user can read back the
current value of the power-down timer by reading the power-
down counter register. The power-down timer starts to count
up when the HWPD bit in Control Register 1 is set (and if the
power-down timer register is not equal to 0x00). If the power-
down timer register is written to after the counter starts, the
counter is reset and then restarts automatically, counting to
the new value in the power-down timer register. When the
timer reaches the value in the power-down counter register,
the device enters power-down mode after checking for the
following conditions:
WHERE N = NUMBER OF DEVICES IN CHAIN
Figure 36. Power-Up Flowchart for a Direct Coupled Daisy Chain
RESET
An optional RESET input can reset the AD7284, which is an
active high input and is provided primarily for use in resetting
the master device. Resetting the master device reverts it to the
default state on power-up. The hardware reset signal is not
physically communicated to the slave devices. A software reset
command to the slave devices is required to implement a full
chain reset. Note that a software reset does not reset the device
identification.
•
•
For a master device, VDRIVE must be low.
For a slave device, the HWPD bit in Control Register 1
must be set.
The RESET pin of a master device can wake up a chain of
devices, as described in the Active Mode, Power-Up section.
For debug purposes, assert the RESET pin on an individual
slave device to reset that device. Appropriate isolation is
required.
See the Power-Down Entry Sequences section for more details.
The default value of the power-down timer register at power-up
and reset is 0x00, or there is no timer delay.
Rev. A | Page 26 of 49
Data Sheet
AD7284
Power-Down Entry Sequences
To power down a chain of devices without using a timer, use the
following procedure:
Enter power-down by using two methods: controlling the
watchdog timer as described in the Watchdog Timer section,
or by configuring the HWPD bit in Control Register 1 and the
power-down timer, as described in this section.
1. Set Bit D2 of Control Register 1 to 1 on all devices to select
a hardware power-down.
2. Pull VDRIVE low on the master device.
Depending on whether the device is configured as a master or a
slave, there are two methods for enabling the full power-down
mode:
To power down a chain of devices using the power-down timer,
use the following procedure:
1. Write to the power-down timer (PDT) register on all
devices to set a power-down timer value.
2. Set Bit D2 of Control Register 1 to 1 on all devices to select
a hardware power-down, which activates the power-down
timer.
•
A slave device is set to full power-down mode by
configuring the power-down timer first (optional) and
setting Bit D2 of Control Register 1, HWPD.
•
A master device is set to full power-down mode by pulling
the VDRIVE pin low. Delay entry into full power-down mode
by using the power-down timer and the HWPD bit. The
master device enters full power-down mode immediately
after VDRIVE is pulled low if the timer value is 0. With the
±. Pull VDRIVE low on the master device.
All devices power down on the expiration of the power-down
timer.
If VDRIVE is not low when the power-down timer expires, set the
HWPD bit of the master to 0 or reset the master device. The
slave devices continue to power down following power-down
timeout, as long as the HWPD bit is set high.
V
DRIVE pin held high, the HWPD bit only controls the start
of the power-down timer.
Powering Down a Chain of Devices
Figure ±7 shows a sequence to fully power down a chain of devices.
ALL DEVICES IN DAISY CHAIN
IN POWERED UP STATE
WRITE TO POWER-DOWN TIMER
REGISTER ON ALL DEVICES TO SET
POWER-DOWN TIMER VALUE
(OPTIONAL)
USER
SET HWPD BIT ON EACH
DEVICE IN CHAIN
HOLD V
LOW ON
DRIVE
MASTER DEVICE
NO
POWER-DOWN
TIMER EXPIRED?
DEVICE
YES
DEVICES POWER DOWN—FULL POWER-DOWN MODE
Figure 37. Entry in Full Power-Down Mode
Rev. A | Page 27 of 49
AD7284
Data Sheet
WATCHDOG TIMER
The watchdog timer (WDT) register allows the user to
configure a set time after which the AD7284 is automatically
powered down if communication to the device is lost.
The sequence to disable the watchdog timer involves three
consecutive register write operations:
1. Write 0x00 to the watchdog timer register.
2. Write 0x5A to the watchdog key register.
±. Write 0x00 again to the watchdog timer register.
The AD7284 allows the user to set the watchdog timer to a
maximum value of 1040 ms and with a resolution of 8.192 ms.
Service the watchdog timer by regularly writing a timeout value
to the watchdog timer register before it expires to restart the
timer and prevent the device from powering down.
Any intermediate SPI command resets the process of
disabling the watchdog timer, reducing the risk of disabling
it unintentionally. See the Example ±: Disabling the Watchdog
Timer section for more details.
At power-up, the watchdog timer is enabled with a default value
of 0x0C (98.±04 ms).
If the watchdog timer is enabled and the device is placed in
partial power-down mode, the device enters full power-down
mode, unless a nonzero value is written to the watchdog timer
register before the watchdog timer times out.
Disabling the watchdog timer may be required for a long cell
balancing period, where the cell balancing timer and power-
down timer are used. In this scenario, enable the power-down
timer before disabling the watchdog timer.
If the watchdog timer times out, the device (or the chain of
devices) enters full power-down mode. The master stays in this
mode until either VDRIVE or RESET are toggled.
Rev. A | Page 28 of 49
Data Sheet
AD7284
SERIAL PERIPHERAL INTERFACE (SPI)
The AD7284 SPI is Mode 1 SPI compatible, that is, the clock
polarity (CPOL) is 0, and the clock phase (CPHA) is 1. The
Device Address
The device address is a 5-bit address that allows each individual
AD7284 in the battery monitoring stack to be uniquely identified.
A maximum of ±0 devices can be supported in one chain. On
initial power-up, each AD7284 is configured with a default
address of 0x00. A simple sequence of commands allows each
AD7284 to recognize its unique device address in the stack (see
the Example 1: Initialize All Devices in a Daisy Chain section).
This device address can then be locked to the AD7284 and is
used in subsequent read and write commands. A unique device
address of 0x1F is used to address all devices in the stack.
CS
interface consists of four signals: , SCLK, SDI, and SDO, as
shown in Figure ±. The SDI line transfers data into the on-chip
registers, and the SDO line reads the on-chip registers and
conversion result registers. SCLK is the serial clock input for the
device, and all data transfers, either on SDI or on SDO, take
place with respect to SCLK. Data clocks into the AD7284 on the
SCLK falling edge, and data clocks out of the AD7284 on the
CS
SCLK rising edge. The
transferred to or from the device. The register data and the
CS
input frames the serial data being
ADC conversion readback data can be framed by
in ±2-bit
Register Address
or 16-bit SCLK bursts, allowing the greatest flexibility for
connecting to processors.
As shown in Table 10, D25 to D20 form a 6-bit register address.
Register addresses can be found in Table 14.
All register reads and writes are configured as ±2 bits of data,
while all conversion results are configured as 64-bits words.
Write and Write/Read
As shown in Table 10, Bit D26 controls the data transfer mode
on the daisy chain, unidirectional (write) or bidirectional
(write/read) communication.
The AD7284 powers up in ±2-bit mode and automatically enters
64-bit mode when conversions initiate. The device remains in
64-bit mode until returned to ±2-bit mode by writing 0x04 to
the ADC functional control register. Conversion data cannot be
reread from the AD7284; if an attempt is made to reread data, it
reads as 0. The life counter value is identical to the previous
read because it increments between conversion sets.
With D26 high, the next communication in the chain is
unidirectional, and the master transmits the SPI command to
the slaves up the chain. D26 is typically high for register write
operations. The maximum SCLK frequency is 725 kHz when
the daisy chain operates in unidirectional mode.
REGISTER WRITE AND REGISTER READ OPERATIONS
With D26 low, the next communication in the chain is
bidirectional. The master transmits the SPI command to the
slaves and then switches to receive mode, expecting data back
from the slaves. The slaves start in receive mode and switch to
transmit mode after reception of the command.
Up to ±0 AD7284 devices can be daisy-chained together to allow
monitoring up to 240 individual Li-Ion cell voltages. The
AD7284 SPI interface, in combination with the daisy-chain
interface, allows any register in the ±0 AD7284 stack to be
updated using one ±2-bit write command.
A minimum delay of 50 µs is required prior to switching from
bidirectional to unidirectional mode (not applicable for the
master only setup). The maximum SCLK frequency is 500 kHz
when the daisy chain operates in bidirectional mode.
All register write and read operations are performed via the SPI
using a ±2-bit data packet. The format of the ±2-bit data packet
is described in Table 10.
Each register access must include a device address and a register
address, in addition to the data to be written. The AD7284 also
requires a 12-bit cyclic redundancy check (CRC) to be included
in each ±2-bit write command.
Examples of register read and register write operations can be
found in the Examples of Interfacing with the AD7284 section.
Register Data
As shown in Table 10, the register data field (Bits[D19:D12])
contains the data to be written into the register during a register
write operation. All AD7284 registers are 8 bits wide and are
listed in Table 14 in the Register Map section.
Register Read Operation
To read back a register from a chain of AD7284 devices, write
the address of the desired register to be read back to the read
register (Register 0x±F).
12-Bit CRC
Follow this with null frames (0x00000000) for each device in
the daisy chain. For example, eight null frames for an eight
device chain. Each of these frame returns the register content of
each device, starting with the master. See the Examples of
Interfacing with the AD7284 section for more details.
The AD7284 includes a 12-bit CRC with a Hamming distance of
six on all write commands to either individual devices or to a chain
of devices. An AD7284 that receives an invalid CRC in the write
command does not execute the command. The CRC on the write
command is calculated based on Bits[D±1:D12] of the write
command, which includes the device address, the register address,
and the register data. The CRC polynomial ((0xB41) in Koopman’s
notation) used when writing to or reading from the AD7284 is
It is not possible to read one register from one device in the
chain, that register in all devices in the chain must be read.
x
12 + x10 + x9 + x7 + x1 + 1
Rev. A | Page 29 of 49
AD7284
Data Sheet
Channel Addresses
CONVERSION DATA READBACK OPERATION
The channel address allows individual measurement results to
be uniquely identified. Each channel address is six bits wide and
two channel addresses are contained within each 64-bit read
cycle. The address for each channel is detailed in the register
map for the AD7284 (see Table 14).
The data returned from a conversion result read operation is
contained within a 64-bit packet. The data returned includes
the device address, the channel addresses, a life counter, and a
16-bit CRC, in addition to the two conversions results, which
are each 14 bits. The 64-bit read conversion result packet is
shown in Table 11.
Life Counter
When reading back conversion data from a daisy chain of
AD7284 devices, the conversion data is first read from the
primary measurement path on the master device, followed by
the primary measurement path from the first slave device, and
so on. When all the conversion data is returned for the primary
measurements, the device can then be configured to read back
the secondary measurement data.
As shown in see Table 14, the life counter is a ±-bit counter that
increments every time a successful sequence of conversions is
completed. After the counter reaches 7, it wraps around and
starts counting again from 0. This feature allows the detection
of a conversion sequence that is not complete. The life counter
is cleared on a software reset or hardware power-down.
Conversion Data
When reading conversion results from a chain of 12 devices
monitoring 96 cells, the readback time is of the region of 9.5 ms
when using the higher SCLK rate of 725 kHz (tSCLK = 1.±8 μs).
For 12 devices, the total number of primary conversions is,
As shown in see Table 14, the conversion data readback consists
of 14 bits. When reading back a conversion result from the
primary measurement path, the 14-bit conversion result is
included. When reading back a conversion result from the
secondary measurement path, an inverted 10-bit conversion
result plus 4 MSB data bits set to 0 make up the 14-bit data
value returned.
12 × 18 = 216
Two conversion sets are packed into a 64-bit frame; therefore,
the number of bits transferred is
Device Address
216 ÷ 2 × 64 = 6912
The device address is described in the Register Write and
Register Read section.
The transfer time is the number of bits transferred multiplied by
the bit period defined by SCLK, 6912 Bits × tSCLK = 9.5 ms.
16-Bit CRC
Within a single device, the device converts all 18 primary and
10 secondary channels. All 18 primary conversions must be
read back, which may be followed by optional read back of all
10 secondary conversions as required.
The AD7284 includes a 16-bit CRC with a Hamming distance
of six within the 64-bit pack and is calculated based on
Bits[D6±:D16] of the read conversion result cycle. The CRC
calculations include Channel Address 1, the life counter,
Channel Address 2, Conversion Data 1, the device address,
and Conversion Data 2. The CRC polynomial ((0xC86C) in
Koopman’s notation) used when reading conversion data from
the AD7284 is
See the Example 5: Convert and Read All Conversion Data
section for more details. The 64-bit conversion data packets
can be read back in 4 × 16-bit or 2 × ±2-bit frames.
x
16 + x15 + x12 + x7 + x6 + x4 + x3 + 1
Table 10. 32-Bit Register Write/Read Operations
Device Address
D31 to D27
5 bits
Write and Write/Read
Register Address
D25 to D20
6 bits
Register Data
D19 to D12
8 bits
CRC
D26
1 bit
D11 to D0
12 bits
Table 11. 64-Bit Read Conversion Result Packet
Channel Address 1
D63 to D58
6 bits
Life Counter Channel Address 2
Conversion Data 1
D48 to D35
14 bits
Device Address Conversion Data 2
CRC
D57 to D55
3 bits
D54 to D49
6 bits
D34 to D30
5 bits
D29 to D16
14 bits
D15 to D0
16 bits
Rev. A | Page 30 of 49
Data Sheet
AD7284
16-Bit CRC
CRC PSEUDOCODE EXAMPLES
To calculate the CRC value from the preceding 48 bits of data,
use the following pseudocode:
The following pseudocode examples show how to calculate the
CRC for two types of data packets.
for (i=63; i>=16; i--)
{
The following variables must first be declared:
•
•
•
i is an integer variable.
shft[xx] are an integer variables.
data_in represents the data bits that the CRC is calculated
on (Bits[D±1:D12]). This data supplies the input to the first
XOR gate.
xor_0 = data_in[i] ^ shft[15] ;
shft[15] = shft[14] ^ xor_0;
shft[14] = shft[13];
shft[13] = shft[12];
shft[12] = shft[11] ^ xor_0;
shft[11] = shft[10];
shft[10] = shft[9];
shft[9] = shft[8];
•
xor_0 is an integer variables. The outputs of the shift
registers start at the leftmost shift register in the circuit
implementation. With the exception of data_in, initialize
all variables to 0.
shft[8] = shft[7];
shft[7] = shft[6] ^ xor_0;
shft[6] = shft[5] ^ xor_0;
shft[5] = shft[4];
shft[4] = shft[3] ^ xor_0;
shft[3] = shft[2] ^ xor_0;
shft[2] = shft[1];
12-Bit CRC
To calculate the CRC value from the preceding 20 bits of data,
use the following pseudocode, where sfht[n] corresponds to
CRC_x in Figure ±8 and Figure ±9:
shft[1] = shft[0];
shft[0] = xor_0;
for (i=31; i>=12; i--)
{
}
xor_0 = data_in[i] ^ shft[11];
shft[11] = shft[10];
shft[10] = shft[9] ^ xor_0;
shft[9] = shft[8] ^ xor_0;
shft[8] = shft[7];
shft[7] = shft[6] ^ xor_0;
shft[6] = shft[5];
shft[5] = shft[4];
shft[4] = shft[3];
shft[3] = shft[2];
shft[2] = shft[1];
shft[1] = shft[0] ^ xor_0;
shft[0] = xor_0;
crc16calc = shft;
}
crc12calc = shft;
CRC_1
CRC_2
CRC_3
CRC_4
CRC_5
CRC_7
CRC_10
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D Q
DATA_IN
SCLK
CRC_0
CRC_6
CRC_8
CRC_9
Figure 38. 12-Bit CRC Implementation
CRC_0
CRC_1
CRC_4
CRC_7
CRC_8
CRC_9
CRC_10
CRC_12
CRC_13
CRC_15
D Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
DATA_IN
SCLK
CRC_2
CRC_3
CRC_5
CRC_6
CRC_11
CRC_14
Figure 39. 16-Bit CRC Implementation
Rev. A | Page 31 of 49
AD7284
Data Sheet
DAISY-CHAIN INTERFACE
TO D_DWN/D_DWN OF NEXT SLAVE DEVICE
To minimize isolation requirements and simplify the interface
between the host processor and each battery monitoring device,
the master AD7284 device is the only communication port to
the host processor. All slave devices interface via the master
device using a 2-wire daisy-chain interface.
AD7284
SLAVE N + 1
V
V
Each AD7284 device is powered from the top and bottom
terminals of the cell pack. The supply voltage of each device is
offset from the adjacent device in the chain by as much as 40 V.
SS
SS
TO BATTERY
10kΩ
50Ω
50Ω
50Ω
1µF
The AD7284 daisy-chain interface is a fully differential, 2-wire,
half-duplex interface enabling minimal interconnects and
robust communication between devices in a chain.
BOARD TO BOARD
CONNECTION
DAISY-CHAIN PHYSICAL INTERFACE
50Ω
1µF
The daisy-chain interface consists of a differential daisy chain
D_UP
D_DWN
).
TO BATTERY
TO BATTERY
for up paths (D_UP/ ) and down paths (D_DWN/
V
V
DD
DD
When multiple devices are configured in a chain, the up paths
from the master are connected to the down paths of the
adjacent slave. Similarly, the up paths on the other side of the
slave device interfaces to the down path of the next adjacent
slave device, and so on, as shown in Figure 40.
AD7284
SLAVE N
V
V
SS
SS
10kΩ
50Ω
50Ω
1µF
The internal common-mode amplifier provides a CCM voltage of
typically 2 V above the VSS rail, which biases the daisy-chain
paths. The CCM pin requires a 1 µF capacitor to VSS.
ON-BOARD
CONNECTION
10Ω
TO BATTERY
When communicating between devices located on the same
board, the daisy chain requires a single pair of external
termination resistors (50 Ω) connected to the CCM pin.
V
V
DD
DD
AD7284
MASTER
When interfacing between devices across boards, pairs of 50 Ω
terminations are required on each sides of the daisy chain. A
low value capacitor (≤100 nF) is required from the termination
center point to the VDD rail.
V
V
SS
SS
TO BATTERY
Figure 40. AD7284 Daisy-Chain Interconnection Examples
(Additional Circuitry Omitted for Clarity)
Additional protection circuitry beyond what is shown in Figure 40
may be required on the daisy-chain pins for hot plug and service
disconnect (see the Hot Plug section and the Service
Disconnect section).
DAISY-CHAIN DEBUG MODE
The AD7284 incorporates a debug feature using the two GPOPx
pins (GPOP1 and GPOP2) that allow the user to monitor the
daisy-chain communications between devices. The daisy chain
is a current-based interface. The debug feature translates the
daisy-chain communications into a single-ended voltage
relative to the logic levels of the corresponding device.
An alternative approach is using a transformer to provide
isolation, as described in the Transformer Configuration
section.
DAISY-CHAIN PROTOCOL
Configuration of the debug feature involves setting Bit D0
(GPOP SEL) of the OISGPOP control register (see Table 28) to
enable the feature.
The daisy chain uses a proprietary protocol with a preamble or
start condition, a Manchester encoded data packet, including a
CRC and a stop condition. The data bit rate is ±.125 Mbps typical.
Table 12. Daisy-Chain Debug Configuration
The daisy-chain interface operates in unidirectional mode for
register write and conversion data readback operation, or in
bidirectional mode for register read operation.
Device GPOP1
GPOP2
Master Commands transmitted to
device above
Data received from
device above
Slave
Commands received from
device below
Data received from
device above
Rev. A | Page 32 of 49
Data Sheet
AD7284
REGISTER MAP
Page Register
PAGE ADDRESSING
To access a particular page, first write the relevant page number
to the page register (Register 0x±E); this gives access to the
registers contained within that page. To access further registers
from the currently selected page, it is not necessary to rewrite
the page selection.
The AD7284 uses page addressing to maximize register
addressing space. Page 0 is the default page on power-on.
Page 0 initiates a conversion and accesses primary or secondary
ADC data. Page 1 contains all the configuration and diagnostic
register space, see Table 14.
Table 13. Page Register (Register 0x3E)
Throughout the register map, there is reserved register address
space. This space does not provide any user functions; it is
reserved space to support future software compatibility.
Bits
Name
Description
[D7:D2] Not applicable Reserved
[D1:D0] Page
00: Page 0
01: Page 1
Table 14. Register Map
Page Number
Address
Register Description
Null frame
Register Name1 Data Bits1
Access1
Power-On Default/Reset1
N/A
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x00
N/A
N/A
N/A
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09 to 0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18 to 0x1B
0x1C
0x1D
0x1E
0x1F to 0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29 to 0x30
0x31
0x32 to 0x33
0x34
0x35 to 0x3C
0x3D
0x3E
Primary Cell Voltage 1
Primary Cell Voltage 2
Primary Cell Voltage 3
Primary Cell Voltage 4
Primary Cell Voltage 5
Primary Cell Voltage 6
Primary Cell Voltage 7
Primary Cell Voltage 8
Reserved
Stack voltage
VREF2 voltage
VREG5 Voltage 1
Primary Auxiliary ADC 1
Primary Auxiliary ADC 2
Primary Auxiliary ADC 3
Primary Auxiliary ADC 4
Reserved
Reference buffer
VREG5 Voltage 2
Temperature sensor
Reserved
Secondary Cell Voltage 1 VSIN1
Secondary Cell Voltage 2 VSIN2
Secondary Cell Voltage 3 VSIN3
Secondary Cell Voltage 4 VSIN4
Secondary Cell Voltage 5 VSIN5
Secondary Cell Voltage 6 VSIN6
Secondary Cell Voltage 7 VSIN7
Secondary Cell Voltage 8 VSIN8
Reserved
VREF1 voltage
Reserved
VREG5 Voltage 3
Reserved
ADC functional control
Page register
Read register
VPIN1
VPIN2
VPIN3
VPIN4
VPIN5
VPIN6
VPIN7
VPIN8
N/A
D13 to D0
D13 to D0
D13 to D0
D13 to D0
D13 to D0
D13 to D0
D13 to D0
D13 to D0
N/A
D13 to D0
D13 to D0
D13 to D0
D13 to D0
D13 to D0
D13 to D0
D13 to D0
N/A
D13 to D0
D13 to D0
D13 to D0
N/A
D9 to D0
D9 to D0
D9 to D0
D9 to D0
D9 to D0
D9 to D0
D9 to D0
D9 to D0
N/A
Read
Read
Read
Read
Read
Read
Read
Read
Reserved
Read
Read
Read
Read
Read
Read
Read
Reserved
Read
Read
Read
Reserved
Read
Read
Read
Read
Read
Read
Read
Read
Reserved
Read
Reserved
Read
Reserved
Write/read
Write/read
Write/read
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x000
0x000
0x000
0x000
0x000
0x000
0x000
0x000
0x000
0x000
0x000
0x000
0x000
0x00
0x00
0xFF
VSTK
VREF2
VREG5_1
AUXP1
AUXP2
AUXP3
AUXP4
N/A
REFBUF
VREG5_2
TMPSNR
N/A
N/A
VREF1
N/A
VREG5_3
N/A
ADCFUNC
Page
RDREG
D9 to D0
N/A
D9 to D0
N/A
D7 to D0
D7 to D0
D7 to D0
0x3F
Rev. A | Page 33 of 49
AD7284
Data Sheet
Page Number
Address
0x00
0x01
Register Description
Null frame
Fault register
Current cell balance
count state
Register Name1 Data Bits1
Access1
N/A
Read
Read
Power-On Default/Reset1
1
1
1
N/A
N/A
N/A
0xFF
0x00
Fault
CBCNT
D7 to D0
D7 to D0
0x02
1
1
0x03
0x04
Current power-down
count state
Current watchdog count WDCNT
state
PDCNT
D7 to D0
D7 to D0
Read
Read
0x00
0x00
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0x05 to 0x06
0x07
0x08
0x09
0x0A
Reserved
N/A
N/A
Reserved
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x0C
0x00
0x00
0x00
0x00
0x00
0xFF
Control Register 1
Control Register 2
Control Register 3
Control Register 4
Cell balance control
CTRL1
CTRL2
CTRL3
CTRL4
CBCTRL
N/A
OISCTRL
OISGPOP
PDT
CBT1
CBT2
CBT3
CBT4
CBT5
CBT6
CBT7
CBT8
N/A
WDT
WDKY
STRG1
STRG2
N/A
D7 to D0
D7 to D0
D7 to D0
D7 to D0
D7 to D0
N/A
D7 to D0
D7 to D0
D7 to D0
D7 to D0
D7 to D0
D7 to D0
D7 to D0
D7 to D0
D7 to D0
D7 to D0
D7 to D0
N/A
Write/read
Write/read
Write/read
Write/read
Write/read
Reserved
Write/read
Write/read
Write/read
Write/read
Write/read
Write/read
Write/read
Write/read
Write/read
Write/read
Write/read
Reserved
0x0B
0x0C to 0x0D Reserved
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19 to 0x20
0x21
0x22
0x23
0x24
OIS control
OIS GPOPx control
Power-down timer
CB Timer 1
CB Timer 2
CB Timer 3
CB Timer 4
CB Timer 5
CB Timer 6
CB Timer 7
CB Timer 8
Reserved
Watchdog timer
Watchdog key
Storage Register 1
Storage Register 2
Reserved
D6 to D0
D7 to D0
D7 to D0
D7 to D0
N/A
Write/read
Write/read
Write/read
Write/read
Reserved
0x25 to 0x3D
0x3E
0x3F
Page register
Read register
Page
RDREG
D7 to D0
D7 to D0
Write/read
Write/read
1 N/A means not applicable.
Rev. A | Page 34 of 49
Data Sheet
AD7284
Table 15 shows examples of output codes and corresponding
junction temperature.
PAGE 0 ADDRESSES
Primary Path Conversion Results Registers
Page 0 contains the 18 registers, as follows, for the primary path:
Table 15. Internal Temperature Sensor Output Codes Examples
Junction Temperature (°C)
Binary Output Code
11 1001 0010 0000
11 1100 1110 0000
11 1111 1111 1111
00 0000 0000 0000
00 0000 0000 0001
00 1011 1110 0000
•
•
•
•
The cell voltage registers (VPIN1 to VPIN8) store the
conversion result from each cell input to the primary
measurement path.
The stack voltage register (VSTK) stores the conversion
result from the battery stack input to the primary
measurement path.
The VREF2 voltage register (VREF2) stores the conversion
result of the secondary reference input to the primary
measurement path.
The VREG5 Voltage 1 register (VREG5_1) stores the conversion
result of the regulated LDO voltage input to the primary
measurement path through an odd multiplexer channel. A
scaling factor of 2/± is applied to the conversion result.
The auxiliary ADC registers (AUXP1 to AUXP4) store the
conversion result of each auxiliary ADC input to the
primary measurement path.
−30
0
+24.96875
+25
+25.03125
+120
Secondary Path Conversion Results Registers
Page 0 contains the 10 registers for the secondary path, as follows:
•
•
•
The cell voltage registers (VSIN1 to VSIN8) store the
conversion result from each cell input to the secondary
measurement path.
The VREF1 voltage register (VREF1) stores the conversion
result of the primary reference input to the secondary
measurement path.
The LDO Voltage ± register (VREG5_±) stores the conversion
result of the regulated LDO voltage input to the secondary
measurement path through an even multiplexer channel. A
scaling factor of 4/5 is applied to the conversion result.
•
•
The reference buffer register (REFBUF) stores the
conversion result of the thermistor buffer voltage VREFBUF
supply, which can be used for the external thermistor
circuitry.
•
•
The VREG5 Voltage 2 register (VREG5_2) stores the conversion
result of the regulated LDO voltage input to the primary
measurement path through an even multiplexer channel. A
scaling factor of 2/± is applied to the conversion result.
The temperature sensor register (TMPSNR) stores the
conversion result of the internal temperature sensor input
to the primary measurement path.
The conversion results are inverted and in 10-bit straight binary
format with four leading zeros.
ADC Functional Control Register
The ADC functional control (ADCFUNC) register allows
initiation of a conversion sequence and selection of primary or
secondary data.
The conversion results are in 14-bit straight binary format,
except for the conversion result of the temperature sensor,
which is in 14-bit, twos complement format.
Table 16. ADCFUNC Register Settings (Register 0x3D)
Bits
Name
Description
[D7:D3] Reserved Reserved, set to 0.
Code 0 of the temperature sensor corresponds to 25°C with
±2 LSB/°C of resolution.
D2
D1
D0
EXIT64
SPIRLD
CONVST
Set to 1 to exit 64-bit data packet mode.
Set to 1 to load the secondary ADC results.
Trigger convert start; set to 1 to initiate
the trigger convert start.
Rev. A | Page 35 of 49
AD7284
Data Sheet
Current Watchdog Count State Register
PAGE 1 ADDRESSES
The current watchdog count state (WDCNT) register stores the
current running value of the watchdog timer counter.
Fault Register
The fault register (fault) allows the user to read the stored
operational fault flags. The fault register is updated at the end of
every conversion sequence. The fault register is reset to 0x00
after the user reads back from it. The default value of the fault
register on power-up is 0xFF.
Table 20. WDCNT Register Settings (Register 0x04)
Bits
Name
Description
D7
Not applicable Reserved.
[D6:D0] WDCOUNT
LSB = 8.192 ms. This register contains
a value between 0x00 and 0x7F. The
maximum value is 1040.384 ms.
Table 17. Fault Register Settings (Register 0x01)
Bits Name
Description
D7
D6
D5
PORFLAG
Power-on reset flag. Set to 1 to indicate that
a power-on reset (POR) has occurred.
Control Register 1
Control Register 1 (CTRL1) gives the user control of the
various power-down features of the AD7284, the software reset
functionality, and over the primary reference to allow it to be
overdriven by an external source.
WDFAULT
Watchdog power-down fault. Set to 1 when
the watchdog timer times out.
LDOFAULT Set to 1 if the internal LDO supply is out of
range, typically <4.8 V or >5.2 V.
D4
D3
Reserved
FUSECRC
Reserved, set to 0.
Table 21. CTRL1 Register Settings (Register 0x07)
Set to 1 when the fuse CRC does not match
the programmed fuse CRC value.
Bits
Name
Description
[D7:D5] Reserved
Reserved, set to 0.
D2
CCMFAULT Set to 1 when the voltage on the CCM pin
exceeds the overvoltage threshold that is
set to 2.5 V typically. Also, set this bit to 1
when the voltage on the CCM pin exceeds the
undervoltage threshold that is set to 1.5 V
typically.
D4
PREF
Primary reference overdrive.
0: normal mode, no overdrive.
1: overdrive mode. The primary
reference can be driven externally.
D3
D2
CBPDB
HWPD
Cell balance power-down.
0: cell balance powered down.
1: cell balance powered up.
Hardware (full) power-down.
0: do not enter full power-down mode
when the power-down timer is 0x00
(default).
1: if a value other than 0x00 is in the
power-down timer register, start the
power-down timer. Enter full power-
down mode when the power-down
timer reaches its timeout (also dependent
on VDRIVE for the master). If the power-
down timer register is already at 0x00,
power down the device (also dependent
on VDRIVE for the master). The HWPD bit
takes precedence over the SWPD bit.
D1
D0
CFGFAULT Set to 1 if in an illegal configuration occurs.
Issue a reset to restart the device in a user
configuration state.
OSCDRIFT The AD7284 has two internal oscillators
which are trimmed to the same frequency.
The oscillators are compared to each other
and, if they differ by more than 3.9%, this bit
is set to 1.
Current Cell Balance Count State Register
The current cell balance count (CBCNT) register stores the
current value of the cell balance timer. The default value is 0x00.
Table 18. CBCNT Register Setting (Register 0x02)
Bits
Name
Description
[D7:D0] CBCOUNT
LSB = 2 minutes. This register contains
a value between 0x00 and 0xFF. The
maximum value is 510 minutes.
D1
D0
SWPD
Software (partial) power-down.
0: do not enter partial power-down
mode (default).
1: enter partial power-down mode
immediately.
Current Power-Down Count State Register
The current power-down count state (PDCNT) register is used
in conjunction with the power-down modes that use the power-
down timer register. The power-down counter register stores
the current value of the power-down counter. If the power-down
counter register is zero and the power-down is set, the slave device
powers down immediately. See the Power-Down section for more
details.
SWRST
Software reset.
0: bring out of reset (default).
1: reset.
Table 19. PDCNT Register Setting (Register 0x03)
Bits
Name
Description
[D7:D0] PDCOUNT LSB = 2 minutes. This register contains a
value between 0x00 and 0xFF. The
maximum value is 510 minutes.
Rev. A | Page 36 of 49
Data Sheet
AD7284
Control Register 2
Table 23. Recommended Configuration for Control Register 2,
Bits[D6:D3]
Control Register 2 (CTRL2) sets the acquisition time of the
ADC and provides current matching control of the daisy chain.
See Table 2± for the appropriate setting for Bits[D6:D±].
Bits
Setting
Description
[D6:D3] 0000
Master in a dc-coupled chain; service
disconnect diodes used
Table 22. CTRL2 Register Settings (Register 0x08)
0000
Master in a chain with mixed coupling;
service disconnect diodes used
Bits
Name
Description
0000
Slave in a mixed chain with a transformer
coupled connection to the device directly
below; service disconnect diodes used
D7
Reserved Reserved, set to 0.
D6
TXIBAL
IDIODE
RXIBAL
Additional current equivalent to the
transmit bias current.
0: matching on.
1: marching off.
0100
0100
0100
Master in a dc-coupled chain; no service
disconnect diodes
Master in a chain with mixed coupling; no
service disconnect diodes
D5
D4
D3
An additional 400 µA forward bias current
is used for the service disconnect (SD) diode.
0: bias current enabled.
1: bias current disabled.
Slave in a mixed chain with a transformer
coupled connection directly below; no
service disconnect diodes
A level shifting current is required for the
data receive circuit (120 µA).
1010
1010
Slave in a dc coupled chain; service
disconnect diodes used
0: current enabled.
1: current disabled.
Slave in a mixed chain with a dc
connection directly below; service
disconnect diodes used
IMASTER Master mode.
0: enable the transceiver (4.5 mA) and the
1110
1110
1110
1110
Master in a transformer coupled chain; no
service disconnect diodes
receiver (3 mA) bias currents.
Slave in a dc-coupled chain; no service
disconnect diodes
1: disable the transceiver and the receiver
bias currents.
Slave in a transformer coupled chain; no
service disconnect diodes
D2
Reserved Reserved, set to 0.
[D1:D0] ACQTME Set acquisition time.
00: 400 ns (default).
01: 800 ns.
Slave in a mixed chain with a dc-coupled
connection directly below; no service
disconnect diodes
10: 1600 ns.
11: 3200 ns.
1111
Master only; no daisy chain
Rev. A | Page 37 of 49
AD7284
Data Sheet
Control Register 3
Asserting Bit D0 (the device ID increment bit) initiates the
device ID setup process, which assigns an ID to the devices in
the chain that are incremented from the master ID. After the ID
process completes, D0 clears and Bit D1 (the device ID lock bit)
is internally set. The user can read back from the control register of
each device to confirm the device ID has locked. Unlock the
device ID by writing a 0 to D1; keep the device ID locked by
writing 1 to D1 on any subsequent writes.
Control Register ± (CTRL±) is used for input sense control and
also provides the general output enabling functions on Bit D4,
Bit D±, and Bit D2.
Table 24. CTRL3 Register Settings (Register 0x09)
Bits
Name
Description
D7
Reserved
ADCDLY
Reserved, set to 0.
ADC delay mode.
0: normal mode, no delay.
D6
Bits[D0:D1] are mutually exclusive and, in the event that both
bits are set in one command, the device ID lock bit, Bit D1,
takes precedence over the increment bit, and the device does
not start the increment sequence.
1: delay mode. The primary and secondary
measurements are delayed by 1000 μs,
relative to each other, as dictated by Bit D5.
The device ID bits written to the control register of the master
device are directly used as that device ID. The slave device IDs
are stored in a different register. A readback of the control
register of any slave device returns the master device ID. The
actual device ID is the first five bits of each ±2-bit SDO frame.
D5
ADCORDR Sets the order of the ADC conversions in
delay mode.
0: primary followed by secondary.
1: secondary followed by primary.
D4
D3
GOE_CB
General output enable for cell balance.
0: disabled (default).
A 25 µs delay per device is required between initiating the
device ID setup process and a new register write command. The
device ID is not cleared by a software reset.
1: enabled.
GOE_OSS General output enable for open input
sense on secondary path.
0: disabled.
1: enabled.
Table 25. CTRL4 Register Settings (Register 0x0A)
Bits Name
Description
D2
GOE_OSP General output enable for open input
sense on primary path.
D7
D6
D5
D4
D3
D2
D1
Reserved
Reserved.
DEVID, Bit 4 Master device ID, Bit 4.
DEVID, Bit 3 Master device ID, Bit 3.
DEVID, Bit 2 Master device ID, Bit 2.
DEVID, Bit 1 Master device ID, Bit 1.
DEVID, Bit 0 Master device ID, Bit 0.
0: disabled.
1: enabled.
[D1:D0] IN_SNSE
Selection of input sense function. These
bits determine which outputs are turned
on for the duration of the sense signal.
DEVIDLOCK Device ID lock. Read this bit to check if
device ID has locked.
00: function off.
01: cell balance sense active.
10: primary open input sense active.
11: secondary open input sense active.
0: device is not locked to its device address.
If no device address is received, the device
continues to operate with default device
address, 0x0.
Control Register 4
1: device is locked to its device address. It is
set automatically by the device when the
device ID setup is complete.
The master device ID bits, Bits[D6:D2] in Control Register 4
(CTRL4), can configure the devices with unique IDs in a single
daisy chain with the master having an address settable between
0 and ±0. An address of ±1 (0x1F) is not allowed by either
master or slave and, if attempted, is ignored, with the existing
address being kept. In the event the master is assigned an
address of ±0, any following slaves are assigned 0, 1, 2, and so
on. Address ±1 is reserved for the address all command and is
not assigned to any single device.
D0
DEVIDINC
Device ID increment.
0: do not initialize the assign ID setup
process.
1: initialize the device ID setup process.
Assigns and auto increments the device ID
for all devices discovered on the daisy
chain.
On power-on, the user can configure the device IDs by first
writing the appropriate ID to Bits[D6:D2] of the master device.
These bits are set to zero by default.
Analog Devices, Inc., recommends programming the master
device with an address other than 0 so that if a POR event
occurs, it is detectable due to the master address reverting back
to 0 on a reset.
Rev. A | Page 38 of 49
Data Sheet
AD7284
Cell Balance Control Register
OIS Control Registers
The cell balance control (CBCTRL) register determines
the state of each of the cell balance outputs (CB1 to CB8)
individually. The default value of the cell balance control
register on power-up is 0x00, and the cell balance outputs
are off.
The OIS control registers (OISCTRL and OISGPOP) control
the switching of a current into each analog voltage input
(100 µA). The nine OISx outputs can be individually enabled by
setting an appropriate bit in the OIS control registers. Setting a
bit to Logic 1 enables the current in conjunction with the open
input sense GOE bits (D2 or D±), as detailed in Table 24.
Table 26. CBCTRL Register Settings (Register 0x0B)
Table 27. OISCTRL Register Settings (Register 0x0E)
Bits Name
Description
Bits Name
Description
D7
D6
D5
D4
D3
D2
D1
D0
CB8
CB7
CB6
CB5
CB4
CB3
CB2
CB1
This bit sets the CB8 output.
0: output off.
1: output on.
D7
D6
D5
D4
D3
D2
D1
D0
OIS8
OIS7
OIS6
OIS5
OIS4
OIS3
OIS2
OIS1
OIS 8 control. Set this bit to 1 to pull current
from either VPIN8 or VSIN8, depending on
the CTRL3 setting, to VSS.
This bit sets the CB7 output.
0: output off.
1: output on.
OIS 7 control. Set this bit to 1 to pull current
from pin VPIN7 or VSIN7 , depending on the
CTRL3 setting, to VSS.
This bit sets the CB6 output.
0: output off.
1: output on.
OIS 6 control. Set this bit to 1 to pull current
from pin VPIN6 or VSIN6, depending on the
CTRL3 setting, to VSS.
This bit sets the CB5 output.
0: output off.
1: output on.
OIS 5 control. Set this bit to 1 to pull current
from pin VPIN5 or VSIN5, depending on the
CTRL3 setting, to VSS.
OIS 4 control. Set this bit to 1 to pull current
from pin VPIN4 or VSIN4, depending on the
CTRL3 setting, to VSS.
This bit sets the CB4 output.
0: output off.
1: output on.
OIS 3 control. Set this bit to 1 to pull current
from pin VPIN3 or VSIN3, depending on the
CTRL3 setting, to VSS.
This bit sets the CB3 output.
0: output off.
1: output on.
OIS 2 control. Set this bit to 1 to pull current
from pin VPIN2 or VSIN2, depending on the
CTRL3 setting, to VSS.
This bit sets the CB2 output.
0: output off.
1: output on.
OIS 1 control. Set this bit to 1 to pull current
from pin VPIN1 or VSIN1, depending on the
CTRL3 setting, to VSS.
This bit sets the CB1 output.
0: output off.
1: output on.
Table 28. OISGPOP Register Settings (Register 0x0F)
Bits
Name
Description
D7
OIS0
OIS 0 control. Set this bit to 1 to pull
current from AVCC.
[D6:D3] Reserved
Reserved.
D2
D1
D0
GPOP2
User defined General-Purpose Output
Signal 2.
GPOP1
User defined General-Purpose Output
Signal 1.
GPOP SEL
GPOPx configuration.
0: user defined GPOPx.
1: GPOPx pins configured for daisy-chain
debug, see the Daisy-Chain Debug Mode
section for further details.
Rev. A | Page 39 of 49
AD7284
Data Sheet
Power-Down Timer Register
Table 31. WDT Register Settings (Register 0x21)
Bits
Name
Description
The power-down timer (PDT) register allows the user to
configure a set time after which the AD7284 is powered down.
The AD7284 allows the user to set the power-down timer to a
value from 0 hours to 8.5 hours (510 minutes, maximum). The
resolution of the power-down timer is 2 minutes. When using
the power-down timer in conjunction with the CBx timers, it is
recommended that the value programmed to the power-down
timer exceed the time programmed to the CBx timer by at least
2 minutes because the power-down timer takes priority over the
CBx timers and the device powers down. The default value of
the power-down timer register on power-up is 0x00.
D7
Reserved Reserved; set this bit to 0.
[D6:D0] WDT
LSB = 8.192 ms. Selectable between 0x00
and 0x7F. The maximum value is 1040 ms.
Watchdog Key Register
The watchdog key (WDKY) register allows the user to disable the
watchdog timer. To disable the watchdog timer, write 0x00 to the
watchdog timer register, then write 0x5A to the watchdog key
register, and finally write 0x00 to the watchdog timer register. The
default value of the watchdog key register on power-up is 0x00.
The power-down timer does not begin counting until the
HWPD bit in Control Register 1 is set. Clearing the HWPD bit
does not stop the power-down timer; stop the power-down
timer by writing 0x00 to the register.
Table 32. WDKY Register Setting (Register 0x22)
Bits
Name
Description
[D7:D0] WDKEY
Key = 0x5A
During a count, a new value can be written to the power-down
timer register. This causes the power-down timer to restart and
count to the new value.
Storage Register 1 and Storage Register 2
Storage Register 1 and Storage Register 2 (STRG1 and STRG2)
are available for user storage purposes. These registers are
volatile.
Table 29. PDT Register Setting (Register 0x10)
Bits
Name
Description
Table 33. STRG1 Register Setting (Register 0x23)
[D7:D0]
PD_T
LSB = 2 minutes. Selectable between
0x00 and 0xFF. The maximum value =
510 minutes.
Bits
Name
Description
[D7:D0] STRG1
Storage Register 1
Table 34. STRG2 Register Setting (Register 0x24)
CB Timer 1 to CB Timer 8 Registers
Bits
Name
Description
The CB Timer 1 to CB Timer 8 (CBT1 to CBT8) registers allow
the user to program individual times for each of the eight cell
balance outputs. The AD7284 allows the user to set the CBx
timer to a value from 0 minutes to 8.5 hours. The resolution of
the CBx timers is 2 minutes. The default value of the CBx timer
registers on power-up is 0x00. When the CBx timer value is set
to 0x00, the CBx timer is not activated; that is, the CBx outputs are
all controlled by the contents of the cell balance register only.
[D7:D0] STRG2
Storage Register 2
REGISTERS COMMON TO PAGE 0 AND PAGE 1
Page Register
The page (page) register can be written to independently of the
current page selection.
Read Register
The read (RDREG) register defines the read operation of the
AD7284. The read register can be written to independently of
the page addressing. To read back a register from a chain of
AD7284 devices, first write the desired register to the read register
on all devices. Issue a null write command (0x00000000) per
device to read back the register contents of each device in the
daisy chain. The readback starts with the master device, then
the first slave device, and so on. The read register is not used for
reading back conversion results. See the Example 5: Convert
and Read All Conversion Data section for more details. The
default value of the read register on power-up is 0xFF.
Table 30. CBT1 Register to CBT8 Register Settings
(Register 0x11 to Register 0x18)
Bits
Name
Description
[D7:D0]
CB_T
LSB = 2 minutes. Selectable between
0x00 and 0xFF. The maximum value is
510 minutes.
Watchdog Timer Register
The watchdog timer (WDT) register allows the user to
configure a set time after which the AD7284 is automatically
powered down if communications to the AD7284 is lost. The
AD7284 allows the user to set the watchdog timer to a maximum
value of 1040 ms with a resolution of 8.192 ms.
The default value of the watchdog timer register on power-up is
0x0C (98.±04 ms).
Rev. A | Page 40 of 49
Data Sheet
AD7284
EXAMPLES OF INTERFACING WITH THE AD7284
REGISTER WRITE AND REGISTER READ
OPERATIONS EXAMPLES
Example 2: Reading the Device ID
See Table ±6. This sequence is similar for any register read
operation. To verify the device IDs are set and locked, take the
following steps to read Control Register 4:
In this section, Example 1 and Example ± illustrate register
write operations. Example 2 illustrates a register read operation.
1. Write 1. Write 0x01 to the page register on all devices to
give access to Control Register 4 in Page 1. The ±2-bit write
command is 0xFFE01±B2.
2. Write 2. Write 0x0A into the read register (the address
corresponding to Control Register 4). The ±2-bit write
command is 0xFBF0A4±F. The write/write, read bit must be 0.
Example 1: Initialize All Devices in a Daisy Chain
See Table ±5. By default, the device ID on the AD7284 is 0. This
example demonstrates how to set the master ID to 2 and to
increment the device ID of slaves up the chain. Changing the
master device ID allows identification of each device in a
system containing more than one master.
CS
±. Write ±. Apply a
low pulse that frames ±2 SCLKs for each
1. Write 1. Write 0x01 to the page register on all devices to
give access to Control Register 4 in Page 1. The ±2-bit write
command is 0xFFE01±B2.
2. Write 2. Write to the Control Register 4 at Address 0x0A.
Set the master ID and increment the IDs up the chain. The
master ID is set by writing a 5-bit code to Bits[D6:D2] (0x02
in this example). Set the device increment bit (D0) to 1 and
the device lock bit (D1) to 0. The ±2-bit write command is
0xFCA098±D.
slave in the chain to be read back. Verify in the register
data field that the device ID is locked for each device in the
daisy chain by ensuring Bit D1 (the device ID lock bit) is
set high on each Control Register 4 readback. Also, in this
example, a device ID of 2 is returned for the master device
signified by the first five bits, a device ID of three for the
first slave device by the first five bits, and so on. The ±2-bit
write command is 0x00000000. In Table ±6, n is the
number of devices in the chain.
Table 35. Example 1: Initializing All Devices in a Daisy Chain
Write Command Device Address Write/Write, Read Register Address
Data
12-Bit CRC
32-Bit Write Command
0xFFE013B2
0xFCA0983D
Write 1
Write 2
11111
11111
1
1
111110
001010
00000001
00001001
001110110010
100000111101
Table 36. Example 2: Reading the Device ID for a Chain of Devices
Write Command Device Address Write/Write, Read Register Address
Data
12-Bit CRC
32-Bit Write Command
0xFFE013B2
0xFBF0A43F
Write 1
11111
11111
00000
1
0
0
111110
111111
000000
00000001
00001010
00000000
001110110010
010000111111
000000000000
Write 2
Write 3 (×n)
0x00000000
Rev. A | Page 41 of 49
AD7284
Data Sheet
Example 3: Disabling the Watchdog Timer
CONVERSION DATA READBACK OPERATION
EXAMPLES
See Table ±7.
Example 4: Convert and Read Primary Conversion Data
1. Write 1. Write 0x01 to the page register on all devices to
give access to the watchdog timer registers in Page 1. The
±2-bit write command is 0xFFE01±B2.
2. Write 2. To start the watchdog timer disable routine, write
0x00 to the watchdog timer register. The ±2-bit write
command is 0xFE100F8E.
±. Write ±. Write the correct key value, 0x5A, to the watchdog
key register. The ±2-bit write command is 0xFE25A8DC.
4. Write 4. Complete the routine by writing 0x00 to the
watchdog timer register. The ±2-bit write command is
0xFE100F8E.
See Table ±8.
1. Write 1. Write Data 0x00 to the page register on all devices.
The ±2-bit write command is 0xFFE005±1.
2. Write 2. Initiate conversions through the software convert
start bit by asserting the LSB of the ADC functional control
register. The ±2-bit write command is 0xFFD01420. Allow
sufficient time for all conversions to be completed, as
described in the Converting with a Chain of AD7284
Devices section. Note that, after conversions are initiated,
the device automatically enters 64-bit read mode and
remains in 64-bit mode until commanded to exit.
±. Write ±. Following the completion of all conversions, apply
CS
a
low pulse that frames ±2 SCLKs for each primary
conversion result to be read back. For a daisy chain of three
devices with 18 primary measurements on each device, this
equates to 54 frames in total. All frames, except the last
one, input a ±2-bit write command of 0x00000000. In the
table, n is the number of devices in the chain.
4. Write 4. The last frame (the 54th frame for a daisy chain of
three devices) inputs 0xFFD04E2C. This command writes
the value of 0x04 to the ADC functional control register,
returning the interface protocol back to ±2-bit mode such
that the devices are ready to receive configuration changes
or further software convert start requests.
Table 37. Example 3: Disabling the Watchdog Timer
Write Command Device Address Write/Write, Read Register Address Data
12-Bit CRC
32-Bit Write Command
0xFFE013B2
0xFE100F8E
0xFE25A8DC
0xFE100F8E
Write 1
Write 2
Write 3
Write 4
11111
11111
11111
11111
1
1
1
1
111110
100001
100010
100001
00000001
00000000
01011010
00000000
001110110010
111110001110
100011011100
111110001110
Table 38. Example 4: Convert and Read Primary Conversion Data
Write Command
Device Address Write/Write, Read Register Address Data
12-Bit CRC
32-Bit Write Command
Write 1
Write 2
11111
11111
1
1
0
1
111110
111101
000000
111101
00000000 010100110001 0xFFE00531
00000001 010000100000 0xFFD01420
00000000 000000000000 0x00000000
00000100 111000101100 0xFFD04E2C
Write 3 × (n × 18) − 1 00000
Write 4 11111
Rev. A | Page 42 of 49
Data Sheet
AD7284
Example 5: Convert and Read All Conversion Data
4. Write 4. During the last primary readback frame, input
0xFFD02FA5. This command writes the value of 0x02 to
the ADC functional control register, selecting the secondary
conversion data results. For a single device, this is the 18th
frame. For a daisy chain of three devices, this is the 54th
frame.
See Table ±9.
1. Write 1. Write Data 0x00 to the page register on all devices.
The ±2-bit write command is 0xFFE005±1.
2. Write 2. Initiate conversions through the software convert
start bit by asserting the LSB of the ADC functional control
register. The ±2-bit write command is 0xFFD01420. Allow
sufficient time for all conversions to be completed as
described in the Converting with a Chain of AD7284
Devices section. Note that, after conversions are initiated,
the device automatically enters 64-bit read mode and
remains in 64-bit mode until commanded to exit.
5. Write 5. During the last secondary read back frame, write
0xFFD04E2C. This command writes the value of 0x04 to
the ADC functional control register, returning the interface
protocol back to ±2-bit mode such that the devices are ready
to receive configuration changes or further software convert
start requests. For a single device, this is the 28th frame.
For a daisy chain of three devices, this is the 84th frame.
±. Write ±. Following the completion of all conversions, apply
CS
a
low pulse that frames ±2 SCLKs for each primary and
secondary conversion result to be read back. For a single
device, with 18 primary and 10 secondary measurements,
this equates to 28 frames in total. All frames, except for
the 18th and 28th, input the ±2-bit write command of
0x00000000. For a daisy chain of three devices with
18 primary and 10 secondary measurements on each
device, this equates to 84 frames in total. In this case, all
frames, except for the 54th and 84th, input a ±2-bit write
command of 0x00000000.
Table 39. Example 5: Convert and Read All Conversion Data
Write Command
Device Address Write/Write-Read Register Address Data
12-Bit CRC
32-Bit Write Command
0xFFE00531
0xFFD01420
0x00000000
0xFFD02FA5
Write 1
Write 2
11111
11111
1
1
0
1
0
1
111110
111101
000000
111101
000000
111101
00000000 010100110001
00000001 010000100000
00000000 000000000000
00000010 111110100101
00000000 000000000000
00000100 111000101100
Write 3 × (n × 18) − 1 00000
Write 4 11111
Write 3 × (n × 10) − 1 00000
Write 5 11111
0x00000000
0xFFD04E2C
Rev. A | Page 43 of 49
AD7284
Data Sheet
APPLICATIONS INFORMATION
The AD7284 can be used in many different system architectures,
from a system with a single device, to a chain of devices connected
with or without transformers, multiple devices on one board,
or single devices on multiple boards. Each of these system
architectures present different external components
requirements.
6. Primary path input filters comprised of RF and CF typically
have values between ±±0 Ω to 1 kΩ and 100 nF to 1 µF.
7. 10 kΩ to protect the CBx pins and gate of the external cell
balancing transistors during the initial connection of the
monitoring circuitry to the battery stack.
8. Secondary path input filters comprised of RF and CF typically
have values between ±±0 Ω to 1 kΩ and 100 nF to 1 µF.
9. Daisy-chain upper port is unused and terminated with 50 Ω.
10. Daisy-chain lower port is unused and connected to VSS via
a 1 kΩ resistor.
TYPICAL CONNECTION DIAGRAMS
This section summarizes the different hardware recommendations
from the previous sections, presents a typical diagram for a
single device, and a typical diagram for a chain of three devices
on separate boards.
Note that the 1 µF capacitor on VDRIVE shown in Figure 41 is an
ADuM5401 requirement. It is recommended to add 100 nF
decoupling on the VDRIVE pin.
Master Only
Figure 41 shows an example of components for a master device,
monitoring eight cells using two independent filters (on the
primary and secondary path), and monitoring temperature
on four thermistors.
Three Devices on Separate Boards
Li-Ion battery applications require a significant number of
individual cells to provide the required output voltage. Figure 42
shows the recommended configuration of a chain of AD7284
devices monitoring a larger battery stack. The daisy-chain
interface of the AD7284 allows each AD7284 to communicate
with the AD7284 immediately above and below it. The daisy-
chain interface allows the AD7284 devices to be electrically
connected to the battery management device without the need
for individual isolation devices between each AD7284. One
AD7284 acts as the master device, interfacing through the
standard SPI interface to the host processor and to the chain
of connected slave devices.
The following notes refer to the notes detailed in Figure 41 and
Figure 42:
1. A 100 nF decoupling capacitor placed close to the battery
cell connector.
2. A transient protection, rated appropriately, capable of
limiting the voltage at the device to within the absolute
maximum ratings.
±. Ferrite bead to filter supply noise. Typically, 1 kΩ ferrite
(100 MHz) is recommend in the VDD path. If a ferrite is
required in the VSS line, it is recommended to use a value
<100 Ω (100 MHz). This note applies to the master or slave
configurations. See Note 11 in Figure 41 and see Note ± in
Figure 42.
4. Current limiting resistor between 10 Ω and 40 Ω. This
resistor also acts as a low-pass filter in conjunction with the
decoupling capacitance on the VDD pin. Take care with
regard to the time constant of this filter, as described in the
Cell Connections section.
Figure 42 shows how a chain of three devices can be configured
to operate on individual boards, if required; the same configuration
can be used if all devices are mounted on the same board.
In general, Analog Devices recommends placing two to three
AD7284 devices on a single board with a transformer coupling
making the connection between boards.
More details on external components requirements are covered
in the Daisy-Chain Interface section, the Hot Plug section, and
the Service Disconnect section.
5. Decoupling capacitors; 100 nF in parallel with 4.7 µF in
total or 100 nF in parallel with 2.2 µF on each VDD pin.
Note that external components are subject to change.
Rev. A | Page 44 of 49
Data Sheet
AD7284
10kΩ
50Ω
50Ω
9
3
2
4
MASTER D_UP
D_UP
1
R
VDD
TRANSIENT
V
V
DD
PROTECTION
DD
5
C
VDD
100nF
V
REG5
100nF
6
R
F
AV
DV
VPIN8
CC
CC
C
F
F
F
F
F
F
F
F
F
100nF
10kΩ
CELL 8
CELL 7
CELL 6
CELL 5
CELL 4
CELL 3
CELL 2
CELL 1
CB8
R
F
NOTES
VPIN7
100nF
C
C
C
C
C
C
C
C
SHOWS MINIMUM COMPONENT SET. END SYSTEM
REQUIREMENTS MAY DICTATE ADDITIONAL
COMPONENTS TO PROTECT AGAINST FAULT
CONDITIONS.
10kΩ
CB7
R
F
V
VPIN6
REF1
REF2
PLACE CLOSE TO BATTERY CELL CONNECTOR
1
2
TRANSIENT PROTECTION
100nF
100nF
1µF
1µF
10kΩ
CB6
FERRITE BEAD FOR NOISE FILTERING
(1kΩ RECOMMENDED).
3
AD7284
R
F
VPIN5
4
5
CURRENT LIMITING RESISTOR
DECOUPLING CAPACITORS
V
10kΩ
CB5
R
F
PRIMARY MEASUREMENT PATH EXTERNAL
FILTERS
6
VPIN4
CELL BALANCE PIN PROTECTION
7
8
10kΩ
CB4
SECONDARY MEASUREMENT PATH WITH
INDEPENDENT EXTERNAL FILTERS
R
F
VPIN3
9
DAISY-CHAIN UPPER INTERFACE PORT
DAISY-CHAIN LOWER INTERFACE PORT
FERRITE < 100Ω IF USED
10kΩ
10
11
CB3
R
F
VPIN2
10kΩ
V
REFBUF
CB2
1µF
33kΩ
R
F
VPIN1
VPAUX4
33kΩ
7
10kΩ
VPAUX3
VPAUX2
VPAUX1
CB1
33kΩ
R
F
VPIN0
33kΩ
8
R
F
F
F
F
F
F
F
F
F
VSIN8
VSIN7
VSIN6
VSIN5
VSIN4
VSIN3
VSIN2
VSIN1
R
R
R
R
R
R
R
R
33kΩ 33kΩ 33kΩ 33kΩ
C
1µF
C
C
C
ISOLATION
V
DRIVE
SDO
ADuM5401
SCLK
SDI
DSP/MICRO
PROCESSOR
CS
(OPTIONAL)
ADuM1201
RESET
11
V
V
C
CM
SS
1µF
SS
D_DWN D_DWN
1kΩ
10
Figure 41. AD7284 Master Configuration Diagram for Eight Battery Cells
Rev. A | Page 45 of 49
AD7284
Data Sheet
50Ω
50Ω
9
3
4
2
TOP OF STACK
1
5
RVDD
D_UP
D_UP
TRANSIENT
PROTECTION
V
DD
V
DD
VREG5
AVCC
100nF
4.7µF
100nF
6
100nF
NOTES
VIN8
VIN7
VIN6
VIN5
VIN4
VIN3
VIN2
VIN1
VSS_S2
VSS_S2
VSS_S2
VSS_S2
VSS_S2
VSS_S2
VSS_S2
VSS_S2
VSS_S2
SHOWS MINIMUM COMPONENT SET.
100nF
DVCC
REFER TO TEXT FOR RECOMMENDED VALUES.
END SYSTEM REQUIREMENTS MAY DICTATE
ADDITIONAL COMPONENTS TO PROTECT
AGAINST FAULT CONDITIONS.
100nF
V
DRIVE
RESET
VREF1
AD7284
DEVICE 3
SLAVE 2
PLACE CLOSE TO BATTERY CELL CONNECTOR
TRANSIENT PROTECTION
1
2
100nF
FERRITE BEAD FOR NOISE FILTERING
CURRENT LIMITING RESISTOR
DECOUPLING CAPACITORS
3
4
100nF 1µF
100nF 1µF
5
6
V
REF2
PRIMARY MEASUREMENT PATH EXTERNAL
FILTERS
NOT SHOWN; SEE FIGURE 29
7
8
SCLK
SDI
NOT SHOWN; SEE FIGURE 29
3
VSS
VSS
9
DAISY-CHAIN UPPER INTERFACE PORT
DAISY-CHAIN LOWER INTERFACE PORT
CS
10
VSS_S2
10
10kΩ
50Ω
50Ω
1µF
BOARD TO BOARD CONNECTION
BOARD TO BOARD CONNECTION
SERVICE DISCONNECT POINT
50Ω
50Ω
*
100nF
*SERVICE DISCONNECT PROTECTION
10kΩ
10kΩ
3
4
2
1
RVDD
5
D_UP
D_UP
TRANSIENT
VDD
VDD
PROTECTION
VREG5
AVCC
100nF
4.7µF
100nF
6
100nF
100nF
VIN8
VIN7
VIN6
VIN5
VIN4
VIN3
VIN2
VIN1
VSS_S1
VSS_S1
VSS_S1
VSS_S1
VSS_S1
VSS_S1
VSS_S1
VSS_S1
VSS_S1
DVCC
100nF
VDRIVE
AD7284
DEVICE 2
SLAVE 1
RESET
VREF1
100nF
100nF 1µF
100nF 1µF
VREF2
SCLK
SDI
3
VSS
VSS
CS
VSS_S1
10
10kΩ
50Ω
50Ω
50Ω
1µF
13
BOARD TO BOARD CONNECTION
BOARD TO BOARD CONNECTION
NOT A SERVICE DISCONNECT POINT
50Ω
100nF
11 12 13
PROTECTION CIRCUITRY
DESCRIBED IN THE
HOT PLUG SECTION
3
4
2
12
10kΩ
10kΩ
5
11
1
R
VDD
10kΩ
9
TRANSIENT
PROTECTION
4.7µF
100nF
VDD
100nF
VDD
VREG5
AVCC
6
100nF
VIN8
VIN7
VIN6
VIN5
VIN4
VIN3
VIN2
VIN1
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
100nF
VSS
DVCC
100nF
VSS
VDRIVE
100nF
VSS
AD7284
DEVICE 1
MASTER
100nF
VSS
VREF1
100nF
100nF
VSS
1µF
VSS
VREF2
100nF
VSS
1µF
VSS
CCM
1µF
VSS
ISOLATION
ADuM5401
SDO
SCLK
SDI
3
DSP/MICRO
PROCESSOR
VSS
VSS
CS
(OPTIONAL)
VSS
RESET
ADuM120x
D_DWN D_DWN
1kΩ
10
VREF2
VSS
Figure 42. AD7284 Daisy-Chain Configuration with Three Devices, Where All Devices Are on Separate Boards
Rev. A | Page 46 of 49
Data Sheet
AD7284
Other protection considerations are discussed in the Applications
Information section, such as the inclusion of 1 kΩ resistors in
series with the inputs, providing protection for the analog
inputs in the event of an overvoltage or undervoltage on those
inputs. At all times, ensure that the devices are not exposed to
conditions outside the absolute maximum levels.
HOT PLUG
A typical battery stack can have voltages in the range of 12 V
to 400 V. For applications requiring flexibility in the order of
connections of a daisy-chain interface, battery voltage, and
battery stack connections, some additional external components
are recommended at the board to board connection points to
protect the AD7284 devices.
SERVICE DISCONNECT (SD)
A protection diode placed across the supplies of each AD7284 acts
to clamp the voltage across the device during initial connection to
the battery stack, preventing an overvoltage damaging the AD7284.
A clamp voltage rating of 40 V is suggested for these diodes, but
lower values can also be used to suit the application where smaller
cell counts are used. The diodes must limit the voltage to maximum
of 48 V (AD7284 absolute maximum rating on VDD). The Zener
diode must withstand the voltage of the full stack.
At SD points, a series diode (SD diode) and small value parallel
D_UP
capacitor (±.9 nF) are necessary for each D_UP pin and
pin, as shown in Figure 44. Clamping diodes with low
capacitance (pF) keep the daisy-chain pin voltages close to the
supply rails. These components must be suitably rated to the
stack voltage.
AD7284
DEVICE (N + 1)
Figure 4± shows the types of external components involved and
includes low capacitance protection diodes (D1 and D2) to
clamp the daisy-chain pin voltages close to the supply rails, and
10 Ω series resistors (R1 and R2) to limit current protecting the
diodes. The daisy-chain pins can support capacitive loads up to
200 pF, typical. In addition, the diode D± clamps the voltage on
the CCM pin.
V
SS
50Ω
1µF
50Ω
D3
BOARD TO BOARD
CONNECTION
AD7284
DEVICE (N + 1)
R1
10Ω
R2
10Ω
50Ω
50Ω
100nF
V
D4
D5
SS
D1
D2
50Ω
1µF
50Ω
D3
20Ω
V
V
DD
AD7284
DEVICE (N)
SS
BOARD TO BOARD
CONNECTION
Figure 44. Suggested Hot Plug Components, Including Service Disconnect
Components (Additional Circuitry Omitted for Clarity)
R1
10Ω
R2
10Ω
50Ω
50Ω
100nF
An alternative approach is to use transformers to provide
isolation from device to device, which reduces some of the
rating requirements on the external components.
D1
D2
20Ω
V
V
DD
AD7284
DEVICE (N)
SS
Figure 43. Suggested Hot Plug Components
(Additional Circuitry Omitted for Clarity)
Rev. A | Page 47 of 49
AD7284
Data Sheet
AD7284
DEVICE (N + 1)
TRANSFORMER CONFIGURATION
Figure 45 shows a typical configuration with transformers.
V
SS
The center point of the isolated sides on the transformer can
connect to the chassis or be left unconnected. If connected to
the chassis, ESD protection diodes and an RC filter to filter
noise from the chassis may be required.
R
R
T
T
TRANSFORMER
CHASSIS
RT is the terminating resistor for the transformers; use values
from 50 Ω to 200 Ω.
BOARD TO BOARD
CONNECTION
ISOLATED DAISY CHAIN
CHASSIS
TRANSFORMER
R
R
T
T
V
V
DD
AD7284
DEVICE (N)
SS
Figure 45. Transformer Configuration
(Additional Circuitry Omitted for Clarity)
Rev. A | Page 48 of 49
Data Sheet
AD7284
OUTLINE DIMENSIONS
12.20
12.00 SQ
11.80
1.60
MAX
10.20
10.00 SQ
9.80
0.75
0.60
0.45
64
49
64
49
48
48
1
1
1.00 REF
SEATING
PLANE
PIN 1
EXPOSED
PAD
5.60
5.50 SQ
5.40
7.50
REF SQ
1.45
1.40
1.35
16
16
33
33
0.20
0.15
0.09
32
32
17
17
TOP VIEW
BOTTOM VIEW
0.27
0.22
0.17
VIEW A
0.15
0.10
0.05
7°
0°
0.50
LEAD PITCH
0.08
COPLANARITY
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
VIEW A
SECTION OF THIS DATA SHEET.
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BCD-HD
Figure 46. 64-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP]
(SW-64-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
Junction Temperature Range
Package Description
Package Option
AD7284WBSWZ
AD7284WBSWZ-RL
EV-AD7284SSSDZ
EV-AD7284TMSDZ
−30°C to +120°C
−30°C to +120°C
64-Lead LQFP_EP with Exposed Pad, Tray
64-Lead LQFP_EP with Exposed Pad, Tape and Reel
Mini Transformer Isolated Slave Evaluation Kit
Transformer Isolated Master Evaluation Kit
SW-64-2
SW-64-2
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The AD7284W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14703-0-5/17(A)
Rev. A | Page 49 of 49
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