SI7409ADN-T1-E3 [VISHAY]

TRANSISTOR 7 A, 30 V, 0.019 ohm, P-CHANNEL, Si, POWER, MOSFET, ROHS COMPLIANT, LEADLESS, 1212-8, POWERPAK-8, FET General Purpose Power;
SI7409ADN-T1-E3
型号: SI7409ADN-T1-E3
厂家: VISHAY    VISHAY
描述:

TRANSISTOR 7 A, 30 V, 0.019 ohm, P-CHANNEL, Si, POWER, MOSFET, ROHS COMPLIANT, LEADLESS, 1212-8, POWERPAK-8, FET General Purpose Power

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Si7409ADN  
Vishay Siliconix  
P-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
- 11  
Qg (Typ.)  
Available  
0.019 at VGS = - 4.5 V  
0.031 at VGS = - 2.5 V  
TrenchFET® Power MOSFET  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
- 30  
25  
- 8.5  
V
DS Optimized for Load Switch  
100 % Rg Tested  
PowerPAK 1212-8  
APPLICATIONS  
Load Switch  
S
S
3.30 mm  
3.30 mm  
1
S
2
S
3
G
4
G
D
8
D
7
D
6
D
5
Bottom View  
Ordering Information: Si7409ADN-T1-E3 (Lead (Pb)-free)  
D
P-Channel MOSFET  
Si7409ADN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
- 30  
12  
V
VGS  
TA = 25 °C  
A = 85 °C  
- 11  
- 7  
Continuous Drain Current (TJ = 150 °C)a  
ID  
T
- 7.9  
- 5  
A
IDM  
IS  
Pulsed Drain Current  
- 40  
Continuous Source Current (Diode Conduction)a  
- 3.2  
3.8  
- 1.3  
1.5  
TA = 25 °C  
TA = 85 °C  
Maximum Power Dissipationa  
PD  
W
2.0  
0.8  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
26  
Maximum  
Unit  
t 10 s  
33  
81  
Maximum Junction-to-Ambienta  
Maximum Junction-to-Case  
RthJA  
Steady State  
Steady State  
65  
°C/W  
RthJC  
1.9  
2.4  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Reliability Manual for profile. The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not plated)  
as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to  
ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 73246  
S-83051-Rev. C, 29-Dec-08  
www.vishay.com  
1
Si7409ADN  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
VGS(th)  
IGSS  
VDS = VGS, ID = - 250 µA  
Gate Threshold Voltage  
- 0.6  
- 1.5  
100  
- 1  
V
VDS = 0 V, VGS  
=
12 V  
Gate-Body Leakage  
nA  
VDS = - 30 V, VGS = 0 V  
DS = - 30 V, VGS = 0 V, TJ = 85 °C  
VDS - 5 V, VGS = - 4.5 V  
VGS = - 4.5 V, ID = - 11 A  
IDSS  
ID(on)  
Zero Gate Voltage Drain Current  
µA  
A
V
- 5  
On-State Drain Currenta  
- 40  
0.015  
0.025  
40  
0.019  
0.031  
Drain-Source On-State Resistancea  
RDS(on)  
Ω
V
GS = - 2.5 V, ID = - 8.5 A  
Forward Transconductancea  
Diode Forward Voltagea  
Dynamicb  
gfs  
VDS = - 15 V, ID = - 11 A  
IS = - 3.2 A, VGS = 0 V  
S
V
VSD  
- 0.7  
- 1.2  
40  
Qg  
Qgs  
Qgd  
Rg  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
25  
5
V
DS = - 15 V, VGS = - 4.5 V, ID = - 11 A  
f = 1.0 MHz  
nC  
9
3.3  
6.5  
30  
50  
115  
75  
60  
100  
10  
45  
Ω
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
75  
V
DD = - 15 V, RL = 15 Ω  
ID - 1 A, VGEN = - 4.5 V, Rg = 6 Ω  
Turn-Off Delay Time  
Fall Time  
175  
115  
90  
ns  
trr  
Source-Drain Reverse Recovery Time  
Reverse Recovery Charge  
IF = - 3.2 A, dI/dt = 100 A/µs  
Qrr  
150  
nC  
Notes:  
a. Pulse test; pulse width 300 µs, duty cycle 2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
V
GS  
= 5 thru 2 V  
1.5 V  
T
= 125 °C  
C
25 °C  
1 V  
- 55 °C  
2.0  
0
0.0  
0
0.5  
1.0  
1.5  
2.5  
0
1
2
3
4
V
GS  
-Gate-to-Source Voltage (V)  
V
DS  
- Drain-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
www.vishay.com  
2
Document Number: 73246  
S-83051-Rev. C, 29-Dec-08  
Si7409ADN  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
4000  
3200  
2400  
1600  
800  
0.030  
0.024  
V
GS  
= 2.5 V  
C
iss  
0.018  
0.012  
0.006  
0.000  
V
GS  
= 4.5 V  
C
oss  
C
rss  
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
V
DS  
- Drain-to-Source Voltage (V)  
I
D
- Drain Current (A)  
On-Resistance vs. Drain Current  
Capacitance  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
5
4
3
2
1
0
V
I
= 4.5 V  
V
D
= 15 V  
DS  
GS  
= 11 A  
I
= 11 A  
D
- 50 - 25  
0
25  
50  
75  
100 125 150  
0
5
10  
15  
20  
25  
30  
T - Junction Temperature (°C)  
J
Q
- Total Gate Charge (nC)  
g
Gate Charge  
On-Resistance vs. Junction Temperature  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
30  
10  
T
= 150 °C  
J
I
D
= 11 A  
1
0.1  
T
= 25 °C  
J
0.01  
0.001  
0
1
2
3
4
5
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V
SD  
- Source-to-Drain Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
Document Number: 73246  
S-83051-Rev. C, 29-Dec-08  
www.vishay.com  
3
Si7409ADN  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
0.6  
50  
40  
30  
I
D
= 250 µA  
0.4  
0.2  
0.0  
20  
10  
- 0.2  
- 0.4  
- 0.6  
T
= 25 °C  
A
Single Pulse  
0
- 50 - 25  
0
25  
50  
75  
100 125 150  
0.01  
0.1  
1
10  
100  
600  
T
- Temperature (°C)  
Time (s)  
J
Threshold Voltage  
Single Pulse Power, Junction-to-Ambient  
100  
Limited by R  
DS(on)*  
I
Limited  
DM  
100 µs, 10 µs  
10  
1
1 ms  
10 ms  
I
D(on)  
Limited  
100 ms  
1 s  
T
= 25 °C  
10 s  
A
0.1  
Single Pulse  
DC, 100 s  
BVDSS Limited  
0.01  
0.1  
1
10  
100  
V
DS  
- Drain-to-Source Voltage (V)  
* V > minimum V  
GS  
at which R  
is specified  
DS(on)  
GS  
Safe Operating Area, Junction-to-Ambient  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
0.05  
0.02  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 65 °C/W  
thJA  
(t)  
3. T  
- T = P  
Z
JM  
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
10  
100  
600  
www.vishay.com  
4
Document Number: 73246  
S-83051-Rev. C, 29-Dec-08  
Si7409ADN  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
10  
1
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see www.vishay.com/ppg?73246.  
Document Number: 73246  
S-83051-Rev. C, 29-Dec-08  
www.vishay.com  
5
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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