2SK3403_06 [TOSHIBA]

Silicon N Channel MOS Type Switching Regulator Applications; 硅N沟道MOS型开关稳压器的应用
2SK3403_06
型号: 2SK3403_06
厂家: TOSHIBA    TOSHIBA
描述:

Silicon N Channel MOS Type Switching Regulator Applications
硅N沟道MOS型开关稳压器的应用

稳压器 开关
文件: 总6页 (文件大小:293K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2SK3403  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-MOSV)  
2SK3403  
Switching Regulator Applications  
Unit: mm  
Low drain-source ON resistance: R  
High forward transfer admittance: |Y | = 5.8 S (typ.)  
= 0.29 (typ.)  
DS (ON)  
fs  
Low leakage current: I  
= 100 μA (max) (V  
= 450 V)  
DSS  
DSS  
Enhancement mode: V = 3.0~5.0 V (V  
= 10 V, I = 1 mA)  
D
th  
DS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
450  
450  
±30  
13  
V
V
V
DSS  
Drain-gate voltage (R  
Gate-source voltage  
= 20 kΩ)  
V
GS  
DGR  
V
GSS  
DC  
(Note 1)  
I
D
Drain current  
A
Pulse (Note 1)  
I
52  
DP  
Drain power dissipation (Tc = 25°C)  
P
100  
W
D
AS  
AR  
JEDEC  
JEITA  
Single pulse avalanche energy  
E
350  
mJ  
(Note 2)  
Avalanche current  
I
13  
10  
A
TOSHIBA  
2-10S1B  
Repetitive avalanche energy (Note 3)  
Channel temperature  
E
mJ  
°C  
°C  
AR  
Weight: 1.5 g (typ.)  
T
150  
ch  
Storage temperature range  
T
55~150  
stg  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in temperature,  
etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage,  
etc.) are within the absolute maximum ratings. Please design the  
appropriate reliability upon reviewing the Toshiba Semiconductor  
Reliability Handbook (“Handling Precautions”/Derating Concept and  
Methods) and individual reliability data (i.e. reliability test report and  
estimated failure rate, etc).  
Thermal Characteristics  
Characteristics  
Symbol  
Max  
Unit  
Thermal resistance, channel to case  
Thermal resistance, channel to ambient  
R
1.25  
83.3  
°C/W  
°C/W  
th (ch-c)  
JEDEC  
JEITA  
R
th (ch-a)  
Note 1: Ensure that the channel temperature does not exceed 150°C.  
TOSHIBA  
2-10S2B  
Note 2:  
V = 90 V, T = 25°C (initial), L = 3.46 mH, R = 25 Ω,  
DD ch G  
I
= 13 A  
Weight: 1.5 g (typ.)  
AR  
Note 3: Repetitive rating: pulse width limited by maximum channel  
temperature  
This transistor is an electrostatic-sensitive device. Please handle with caution.  
1
2006-11-06  
2SK3403  
Electrical Characteristics (Tc = 25°C)  
Characteristics  
Gate leakage current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
I
V
= ±25 V, V  
= 0 V  
±30  
±10  
μA  
V
GSS  
GS  
DS  
Gate-source breakdown voltage  
Drain cut-off current  
V
V
I
= 10 μA, V  
= 0 V  
(BR) GSS  
G
DS  
I
V
= 450 V, V  
= 0 V  
100  
μA  
V
DSS  
DS  
GS  
Drain-source breakdown voltage  
Gate threshold voltage  
I
= 10 mA, V  
= 0 V  
450  
3.0  
(BR) DSS  
D
GS  
V
V
V
V
= 10 V, I = 1 mA  
5.0  
0.4  
V
th  
DS  
GS  
DS  
D
Drain-source ON resistance  
Forward transfer admittance  
Input capacitance  
R
= 10 V, I = 6 A  
0.29  
5.8  
1600  
17  
Ω
S
DS (ON)  
Y ⎪  
D
= 10 V, I = 6 A  
3.0  
fs  
D
C
C
iss  
V
= 25 V, V  
= 0 V, f = 1 MHz  
GS  
pF  
Reverse transfer capacitance  
Output capacitance  
DS  
rss  
C
220  
oss  
Rise time  
t
r
28  
45  
10  
56  
10 V  
I
= 6 A  
D
V
GS  
0 V  
Output  
Turn-on time  
Switching time  
t
on  
R
=
L
ns  
33.3 Ω  
Fall time  
t
f
V
200 V  
DD  
<
Duty 1%, t = 10 μs  
=
w
Turn-off time  
t
off  
Total gate charge  
Gate-source charge  
Gate-drain charge  
Q
34  
19  
15  
g
V
360 V, V  
= 10 V, I = 13 A  
nC  
Q
DD  
GS  
D
gs  
gd  
Q
Source-Drain Ratings and Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Continuous drain reverse current (Note 1)  
I
13  
52  
A
A
DR  
Pulse drain reverse current  
Forward voltage (diode)  
Reverse recovery time  
Reverse recovery charge  
(Note 1)  
I
DRP  
V
I
I
= 13 A, V  
= 13 A, V  
= 0 V  
1.7  
V
DSF  
DR  
DR  
GS  
GS  
t
= 0 V,  
300  
3.4  
ns  
μC  
rr  
dI /dt = 100 A/μs  
DR  
Q
rr  
Marking  
K3403  
Part No. (or abbreviation code)  
Lot No.  
A line indicates  
lead (Pb)-free package or  
lead (Pb)-free finish.  
2
2006-11-06  
2SK3403  
I
– V  
I
– V  
DS  
D
DS  
D
10  
8
20  
16  
Common source  
Tc = 25°C  
Pulse test  
Common source  
Tc = 25°C  
Pulse test  
15  
10  
8.5  
7.5  
10  
8.25  
7.25  
8
15  
7.0  
6
12  
8
7.5  
4
6.5  
7
6.5  
V
= 6.0 V  
4
2
GS  
V
= 6 V  
GS  
0
0
0
0
2
4
6
8
10  
10  
20  
30  
40  
50  
Drain-source voltage  
V
DS  
(V)  
Drain-source voltage  
V
DS  
(V)  
I
D
– V  
V
– V  
DS GS  
GS  
30  
20  
10  
0
10  
8
Common source  
= 20 V  
Pulse test  
Common source  
Tc = 25°C  
Pulse test  
V
DS  
6
25  
I
= 13 A  
D
4
Tc = −55°C  
100  
6
3
2
0
0
3
6
9
12  
4
8
12  
16  
20  
Gate-source voltage  
V
GS  
(V)  
Gate-source voltage  
V
D
(V)  
GS  
Y – I  
fs  
R
– I  
DS (ON)  
D
50  
10  
10  
Common source  
Tc = 25°C  
Common source  
V
= 20 V  
DS  
Pulse test  
Pulse test  
Tc = −55°C  
25  
100  
1
1
V
= 10 V  
GS  
15  
0.1  
0.1  
0.1  
0.1  
1
10  
100  
1
10  
100  
Drain current  
I
(A)  
Drain current  
I
(A)  
D
D
3
2006-11-06  
2SK3403  
R
Tc  
I
– V  
DS  
DS (ON)  
DR  
1.0  
0.8  
0.6  
0.4  
0.2  
0
100  
10  
1
Common source  
= 10 V  
Common source  
Tc = 25°C  
V
GS  
6
Pulse test  
Pulse test  
I
= 13 A  
D
3
10  
3
1
V
= 0, 1 V  
GS  
V
5
0.1  
0
0.2  
0.4  
0.6  
0.8  
1  
1.2  
80  
40  
0
40  
80  
120  
160  
Case temperature Tc (°C)  
Drain-source voltage  
(V)  
DS  
Capacitance – V  
V
Tc  
th  
DS  
10000  
1000  
100  
10  
6
5
4
3
2
1
Common source  
= 10 V  
V
DS  
= 1 mA  
I
D
Pulse test  
C
iss  
C
oss  
Common  
source  
= 0 V  
C
rss  
V
GS  
f = 1 MHz  
Tc = 25°C  
0
80  
40  
0
40  
80  
120  
160  
1
0.1  
Case temperature Tc (°C)  
1
10  
100  
1000  
Drain-source voltage  
V
DS  
(V)  
P
Tc  
Dynamic input/output characteristics  
D
200  
160  
500  
20  
16  
12  
8
Common source  
I
= 13 A  
D
Tc = 25°C  
Pulse test  
400  
300  
200  
100  
0
V
V
= 90 V  
DD  
DS  
120  
80  
180  
360  
V
GS  
4
40  
0
0
50  
0
40  
80  
120  
160  
200  
0
10  
20  
30  
40  
Case temperature Tc (°C)  
Total gate charge  
Q
(nC)  
g
4
2006-11-06  
2SK3403  
r
th  
– t  
w
3
1
Duty = 0.5  
0.5  
0.3  
0.2  
0.1  
P
DM  
0.1  
0.05  
t
0.05  
0.03  
0.02  
0.01  
T
Single pulse  
Duty = t/T  
R
= 1.25°C/W  
th (ch-c)  
0.01  
10 μ  
100 μ  
1 m  
10 m  
100 m  
1
10  
Pulse width  
t
(S)  
w
Safe operating area  
E
AS  
– T  
ch  
400  
100  
I
max (pulse) *  
D
50  
30  
300  
200  
100  
0
I
max  
D
(continuous)  
100 μs *  
10  
1 ms *  
5
3
DC operation  
Tc = 25°C  
1
0.5  
0.3  
25  
50  
75  
100  
125  
150  
Channel temperature (initial) Tch (°C)  
* Single nonrepetitive pulse  
Tc = 25°C  
0.1  
Curves must be derated linearly  
with increase in temperature.  
0.05  
0.03  
V
max  
300  
DSS  
B
VDSS  
15 V  
3
10  
30  
100  
V
1000  
I
AR  
15 V  
Drain-source voltage  
(V)  
DS  
V
V
DS  
DD  
Test circuit  
Wave form  
1
2
B
VDSS  
2
R
V
= 25 Ω  
G
=
LI ⋅  
Ε
AS  
V
DD  
= 90 V, L = 3.46 mH  
B
VDSS  
DD  
5
2006-11-06  
2SK3403  
RESTRICTIONS ON PRODUCT USE  
20070701-EN  
The information contained herein is subject to change without notice.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc.  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his  
document shall be made at the customer’s own risk.  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patents or other rights of  
TOSHIBA or the third parties.  
Please contact your sales representative for product-by-product details in this document regarding RoHS  
compatibility. Please use these products in this document in compliance with all applicable laws and regulations  
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses  
occurring as a result of noncompliance with applicable laws and regulations.  
6
2006-11-06  

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