TLV5621ED [TI]

8 位、10us 四路 DAC,串行输入、简单 2 线接口、可编程 1x 或 2x 输出、断电功能 | D | 14 | -40 to 85;
TLV5621ED
型号: TLV5621ED
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

8 位、10us 四路 DAC,串行输入、简单 2 线接口、可编程 1x 或 2x 输出、断电功能 | D | 14 | -40 to 85

光电二极管 转换器 数模转换器
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中文:  中文翻译
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TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
2.7-V to 5.5-V Single-Supply Operation  
Low Power Consumption  
Half-Buffered Output  
Power-Down Mode  
Four 8-Bit Voltage Output DACs  
One-Half Power 8-Bit Voltage Output DAC  
Fast Serial Interface . . . 1 MHz Max  
applications  
Simple Two-Wire Interface In Single  
Buffered Mode  
Programmable Voltage Sources  
Digitally-Controlled Amplifiers/Attenuators  
Cordless/Wireless Communications  
Automatic Test Equipment  
High-Impedance Reference Inputs For Each  
DAC  
Programmable for 1 or 2 Times Output  
Range  
Portable Test Equipment  
Simultaneous-Update Facility In  
Double-Buffered Mode  
Process Monitoring and Control  
Signal Synthesis  
Internal Power-On Reset  
Industry Temperature Range  
D PACKAGE  
(TOP VIEW)  
description  
The TLV5621I is a quadruple 8-bit voltage output  
digital-to-analog converter (DAC) with buffered  
reference inputs (high impedance). The DAC  
produces an output voltage that ranges between  
either one or two times the reference voltages and  
GND, and the DAC is monotonic. The device is  
simple to use since it operates from a single  
supply of 2.7 V to 5.5 V. A power-on reset function  
is incorporated to provide repeatable start-up  
conditions. A global hardware shut-down terminal  
and the capability to shut down each individual  
DAC with software are provided to minimize  
power consumption.  
GND  
REFA  
REFB  
REFC  
REFD  
DATA  
CLK  
V
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
DD  
HWACT  
DACA  
DACB  
DACC  
DACD  
EN  
8
Digital control of the TLV5621I is over a simple 3-wire serial bus that is CMOS compatible and easily interfaced  
to all popular microprocessor and microcontroller devices. A TLV5621I 11-bit command word consists of  
eight bits of data, two DAC select bits, and a range bit for selection between the times one or times two output  
range. The TLV5621I digital inputs feature Schmitt triggers for high noise immunity. The DAC registers are  
double buffered which allows a complete set of new values to be written to the device, and then under control  
of the HWACT signal, all of the DAC outputs are updated simultaneously.  
The 14-terminal small-outline (D) package allows digital control of analog functions in space-critical  
applications. The TLV5621I does not require external trimming. The TLV5621I is characterized for operation  
from –40°C to 85°C.  
AVAILABLE OPTIONS  
PACKAGE  
SMALL OUTLINE  
T
A
(D)  
40°C to 85°C  
TLV5621ID  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
functional block diagram  
REFA  
+
DAC  
DAC  
DAC  
DAC  
+
DACA  
DACB  
DACC  
DACD  
× 2  
× 2  
× 2  
× 2  
8
8
8
8
8
Latch  
Latch  
Latch  
Latch  
Latch  
Latch  
Latch  
Latch  
REFB  
+
+
8
8
REFC  
REFD  
+
+
+
+
8
CLK  
DATA  
Power-On  
Reset  
Serial  
Interface  
EN  
HWACT  
Terminal Functions  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
CLK  
NO.  
7
12  
11  
10  
9
I
Serial interface clock, data enters on the negative edge  
DAC A analog output  
DACA  
DACB  
DACC  
DACD  
DATA  
EN  
O
O
O
O
I
DAC B analog output  
DAC C analog output  
DAC D analog output  
6
Serial-interface digital-data input  
Input enable  
8
I
GND  
1
Ground return and reference  
Global hardware activate  
HWACT  
REFA  
REFB  
REFC  
REFD  
13  
2
I
I
I
I
I
Reference voltage input to DACA  
Reference voltage input to DACB  
Reference voltage input to DACC  
Reference voltage input to DACD  
Positive supply voltage  
3
4
5
V
DD  
14  
detailed description  
The TLV5621 is implemented using four resistor-string DACs. The core of each DAC is a single resistor with  
256 taps, corresponding to the 256 possible codes listed in Table 1. One end of each resistor string is connected  
to GND and the other end is fed from the output of the reference input buffer. Monotonicity is maintained by use  
of the resistor strings. Linearity depends upon the matching of the resistor elements and upon the performance  
of the output buffer. Because the inputs are buffered, the DACs always present a high-impedance load to the  
reference source.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
Each DAC output is buffered by a configurable-gain output amplifier, which can be programmed to times one  
or times two gain.  
On power-up, the DACs are reset to CODE 0.  
Each output voltage is given by:  
CODE  
V (DACA|B|C|D)  
REF  
(1 RNG bit value)  
O
256  
where CODE is in the range 0 to 255 and the range (RNG) bit is a 0 or 1 within the serial control word.  
Table 1. Ideal-Output Transfer  
D7  
0
0
D6  
0
0
D5  
0
0
D4  
0
0
D3  
0
0
D2  
0
0
D1  
0
0
D0  
0
1
OUTPUT VOLTAGE  
GND  
(1/256) × REF (1+RNG)  
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
(127/256) × REF (1+RNG)  
(128/256) × REF (1+RNG)  
1
1
1
1
1
1
1
1
(255/256) × REF (1+RNG)  
data interface  
The data interface has two modes of operation; single and double buffered. Both modes serially clock in bits  
of data using DATA and CLK whenever EN is high. When EN is low, CLK is disabled and data cannot be loaded  
into the buffers.  
In the single buffered mode, the DAC outputs are updated on the last/twelfth falling edge of CLK, so this mode  
only requires a two-wire interface with EN tied high (see Figure 1 and Figure 2).  
In the double buffered mode (startup default), the outputs of the DACs are updated on the falling edge of the  
EN strobe (see Figure 3 and Figure 4). This allows multiple devices to share data and clock lines by having only  
separate EN lines.  
single-buffer mode (MODE = 1)  
When a two wire interface is used, EN is tied high and the input to the device is always active; therefore, random  
data can be clocked into the input latch. In order to regain word synchronization, twelve zeros are clocked in  
as shown in Figure 1, and then a data or control word is clocked in. In Figure 1, the MODE bit is set to one, and  
a control word is clocked in with the DAC outputs becoming active after the last falling edge of the control word.  
Figure 2 shows valid data being written to a DAC, note that CLK is held low while the data is invalid. Data can  
be written to all four DACs and then the control word is clocked in which sets the MODE bit to 1. At the end of  
the control word, the data is latched to the inputs of the DACs.  
Note that once the MODE bit has been set, it is not possible to clear it, i.e., it is not possible to move from single  
to double-buffered mode.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CLK  
MODE  
RNG RNG RNG RNG  
RS  
DATA  
DAC  
SIA SIB SIC SID ACT  
A
B
C
D
EN  
(Tied High)  
NOTE A: Twelve zeros enable word synchronization and the output can change after the leading edge of CLK depending on the data in the latches.  
Figure 1. Register Write Operation Following Noise or Undefined Levels on DATA or CLK (Single-Buffer Mode)  
CLK  
MODE  
RNG RNG RNG RNG  
DATA  
DAC  
RS  
A1  
A0  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
RS  
SIA SIB SIC SID ACT  
A
B
C
D
EN  
(Tied High)  
NOTE A: EN is held high and data is written to a DAC register. The data is latched to the output of the DAC on the falling edge of the last CLK of the control word, where the  
mode is set.  
Figure 2. First Nonzero Write Operation After Startup (EN = High)  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
double-buffered mode (MODE = 0)  
In this mode, data is only latched to the output of the DACs on the falling edge of the EN strobe. Therefore, all  
four DACs can be written to before updating their outputs.  
Any number of input data blocks can be written with all having the same length. Subsequent data blocks simply  
overwrite previous ones with the same address until EN goes low.  
Multiple data blocks can be written in any sequence provided signal timing limits are met. The negative going  
edge of EN terminates and latches all data.  
Multiple Random Sequence Data Blocks  
DATA  
Data Latched Into DAC Control Registers and Control Word  
EN  
Figure 3. Data and Control Serial Control  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
CLK  
RNG RNG RNG RNG  
MODE  
RS  
RS  
A1  
A0  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
SIA SIB SIC SID ACT  
DATA  
A
B
C
D
DAC  
EN  
NOTE A: Data is written to the output of a DAC, and the data is latched to the output on the falling edge of EN. A control word then selects double-buffered mode. When the  
range is changed, the output changes on the falling edge of EN.  
Figure 4. First Nonzero Write Operation After Startup  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
control register  
The control register contains ten active bits. Four bits are range select bits as on the TLC5620. The register also  
contains a software shutdown bit (ACT) and four shutdown inhibit bits (SIA, SIB, SIC, SID). The shutdown inhibit  
bits act on each DAC (DACA through DACD). The mode select bit is used to change between single and double  
buffered modes. The bits in the control register are listed in Table 2.  
Table 2. Control Register Bits  
BIT  
MODE  
RNG A  
RNG B  
RNG C  
RNG D  
SIA  
FUNCTION  
Selection bit for type of interface (see data interface section)  
Range select bit for DACA, 0 = 1, 1 =  
Range select bit for DACB, 0 = 1, 1 =  
Range select bit for DACC, 0 = 1, 1 =  
Range select bit for DACD, 0 = 1, 1 =  
Shutdown inhibit bit for DACA  
2
2
2
2
SIB  
Shutdown inhibit bit for DACB  
SIC  
Shutdown inhibit bit for DACC  
SID  
Shutdown inhibit bit for DACD  
ACT  
Software shutdown bit  
The SIx bits inhibit the actions of the shutdown bits as shown in Table 3. When the ACT bit is 1 or the HWACT  
signal is high (active), the inhibit bits act as enable bits in inverse logic terms. The ACT software shutdown bit  
and HWACT (asynchronously acting hardware terminal) are logically ORed together.  
This configuration allows any combination of DACs to be shut down to save power.  
Table 3. Shutdown Inhibit Bits and HWACT Signal  
SIx  
0
ACT  
HWACT  
DACx STATUS  
Shutdown (see Note 1)  
Shutdown  
0
0
1
1
0
0
1
1
L
H
L
0
0
Shutdown  
0
H
L
Active (see Note 1)  
Active  
1
1
H
L
Active  
1
Active  
1
H
Active  
NOTE 1: Sense of HWACT terminal and ACT bit were changed from early  
versions of this specification.  
The values of the input address select bits, A0 and A1, and the updated DAC are listed in Table 4.  
Table 4. Serial Input Decode  
INPUT ADDRESS SELECT BITS  
DAC UPDATED  
A1  
A0  
0
0
DACA  
DACB  
DACC  
DACD  
0
1
1
0
1
1
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
power-on reset  
Power-on reset circuitry is available on the TLV5621I. The threshold to trigger a power-on reset is 1.95 V typical  
(1.4 V min and 2.5 V max). For a power-on reset, all DACs are shut down. The control register bit values and  
states after a power-on reset are listed in Table 5.  
Table 5. Control Register Bit Values and States After Power-On Reset  
BIT  
MODE  
RNG A  
RNG B  
RNG C  
RNG D  
SIA  
VALUE  
STATE AFTER POWER-ON RESET  
0
1
1
1
1
0
0
0
0
0
Double buffer mode selected  
Range  
Range  
Range  
Range  
2
2
2
2
Shutdown affects DACA according to ACT state  
Shutdown affects DACB according to ACT state  
Shutdown affects DACC according to ACT state  
Shutdown affects DACD according to ACT state  
DACs in shutdown state  
SIB  
SIC  
SID  
ACT  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
linearity, offset, and gain error using single-end supplies  
When an amplifier is operated from a single supply, the voltage offset can still be either positive or negative. With  
a positive offset, the output voltage changes on the first code change. With a negative offset the output voltage  
may not change with the first code depending on the magnitude of the offset voltage.  
The output amplifier attempts to drive the output to a negative voltage. However, because the most negative  
supply rail is ground, the output cannot drive below ground and clamps the output at 0 V.  
The output voltage then remains at zero until the input code value produces a sufficient positive output voltage  
to overcome the negative offset voltage, resulting in the transfer function shown in Figure 5.  
Output  
Voltage  
0 V  
DAC Code  
Negative  
Offset  
Figure 5. Effect of Negative Offset (Single Supply)  
This offset error, not the linearity error, produces this breakpoint. The transfer function would have followed the  
dotted line if the output buffer could drive below the ground rail.  
For a DAC, linearity is measured between zero-input code (all inputs 0) and full-scale code (all inputs 1) after  
offset and full scale are adjusted out or accounted for in some way. However, single supply operation does not  
allow for adjustment when the offset is negative due to the breakpoint in the transfer function. So the linearity  
is measured between full-scale code and the lowest code that produces a positive output voltage. The code is  
calculated from the maximum specification for the negative offset.  
equivalent inputs and outputs  
INPUT CIRCUIT  
OUTPUT CIRCUIT  
V
DD  
V
DD  
_
+
Input from  
Decoded DAC  
Register String  
DAC  
Voltage Output  
V
ref  
Input  
× 1  
84 k  
Output  
Range  
Select  
To DAC  
Resistor  
String  
I
× 2  
SINK  
60 µA  
Typical  
84 kΩ  
GND  
GND  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage (V  
– GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
DD  
Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND – 0.3 V to V  
Reference input voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND – 0.3 V to V  
Operating free-air temperature range, T  
Storage temperature range, T  
+ 0.3 V  
+ 0.3 V  
DD  
DD  
ID  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C to 150°C  
A
stg  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
recommended operating conditions  
MIN  
NOM  
MAX  
UNIT  
V
Supply voltage, V  
(see Note 2)  
2.7  
3.3  
5.5  
DD  
High-level digital input voltage, V  
0.8 V  
V
IH  
DD  
Low-level digital input voltage, V  
0.2 V  
V
IL  
Reference voltage, V [A|B|C|D], x1 gain  
DD  
GND  
V
DD  
1.5  
V
ref  
Load resistance, R  
10  
50  
kΩ  
ns  
ns  
ns  
ns  
L
Setup time, data input, t  
su(DATA-CLK)  
Hold time, data input valid after CLK, t  
(see Figure 6)  
(see Figure 6)  
50  
h(DATA-CLK)  
(see Figure 7)  
Setup time, CLKto EN, t  
Setup time, ENto CLK, t  
100  
100  
su(CLK-EN)  
su(EN-CLK)  
(see Figure 7) (see Note 3)  
Pulse duration, EN low, t  
(see Figure 7) (see Note 3)  
200  
400  
ns  
ns  
w(EN)  
Pulse duration, CLK high, t  
CLK frequency  
(see Figure 6) (see Note 3)  
w(CLK)  
1
MHz  
°C  
Operating free-air temperature, T  
–40  
85  
A
NOTES: 2. The device operates over the supply voltage range of 2.7 V to 5.5 V. Over this voltage range the device responds correctly to data  
input by changing the output voltage but conversion accuracy is not specified over this extended range.  
3. This is specified by design but is not production tested.  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
electrical characteristics over recommended operating free-air temperature range,  
V
= 3 V to 3.6 V, V = 1.25 V, GND = 0 V, R = 10 k, C = 100 pF, × 1 gain output range  
DD  
ref L L  
(unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Maximum full-scale output  
voltage  
V
O
max  
V
ref  
= 1.5 V, open circuit output, × 2 gain  
V – 100  
DD  
2
mV  
I
I
High-level digital input current  
Low-level digital input current  
Output sink current, DACA  
V = V  
±10  
±10  
µA  
µA  
µA  
IH(digital)  
I
DD  
V = 0 V  
I
IL(digital)  
DAC code 0  
5
20  
1
I
I
Output sink current, DACB,  
DACC, DACD  
O(sink)  
DAC code 0  
µA  
Output source current  
Input capacitance  
Each DAC output, DAC code 255  
mA  
O(source)  
15  
15  
1
C
pF  
i
Reference input capacitance  
A, B, C, D inputs  
V
= 3.6 V  
= 5 V  
1.5  
1.5  
mA  
mA  
DD  
DD  
I
I
Supply current  
DD  
V
1
Supply current, one low power  
DAC active  
V
= 3.6 V, See Note 4  
= 3.6 V, See Note 4  
150  
50  
250  
100  
µA  
µA  
DD(active)  
DD  
DD  
Supply current, all DACs shut  
down  
I
I
V
DD(shutdown)  
Reference input current  
Integral linearity error  
Differential linearity error  
Zero-scale error  
A, B, C, D inputs  
±10  
±1  
µA  
LSB  
LSB  
mV  
ref  
E
E
E
V
= 1.25 V, × 2 gain, See Notes 5 and 13  
= 1.25 V, × 2 gain, See Notes 6 and 13  
= 1.25 V, × 2 gain, See Note 7  
ref  
L
ref  
V
ref  
±0.1  
±0.9  
30  
D
V
0
ZS  
Zero-scale error temperature  
coefficient  
V
= 1.25 V, × 2 gain, See Note 8  
10  
2
µV/°C  
ref  
Zero-scale error supply rejection  
Full-scale error  
mV/V  
mV  
E
FS  
V
ref  
= 1.25 V, × 2 gain, See Note 9  
= 1.25 V, × 2 gain, See Note 10  
±60  
Full-scale error temperature  
coefficient  
V
ref  
±25  
µV/°C  
Full-scale error supply rejection  
Power-supply sensitivity  
2
mV/V  
mV/V  
PSRR  
See Notes 11 and 12  
0.5  
Feedback resistor network  
resistance  
168  
kΩ  
NOTES: 4. This is measured with no load (open circuit output), V = 1.25 V, range = × 2.  
ref  
5. Integral nonlinearity (INL) is the maximum deviation of the output from the line between zero and full scale (excluding the effects  
of zero code and full-scale errors).  
6. Differentialnonlinearity (DNL) is the difference between the measured and ideal 1 LSB amplitude change of any two adjacent codes.  
Monotonic means the output voltage changes in the same direction (or remains constant) as a change in the digital input code.  
7. Zero-scale error is the deviation from zero voltage output when the digital input code is zero.  
6
8. Zero-scale error temperature coefficient is given by: ZSETC = [ZSE(T  
) – ZSE(T  
)]/V × 10 /(T  
– T  
).  
min  
max  
min ref max  
9. Full-scale error is the deviation from the ideal full-scale output (V – 1 LSB) with an output load of 10 k.  
ref  
6
10. Full-scale temperature coefficient is given by: FSETC = [FSE(T  
max  
) – FSE (T  
)]/V × 10 /(T  
ref max  
voltage from 4.5 V to 5.5 V dc and measuring the effect  
– T  
).  
min  
min  
11. Zero-scale error rejection ratio (ZSE-RR) is measured by varying the V  
of this signal on the zero-code output voltage.  
DD  
12. Full-scale error rejection ratio (FSE-RR) is measured by varing the V  
this signal on the full-scale output voltage.  
voltage from 3 V to 3.6 V dc and measuring the effect of  
DD  
13. Linearity is only specified for DAC codes 1 through 255.  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
operating characteristics over recommended operating free-air temperature range,  
V
= 3 V to 3.6 V, V = 1.25 V, GND = 0 V, R = 10 k, C = 100 pF, × 1 gain output range  
DD  
ref L L  
(unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
0.8  
0.5  
1
MAX  
UNIT  
V/µs  
V/µs  
V/µs  
µs  
Output slew rate, rising (DACA)  
Output slew rate, falling (DACA)  
Output slew rate (DACB, DACC, DACD)  
Output settling time, rising (DACA)  
Output settling time, falling (DACA)  
To 1/2 LSB,  
To 1/2 LSB,  
V
V
= 3 V  
= 3 V  
20  
DD  
75  
µs  
DD  
Output settling time, rising (DACB, DACC,  
DACD)  
To 1/2 LSB,  
To 1/2 LSB,  
To 1/2 LSB,  
V
V
V
= 3 V  
= 3 V  
= 3 V  
10  
75  
40  
µs  
µs  
µs  
DD  
DD  
DD  
Output settling time, falling (DACB, DACC,  
DACD)  
Output settling time, HWACT or ACTto  
output volts (DACA) (see Note 14)  
120  
Output settling time, HWACT or ACTto  
output volts (DACB, DACC, DACD)  
(see Note 14)  
To 1/2 LSB,  
V
DD  
= 3 V  
25  
75  
µs  
Large-signal bandwidth  
Digital crosstalk  
Measured at 3 dB point  
100  
50  
60  
60  
kHz  
dB  
CLK = 1-MHz square wave measured at DACA–DACD  
A, B, C, D inputs, See Note 15  
Reference feedthrough  
Channel-to-channel isolation  
dB  
A, B, C, D inputs, See Note 16  
dB  
Channel-to-channel isolation when in  
shutdown  
A, B, C, D inputs  
40  
dB  
Reference bandwidth (DACA)  
See Note 17  
20  
kHz  
kHz  
Reference bandwidth (DACB, DACC, DACD) See Note 17  
100  
This is specified by characterization but is not production tested.  
NOTES: 14. The ACT bit is latched on EN.  
15. Reference feedthrough is measured at any DAC output with an input code = 00 hex with a V input = 1 V dc + 1 V  
16. Channel-to-channel isolation is measured by setting the input code of one DAC to FF hex and the code of all other DACs to 00 hex  
at 10 kHz.  
ref  
PP  
with V input = 1 V dc + 1 V  
ref PP  
at 10 kHz.  
17. Reference bandwidth is the –3 dB bandwidth with an ideal input at V = 1.25 V dc + 2 V  
and with a digital input code of full-scale  
ref PP  
(range set to × 1 and V  
= 5 V).  
DD  
12  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
PARAMETER MEASUREMENT INFORMATION  
t
w(CLK)  
50%  
50%  
50%  
CLK  
t
h(DATA-CLK)  
t
su(DATA-CLK)  
DATA  
Figure 6. Timing of DATA Relative to CLK  
EN  
50%  
t
50%  
t
w(EN)  
su(EN-CLK)  
t
su(CLK-EN)  
50%  
50%  
CLK  
DATA  
Figure 7. Timing of CLK Relative to EN  
TLV5621  
DACA  
DACB  
DACC  
10 kΩ  
C
= 100 pF  
L
DACD  
Figure 8. Slewing Settling Time and Linearity Measurements  
13  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
TYPICAL CHARACTERISTICS  
POSITIVE RISE TIME AND SETTLING TIME  
NEGATIVE FALL TIME AND SETTLING TIME  
3
2.5  
2
3
2.5  
2
V
T
A
= 3 V  
DD  
= 25°C  
Code FF to  
00 Hex  
Range = ×2  
1.5  
1
1.5  
1
V
ref  
= 1.25 V  
V
= 3 V  
DD  
= 25°C  
(see Notes  
A and B)  
T
A
0.5  
0.5  
Code 00 to  
FF Hex  
Range = ×2  
0
0
V
ref  
= 1.25 V  
(see Notes  
A and B)  
0.5  
0.5  
–1  
–1  
0
2
4
6
8
10 12 14 16 18 20  
0
2
4
6
8
10 12 14 16 18 20  
t – Time – µs  
t – Time – µs  
NOTES: A. Fall time = 4.25 µs, negative slew rate = 0.46 V/µs,  
settling time = 8.5 µs.  
NOTES: A. Rise time = 2.05 µs, positive slew rate = 0.96 V/µs,  
settling time = 4.5 µs.  
B. For DACB, DACC, and DACD  
B. For DACB, DACC, and DACD  
Figure 9  
Figure 10  
DAC OUTPUT VOLTAGE  
DAC OUTPUT VOLTAGE  
vs  
LOAD RESISTANCE  
vs  
LOAD RESISTANCE  
1.6  
3
2.8  
2.6  
2.4  
2.2  
2
1.4  
1.2  
1
0.8  
0.6  
1.8  
1.6  
V
= 3 V  
= 1.5 V  
DD  
V
= 3 V  
= 1.5 V  
0.4  
DD  
V
ref  
V
ref  
1.4  
1.2  
1
Range = ×1  
Range = ×2  
(see Note A)  
0.2  
0
(see Note A)  
0
10 20 30 40 50 60 70 80 90 100  
0
10 20 30 40 50 60 70 80 90 100  
R
– Load Resistance – kΩ  
R
– Load Resistance – kΩ  
L
L
NOTE A: For DACB, DACC, and DACD  
NOTE A: For DACB, DACC, and DACD  
Figure 11  
Figure 12  
14  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
TYPICAL CHARACTERISTICS  
SUPPLY CURRENT  
vs  
FREE-AIR TEMPERATURE  
1.2  
Range = ×2  
Input Code = 255  
1.15  
V
V
= 3 V  
= 1.25 V  
DD  
ref  
1.1  
1.05  
1
0.95  
0.9  
0.85  
0.8  
50  
0
50  
100  
T
A
– Free-Air Temperature – °C  
Figure 13  
APPLICATION INFORMATION  
_
+
TLV5621  
V
O
DACA  
DACB  
DACC  
DACD  
R
NOTE A: Resistor R  
10 kΩ  
Figure 14. Output Buffering Scheme  
15  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV5621I  
LOW-POWER QUADRUPLE 8-BIT DIGITAL-TO-ANALOG CONVERTER  
SLAS138B – APRIL 1996 – REVISED FEBRUARY 1997  
MECHANICAL DATA  
D (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PIN SHOWN  
PINS **  
0.050 (1,27)  
8
14  
16  
DIM  
0.020 (0,51)  
0.014 (0,35)  
0.010 (0,25)  
0.197  
(5,00)  
0.344  
(8,75)  
0.394  
(10,00)  
M
A MAX  
14  
8
0.189  
(4,80)  
0.337  
(8,55)  
0.386  
(9,80)  
A MIN  
0.244 (6,20)  
0.228 (5,80)  
0.008 (0,20) NOM  
0.157 (4,00)  
0.150 (3,81)  
Gage Plane  
1
7
A
0.010 (0,25)  
0°8°  
0.044 (1,12)  
0.016 (0,40)  
Seating Plane  
0.004 (0,10)  
0.010 (0,25)  
0.004 (0,10)  
0.069 (1,75) MAX  
4040047/B 10/94  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Four center pins are connected to die mount pad.  
E. Falls within JEDEC MS-012  
16  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1998, Texas Instruments Incorporated  

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