SN74LVC1G06-EP [TI]

SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT; 单个逆变器缓冲器/驱动器,具有漏极开路输出
SN74LVC1G06-EP
型号: SN74LVC1G06-EP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
单个逆变器缓冲器/驱动器,具有漏极开路输出

驱动器 输出元件
文件: 总7页 (文件大小:142K)
中文:  中文翻译
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SN74LVC1G06-EP  
SINGLE INVERTER BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES669AJULY 2006REVISED MARCH 2007  
FEATURES  
Controlled Baseline  
Voltages up to 5.5 V  
One Assembly Site  
One Test Site  
Max tpd of 4 ns at 3.3 V  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
One Fabrication Site  
Extended Temperature Performance of –55°C  
to 125°C  
Ioff Supports Partial-Power-Down Mode  
Operation  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Enhanced Product-Change Notification  
ESD Protection Exceeds JESD 22  
(1)  
Qualification Pedigree  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1000-V Charged-Device Model (C101)  
Supports 5-V VCC Operation  
Input and Open-Drain Output Accept  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
DCK PACKAGE  
(TOP VIEW)  
NC  
A
V
1
2
3
5
CC  
4
GND  
Y
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
The SN74LVC1G06 is a single inverter buffer/driver that is designed for 1.65-V to 5.5-V VCC operation.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to  
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN74LVC1G06-EP  
SINGLE INVERTER BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES669AJULY 2006REVISED MARCH 2007  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(3)  
SN74LVC1G06MDCKREP(4)  
CBA  
–55°C to 125°C  
SOT (SC-70) – DCK  
Reel of 3000  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
Web site at www.ti.com.  
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(3) The actual top-side marking has one additional character that designates the assembly/test site.  
(4) Product Preview  
FUNCTION TABLE  
INPUT  
A
OUTPUT  
Y
H
L
L
H
LOGIC DIAGRAM (POSITIVE LOGIC)  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
–0.5  
MAX  
6.5  
UNIT  
V
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Voltage range applied to any output in the high or low state(2)(3)  
6.5  
V
VO  
VO  
IIK  
6.5  
V
6.5  
V
Input clamp current  
VI < 0 V  
–50  
–50  
±50  
±100  
252  
150  
mA  
mA  
mA  
mA  
°C/W  
°C  
IOK  
IO  
Output clamp current  
VO < 0 V  
Continuous output current  
Continuous current through VCC or GND  
Package thermal impedance(4)  
Storage temperature range  
θJA  
Tstg  
–65  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCC is provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
Recommended Operating Conditions(1)  
MIN  
1.65  
MAX UNIT  
Operating  
5.5  
V
VCC  
Supply voltage  
Data retention only  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
1.5  
0.65 × VCC  
1.7  
VIH  
High-level input voltage  
V
2
0.7 × VCC  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
2
Submit Documentation Feedback  
SN74LVC1G06-EP  
SINGLE INVERTER BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES669AJULY 2006REVISED MARCH 2007  
Recommended Operating Conditions (continued)  
MIN  
MAX UNIT  
0.35 × VCC  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
0.7  
VIL  
Low-level input voltage  
V
0.8  
0.3 × VCC  
VI  
Input voltage  
0
0
5.5  
5.5  
4
V
V
VO  
Output voltage  
VCC = 1.65 V  
VCC = 2.3 V  
8
IOL  
Low-level output current  
16  
24  
32  
20  
10  
5
mA  
VCC = 3 V  
VCC = 4.5 V  
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V  
VCC = 3.3 V ± 0.3 V  
VCC = 5 V ± 0.5 V  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
TA  
–55  
125  
°C  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
1.65 V to 5.5 V  
1.65 V  
MIN TYP(1)  
MAX  
0.1  
UNIT  
IOL = 100 µA  
IOL = 4 mA  
0.45  
0.3  
IOL = 8 mA  
2.3 V  
VOL  
V
IOL = 16 mA  
0.4  
3 V  
IOL = 24 mA  
0.55  
0.55  
±1  
IOL = 32 mA  
4.5 V  
0 V to 5.5 V  
0 V  
II  
A input  
VI = 5.5 V or GND  
VI or VO = 5.5 V  
VI = 5.5 V or GND,  
µA  
µA  
µA  
µA  
pF  
pF  
Ioff  
ICC  
±10  
10  
IO = 0  
1.65 V to 5.5 V  
3 V to 5.5 V  
3.3 V  
ICC  
Ci  
One input at VCC – 0.6 V,  
VI = VCC or GND  
Other inputs at VCC or GND  
500  
4
5
Co  
VO = VCC or GND  
3.3 V  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
Switching Characteristics  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)  
VCC = 1.8 V  
± 0.15 V  
VCC = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN MAX  
MIN  
MAX  
tpd  
A
Y
2.2  
8
1.1  
6
1.2  
6
1
5.5  
ns  
Operating Characteristics  
TA = 25°C  
VCC = 1.8 V  
VCC = 2.5 V  
VCC = 3.3 V  
VCC = 5 V  
PARAMETER  
TEST CONDITIONS  
UNIT  
TYP  
TYP  
TYP  
TYP  
Cpd Power dissipation capacitance  
f = 10 MHz  
3
3
4
6
pF  
3
Submit Documentation Feedback  
SN74LVC1G06-EP  
SINGLE INVERTER BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES669AJULY 2006REVISED MARCH 2007  
PARAMETER MEASUREMENT INFORMATION  
(Open Drain)  
V
LOAD  
S1  
Open  
R
L
TEST  
S1  
From Output  
Under Test  
GND  
t
(see Notes E and F)  
(see Notes E and G)  
V
V
V
PZL  
LOAD  
LOAD  
LOAD  
R
L
C
L
t
PLZ  
(see Note A)  
t
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUT  
V
M
V
LOAD  
C
L
V
R
L
V
CC  
V
I
t /t  
r f  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
V
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
/2  
/2  
2 × V  
2 × V  
6 V  
1 kΩ  
500 Ω  
500 Ω  
500 Ω  
0.15 V  
0.15 V  
0.3 V  
30 pF  
30 pF  
50 pF  
50 pF  
CC  
CC  
CC  
V
CC  
V
CC  
CC  
3 V  
1.5 V  
/2  
V
CC  
V
CC  
2 × V  
CC  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
h
su  
V
I
V
I
V
M
V
M
Input  
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
I
I
Output  
Control  
V
M
V
M
V
M
V
M
Input  
0 V  
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
PLH  
Output  
Waveform 1  
V
V
/2  
/2  
LOAD  
V
V
OH  
V
V
V
V
V
M
M
M
Output  
V
V
+ V  
OL  
S1 at V  
LOAD  
OL  
OL  
(see Note B)  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
V
LOAD  
V
V
OH  
− V  
LOAD/2  
M
V
M
M
Output  
S1 at V  
LOAD  
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E. Since this device has open-drain outputs, t  
and t are the same as t .  
PZL pd  
PLZ  
F.  
G.  
t
t
is measured at V .  
M
is measured at V + V .  
OL  
PZL  
PLZ  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
4
Submit Documentation Feedback  
PACKAGE OPTION ADDENDUM  
www.ti.com  
29-Mar-2007  
PACKAGING INFORMATION  
Orderable Device  
SN74LVC1G06MDCKREP  
V62/06655-01XE  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SC70  
DCK  
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
DCK  
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
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improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
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