MRF16006 [TE]

RF POWER TRANSISTOR NPN SILICON; RF功率晶体管NPN硅
MRF16006
型号: MRF16006
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

RF POWER TRANSISTOR NPN SILICON
RF功率晶体管NPN硅

晶体 晶体管 CD 放大器 局域网
文件: 总5页 (文件大小:143K)
中文:  中文翻译
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SEMICONDUCTOR TECHNICAL DATA  
by MRF16006/D  
The RF Line  
NP N S ilic on  
M
R
F
1
6
0
0
6
RF Power Transistor  
Designed for 28 Volt microwave large–signal, common base, Class–C CW  
amplifier applications in the range 1600 – 1640 MHz.  
6.0 WATTS, 1.6 GHz  
RF POWER TRANSISTOR  
NPN SILICON  
Specified 28 Volt, 1.6 GHz Class–C Characteristics  
Output Power = 6 Watts  
Minimum Gain = 7.4 dB, @ 6 Watts  
Minimum Efficiency = 40% @ 6 Watts  
Characterized with Series Equivalent Large–Signal Parameters from  
1500 MHz to 1700 MHz  
Silicon Nitride Passivated  
Gold Metallized, Emitter Ballasted for Long Life and Resistance to  
Metal Migration  
CASE 395C–01, STYLE 2  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Collector–Emitter Voltage  
Emitter–Base Voltage  
Symbol  
Value  
60  
Unit  
Vdc  
Vdc  
Adc  
V
CES  
V
EBO  
4.0  
Collector–Current  
I
C
1.0  
Total Device Dissipation @ T = 25°C  
P
D
26  
Watts  
C
Derate above 25°C  
0.15  
W/°C  
Storage Temperature Range  
T
–65 to +150  
6.8  
°C  
stg  
THERMAL CHARACTERISTICS  
Thermal Resistance — Junction to Case (1) (2)  
R
°C/W  
θ
JC  
(1) Thermal measurement performed using CW RF operating condition.  
(2) Thermal resistance is determined under specified RF operating conditions by infrared measurement techniques.  
REV 2  
1
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Typ  
Max  
Unit  
Collector–Emitter Breakdown Voltage  
V
Vdc  
Vdc  
(BR)CES  
(BR)CBO  
(BR)EBO  
(I = 40 mAdc, V = 0)  
55  
55  
4.0  
C
BE  
Collector–Base Breakdown Voltage  
(I = 40 mAdc, I = 0)  
V
V
C
E
Emitter–Base Breakdown Voltage  
(I = 2.5 mAdc, I = 0)  
Vdc  
E
C
Collector Cutoff Current  
I
mAdc  
CES  
(VCE = 28 Vdc, V = 0)  
2.5  
BE  
ON CHARACTERISTICS  
DC Current Gain  
h
pf  
FE  
(I = 0.2 Adc, V = 5.0 Vdc)  
CE  
20  
11  
80  
CE  
DYNAMIC CHARACTERISTICS  
Output Capacitance  
C
G
ob  
(V = 28 Vdc, f = 1.0 MHz)  
CB  
FUNCTIONAL TESTS  
Common–Base Amplifier Power Gain  
dB  
%
pe  
(V = 28 Vdc, P = 6 Watts, f = 1600/1640 MHz)  
CC  
7.4  
40  
45  
out  
Collector Efficiency  
η
(V = 28 Vdc, P = 6 Watts, f = 1600/1640 MHz)  
CC  
out  
Return Loss  
I
RL  
dB  
(V = 28 Vdc, P = 6 Watts, f = 1600/1640 MHz)  
CC  
8.0  
out  
Output Mismatch Stress  
(V = 28 Vdc, P = 6 Watts, f = 1600 MHz, Load  
ψ
No Degradation in Output Power  
CC  
out  
VSWR = 3:1 all phase angles at frequency of test)  
REV 2  
2
L
3
1
B
1
28  
V
d
c
R
L
2
C
1
C
2
C
3
C 4  
L
1
C
5
Board Material – Teflon Glass Laminate Dielectric  
Thickness – 0.30, ε = 2.55, 2.0 oz. Copper  
r
B1  
Fair Rite Bead on #24 Wire  
C4  
47 µF, 50 V, Electrolytic Cap  
C1, C5 100 pF, B Case, ATC Chip Cap  
L1, L2  
L3  
R1  
3 Turns, #18, 0.133ID, 0.15Long  
9 Turns, #24 Enamel  
82 Ω, 1.0 W, Carbon Resistor  
C2  
C3  
0.1 µF, Dipped Mica Cap  
0.1 µF, Chip Cap  
Figure 1. MRF16006 Test Fixture Schematic  
Z
i
n
f
=
1
.
5
G Hz  
1
.
7
G
H
z
1
.
6
G Hz  
Z
= Ω  
1
0
o
1
.
7
G
H
z
1
.
6
f
G
=
H
z
Z
*
O L  
1
.
5
G Hz  
V
C C  
=
2
8
V dc,  
o ut  
=
P
6
W
f
Z
in  
Z
OL  
*
MHz  
1500  
1600  
1700  
Ohms  
Ohms  
Z
*
=
C
o
n
j
u
g
a
t
e
o
f
t
h
e
o
p
t
i
m
u
m
l
o
a
d
i
m
p
e
d
a
n
c
e
i
n
t
o
w
fr eq u e n cy.  
h
i
c
h
t
h
e
d e vic e  
O L  
6.28 + j 8.53  
7.04 + j 9.00  
9.55 + j 12.86  
1.22 – j 1.37  
1.58 – j 0.53  
1.71 + j 0.39  
o
u
t
p
u
t
o
p
e
r
a
t
e
s
a
t
a
g
i
v
e
n
o
u
t
p
u
t
p
o
w
e
r,  
v
o
l
t
a
g
e
a
n
d
Figure 2. Series Equivalent Input/Output Impedance  
REV 2  
3
1
2
0
8
6
1
f
=
1
.
6
G Hz  
1
.6  
4
G Hz  
V
=
5
2
8
V dc  
4
C
C
2
0
0
.
2
5
0
.
4
5
0
.
65  
0
.8  
5
1
.
0
5
1
.
2
1
.
4
5
P ,  
i n  
I
N
P
U
T
P
O
WE  
R
(WATTS )  
Figure 3. Output Power versus Input Power  
REV 2  
4
PACKAGE DIMENSIONS  
–A–  
U
Q 2 PL  
1
M
M
M
B
0
.5  
1
(
0
.
02  
0
)
T
A
N O TE S :  
1. D I MEN S IO N I N G A ND TO LE R AN C IN G PE R AN S I  
Y 14. 5M, 198 2.  
2
.
C
O
N
T
R
O
L
L
I
N
G
D
I
M
E
N
S
I
O
N
:
I
N
C
H
.
–B–  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
18. 77  
6. 10  
4. 19  
5. 46  
1. 40  
2. 01  
0. 10  
5. 33  
8. 00  
3. 18  
MAX  
19 .0 5  
6.6 0  
5.0 3  
5.7 2  
1.7 8  
2.3 1  
0.1 5  
6.1 0  
8.3 8  
3.4 2  
3
A
B
C
D
E
H
J
0. 739  
0. 240  
0. 165  
0. 215  
0. 055  
0. 079  
0. 004  
0. 210  
0. 315  
0. 125  
0. 750  
0. 260  
0. 198  
0. 225  
0. 070  
0. 091  
0. 006  
0. 240  
0. 330  
0. 135  
K
2
K
N
Q
U
S TY LE 2:  
P IN 1. E MIT T ER  
D
N
2. C O LLE C TO R  
3. B AS E  
0. 560 ꢀB SC  
14. 23 ꢀB SC  
E
J
C
H
SEATING  
PLANE  
–T–  
CASE 395C–01  
ISSUE A  
Specifications subject to change without notice.  
n North America: Tel. (800) 366-2266, Fax (800) 618-8883  
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298  
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020  
Visit www.macom.com for additional data sheets and product information.  
REV 2  
5

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