VN771P13TR [STMICROELECTRONICS]

BRUSH DC MOTOR CONTROLLER, 14A, PDSO28, SO-28;
VN771P13TR
型号: VN771P13TR
厂家: ST    ST
描述:

BRUSH DC MOTOR CONTROLLER, 14A, PDSO28, SO-28

电动机控制 光电二极管
文件: 总11页 (文件大小:95K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
VN771P  
QUAD SMART POWER SOLID STATE RELAY  
FOR COMPLETE H BRIDGE CONFIGURATIONS  
TYPE  
RDS(on)  
*
IOUT  
VCC  
VN771P  
0.135  
14 A  
26 V  
* Total resistance of one side in bridge configuration  
SUITED AS LOW VOLTAGE BRIDGE  
LINEAR CURRENT LIMITATION  
VERY LOW STAND-BY POWER  
DISSIPATION  
SHORT CIRCUIT PROTECTED  
STATUS FLAG DIAGNOSTICS  
OPEN DRAIN DIAGNOSTICS OUTPUT  
INTEGRATED CLAMPING CIRCUITS  
UNDER-VOLTAGE PROTECTION  
ESD PROTECTION  
SO-28  
short circuit and over current condition, the  
thermal protection turns the integrated Power  
MOS off at a minimum junction temperature of  
140 oC. When this temperature returns to 125 oC  
the switch is automatically turned on again. In  
short circuit the protection reacts with virtually no  
delay, the sensor (one for each channel) being  
located inside each of the two Power MOS areas.  
This positioning allows the device to operate with  
one channel in automatic thermal cycling and the  
other one on a normal load. An internal function  
of the devices ensures the fast demagnetization  
DESCRIPTION  
The VN771P is a device formed by three  
monolithic chips housed in a standard SO28  
package: a double high side and two low side  
switches. Both the double high side and low side  
switches are made using STMicroelectronics  
VIPower technology. This device is suitable to  
drive a DC motor in a bridge configurationas well  
as to be used as a quad switch for any low  
voltage application. The dual high side switches  
have built-in thermal shut-down to protect the  
chip from over temperature and short circuit,  
status output to provide indication for open load  
in off and on state, overtemperature conditions  
and stuck-on to VCC. The low side switches are  
two OMNIFET types (fully autoprotected Power  
MOSFET in VIPower technology). They have  
built-in thermal shut-down, linear current limitation  
and overvoltage clamping. Fault feedback for  
thermal intervention can be detected by  
monitoring the voltage at the input pin.  
of inductive loads with a typical voltage (Vdemag  
)
of -18V. This function allows to greatly reduces  
the power dissipation according to the formula:  
dem =0.5Lload (Iload)2 [(VCC+Vdemag)/Vdemag] f  
where f = switching frequencyand  
demag = demagnetizationvoltage.  
In this device if the GND pin is disconnected,with  
VCC not exceeding 16V, both channel will switch  
off.  
P
V
LOW-SIDE SWITCHES  
DUAL HIGH-SIDE SWITCH  
During normal operation, the Input pin is  
electrically connected to the gate of the internal  
power MOSFET. The device then behaves like a  
standard power MOSFET and can be used as a  
switch from DC to 50 KHz. The only difference  
from the user’s standpoint is that a small DC  
current (Iiss) flows into the Input pin in order to  
supply the internal circuitry.  
From the falling edge of the input signal, the  
status output, initially low to signal a fault  
condition (overtemperature or open load  
on-state), will go back to a high state with a  
different delay in case of overtemperature (tpovl)  
and in case of open open load (tpol) respectively.  
This feature allows to discriminate the nature of  
the detected fault. To protect the device against  
1/11  
September 1998  
VN771P  
BLOCK DIAGRAM  
2/11  
VN771P  
CONNECTION DIAGRAM  
PIN FUNCTION  
No  
NAME  
DRAIN 3  
INPUT 3  
N.C.  
FUNCTION  
Drain of Switch 3 (low-side switch)  
1, 3, 25, 28  
2
Input of Switch 3 (low-side switch)  
Not Connected  
4, 11  
5, 10, 19, 24  
VCC  
Drain of Switches 1and 2 (high-side switches) and Power Supply Voltage  
Ground of Switches 1 and 2 (high-side switches)  
Input of Switch 1 (high-side switch)  
6
GND  
7
INPUT 1  
8
9
DIAGNOSTIC Diagnostic of Switches 1 and 2 (high-side switches)  
INPUT 2  
DRAIN 4  
Input of Switch 2 (high-side switch)  
Drain of Switch 4 (low-side switch)  
Input of Switch 4 (low-side switch)  
Source of Switch 4 (low-side switch)  
Source of Switch 2 (high-side switch)  
Source of Switch 1 (high-side switch)  
Source of Switch 3 (low-side switch)  
12, 14, 15, 18  
13  
INPUT 4  
16, 17  
20, 21  
22, 23  
26, 27  
SOURCE 4  
SOURCE 2  
SOURCE 1  
SOURCE 3  
3/11  
VN771P  
PROTECTION CIRCUITS  
inductive loads.  
DUAL HIGH SIDE SWITCH  
- OVERTEMPERATURE AND SHORT CIRCUIT  
PROTECTION: these are based on sensing  
the chip temperature and are not dependent on  
the input voltage. The location of the sensing  
element on the chip in the power stage area  
ensures fast, accurate detection of the junction  
temperature. Overtemperature cutout occurs at  
minimum 150oC. The device is automatically  
restarted when the chip temperature falls  
below 135oC.  
The simplest way to protect the device against a  
continuous reverse battery voltage (-26V) is to  
insert a a small resistor between pin 2 (GND) and  
ground. The suggested resistance value is about  
150. In any case the maximum voltage drop on  
this resistor should not overcome 0.5V.  
If there is no need for the control unit to handle  
external analog signals referred to the power  
GND, the best approach is to connect the  
reference potential of the control unit to the  
device ground (see application circuit in fig. 3),  
which becomes the common signal GND for the  
whole control board avoiding shift of Vih, Vil and  
- STATUS FEEDBACK: In the case of an  
overtemperature fault condition, a Status  
Feedback is provided through the Input pin.  
The internal protection circuit disconnects the  
input from the gate and connects it instead to  
ground via an equivalent resistance of 100 .  
The failure can be detected by monitoring the  
voltage at the Input pin, which will be close to  
ground potential.  
Additional features of these devices are ESD  
protection according to the Human Body model  
and the ability to be driven from a TTL Logic  
circuit (with a smallincrease in RDS(on)).  
Vstat  
.
LOW SIDE SWITCHES  
The devices integrate:  
- OVERVOLTAGE CLAMP PROTECTION:  
internally set at 42V, along with the rugged  
avalanche characteristics of the Power  
MOSFET stage give this device unrivalled  
ruggedness and energy handling capability.  
This feature is mainly important when driving  
TRUTH TABLE (for Dual high-side switch only)  
INPUT 1  
INPUT 2 SOURCE 1 SOURCE 2 DIAGNOSTIC  
Normal Operation  
L
H
L
L
H
H
L
L
H
L
L
H
H
L
H
H
H
H
H
H
Under-voltage  
X
H
X
X
X
H
L
L
X
L
X
L
H
L
L
Thermal Shutdown  
Channel 1  
Channel 2  
Channel 1  
Open Load  
H
L
X
L
H
L
X
L
L
L
X
L
H
L
X
L
H
L
L
L
Channel 2  
Channel 1  
Channel 2  
Output Shorted to VCC  
H
L
X
L
H
H
X
L
L
L
X
L
H
L
X
L
H
H
L
L
NOTE: The low-side switches have the fault feedback which can be detected by monitoring the voltage at the input pins.  
L = Logic LOW, H = Logic HIGH, X = Don’t care  
4/11  
VN771P  
ABSOLUTE MAXIMUM RATING (-40 oC < Tj < 150 oC)  
HIGH SIDE SWITCH  
Symbol  
Parameter  
Value  
Unit  
V
V(BR)DSS Drain-Source Breakdown Voltage  
40  
IOUT  
IR  
Output Current (cont.)  
Reverse Output Current  
Input Current  
14  
A
-14  
±10  
A
IIN  
mA  
V
-VCC  
ISTAT  
VESD  
Ptot  
Tj  
Reverse Supply Voltage  
Status Current  
-4  
±10  
mA  
V
Electrostatic Discharge (C = 100 pF, R =1.5 K)  
2000  
o
Power Dissipation at Tc = 25 C  
Internally Limited  
-40 to 150  
-55 to 150  
W
Junction Operating Temperature  
Storage Temperature  
oC  
oC  
Tstg  
LOW SIDE SWITCH  
Symbol  
Parameter  
Value  
Internally Clamped  
18  
Unit  
V
V(BR)DSS Drain-Source Breakdown Voltage  
VIN  
ID  
Input Voltage  
V
Drain Current  
Internally Limited  
-28  
A
IR  
Reverse DC Output Current  
Electrostatic Discharge (C = 100 pF, R =1.5 K)  
A
VESD  
Ptot  
Tj  
2000  
V
o
Total Dissipation at Tc = 25 C  
Internally Limited  
Internally Limited  
-55 to 150  
W
oC  
oC  
Operating Junction Temperature  
Storage Temperature  
Tstg  
THERMAL DATA  
Rthj-case Thermal Resistance Junction-case (High-side switch) Max  
20  
20  
60  
oC/W  
oC/W  
oC/W  
Rthj-case Thermal Resistance Junction-case (Low-side switch)  
Rthj-amb Thermal Resistance Junction-ambient  
Max  
Max  
ELECTRICAL CHARACTERISTICS FOR DUAL HIGH SIDE SWITCH  
(8 < VCC < 16 V; -40 Tj 125 oC unless otherwise specified)  
POWER  
Symbol  
VCC  
Parameter  
Supply Voltage  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
6
13  
26  
5.2  
0.1  
100  
2
o
In(*)  
Ron  
Nominal Current  
On State Resistance  
Supply Current  
Tc = 85 C VDS(on) 0.5 VCC = 13 V  
3.4  
A
o
IOUT = In VCC = 13 V Tj = 25 C  
0.065  
o
IS  
Off State  
Tj = 25 C VCC = 13 V  
35  
10  
µA  
V
o
VDS(MAX) Maximum Voltage Drop IOUT = 13 A Tj = 85 C VCC = 13 V  
1.2  
5
o
Ri  
Output to GND internal Tj = 25 C  
Impedance  
20  
KΩ  
5/11  
VN771P  
ELECTRICAL CHARACTERISTICS FOR DUAL HIGH SIDE SWITCH (continued)  
SWITCHING  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
d(on)(^) Turn-on Delay Time Of Rout = 2.7 Ω  
5
35  
200  
µs  
Output Current  
tr(^)  
Rise Time Of Output  
Current  
Rout = 2.7 Ω  
28  
10  
28  
110  
140  
75  
360  
500  
360  
µs  
µs  
µs  
td(off)(^) Turn-off Delay Time Of Rout = 2.7 Ω  
Output Current  
tf(^)  
Fall Time Of Output  
Current  
Rout = 2.7 Ω  
(di/dt)on Turn-on Current Slope Rout = 2.7 Ω  
(di/dt)off Turn-off Current Slope Rout = 2.7 Ω  
0.003  
0.005  
0.1  
0.1  
A/µs  
A/µs  
LOGIC INPUT  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
VIL  
Input Low Level  
Voltage  
1.5  
V
VIH  
Input High Level  
Voltage  
3.5  
0.2  
()  
V
V
VI(hyst.) Input Hysteresis  
Voltage  
0.9  
30  
1.5  
IIN  
Input Current  
VIN = 5 V Tj = 25 oC  
100  
7
µA  
VICL  
Input Clamp Voltage  
IIN = 10 mA  
IIN = -10 mA  
5
6
-0.7  
V
V
PROTECTION AND DIAGNOSTICS  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
VSTAT  
Status Voltage Output ISTAT = 1.6 mA  
Low  
0.4  
V
VUSD  
VSCL  
TTSD  
Under Voltage Shut  
Down  
3.5  
5
4.5  
6
7
V
Status Clamp Voltage  
ISTAT = 10 mA  
ISTAT = -10 mA  
6
-0.7  
V
V
oC  
Thermal Shut-down  
Temperature  
140  
160  
180  
50  
TSD(hyst.) Thermal Shut-down  
Hysteresis  
oC  
TR  
VOL  
IOL  
Reset Temperature  
Open Voltage Level  
125  
2.5  
0.6  
oC  
V
Off-State (note 2)  
On-State  
4
5
Open Load Current  
Level  
0.9  
1.4  
A
6/11  
VN771P  
ELECTRICAL CHARACTERISTICS FOR DUAL HIGH SIDE SWITCH (continued)  
PROTECTION AND DIAGNOSTICS  
Symbol  
tpovl  
Parameter  
Status Delay  
Status Delay  
Test Conditions  
Min.  
Typ.  
5
Max.  
10  
Unit  
µs  
(note 3)  
(note 3)  
tpol  
50  
500  
2500  
µs  
(*) In= Nominal current according to ISO definition for high side automotive switch (see note 1)  
(^) See switching time waveform  
() The VIH is internally clamped at 6V about. It is possible to connect this pin to an higher voltage via an external resistor calculated to not  
exceed 10 mA at the input pin.  
note 1: The Nominal Current is the current at Tc = 85 oC forbattery voltage of 13V which produces a voltage drop of 0.5 V  
note 2: IOL(off) = (VCC -VOL)/ROL  
note 3: tpovl tpol: ISO definition  
ELECTRICAL CHARACTERISTICS FOR LOW SIDE SWITCHES  
(Tcase = 25 oC unless otherwise specified)  
OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
VCLAMP  
Drain-source Clamp  
Voltage  
ID = 10 A  
Vin = 0  
36  
42  
48  
V
VCLTH  
VINCL  
IDSS  
Drain-source Clamp  
Threshold Voltage  
ID = 2 mA Vin = 0  
Iin = -1 mA  
35  
-1  
V
V
Input-Source Reverse  
Clamp Voltage  
-0.3  
Zero Input Voltage  
Drain Current (Vin = 0) VDS = 25 V Vin = 0  
VDS = 13 V Vin = 0  
50  
200  
µA  
µA  
IISS  
Supply Current from  
Input Pin  
VDS = 0 V Vin = 10 V  
250  
500  
µA  
ON ( )  
Symbol  
Parameter  
Test Conditions  
VDS = Vin ID + Iin = 1 mA  
Min.  
Typ.  
Max.  
Unit  
VIN(th)  
Input Threshold  
Voltage  
0.8  
3
V
RDS(on)  
Static Drain-source On Vin = 10 V ID = 10 A  
0.035  
0.05  
Resistance  
Vin = 5 V  
ID = 10 A  
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
gfs ( )  
Forward  
VDS = 13 V  
ID = 10 A  
14  
18  
S
Transconductance  
Coss  
Output Capacitance  
VDS = 13 V f = 1 MHz Vin = 0  
700  
900  
pF  
7/11  
VN771P  
ELECTRICAL CHARACTERISTICS FOR LOW SIDE SWITCHES (continued)  
SWITCHING (**)  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
td(on)  
tr  
td(off)  
tf  
Turn-on Delay Time  
Rise Time  
Turn-off Delay Time  
Fall Time  
VDD = 15 V  
Vgen = 10 V  
(see figure 3)  
Id = 10 A  
Rgen = 10 Ω  
100  
330  
400  
155  
200  
600  
700  
300  
ns  
ns  
ns  
ns  
td(on)  
tr  
td(off)  
tf  
Turn-on Delay Time  
Rise Time  
Turn-off Delay Time  
Fall Time  
VDD = 15 V  
Vgen = 10 V  
(see figure 3)  
Id = 10 A  
Rgen = 1000 Ω  
450  
1.7  
7.5  
3.4  
700  
3
10  
5
ns  
µs  
µs  
µs  
(di/dt)on Turn-on Current Slope VDD = 15 V  
Vin = 10 V  
ID = 10 A  
Rgen = 10 Ω  
35  
A/µs  
Qi  
Total Input Charge  
VDD = 12 V ID = 10 A Vin = 10 V  
60  
nC  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
VSD ( )  
Forward On Voltage  
ISD = 10 A Vin = 0  
1.6  
trr  
(
)
Reverse Recovery  
Time  
Reverse Recovery  
Charge  
Reverse Recovery  
Current  
ISD = 10 A  
VDD = 30 V  
(see test circuit, figure 5)  
di/dt = 100 A/µs  
Tj = 25 C  
180  
0.45  
7
ns  
o
Qrr  
(
)
µC  
IRRM  
(
)
A
PROTECTION  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Tjsh  
(
)
Overtemperature  
Shutdown  
150  
oC  
Tjrs  
Igf  
(
)
Overtemperature Reset  
Fault Sink Current  
135  
oC  
(
)
Vin = 10 V VDS = 13 V  
50  
20  
mA  
mA  
Vin = 5 V  
VDS = 13 V  
Ilim  
tdlim  
Eas  
Drain Current Limit  
Vin = 10 V VDS = 13 V  
20  
20  
28  
28  
40  
40  
A
A
Vin = 5 V  
VDS = 13 V  
(
)
Step Response  
Current Limit  
Vin = 10 V  
Vin = 5 V  
25  
70  
40  
120  
µs  
µs  
o
(
)
Single Pulse Avalance starting Tj = 25 C  
2.5  
J
Energy  
Vin = 10 V VDD = 20 V  
Rgen = 1KL = 10 mH  
( ) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %  
) Parameters guaranteed by design/characterization  
(
8/11  
VN771P  
TYPICAL APPLICATION DIAGRAM  
9/11  
VN771P  
SO-28 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
TYP.  
MAX.  
2.65  
0.30  
0.49  
0.32  
MIN.  
MAX.  
0.104  
0.012  
0.019  
0.012  
A
a1  
b
0.10  
0.35  
0.23  
0.004  
0.013  
0.009  
b1  
C
c1  
D
E
0.50  
0.020  
45 (typ.)  
17.7  
18.1  
0.697  
0.393  
0.713  
0.419  
10.00  
10.65  
e
1.27  
0.050  
0.650  
e3  
F
16.51  
7.40  
0.40  
7.60  
1.27  
0.291  
0.016  
0.299  
0.050  
L
S
8 (max.)  
0016572  
10/11  
VN771P  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are  
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products  
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
1998 STMicroelectronics – Printed in Italy – All RightsReserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands -  
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.  
.
11/11  

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