VN5R003H-E [STMICROELECTRONICS]
3 mΩ reverse battery protection switch; 3 MI ©电池反向保护开关
| 型号： | VN5R003H-E |
| 厂家： | 
ST |
| 描述： | 3 mΩ reverse battery protection switch |
| 文件： | 总20页 (文件大小：293K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VN5R003H-E
3 mΩ reverse battery protection switch
Datasheet − production data
Features
Max supply voltage
Operating voltage range
On-state resistance
VCC -16 to 41 V
VCC -16 to 28 V
RON 3 mΩ
GAP GCFT00135
HPak
■ General
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
Description
The VN5R003H-E is a device made using
STMicroelectronics® VIPower® technology. It is
intended for providing reverse battery protection
to an electronic module.
– Compliant with European directive
2002/95/EC
■ Protections
– Automatic switch off in case of negative
input voltage
– Electrostatic discharge protection
This device has two power pins (Drain and
Source) and a control pin IN. If the IN voltage
versus Drain is negative the device is turned on.
A negative voltage of Drain pin versus IN
Application
automatically turns off the device. When IN is left
open, device is in OFF-state and behaves like a
power diode between Source and Drain pins.
■ Reverse battery protection of an electronic
control unit
Table 1.
Device summary
Package
Order codes
Tape and reel
Tube
HPAK
VN5R003H-E
VN5R003HTR-E
April 2012
Doc ID 17602 Rev. 5
1/20
This is information on a product in full production.
www.st.com
1
Contents
VN5R003H-E
Contents
1
2
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
2.2
2.3
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
4
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1
HPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
®
5.1
5.2
5.3
5.4
ECOPACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
HPAK suggested land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2/20
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VN5R003H-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power section for reverse battery mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
HPAK mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Doc ID 17602 Rev. 5
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List of figures
VN5R003H-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Maximum pulsed drain current (VBATT = 13 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Battery supplied systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Switched systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Rthj-amb vs PCB copper area in open box free air condition. . . . . . . . . . . . . . . . . . . . . . . 12
HPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 10. Thermal fitting model of a single-channel HSD in HPAK . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 11. HPAK package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. HPAK suggested pad layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 13. HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 14. HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4/20
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VN5R003H-E
Block diagram and pin description
1
Block diagram and pin description
Figure 1.
Block diagram
SOURCE
IN
DRIVER
DRAIN
Table 2.
Pin function
Name
Drain
Function
Power MOS drain
Source
IN
Power MOS source
Control pin
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Block diagram and pin description
VN5R003H-E
Figure 2.
Configuration diagram (top view)
1 - SOURCE
2 - SOURCE
3 - IN
4 - DRAIN
5 - NC
6 - SOURCE
7 - SOURCE
TAB - DRAIN
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6/20
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VN5R003H-E
Electrical specifications
2
Electrical specifications
Figure 3.
Current and voltage conventions
IS
SOURCE
ID
DRAIN
IN
VCC
VD
VS
VIN
IN
2.1
Absolute maximum ratings
Stressing the device above the rating listed in Table 3 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to the conditions in table below for extended periods may affect device reliability.
Table 3.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
VS
Source power terminal DC voltage (reverse battery mode)
Source or Drain current
-16 to 41
60
V
A
A
I
S, ID
-IS, -ID Reverse currents
Inductive clamp energy
60
EMAX
0.9
J
L = 2 mH, VD = 0 V, IN open, IS < 0, Tjstart = 25°C
Electrostatic discharge
VESD (Human Body Model: R = 1.5 KΩ; C = 100 pF)
5000
V
- All terminals
VESD Charge device model (CDM-AEC-Q100-011)
1000
V
Tj
Junction operating temperature
Storage temperature
-40 to 150
-55 to 150
°C
°C
Tstg
Doc ID 17602 Rev. 5
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Electrical specifications
VN5R003H-E
2.2
Thermal data
Table 4.
Symbol
Thermal data
Parameter
Max.
Unit
Rthj-case Thermal resistance junction-case
0.5
°C/W
Thermal resistance junction-ambient (mounted on FR4
Rthj-amb
42
°C/W
using 6 cm2 copper pad)
2.3
Electrical characteristics
Table 5.
Symbol
Power section for reverse battery mode(1)
Parameter
Test conditions
Min. Typ. Max. Unit
VS
Operating supply voltage
—
-16
17
13
28
23
V
V
Drain-Source clamp
voltage
VCLPDS
VD = 0 V, IN open, IS = -5 A
Drain input clamp
voltage
VCLPDIN
VF
VIN = 0 V, ID = 20 mA
41
52
V
V
Source drain voltage
IN = open, IS = 10 A; Tj = 25°C
0.85
3
IS = 10 A; Tj = 25°C;
8 V < VCC < 28 V
On state resistance
between SOURCE and
Drain terminals
RON
mΩ
IS = 10 A; Tj = 150°C;
8 V < VCC < 28 V
5.5
IIN
Input current
VS = 13 V, VIN = 0 V
2
3
0
mA
mA
mA
IIN
(REV)
Reverse input current
VS = -16 V, VIN = 0 V
-2
IOUT_rev Output reverse current
VS = -16 V, VD = 0 V, IN open
-1.5
-0.5
1. Operating conditions: 40°C < T < 150°C
j
8/20
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VN5R003H-E
Electrical specifications
Table 6.
Electrical transient requirements (part 1)
Burst cycle/pulse
repetition time
Test levels(1)
Number of
ISO 7637-2:
2004(E)
Test pulse
Delays and
Impedance
pulses or
test times
III
IV
Min.
Max.
1(2)
2a
-75 V
+37 V
-100 V
+75 V
-6 V
-100 V
+50 V
-150 V
+100 V
-7 V
5000 pulses
5000 pulses
1h
0.5 s
0.2 s
5 s
2 ms, 10 Ω
50 µs, 2 Ω
5 s
3a
90 ms
90 ms
100 ms
100 ms
0.1 µs, 50 Ω
0.1 µs, 50 Ω
100 ms, 0.01 Ω
400 ms, 2 Ω
3b
1h
4
1 pulse
1 pulse
—
—
5b(3)
+65 V
+87 V
1. The above test levels must be considered referred to V = 13.5 V except for pulse 5b.
CC
2. The device does not turn Off once the ISO pulse is applied.
3. Valid in case of external load dump clamp: 40 V maximum referred to ground.
Table 7.
Electrical transient requirements (part 2)
Test level results(1)
ISO 7637-2:
2004(E)
III
IV
Test pulse
1
2a
3a
3b
4
C
C
C
C
C
C
C
C
C
C
C
C
5b(2)
1. Transient pulses have been applied with the INPUT pin grounded with R1>5Ω.
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
Table 8.
Class
Electrical transient requirements (part 3)
Contents
C
E
All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device are not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
Doc ID 17602 Rev. 5
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Electrical specifications
Figure 4.
VN5R003H-E
Maximum pulsed drain current (VBATT = 13 V)
-AXIMUM 0ULSED $RAIN #URRENT
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Note:
PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 35 mm,
Copper areas: minimum pad lay-out and 2 cm2
10/20
Doc ID 17602 Rev. 5
VN5R003H-E
Application information
3
Application information
Figure 5 shows the solution for systems supplied directly from the battery. If the system
goes into Stand-by mode, the transistor T1 is switched off by the microcontroller with zero
quiescent current. System is still supplied through the PowerMOS body diode.
Figure 5.
Battery supplied systems
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Figure 6 refers to a solution for systems supplied after the ignition switch. Low quiescent
currents are not strictly required, so resistor R1 can be directly connected to ground.
Figure 6.
Switched systems
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Doc ID 17602 Rev. 5
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Package and PC board thermal data
VN5R003H-E
4
Package and PC board thermal data
4.1
HPAK thermal data
Figure 7.
PC board
Note:
Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10%, board double layer, board
dimension 78 mm x 86 mm, board material FR4, Cu thickness = 70 µm (front and back side), thermal vias separation
1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm, footprint dimension 6.4 mm x 7 mm).
Figure 8.
Rthj-amb vs PCB copper area in open box free air condition
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12/20
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VN5R003H-E
Package and PC board thermal data
Figure 9.
HPAK thermal impedance junction ambient single pulse
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Figure 10. Thermal fitting model of a single-channel HSD in HPAK
GAPGCFT 00133
Note:
The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections
(power limitation or thermal cycling during thermal shutdown) are not triggered.
Doc ID 17602 Rev. 5
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Package and PC board thermal data
VN5R003H-E
Equation 1: pulse calculation formula
ZTHδ = RTH ⋅ δ + ZTHtp(1 – δ)
where δ = tP/T
Table 9. Thermal parameter
Area/island (cm2)
Footprint
0.01
0.15
1
4
8
R1 (°C/W)
R2 (°C/W)
R3 (°C/W)
R4 (°C/W)
8
R5 (°C/W)
28
21
24
12
16
R6 (°C/W)
31
C1 (W.s/°C)
C2 (W.s/°C)
C3 (W.s/°C)
C4 (W.s/°C)
C5 (W.s/°C)
C6 (W.s/°C)
0.005
0.05
0.08
0.4
0.8
1.4
6
3
9
3
14/20
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VN5R003H-E
Package and packing information
5
Package and packing information
®
5.1
ECOPACK
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2
HPAK mechanical data
Figure 11. HPAK package dimension
GAPGCFT00134
Doc ID 17602 Rev. 5
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Package and packing information
VN5R003H-E
Table 10. HPAK mechanical data
Data book mm
Min.
Ref. dim
Typ
Max.
A
A1
A2
b
—
—
2.20
0.90
0.03
0.45
5.20
0.45
0.48
6.00
—
2.40
1.10
0.23
0.60
5.40
0.60
0.60
6.20
—
—
—
b4
c
—
—
c2
D
—
—
D1
E
5.10
—
6.40
—
6.60
—
E1
e
5.20
0.85
—
—
—
e1
e2
e3
H
1.60
3.30
5.00
9.35
1
1.80
3.50
5.20
10.10
—
—
—
—
L
—
(L1)
L2
L4
R
2.80
0.80
—
—
—
—
—
0.60
—
1.00
—
0.20
—
V2
0°
8°
16/20
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VN5R003H-E
Package and packing information
5.3
HPAK suggested land pattern
Figure 12. HPAK suggested pad layout(a)
All dimensions are in mm.
5.4
Packing information
Figure 13. HPAK tube shipment (no suffix)
A
Base q.ty
75
3000
532
6
C
Bulk q.ty
Tube length (± 0.5)
A
B
21.3
0.6
C (± 0.1)
All dimensions are in mm.
B
a. The land pattern proposed is not intended to over-rule User's PCB design, manufacturing and soldering
process rules
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Package and packing information
VN5R003H-E
Figure 14. HPAK tape and reel (suffix “TR”)
REEL DIMENSIONS
All dimensions are in mm.
Base q.ty
Bulk q.ty
A (max)
B (min)
C (± 0.2)
F
2500
2500
330
1.5
13
20.2
16.4
60
G (+ 2 / -0)
N (min)
T (max)
22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
W
P0 (± 0.1)
P
16
4
Tape hole spacing
Component spacing
Hole diameter
8
D (± 0.1/-0) 1.5
Hole diameter
D1 (min)
F (± 0.05)
K (max)
1.5
7.5
2.75
2
Hole position
Compartment depth
Hole spacing
P1 (± 0.1)
All dimensions are in mm.
End
Start
Top
No components
500mm min
Components
No components
cover
tape
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
18/20
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VN5R003H-E
Revision history
6
Revision history
Table 11.
Date
Document revision history
Revision
Changes
23-Jun-2010
06-Jul-2010
06-Oct-2010
1
2
3
Initial release.
Updated Table 4: Thermal data.
Added Figure 4: Maximum pulsed drain current (VBATT = 13 V)
Changed document status from target specification to datasheet.
Table 3: Absolute maximum ratings:
– Removed VD row
Table 5: Power section for reverse battery mode
– IIN: added maximum value
18-Nov-2010
17-Apr-2012
4
5
Table 6: Electrical transient requirements (part 1)
– Added Note 2
Updated Figure 5: Battery supplied systems and Figure 6: Switched
systems
Updated Figure 4: Maximum pulsed drain current (VBATT = 13 V)
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VN5R003H-E
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