MQFP [STATSCHIP]
Metric Quad Flat Pack; 公制四方扁平的包
| 型号： | MQFP |
| 厂家： | 
STATS CHIPPAC, LTD. |
| 描述： | Metric Quad Flat Pack |
| 文件： | 总2页 (文件大小：103K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MQFP
Metric Quad Flat Pack
• 10 x 10mm to 32 x 32mm body
sizes
• 44 to 240 lead counts
• Lead pitch range from 0.80mm
to 0.50mm
FEATURES
DESCRIPTION
• Body Sizes: 10 x 10mm to 32 x 32mm
• Package Height: 2.0 mm to 3.4mm
• Lead Counts: 44L to 240L
• Lead Pitch: 0.80mm to 0.50mm
STATS ChipPAC’s Metric Quad Flat Pack (MQFP) is a
leadframe based, plastic encapsulated package with gull
wing shaped leads on four sides. The MQFP is targeted at
cost sensitive applications while providing a high degree
of thermal and electrical performance. Offered in a wide
range of body sizes and pin counts, the MQFP provides
designers with the flexibility and convenience of meeting
their packaging needs for a large variety of device designs.
• Wide range of open tool leadframe and die pad
sizes available
• Moisture Sensitivity: JEDEC Level 3
• JEDEC standard compliant
• Lead-free and Green material sets available
• Copper and alloy leadframes available
APPLICATIONS
• ASIC
• DSP
• Gate Array
• Logic / Microprocessors / Controllers
• Multimedia, PC Chipsets, Others
www.statschippac.com
MQFP
Metric Quad Flat Pack
SPECIFICATIONS
RELIABILITY
Die Thickness
380-560µm (15-22mils) range preferred
Moisture Sensitivity Level
JEDEC Level 3
Gold Wire
25/30µm (1.0/1.2mils) diameter, 99.999%Au
85/15 Sn/PB or Matte Tin
Laser / ink
Temperature Cycling
-65°C/150°C, 1000 cycles
Lead Finish
Marking
High Temperature Storage
Pressure Cooker Test
150°C, 500 hrs
121°C, 100% RH,
2 atm, 168 hrs
Packing Options
JEDEC tray / tape and reel
Liquid Thermal Shock (opt)
-55°C/125°C, 1000 cycles
THERMAL PERFORMANCE, θja (°C/W)
Package
Body Size (mm)
Pad Size (mm)
Die Size (mm) Thermal Performance, θja (°C/W)
100L
14 x 14 x 2.0
9.0 x 9.0
7.8 x 7.8
37.0
208L
28 x 28 x 3.4
14.0 x 14.0
10.2 x 10.2
24.8
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
ELECTRICAL PERFORMANCE
Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design
to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire.
Conductor
Component
Length
(mm)
Resistance
(mOhms)
Inductance
(nH)
Inductance
Mutual (nH)
Capacitance
(pF)
Capacitance
Mutual (pF)
Wire
2
120
1.65
0.45 - 0.85
0.70 - 0.79
1.15 - 1.64
0.45 - 0.85
3.33 - 3.99
3.78 - 4.84
0.10
0.01 - 0.02
0.14 - 0.17
0.15 - 0.19
0.01 - 0.02
0.66 - 0.76
0.67 - 0.78
Lead (10 x 10mm, 44L)
Total (10 x 10mm, 44L)
Wire
2.4 - 3.2
19.0 - 25.0
139 - 145
120
1.56 - 1.75
3.21 - 3.4
1.65
0.31 - 0.38
0.41 - 0.48
0.10
2
Lead (32 x 32mm, 240L) 11.0 - 12.6
Total (32 x 32mm, 240L)
88.0 - 100.8
208 - 220.8
6.05 - 7.25
7.7 - 8.9
1.64 - 1.89
1.74 - 1.99
CROSS-SECTION
PACKAGE CONFIGURATIONS
Package Size (mm) Lead Count
10 x 10
14 x 14
14 x 20
28 x 28
32 x 32*
44, 52
64, 80, 100
64, 80, 100, 128
120, 128, 144, 160, 208
240
Note: *Cavity down configuration available.
Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
Global Offices USA 510-979-8000 JAPAN 81-43-351-3320 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
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