MQFP-ED [STATSCHIP]
Exposed Drop-in Heat Slug Metric Quad Flat Pack; 暴露嵌入式热弹头公制四方扁平封装
| 型号： | MQFP-ED |
| 厂家： | 
STATS CHIPPAC, LTD. |
| 描述： | Exposed Drop-in Heat Slug Metric Quad Flat Pack |
| 文件： | 总2页 (文件大小：99K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MQFP-ed
Exposed Drop-in Heat Slug Metric Quad Flat Pack
• 14 x 20mm to 32 x 32mm
• 100 to 240 lead count
• Lead pitch range from 0.80mm
to 0.50mm
FEATURES
DESCRIPTION
• Body Sizes: 14 x 20mm to 32 x 32mm
STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad
Flat Pack (MQFP-ed) is a thermally enhanced version of
the QFP package. Thermal enhancement is achieved by
adding a drop-in exposed anodized aluminum heat spreader
during the molding process, using a standard leadframe.
MQFP-ed typically has 60% higher thermal performance
over the standard MQFP and the QFP-d for higher power
applications.
• Package Height: 3.4mm
• Lead Counts: 100L to 240L
• Lead Pitch: 0.80mm to 0.50mm
• JEDEC standard compliant
• Lead-free and Green material sets available
APPLICATIONS
• ASIC
• DSP
• FPGA
• PLD
• Logic, microprocessors / controllers
• High speed logic, high power microprocessors
• 3D graphics, telecom, wireless, audio, CPU / GUI
www.statschippac.com
MQFP-ed
Exposed Drop-in Heat Slug Metric Quad Flat Pack
SPECIFICATIONS
RELIABILITY
Die Thickness
380-560µm (15-22mils) range preferred
25/30µm (1.0/1.2mils) diameter, 99.999% Au
85/15 Sn/Pb or Matte Tin
Moisture Sensitivity Level
Temperature Cycling
High Temperature Storage
Pressure Cooker Test
JEDEC Level 3
Gold Wire
-65°C/150°C, 1000 cycles
150°C, 500 hrs
Lead Finish
Marking
Laser / ink
121°C 100% RH,
2 atm, 168 hrs
Packing Options
JEDEC tray / tape and reel
Liquid Thermal Shock (opt)
-55°C/125°C, 1000 cycles
THERMAL PERFORMANCE, θja (°C/W)
Package
Body Size (mm)
Pad Size (mm)
Die Size (mm) Thermal Performance, θja (°C/W)
10.2 x 10.2 14.9
208L
28 x 28 x 3.4
14.0 x 14.0
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
ELECTRICAL PERFORMANCE
Package
Body Size (mm)
Pad Size (mm)
Frequency
Self Inductance (nH)
11.6~14.7
Self Capacitance (pF)
208L
28 x 28 x 3.4
10.5 x 10.5
100MHz
1.43~1.56
Notes: *Results are simulated. Data is available through 2.5GHz.
CROSS-SECTION
PACKAGE CONFIGURATIONS
Package Size (mm) Lead Count
14 x 20
28 x 28*
32 x 32
100, 128
128, 144, 160, 208
160, 240
Note: *Cavity down configuation available.
Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
Global Offices USA 510-979-8000 JAPAN 81-43-351-3320 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
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