MQFPPOWERQUAD2 [AMKOR]
Exceptional thermal and electrical performance by design include the following; 设计卓越的热性能和电气性能包括以下
| 型号： | MQFPPOWERQUAD2 |
| 厂家： | 
AMKOR TECHNOLOGY |
| 描述： | Exceptional thermal and electrical performance by design include the following |
| 文件： | 总2页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LEADFRAME
data sheet
MQFP
®
PowerQuad 2
Exceptional thermal and electrical performance by design include
the following:
Features:
• Very high conductive, solid copper heatsink
• 50% reduction in package self inductance
• 64-304 lead counts (14 x 14 mm to 40 x 40 mm body size)
• Industry-accepted JEDEC package outlines
• Low stress mold compound
®
MQFP PowerQuad 2
Packages:
• Heatsink-up and heatsink-down configurations available
• ~50% improvement in Theta JA over standard MQFP
The MQFP PowerQuad® 2 (PQ2) is patented,
advanced IC packaging technology with
excellent attributes in thermal and electrical
performance. Extraordinary gains in power
dissipation and speed are achieved through
the use of an innovative, integrated, embedded
copper heatsink. The IC is attached directly to
this large, highly efficient heatsink which
readily extracts generated heat under demand
situations. To enhance the thermal conduction
from the IC to the mounting surface, the internal
package leads are mechanically connected, yet
electrically isolated, by a proprietary process
to the heatsink. Thermal resistance improve-
ments greater than 50% can be realized with
this technology without the use of any external
cooling aids! The large heatsink also provides
a “floating” ground plane to the signal leads,
reducing self inductance by 50% (over conven-
tional plastic QFPs). Additionally, the patented
PQ2 heatsink has integrated mechanical “locking”
features to ensure package integrity while elimi-
nating moisture penetration. The end result is
a high-power, high-speed IC package with the
properties to enable new electronic products and
emerging end applications to move from concept
to production.
Thermal Resistance:
Multi-Layer PCB
Theta JA (°C/W) by Velocity (LFPM)
Pkg
0
200
14.7
10.4
9.6
500
13.3
9.2
8.4
7.2
100 ld
208 ld
240 ld
304 ld
17.6
12.6
11.8
10.3
8.4
Self
Bulk
Self
Electrical:
Body
Inductance Capacitance Resistance
Pkg Size(mm) Lead
(nH)
(pF)
(mΩ)
100 ld 14 x 20 Longest
Shortest
208 ld 28 x 28 Longest
Shortest
240 ld 32 x 32 Longest
Shortest
304 ld 40 x 40 Longest 12.200
Shortest 7.280
4.550
2.560
8.740
5.310
7.710
4.900
1.230
0.768
1.970
1.590
1.580
1.180
2.650
2.040
60.1
26.9
100.0
73.5
87.8
57.3
144.0
93.5
Simulated Results
@ 100 MHz
Reliability is of prime importance and long-term performance is
assured by advanced designs, manufacturing process and materials.
Reliability:
• Temp cycle
• Autoclave
• Temp/humidity
• High temp storage
-65/+150 °C, 1000 cycles
121 °C, 2 atm, 504 hours
85 °C/85%RH, 1000 hours
150 °C, 1000 hours
Applications:
Major semiconductor packaging engineers and manufacturers have chosen PowerQuad® 2 as the IC package of choice for advanced, power micr
processors,DSPs, high-speed logic / FPGAs, PLDs, ASICs and other similar technologies. System designers and OEM product developers find PQ2
solves power / thermal / speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability,
technical support). PQ2 is ideal for: PCs, notebooks, high-end audio/video, power supplies, VME CPU board systems, workstations, RISC engine
modules, GUI boards and many other applications.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
DS185H
Rev Date: 05’06
www.amkor.com
LEADFRAME
data sheet
MQFP
®
PowerQuad 2
Cross-sections
MQFP PowerQuad® 2
Process Highlights
Mold
Die thickness (max)
Strip solder plating
Marking
25 mils
Compound
85/15 Sn/Pb
Pad
Die Attach
Gold Wire
Adhesive
Lead inspection
Pack/ship options
Laser/optical
Bar code/dry pack/TNR
Cu Leadframe
Die
Test Services
Cu Heat Slug
• Program generation/conversion
• Product engineering
Polyimide
Polyimide
• Wafer sort
Nickel Plated
Black Oxide
• Contact Amkor Test Services for more details
Black Oxide
Nickel Plated
Shipping
Low profile tray (JEDEC Outline CS-004)
Cu Heat Slug
Die
Cu Leadframe
Mold
Compound
Die Attach
Adhesive
Gold Wire
Inverted
Configuration Options:
MQFP POWERQUAD® 2 PACKAGE FAMILY (UNITS IN MM)
Units
Tray
Matrix Tray
Lead
Count
64
Body
Size
Body
Thickness
2.0
Lead
Pitch
0.80
0.80
0.80
0.65
0.65
0.50
0.40
0.50
0.50
Form
Length Tip To Tip Length Standoff
1.60/1.95 17.2 x 17.9 0.80 0.15
1.30/1.60 30.6/31.2 0.56/0.88 0.13/0.33
1.30/1.60 30.6/31.2 0.56/0.88 0.13/0.33
1.30/1.60 30.6/31.2 0.56/0.88 0.13/0.33
1.30/1.60 30.6/31.2 0.56/0.88 0.13/0.33
1.30/1.60 30.6/31.2 0.56/0.88 0.13/0.33
1.30/1.60 30.6/31.2 0.56/0.88 0.13/0.33
Foot
Board
Per
JEDEC
MS-022
14 x 14
28 x 28
28 x 28
28 x 28
28 x 28
28 x 28
28 x 28
32 x 32
40 x 40
6 x 14
3 x 8
3 x 8
3 x 8
3 x 8
3 x 8
3 x 8
3 x 8
2 x 6
84
24
24
24
24
24
24
24
12
120
128
144
160
208
256
240
304
3.37
MS-029/022
MS-029/022
MS-029/022
MS-029/022
MS-029/022
MS-029/022
MS-029
3.37
3.37
3.37
3.37
3.37
3.40
3.80
1.30
1.30
34.6
42.6
0.56
0.56
0.38
0.43
MS-029
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
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