ICX415AQ_技术文档

ICX415AQ

Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras

Description

22 pin DIP (Cer-DIP)

The ICX415AQ is a diagonal 8mm (Type 1/2) interline

CCD solid-state image sensor with a square pixel

array. Progressive scan allows all pixel's signals to be

output independently within approximately 1/50 second.

This chip features an electronic shutter with variable

charge-storage time which makes it possible to

realize full-frame still image without a mechanical

shutter. High resolution and high color reproductivity

are achieved through the use of R, G, B primary

color mosaic filters. Further, high sensitivity and low

dark current are achieved through the adoption of

HAD (Hole-Accumulation Diode) sensors.

This chip is suitable for applications such as FA

and surveillance cameras.

Pin 1

Features

2

• Progressive scan allows individual readout of the image signals

from all pixels.

• High vertical resolution still images without a mechanical shutter

• Square pixel

• Horizontal drive frequency: 29.5MHz

• R, G, B primary color mosaic filters on chip

• No voltage adjustments (reset gate and substrate bias are not

adjusted.)

V

3

8

H

38

Pin 12

• High resolution, low dark current, high color reproductivity, high

sensitivity

• Continuous variable-speed shutter

• Low smear

Optical black position

(Top View)

• Excellent anti-blooming characteristics

Device Structure

• Interline CCD image sensor

• Image size:

Diagonal 8mm (Type 1/2)

• Number of effective pixels: 782 (H) × 582 (V) approx. 460K pixels

• Total number of pixels:

• Chip size:

823 (H) × 592 (V) approx. 490K pixels

7.48mm (H) × 6.15mm (V)

• Unit cell size:

• Optical black:

8.3µm (H) × 8.3µm (V)

Horizontal (H) direction: Front 3 pixels, rear 38 pixels

Vertical (V) direction:

Horizontal 19

Vertical 5

Front 8 pixels, rear 2 pixels

• Number of dummy bits:

• Substrate material:

Silicon

Wfine CCD is trademark of Sony corporation.

Represents a CCD adopting progressive scan, primary color filter and square pixel.

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by

any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the

operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

– 1 –

E02404B35

ICX415AQ

Block Diagram and Pin Configuration

(Top View)

11

10

9

8

7

6

5

4

3

2

1

R

G

R

G

R

G

R

G

B

G

B

G

B

G

B

G

R

G

R

G

B

G

R

G

R

B

G

Note)

Horizontal register

Note)

: Photo sensor

12

13

14

15

16

17

18

19

20

21

22

Pin Description

Pin No. Symbol

Description

Pin No. Symbol

Description

1

2

3

4

5

6

7

8

9

NC

12

13

14

15

16

17

18

19

20

V^DD

φRG

V^L

Supply voltage

NC

Reset gate clock

Protective transistor bias

Substrate clock

Vφ³

Vφ2

Vφ1

NC

Vertical register transfer clock

φSUB

Hφ1

Hφ2

NC

Horizontal register transfer clock

GND

NC

GND

NC

2

VOUT

Signal output

CSUB

Substrate bias

Supply voltage for the substrate

voltage generation

1

10

11

CGG

Output amplifier gate

21

22

SUBCIR

NC

1

2

DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance

of 1µF or more.

DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance

of 0.1µF or more.

– 2 –

ICX415AQ

Absolute Maximum Ratings

Item

Substrate clock φSUB – GND

Ratings

–0.3 to +55

–0.3 to +18

–55 to +10

–15 to +20

to +10

Unit

V

Remarks

V^DD, VOUT, CGG, SUBCIR – GND

V

Supply voltage

V^DD, VOUT, CGG, SUBCIR – φSUB

Vφ1, Vφ2, Vφ3 – GND

V

Clock input voltage

Vφ1, Vφ2, Vφ3 – φSUB

V

1

Voltage difference between vertical clock input pins

Voltage difference between horizongal clock input pins

Hφ¹, Hφ2 – Vφ3

to +15

V

to +17

V

–16 to +16

–10 to +15

–55 to +10

–65 to +0.3

–0.3 to +27.5

–0.3 to +22.5

–0.3 to +17.5

–30 to +80

–10 to +60

–10 to +75

V

Hφ1, Hφ2 – GND

V

Hφ1, Hφ2 – φSUB

V

V^L– φSUB

V

Vφ2, Vφ3 – VL

V

RG – GND

V

Vφ¹, Hφ1, Hφ2, GND – VL

Storage temperature

V

°C

Performance guarantee temperature

Operating temperature

1

+27V (Max.) when clock width < 10µs, clock duty factor < 0.1%.

+16V (Max.) is guaranteed for power-on and power-off.

– 3 –

ICX415AQ

Bias Conditions

Item

Symbol Min.

Typ.

Max.

Unit Remarks

V

Supply voltage

Protective transistor bias

Substrate clock

Reset gate clock

1

V^DD

VL

14.55

15.0

15.45

1

2

3

φSUB

φRG

VL setting is the VVL voltage of the vertical transfer clock waveform, or the same voltage as the VL power

supply for the V driver should be used.

2

Indications of substrate voltage setting value

Set SUBCIR pin to open when applying a DC bias the substrate clock pin.

Adjust the substrate voltage because the setting value of the substrate voltage is indicated on the back of

image sensor by a special code when applying a DC bias the substrate clock pin.

VSUB code – two characters indication

↑

Integer portion

Decimal portion

The integer portion of the code and the actual value correspond to each other as follows.

Integer portion of code

Value

A

5

C

6

d

7

E

8

f

G

h

J

9

10

11

12

[Example] "A5" → VSUB = 5.5V

Do not apply a DC bias to the reset gate clock pins, because a DC bias is generated within the CCD.

3

DC Characteristics

Item

Symbol Min.

4.0

Typ.

7.0

Max.

9.0

Unit Remarks

mA

Supply current

IDD

– 4 –

ICX415AQ

Clock Voltage Conditions

Item

Waveform

Diagram

Symbol

Min.

Typ.

Max. Unit

Remarks

Readout clock voltage V^VT

14.55 15.0 15.45

V

1

2

VVH02

–0.05

0

0.05

V^VH= VVH02

VVH1, VVH2, VVH3 –0.2

VVL = (VVL1 + VVL3)/2

(During 29.5MHz)

VVL1, VVL2, VVL3

–7.8

–7.5

–7.2

–7.0

V

2

VVL = (VVL1 + VVL3)/2

(During 14.75MHz)

–8.0

6.8

–7.5

7.5

Vertical transfer clock

voltage

Vφ1, Vφ2, Vφ3

| VVL1 – VVL3 |

V^VHH

8.05

0.1

V

2

3

4

5

0.5

High-level coupling

Low-level coupling

VVHL

0.5

VVLH

0.5

VVLL

0.5

VφH

4.75

–0.05

0.8

5.0

0

5.25

0.05

Horizontal transfer

clock voltage

VHL

VCR

2.5

5.0

Cross-point voltage

VφRG

4.5

5.5

0.8

Reset gate clock

voltage

VRGLH – VRGLL

VRGL – VRGLm

Low-level coupling

0.5

Substrate clock voltage VφSUB

21.5

22.5

23.5

– 5 –

ICX415AQ

Clock Equivalent Circuit Constants

Symbol

Typ.

3900

3300

2200

1800

47

Item

Min.

Max. Unit Remarks

CφV1

pF

Ω

CφV2

Capacitance between vertical transfer clock and GND

Capacitance between vertical transfer clocks

CφV3

CφV12

CφV23

CφV31

CφH1, CφH2

CφHH

Capacitance between horizontal transfer clock and GND

Capacitance between horizontal transfer clocks

Capacitance between reset gate clock and GND

Capacitance between substrate clock and GND

30

CφRG

6

CφSUB

R1, R2

R3

390

27

Vertical transfer clock series resistor

22

Ω

RGND

100

16

Vertical transfer clock ground resistor

Horizontal transfer clock series resistor

Reset gate clock series resistor

Ω

RφH1, RφH2

RφRG

Ω

39

R1

R2

Vφ1

Vφ2

CφV12

CφV1

CφV2

CφV3

RφH1

RφH2

Hφ2

Hφ1

RGND

CφHH

CφV31

CφV23

CφH2

CφH1

R3

Vφ3

Vertical transfer clock equivalent circuit

Horizontal transfer clock equivalent circuit

RφRG

CφRG

Reset gate clock equivalent circuit

– 6 –

ICX415AQ

Drive Clock Waveform Conditions

(1) Readout clock waveform

VT

100%

90%

φM

VVT

φM

2

10%

0%

0V

tr

twh

tf

Note) Readout clock is used by composing vertical transfer clocks Vφ2 and Vφ3.

(2) Vertical transfer clock waveform

VVH1

Vφ1

VVHH

VVH

VVHL

VVLH

V

VL01

VH02

VVL1

V

VL

V

VLL

Vφ2

V

VH2

V

VVHH

VVH

VVHL

VVLH

VVL2

VVL

VVLL

VVH3

Vφ3

VVHH

VVH

VVHL

VVL03

VVLH

VVL

VVLL

V

VH = VVH02

VL = (VVL01 + VVL03)/2

VL3 = VVL03

VφV1 = VVH1 – VVL01

VφV2 = VVH02 – VVL2

VφV3 = VVH3 – VVL03

– 7 –

ICX415AQ

(3) Horizontal transfer clock waveform

tf

tr

Hφ1, Hφ2

twh

Hφ2

90%

VCR

VφH

twl

VφH

2

10%

Hφ1

VHL

two

Cross-point voltage for the Hφ¹rising side of the horizontal transfer clocks Hφ1 and Hφ2 waveforms is VCR.

The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two.

(4) Reset gate clock waveform

φRG

tr

twh

tf

VRGH

RG waveform

twl

VφRG

Point A

V

RGLH

RGLL

RGLm

V

RGL

VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from

Point A in the above diagram until the rising edge of RG.

In addition, VRGL is the average value of VRGLH and VRGLL.

VRGL = (VRGLH + VRGLL)/2

Assuming VRGH is the minimum value during the interval twh, then:

VφRG = VRGH – VRGL

Negative overshoot level during the falling edge of RG is VRGLm.

(5) Substrate clock waveform

φSUB

100%

90%

φM

VφSUB

φM

2

10%

V

SUB

0%

(A bias generated within the CCD)

tr

twh

tf

– 8 –

ICX415AQ

Clock Switching Characteristics (Horizontal drive frequency: 29.5MHz)

twh

twl

tr

tf

Item

Symbol

Unit Remarks

Min. Typ. Max.Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.

During

readout

Readout clock

VT

2.3 2.5

0.5

µs

Vertical transfer Vφ1, Vφ2,

When using

CXD3400N

15

250 ns

clock

Vφ3

Hφ1

Hφ2

9.5 12.0

5.0 7.5

Horizontal

transfer clock

ns

tf ≥ tr – 2ns

Reset gate clock φRG

Substrate clock φSUB

4

7

22

2

3

When draining

charge

0.7 0.8

0.5

0.5 µs

two

Min. Typ. Max.

Item

Symbol

Unit Remarks

1

Horizontal transfer clock Hφ1, Hφ2 7.5 9.5

ns

Clock Switching Characteristics (Horizontal drive frequency: 14.75MHz)

twh

twl

tr

tf

Item

Symbol

V^T

Unit Remarks

Min. Typ. Max.Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.

During

µs

Readout clock

4.6 5.0

0.5

readout

Vertical transfer Vφ1, Vφ2,

When using

CXD3400N

15

350 ns

clock

Vφ3

Hφ1

Hφ2

18 23

21 26

18 23

10 17.5

10 15

10 17.5

10 15

Horizontal

transfer clock

ns

tf ≥ tr – 2ns

Reset gate clock φRG

Substrate clock φSUB

11 14

1.4 1.6

49

2

When draining

charge

0.5

0.4 µs

two

Item

Symbol

Unit Remarks

Min. Typ. Max.

20 24

1

Horizontal transfer clock Hφ1, Hφ2

ns

1

The overlap period of twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two.

– 9 –

ICX415AQ

Image Sensor Characteristics

(Ta = 25°C)

Measurement

method

Item

Symbol Min. Typ. Max. Unit

Remarks

G Sensitivity

Sg

570 720 940 mV

0.4 0.55 0.7

1

2

3

4

1/25s accumulation conversion value

Rr

Sensitivity

comparison

Rb

0.3 0.45 0.6

Vsat

Sm

SHg

375

mV

Ta = 60°C

Zone 0

Saturation signal

Smear

–100 –92 dB

25

8

%

Video signal shading

Uniformity between

video signal

channels

∆Srg

∆Sbg

5

8

5

6

%

Ta = 60°C

mV

Dark signal

Dark signal shading

Lag

2

Vdt

∆Vdt

Lag

7

8

mV

%

1

0.5

Note) All image sensor characteristic data noted above is for operation in 1/50s progressive scan mode.

Zone Definition of Video Signal Shading

782 (H)

6

2

582 (V)

2

Zone 0

Ignored region

Effective pixel region

Measurement System

CCD signal output [ A]

Gr/Gb

S/H

CCD

C.D.S

AMP

Gr/Gb channel signal output [ B]

R/B channel signal output [ C]

R/B

S/H

Note) Adjust the amplifier gain so that the gain between [ A] and [ B], and between [ A] and [ C] equals 1.

– 10 –

ICX415AQ

Image Sensor Characteristics Measurement Method

Measurement conditions

(1) In the following measurements, the device drive conditions are at the typical values of the bias and clock

voltage conditions.

(2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical

black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb

channel signal output or the R/B channel signal output of the measurement system.

(2) In the following measurements, this image sensor is operated in 1/50s all pixels progressive scan mode.

Color coding of this image sensor & Readout

The primary color filters of this image sensor are arranged in

Gb

R

B

Gr

B

Gb

R

B

Gr

B

the layout shown in the figure on the left (Bayer arrangement).

Gr and Gb denote the G signals on the same line as the R

signal and the B signal, respectively.

Gb

R

Gb

R

Gr

Horizontal register

Color Coding Diagram

All pixels' signals are output successively in a 1/50s period.

R signal and Gr signal lines and Gb signal and B signal lines are output sequentially.

– 11 –

ICX415AQ

Image sensor readout mode

The diagram below shows the output methods for the following two readout modes.

(1) Progressive scan mode

G

R

G

R

G

R

B

G

B

G

VOUT

1. Progressive scan mode

In this mode, all pixel signals are output in non-interlace format in 1/50s.

All pixel signals within the same exposure period are read out simultaneously, making this mode suitable for

high resolution image capturing.

(2) Center scan mode

Undesired portions (Swept by vertical register high-speed transfer)

Picture center cut-out portion

2. Center scan mode

This is the center scan mode using the progressive scan method.

The undesired portions are swept by vertical register high-speed transfer, and the picture center portion is

cut out.

There are the mode (100 frames/s) which outputs 264 lines of an output line portion, and the mode

(200 frames/s) which outputs 88 lines.

– 12 –

ICX415AQ

Definition of standard imaging conditions

(1) Standard imaging condition I:

Use a pattern box (luminance: 706cd/m², color temperature of 3200K halogen source) as a subject.

(Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR

cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined

as the standard sensitivity testing luminous intensity.

(2) Standard imaging condition II:

Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.

Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted

to the value indicated in each testing item by the lens diaphragm.

1. G Sensitivity, sensitivity comparison

Set to the standard imaging condition I. After setting the electronic shutter mode with a shutter speed of

1/100s, measure the signal outputs (VGR, VGb, VR and VB) at the center of each Gr, Gb, R and B channel

screen, and substitute the values into the following formulas.

VG = (VGr + VGb)/2

100

Sg = VG ×

[mV]

25

Rr = VR/VG

Rb = VB/VG

2. Saturation signal

Set to the standard imaging condition II. After adjusting the luminous intensity to 20 times the intensity with

the average value of the Gr signal output, 120mV, measure the minimum values of the Gr, Gb, R and B

signal outputs.

3. Smear

Set to the standard imaging condition III. With the lens diaphragm at F5.6 to F8, first adjust the average

value of the Gr signal output to 120mV. Measure the average values of the Gr signal output, Gb signal

output, R signal output and B signal output (Gra, Gba, Ra, Ba), and then adjust the luminous intensity to

500 times the intensity with the average value of the Gr signal output, 120mV.

After the readout clock is stopped and the charge drain is executed by the electronic shutter at the

respective H blankings, measure the maximum value (Vsm [mV]) independent of the Gr, Gb, R and B

signal outputs, and substitute the values into the following formula.

Gra + Gba + Ra + Ba

4

1

500

1

10

Sm = 20 × log Vsm ÷

×

[dB] (1/10V method conversion value)

(

)

– 13 –

ICX415AQ

4. Video signal shading

Set to the standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjusting the luminous

intensity so that the average value of the Gr signal output is 120mV. Then measure the maximum value

(Grmax [mV]) and minimum value (Grmin [mV]) of the Gr signal output and substitute the values into the

following formula.

SHg = (Grmax – Grmin)/120 × 100 [%]

5. Unifoemity between video signal channels

After measuring 4, measure the maximum (Rmax [mV]) and minimum (Rmin [mV]) values of R signal, and

the maximum (Bmax [mV]) and minimum (Bmin [mV]) values of B signal. Substitute the values into the

following formula.

∆Srg = (Rmax – Rmin )/120 × 100 [%]

∆Sbg = (Bmax – Bmin )/120 × 100 [%]

6. Dark signal

Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature of 60°C

and the device in the light-obstructed state, using the horizontal idle transfer level as a reference.

7. Dark signal shading

After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark

signal output and substitute the values into the following formula.

∆Vdt = Vdmax – Vdmin [mV]

8. Lag

Adjust the Gr signal output value generated by the strobe light to 120mV. After setting the strobe light so

that it strobes with the following timing, measure the residual signal amount (Vlag). Substitute the value

into the following formula.

Lag = (Vlag/120) × 100 [%]

VD

V2

Light

Strobe light

timing

Gr signal output 120mV

Vlag(lag)

Output

– 14 –

ICX415AQ

N C

G G C

^{O U}V ^T

N C

^{D D}V

R φ G

L V

S φ U B

G N D

N C

1 φ V

1 φ H

2 φ H

N C

^{S U}C ^B

2 φ V

3 φ V

N C

S U B C I R

N C

– 15 –

ICX415AQ

Spectral Sensitivity Characteristics (Excludes lens characteristics and light source characteristics)

1.0

G

R

0.8

B

0.6

0.4

0.2

0

400

450

500

550

600

650

700

Wave Length [nm]

– 16 –

ICX415AQ

8

7

6

5

4

3

2

1

7

1

6 2 5

2

1

5 9 8

5 9 6

5 8 2

3

2

1

8

7

6

5

4

3

2

1

7

1

6 2 5

5 9 8

2

1

5 8 2

– 17 –

ICX415AQ

– 18 –

ICX415AQ

1 6 6

1 6 3

1 9

1

1 4 4

1 0 2

1 3 8 9 6

1

4 2

4

1

9 4 4

– 19 –

ICX415AQ

8

7

6

5

4

3

2

1

3 1 2

3 1 1

3 1 0

2 9 1

2 9 0

4 2 3

4 2 2

1 6 1

1 6 0

2 7

2 4

2 3

8

7

6

5

4

3

2

1

3 1 2

3 1 1

3 1 0

2 9 1

2 9 0

4 2 3

4 2 2

– 20 –

ICX415AQ

1 4 4

4 2

– 21 –

ICX415AQ

1 4 4

4 2

– 22 –

ICX415AQ

8

7

6

5

4

3

2

1

1 5 6

1 5 5

1 5 4

1 2 4

1 2 3

3 3 5

3 3 4

2 4 9

2 4 8

3 6

3 3

3 2

8

7

6

5

4

3

2

1

1 5 6

1 5 5

1 5 4

1 2 4

1 2 3

3 3 5

3 3 4

– 23 –

ICX415AQ

1 4 4

4 2

– 24 –

ICX415AQ

1 4 4

4 2

– 25 –

ICX415AQ

Notes on Handling

1) Static charge prevention

CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following

protective measures.

a) Either handle bare handed or use non-chargeable gloves, clothes or material.

Also use conductive shoes.

b) When handling directly use an earth band.

c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.

d) Ionized air is recommended for discharge when handling CCD image sensor.

e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.

2) Soldering

a) Make sure the package temperature does not exceed 80°C.

b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W

soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount,

cool sufficiently.

c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering

tool, use a thermal controller of the zero cross On/Off type and connect it to ground.

3) Dust and dirt protection

Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and

dirt. Clean glass plates with the following operation as required, and use them.

a) Perform all assembly operations in a clean room (class 1000 or less).

b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should

dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized

air is recommended.)

c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.

d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences.

e) When a protective tape is applied before shipping, just before use remove the tape applied for

electrostatic protection. Do not reuse the tape.

4) Installing (attaching)

a) Remain within the following limits when applying a static load to the package. Do not apply any load more

than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited

portions. (This may cause cracks in the package.)

39N

29N

0.9Nm

Upper ceramic

Low melting

point glass

Lower ceramic

Compressive strength

Shearing strength

Tensile strength

Torsional stregth

b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the

package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation,

use either an elastic load, such as a spring plate, or an adhesive.

– 26 –

ICX415AQ

c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated

voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,

and indicated values should be transferred to other locations as a precaution.

d) The notch of the package is used for directional index, and that can not be used for reference of fixing.

In addition, the cover glass and seal resin may overlap with the notch of the package.

e) If the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may be

generated by the fragments of resin.

f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-

acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives.

(reference)

5) Others

a) Do not expose to strong light (sun rays) for long periods, as color filters will be discolored. When high

luminous objects are imaged with the exposure level controlled by the electronic iris, the luminance of the

image-plane may become excessive and discoloring of the color filter will possibly be accelerated. In such

a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-

off mode should be properly arranged. For continuous using under cruel condition exceeding the normal

using condition, consult our company.

b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or

usage in such conditions.

c) Brown stains may be seen on the bottom or side of the package. But this does not affect the CCD

characteristics.

– 27 –

ICX415AQ

0 ˚ t o 9 ˚

4 . 0 ± 0 . 3

3 . 2 6 ± 0 . 3

0 . 7

1 5 . 2 4

1 . 2 7

1 5 . 1 ± 0 . 3

7 . 5 5

1 1 . 5 5

3

0 . 5 5

~

Sony Corporation

– 28 –


型号：	ICX415AQ
厂家：	SONY CORPORATION
描述：	Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras 对角线8毫米（类型1/2）与正方形像素的彩色摄像机逐行扫描CCD图像传感器模拟IC 传感器图像传感器信号电路 CD 摄像机
文件：	总28页 (文件大小：262K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ICX415AQ [SONY]

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