PC3H410NIP0F [SHARP]
Mini-flat Half Pitch Package, High CMR, AC Input, Low Input Current Photocoupler; 微型扁平半间距封装，高CMR ，AC输入，低输入电流光耦
| 型号： | PC3H410NIP0F |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Mini-flat Half Pitch Package, High CMR, AC Input, Low Input Current Photocoupler |
| 文件： | 总13页 (文件大小：199K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC3H41xNIP0F Series
Mini-flat Half Pitch Package,
High CMR, AC Input,
Low Input Current Photocoupler
PC3H41xNIP0F
Series
∗4-channel package type is also available.
(model No. PC3Q410NIP0F)
■ Description
■ Agency approvals/Compliance
PC3H41xNIP0F Series contains a IRED optically
1. Recognized by UL1577 (Double protection isolation),
coupled to a phototransistor.
file No. E64380 (as model No. PC3H41)
It is packaged in a 4-pin Mini-flat, half pitch type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter Voltage is 80V, CTR is 50% to
400% at input current of ±0.5mA, and CMR is MIN.
10kV/µs.
2. Package resin : UL flammability grade (94V-0)
■ Applications
1. Programmable controllers
2. Facsimiles
3. Telephones
■ Features
1. 4-pin Mini-flat Half pitch package (Lead pitch :
1.27mm)
2. Double transfer mold package (Ideal for Flow
Soldering)
3. AC input type
4. Low input current type (IF=±0.5mA)
5. High collector-emitter voltage (VCEO : 80V)
6. High noise immunity due to high common mode
rejection voltage (CMR : MIN. 10kV/µs)
7. Isolation voltage between input and output (Viso(rms)
2.5kV)
:
8. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A02102EN
1
Date Jun. 30. 2005
© SHARP Corporation
PC3H41xNIP0F Series
■ Internal Connection Diagram
1
2
3
4
Anode /Cathode
Cathode / Anode
Emitter
1
4
3
2
Collector
(Unit : mm)
■ Outline Dimensions
Rank mark
SHARP mark "S"
Date code
Primary side mark
1
4
H 4 1
4.4±0.2
2
3
5.3±0.3
Epoxy resin
(1.7)
+0.4
−0.2
0.5
+0.2
7.0
−0.7
*( ) : Reference dimensions
Product mass : approx. 0.05g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A02102EN
2
PC3H41xNIP0F Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A02102EN
3
PC3H41xNIP0F Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
mA
mW
V
Parameter
Symbol
IF
Rating
Forward current
±10
*1 Peak forward current
IFM
±200
Power dissipation
P
15
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
80
6
50
V
mA
mW
mW
˚C
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
*2 Isolation voltage
*3 Soldering temperature
PC
150
Ptot
170
Topr
Tstg
−30 to +100
−40 to +125
2.5
˚C
Viso (rms)
kV
Tsol
260
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
MAX.
1.4
250
100
−
Unit
V
Forward voltage
Terminal capacitance
Collector dark current
IF=±10mA
V=0, f=1kHz
−
1.2
Input
Ct
−
30
pF
nA
V
ICEO
VCE=50V, IF=0
−
−
Output Collector-emitter breakdown voltage BVCEO
IC=0.1mA, IF=0
IE=10µA, IF=0
80
−
Emitter-collector breakdown voltage
BVECO
IC
6
−
−
V
Collector current
IF=±0.5mA, VCE=5V
IF=±10mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
0.25
−
2.0
0.2
−
mA
V
Collector-emitter saturation voltage VCE (sat)
−
−
1×1011
0.6
4
Isolation resistance
Floating capacitance
RISO
Cf
tr
5×1010
Ω
Transfer
charac-
teristics
−
−
−
1.0
18
pF
µs
µs
Rise time
Response time
VCE=2V, IC=2mA, RL=100Ω
Fall time
tf
3
18
Ta=25˚C, RL=470Ω, VCM=1.5kV(peak),
IF=0, VCC=9V, Vnp=100mV
Common mode rejection voltage
CMR
10
−
−
kV/µs
Sheet No.: D2-A02102EN
4
PC3H41xNIP0F Series
■ Model Line-up
Taping
IC [mA]
Package
Rank mark
(I =±0.5mA, V =5V, T =25˚C)
3 000pcs/reel
PC3H410NIP0F
PC3H411NIP0F
F
CE
a
0.25 to 2.0
0.5 to 1.5
with or without
A
Model No.
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A02102EN
5
PC3H41xNIP0F Series
Fig.1 Test Circuit for Common Mode Rejection Voltage
(dV/dt)
VCM
1)
VCC
Vnp
Vcp
RL
Vnp
VO
VCM : High wave
pulse
RL=470Ω
(Vcp Nearly = dV/dt×Cf×RL)
1) Vcp : Voltage which is generated by displacement current in floating
capacitance between primary and secondary side.
VCM
VCC=9V
Fig.2 Forward Current vs. Ambient
Fig.3 Diode Power Dissipation vs. Ambient
Temperature
Temperature
15
15
10
10
5
0
5
0
−30
0
25
50
75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.4 Collector Power Dissipation vs.
Fig.5 Total Power Dissipation vs. Ambient
Ambient Temperature
250
Temperature
250
200
200
150
100
170
150
100
50
0
50
0
−30
0
25
50
75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A02102EN
6
PC3H41xNIP0F Series
Fig.6 Peak Forward Current vs. Duty Ratio
Fig.7 Forward Current vs. Forward Voltage
100
Pulse width≤100µs
Ta=25˚C
1 000
10
Ta=25˚C
100
Ta=100˚C
Ta=0˚C
Ta=75˚C
Ta=50˚C
1
Ta=−25˚C
10
0.1
10−3
10−2
Duty ratio
10−1
1
0
0.5
1
1.5
2
Forward voltage VF (V)
Fig.8 Current Transfer Ratio vs. Forward
Current
Fig.9 Collector Current vs. Collector-emitter
Voltage
600
40
VCE=5V
Ta=25˚C
Ta=25˚C
500
PC (MAX.)
30
400
300
200
IF=7mA
20
IF=5mA
IF=3mA
IF=2mA
10
100
0
IF=0.5mA
IF=1mA
0
0.1
1
10
0
2
4
6
8
10
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.10 Relative Current Transfer Ratio vs.
Fig.11 Collector - emitter Saturation Voltage
vs. Ambient Temperature
Ambient Temperature
150
0.16
IF=10mA
IC=1mA
0.14
VCE=5V
IF=0.5mA
0.12
0.1
100
0.08
0.06
0.04
50
0
0.02
0
−30 −20 −10
0
10 20 30 40 50 60 70 80 90 100
−30 −20 −10
0
10 20 30 40 50 60 70 80 90 100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A02102EN
7
PC3H41xNIP0F Series
Fig.12 Collector Dark Current vs. Ambient
Temperature
Fig.13 Response Time vs. Load Resistance
(active region)
10−5
100
VCE=2V, IC=2mA
VCE=50V
10−6
10−7
10−8
10−9
tr
tf
10
td
ts
10−10
10−11
1
0.1
−30 −20 −10
0
10 20 30 40 50 60 70 80 90 100
1
10
Ambient temperature Ta (˚C)
Load resistance RL (kΩ)
Fig.14 Response Time vs. Load Resistance
Fig.15 Test Circuit for Response Time
(saturation region)
1 000
V =5V, IF=1mA, T =25˚C
cc a
VCC
RL
RD
Input
Input
Output
VCE
tf
Output
ts
10%
90%
100
10
ts
tf
td
tr
tr
Please refer to the conditions in Fig.13 and Fig.14
td
1
1
10
100
Load resistance RL (kΩ)
Fig.16 Frequency Response
Fig.17 Collector-emitter Saturation Voltage
vs. Forward Current
5
5
0
IC=7mA
Ta=25˚C
IC=5mA
VCE=2V
IC=2mA
Ta=25˚C
4
IC=3mA
RL=10kΩ
−5
IC=2mA
3
1kΩ
IC=1mA
−10
−15
IC=0.5mA
100Ω
2
1
0
−20
−25
0.1
1
10
100
1 000
0
2
4
6
8
10
Frequency f (kHz)
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
8
Sheet No.: D2-A02102EN
PC3H41xNIP0F Series
■ Design Considerations
● Design guide
While operating at IF<0.5mA, CTR variation may increase.
Please make design considering this fact.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through IRED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of IRED.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
6.3
1.5
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A02102EN
9
PC3H41xNIP0F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A02102EN
10
PC3H41xNIP0F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A02102EN
11
PC3H41xNIP0F Series
■ Package specification
● Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
G
D
J
E
I
M A X .
5 ˚
L
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
12.0±0.3
5.5±0.1
1.75±0.1
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
L
+0.1
7.5±0.1
0.3±0.05
2.3±0.1
3.1±0.1
φ1.6
−0
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
13.5±1.5
100±1.0
13±0.5
f
g
f
23±1.0
2.0±0.5
2.0±0.5
a
b
Direction of product insertion
Pull-out direction
[Packing : 3 000pcs/reel]
Sheet No.: D2-A02102EN
12
PC3H41xNIP0F Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
[E211]
Sheet No.: D2-A02102EN
13
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