PC3H41XNIP [SHARP]

AC Input, Low Input Current Type Photocoupler; AC输入,低输入电流型光耦合器
PC3H41XNIP
型号: PC3H41XNIP
厂家: SHARP ELECTRIONIC COMPONENTS    SHARP ELECTRIONIC COMPONENTS
描述:

AC Input, Low Input Current Type Photocoupler
AC输入,低输入电流型光耦合器

光电
文件: 总5页 (文件大小:77K)
中文:  中文翻译
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PC3H41X NIP Series/PC3Q410NIP  
AC Input, Low Input Current  
Type Photocoupler  
PC3H41X NIP Series  
PC3Q410 NIP  
Outline Dimensions  
Features  
(Unit : mm)  
1. Low input current type (IF0.5mA)  
2. High resistance to noise due to high common rejection  
voltage (CMR:MIN. 10kV/µs)  
PC3H41xNIP Series  
Internal connection  
diagram  
Anode mark  
4
1
3
1
2
4
3
1
2
Anode  
(Cathode)  
3. AC input type  
Cathode  
(Anode)  
H 4 1  
4.4±0.2  
4. Mini-flat package PC3H41X NIP Series (1ch)  
PC3Q410 NIP (4ch)  
3
4
Emitter  
Collector  
2
5. Isolation voltage (Viso:2.5kVrms)  
6. Recognized by UL, file No. E64380  
5.3±0.3  
Epoxy resin  
Applications  
1. Programmable controllers  
2. Facsimiles  
+0.4  
0.5  
0.2  
+0.2  
7.0  
0.7  
3. Telephones  
PC3Q410NIP  
Rank Table  
10.3±0.3  
Internal connection  
diagram  
Model No.  
Rank mark  
Ic (mA)  
0.25 to 2.0  
0.5 to 1.5  
Conditions  
1.27±0.25  
16 15 14 13 12 11 10  
9
IF0.5mA  
VCE=5V  
Ta=25°C  
PC3H410NIP A or no mark  
16  
9
A
PC3H411NIP  
Model No.  
Rank mark  
No mark  
Ic (mA)  
Conditions  
P C 3 Q 4 1  
IF0.5mA  
VCE=5V  
Ta=25°C  
1
2
3
4
5
6 7  
8
0.25 to 2.0  
PC3Q410NIP  
1
2
9
3
5
6
7
Anode (Cathode)  
Cathode (Anode)  
Emitter  
4
8
11 13 15  
0.4±0.1  
8
1
Absolute Maximum Ratings  
(Ta=25°C)  
10 12 14 16  
Collector  
Primary side mark  
Parameter  
Symbol  
Rating  
±10  
±200  
15  
Unit  
mA  
mA  
mW  
IF  
Forward current  
*1 Peak forward current  
Power dissipation  
Collector-emitter voltage  
Emitter-collector voltage  
Collector current  
Collector power dissipation  
Total power dissipation  
Operating temperature  
Storage temperature  
*2 Isolation voltage  
C0.4  
(Input side)  
Epoxy resin  
Input  
IFM  
5.3±0.3  
P
VCEO  
VECO  
IC  
V
70  
+0.4  
V
6
0.5  
0.2  
Output  
+0.2  
50  
mA  
mW  
mW  
7.0  
0.7  
PC  
150  
170  
Ptot  
Topr  
Tstg  
Viso  
Tsol  
30 to +100  
40 to +125  
°C  
°C  
kVrms  
°C  
2.5  
260  
*3  
Soldering temperature  
*1 Pulse width<=100µs, Duty ratio=0.001  
*2 40 to 60%RH, AC for 1 minute, f=60Hz  
*3 For 10s  
0.2mm or more  
Soldering area  
Notice  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP  
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/  
PC3H41X NIP Series/PC3Q410NIP  
Electro-optical Characteristics  
(Ta=25°C)  
Parameter  
Symbol  
Conditions  
IF10mA  
MIN.  
TYP.  
1.2  
30  
MAX.  
1.4  
250  
100  
Unit  
V
pF  
Forward voltage  
VF  
Ct  
Terminal capacitance  
Collector dark current  
Collector-emitter breakdown voltage  
Emitter-collector breakdown voltage  
Collector current  
V=0, f=1kHz  
ICEO  
BVCEO  
BVECO  
IC  
VCE=50V, IF=0  
IC=0.1mA, IF=0  
IE=10µA, IF=0  
nA  
V
70  
6
V
2.0  
0.2  
mA  
V
IF0.5mA, VCE=5V  
IF10mA, IC=1mA  
DC500V 40 to 60%RH  
V=0, f=1MHz  
0.25  
5×1010  
1011  
0.6  
4
Collector-emitter saturation voltage  
Isolation resistance  
Floating capacitance  
VCE (sat)  
RISO  
Cf  
pF  
µs  
µs  
1.0  
18  
18  
tr  
Rise time  
Response time  
VCE=2V, IC=2mA, RL=100Ω  
Fall time  
tf  
3
Ta=25°C, RL=470Ω, VCM=1.5kV (peak),  
IF=0mA, VCC=9V, Vnp=100mV  
*1  
kV/µs  
Common mode rejection voltage  
CMR  
10  
*1 Refer to Fig.1.  
Fig.1 Test Circuit for Common Mode Rejection Voltage  
(dV/dt)  
VCM  
1)  
VCC  
Vnp  
Vcp  
RL  
Vnp  
VO  
V
CM : High wave  
pulse  
RL=470Ω  
CC=9V  
(Vcp Nearly = dV/dt×Cf×RL)  
VCM  
1) Vcp : Voltage which is generated by displacement current in floating  
capacitance between primary and secondary side.  
V
Fig.2 Forward Current vs. Ambient  
Temperature  
Fig.3 Diode Power Dissipation vs. Ambient  
Temperature  
15  
10  
10  
5
0
5
0
30  
0
25  
50  
75  
100  
125  
30  
0
25  
50  
75  
100  
125  
Ambient temperature Ta (°C)  
Ambient temperature Ta (°C)  
PC3H41X NIP Series/PC3Q410NIP  
Fig.4 Collector Power Dissipation vs.  
Ambient Temperature  
Fig.5 Total Power Dissipation vs. Ambient  
Temperature  
200  
150  
100  
200  
170  
150  
100  
50  
0
50  
0
30  
0
25  
50  
75  
100  
125  
30  
0
25  
50  
75  
100  
125  
Ambient temperature Ta (°C)  
Ambient temperature Ta (°C)  
Fig.6 Peak Forward Current vs. Duty Ratio  
Fig.7 Forward Current vs. Forward Voltage  
100  
2000  
1000  
500  
Pulse width <=100µs  
Ta=25°C  
10  
200  
100  
50  
Ta=25°C  
Ta=100°C  
Ta=0°C  
Ta=75°C  
Ta=50°C  
1
Ta=−25°C  
20  
10  
0.1  
103  
2
5
102  
Duty ratio  
2
5
101  
2
5
1
0
0.5  
1.0  
1.5  
2.0  
5
Forward voltage VF (V)  
Fig.8 Current Transfer Ratio vs. Forward  
Current  
Fig.9 Current Transfer Ratio vs. Forward  
Current  
PC3H41xNIP Series  
PC3Q410NIP  
600  
500  
VCE=5V  
VCE=5V  
Ta=25°C  
Ta=25°C  
500  
400  
300  
200  
400  
300  
200  
100  
0
100  
0
0.1  
1
10  
0.1  
1
10  
Forward current IF (mA)  
Forward current IF (mA)  
PC3H41X NIP Series/PC3Q410NIP  
Fig.10 Collector Current vs. Collector-emitter  
Fig.11 Collector Current vs. Collector-emitter  
Voltage  
Voltage  
PC3Q410NIP  
PC3H41xNIP Series  
40  
40  
Ta=25°C  
Ta=25°C  
PC (MAX.)  
PC (MAX.)  
30  
30  
IF=7mA  
IF=7mA  
20  
20  
IF=5mA  
IF=3mA  
IF=5mA  
IF=3mA  
IF=2mA  
10  
10  
IF=2mA  
IF=0.5mA  
IF=1mA  
IF=0.5mA  
IF=1mA  
0
0
0
2
4
6
8
10  
0
2
4
6
8
10  
Collector-emitter voltage VCE (V)  
Collector-emitter voltage VCE (V)  
Fig.12 Relative Current Transfer Ratio vs.  
Ambient Temperature  
Fig.13 Relative Current Transfer Ratio vs.  
Ambient Temperature  
PC3H41xNIP Series  
PC3Q410NIP  
150  
150  
VCE=5V  
IF=0.5mA  
VCE=5V  
IF=0.5mA  
100  
100  
50  
0
50  
0
30 20 10  
0
10 20 30 40 50 60 70 80 90 100  
30 20 10  
0
10 20 30 40 50 60 70 80 90 100  
Ambient temperature Ta (°C)  
Ambient temperature Ta (°C)  
Fig.15 Collector Dark Current vs. Ambient  
Temperature  
Fig.14 Collector - emitter Saturation Voltage  
vs. Ambient Temperature  
105  
0.16  
VCE=50V  
IF=10mA  
IC=1mA  
0.14  
106  
107  
108  
109  
0.12  
0.10  
0.08  
0.06  
0.04  
1010  
1011  
0.02  
0
30 20 10  
0
10 20 30 40 50 60 70 80 90 100  
30 20 10  
0
10 20 30 40 50 60 70 80 90 100  
Ambient temperature Ta (°C)  
Ambient temperature Ta (°C)  
PC3H41X NIP Series/PC3Q410NIP  
Fig.16 Response Time vs. Load Resistance  
Fig.17 Response Time vs. Load Resistance  
(Saturation)  
1000  
1000  
VCE=2V  
IC=2mA  
Ta=25°C  
VCC=5V  
IF=16mA  
Ta=25°C  
tf  
100  
100  
10  
tf  
td  
ts  
10  
ts  
tr  
td  
1
1
tr  
0.1  
0.1  
0.1  
1
10  
1
10  
Load resistance RL (k)  
100  
Load resistance RL (k)  
Fig.18 Test Circuit for Response Time  
Fig.19 Voltage Gain vs Frequency  
5
VCC  
VCE=2V  
IC=2mA  
Ta=25°C  
0
5  
RL  
RD  
Input  
Input  
Output  
RL=10kΩ  
Output  
10%  
90%  
1kΩ  
10  
15  
ts  
tf  
td  
tr  
100Ω  
20  
25  
0.1  
1
10  
Frequency f (kHz)  
100  
1000  
Fig.20 Collector-emitter Saturation Voltage  
Fig.21 Reflow Soldering  
vs. Forward Current  
5
Only one time soldering is recommended within the temperature  
profile shown below.  
IC=7mA  
Ta=25°C  
230°C  
IC=5mA  
4
IC=3mA  
IC=2mA  
200°C  
180°C  
3
IC=1mA  
IC=0.5mA  
2
1
0
25°C  
30s  
1min  
0
2
4
6
8
10  
2min  
1.5min  
1min  
Forward current IF (mA)  

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