PC3H4AJ0001H [SHARP]
AC Input-Transistor Output Optocoupler,;
| 型号： | PC3H4AJ0001H |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | AC Input-Transistor Output Optocoupler, 输入元件 输出元件 光电 |
| 文件： | 总13页 (文件大小：1067K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC3H4J00001H Series
Mini-flat Half Pitch Package,
AC Input Photocoupler
PC3H4J00001H
Series
■Description
■Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC3H4)
PC3H4J00001H Series contains an IRED optically
coupled to a phototransistor.
2.Package resin : UL flammability grade (94V-0)
It is packaged in a 4-pin Mini-flat, half pitch type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter voltage is 80V and CTR is 20% to
400% (at IF=± 1mA,VCE=5V,Ta=25℃)
.
■Applications
1. Programmablecontrollers
■Features
1. 4-pin Mini-flat Half pitch package
(Lead pitch : 1.27mm)
2. Double transfer mold package
(Ideal for Flow Soldering)
3. AC inputtype
4. High collector-emitter voltage (VCE : 80V)
5. Isolation voltage between input and output
(Viso(rms): 2.5kV)
6. RoHS directivecompliant
Notice The content of data sheet is subject to change without priornotice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARPdevice.
Sheet No.: OP18008EN
Date Jan. 15. 2018
© SHARPCorporation
1
PC3H4J00001H Series
Internal Connection Diagram
Anode / Cathode
Cathode / Anode
Emitter
1
2
3
4
1
2
4
3
Collector
Outline Dimensions
(Unit : mm)
*( ) : ReferenceDimensions
Product mass : approx.0.05g
Sheet No.: OP18008EN
2
PC3H4J00001H Series
Date code indication (Ex.)
3-digit number shall be marked the age indication of 1-digit number, and week code of 2-digit number.
Week code “01” indicate the week including the first Thursday of January. And later, Monday is the starting
point.
Year Week
Date code
652
701
702
703
・
MON
12/26
1/2
1/9
1/16
・
TUE
12/27
1/3
1/10
1/17
・
WED
12/28
1/4
1/11
1/18
・
THU
12/29
1/5
1/12
1/19
・
FRI
12/30
1/6
1/13
1/20
・
SAT
12/31
1/7
1/14
1/21
・
SUN
1/1
1/8
1/15
1/22
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
752
751
752
801
12/11
12/18
12/25
1/1
12/12
12/19
12/26
1/2
12/13
12/20
12/27
1/3
12/14
12/21
12/28
1/4
12/15
12/22
12/29
1/5
12/16
12/23
12/30
1/6
12/17
12/24
12/31
1/7
Country of origin and Plating material
Country of origin
Plating material
Japan
SnBi (Bi : 1 4%)
～
Rankmark
Refer to the Model Line-uptable.
Sheet No.: OP18008EN
3
PC3H4J00001H Series
■Absolute Maximum Ratings
(Ta25˚C)
Parameter
Symbol
Rating
Unit
mA
A
Forward current
IF
IFM
50
1
70
*1
Peak forward current
Power dissipation
Collector-emittervoltage
Emitter-collectorvoltage
Collector current
P
mW
V
80
VCEO
VECO
IC
6
50
V
mA
mW
mW
˚C
Collector power dissipation
PC
150
Total power dissipation
Operating temperature
Storage temperature
*2 Isolation voltage
*3 Soldering temperature
170
Ptot
30 to 100
40 to 125
2.5
Topr
Tstg
˚C
kV
˚C
Viso (rms)
Tsol
260
*1 Pulse width100s, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
■Electro-opticalCharacteristics
(Ta25˚C)
Symbol
VF
Unit
Parameter
Conditions
MIN.
TYP.
MAX.
1.4
250
100
Forward voltage
Input
IF20mA
V0, f1kHz
VCE50V, IF0
IC0.1mA, IF0
IE10A, IF0
1.2
V
80
Terminal capacitance
Ct
30
pF
nA
V
Dark current
ICEO
BVCEO
BVECO
IC
Collector-emitter breakdown voltage
Output
Emitter-collector breakdown voltage
Collector current
6
V
IF1mA, VCE5V
IF20mA, IC1mA
DC500V, 40 to 60%RH
V0, f1MHz
0.2
4.0
0.2
1.0
18
mA
V
0.1
11011
0.6
4
Collector-emitter saturation voltage
Isolation resistance
VCE (sat)
RISO
Cf
51010
Transfer
charac-
teristics
Floating capacitance
pF
s
s
Risetime
tr
Responsetime
VCE2V, IC2mA,
RL100
Falltime
tf
3
18
Sheet No.: OP18008EN
4
PC3H4J00001H Series
Model Line-up
Taping
Package
3,500pcs/reel
IC[mA]
(IFmA, VCE5V,T25˚C)
Rankmark
a
PC3H4J00001H
PC3H4AJ0001H
with or “_”
A
0.2 to 4.0
Model No.
0.5 to 1.5
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: OP18008EN
5
PC3H4J00001H Series
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
Sheet No.: OP18008EN
6
PC3H4J00001H Series
Fig.7 Current Transfer Ratio vs. Forward
Current
Fig.8 Collector Current vs. Collector-emitter
Voltage
Fig.9 Relative Current Transfer Ratiovs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
Fig.12 Collector-emitter Saturation Voltage
vs. Forward Current
Fig.11 Collector Dark Current vs. Ambient
Temperature
Sheet No.: OP18008EN
7
PC3H4J00001H Series
Fig.14 Test Circuit for ResponseTime
Fig.13 Response Timevs.
Load Resistance
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: OP18008EN
8
PC3H4J00001H Series
Design Considerations
● Design guide
While operating at IF<1mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the designconsideration.
●Recommended Foot Print (reference)
6.3
1.5
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: OP18008EN
9
PC3H4J00001H Series
Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more thantwice.
(˚C)
300
Terminal : 260˚C peak
(package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the be-
low listedguidelines.
Flow soldering should be completed below 260℃ and within 10s.
Preheating is within the bounds of 100 to 150℃ and 30 to 80s.
Please don't solder more thantwice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400℃.
Please don't solder more thantwice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: OP18008EN
10
PC3H4J00001H Series
● Cleaninginstructions
Solvent cleaning:
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of thedevice.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packagingresin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane(Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
(1) The RoHS directive(2011/65/EU)
This product complies with the RoHS directive(2011/65/EU)
Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls
（PBB）and polybrominated diphenyl ethers（PBDE）
(2) Content of six substances specified in Management Methods for Control of Pollution Caused
by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Marking Styles for the Names and Contents of the Hazardous Substances
Hazardous Substances
Polybrominated
biphenyls
Polybrominated
diphenyl ethers
Hexavalent
chromium
(Cr6+)
Category
Lead
Mercury
Cadmium
(Cd)
(Pb)
(Hg)
(PBB)
○
(PBDE)
○
Photocoupler
○
○
○
○
This table is prepared in accordance with the provisions of SJ/T 11364.
○：Indicates that said hazardous substance contained in all of the homogeneous materials
for this part is below the limit requirement of GB/T 26572.
Sheet No.: OP18008EN
11
PC3H4J00001H Series
Packagespecification
●Tape and Reel package
Packagematerials
Carrier tape : PS
Cover tape : PET (three layersystem)
Reel : PS
Carrier tape structure andDimensions
Dimensions List
(Unit : mm)
A
B
7.50.1
C
D
4.00.1
K
E
2.00.1
L
F
G
0.1
16.00.3
1.750.1
4.00.1
1.5
0.0
H
I
J
7.550.1
0.3
2.30.1
2.850.1 1.550.1
Reel structure and Dimensions
Dimensions List
(Unit : mm)
a
b
17.51.0
f
c
d
3302.0
e
100.01.0 13.00.2
g
2.00.5
2.00.5
21.0
Direction of productinsertion
Pull-out direction
[Packing : 3,500pcs/reel]
Sheet No.: OP18008EN
12
PC3H4J00001H Series
■ Important Notices
·The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP'sdevices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles,etc.)
--- Trafficsignals
--- Gas leakage sensor breakers
--- Alarmequipment
--- Various safety devices,etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
·Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
withoutnotice.
--- Spaceapplications
--- Telecommunication equipment [trunk lines]
--- Nuclear power controlequipment
--- Medical and other life support equipment (e.g.,
scuba).
·If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
·Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the followingconditions:
·This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
(i)The devices in this publication are designed for use in
general electronic equipment designs such as:
--- Personalcomputers
--- Office automationequipment
--- Telecommunication equipment[terminal]
--- Test and measurementequipment
--- Industrialcontrol
--- Audio visualequipment
·Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
--- Consumerelectronics
(ii)Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: OP18008EN
13
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