PC3H510NIP [ETC]
PHOTOCOUPLER ; 光电耦合器\n
| 型号： | PC3H510NIP |
| 厂家： | 
ETC |
| 描述： | PHOTOCOUPLER
|
| 文件： | 总4页 (文件大小：48K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC3H510NIP
Low Input Current, Half-Pitch
Photocoupler
PC3H510NIP
ꢀ Outline Dimensions
ꢀ Features
(Unit : mm)
1. Low input drive current (IF=0.5mA)
Internal connection
diagram
2. High sensitivity
Anode mark
4
3
(Darlington type, CTR:Min. 600%)
3. Half-pitch type, well suited for high-density mounting
(Lead pitch:1.27mm)
1
4
1
2
3
4
Anode
Cathode
Emitter
Collector
H 5 1
4.4±0.2
2
3
4. Soldering reflow type (230˚C, 30s)
5. Taping package
1
2
5.3±0.3
6. Isolation voltage (Viso (rms):2.5kV)
7. Recognized by UL, file No. E64380
Epoxy resin
ꢀ Applications
1. Programmable controllers
2. Facsimiles
+0.4
0.5
−0.2
+0.2
7.0
−0.7
3. Telephones
ꢀ Package Specifications
Model No.
Package specification
Taping reel diameter 330mm (3 000pcs.)
PC3H510NIP
ꢀ Absolute Maximum Ratings
(Ta=25°C)
Unit
mA
Parameter
Symbol
Rating
*1 Forward current
*2 Peak forward current
Reverse voltage
*1 Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Collector current
IF
IFM
10
0.2mm or more
Soldering area
200
mA
Input
VR
6
V
mW
P
15
VCEO
VECO
IC
V
35
V
6
80
Output
mA
mW
mW
*1
Collector power dissipation
PC
150
*1
170
Total power dissipation
Ptot
Operating temperature
Storage temperature
*3 Isolation voltage
Topr
Tstg
Viso (rms)
Tsol
−30 to +100
−40 to +125
°C
°C
kV
°C
2.5
260
*4
Soldering temperature
*1 The derating factors of absolute maximum ratings due to ambient temperature are
shown in Fig.2 to 5
*2 Pulse width≤100µs, Duty ratio=0.001(shown in Fig.6)
*3 40 to 60%RH, AC for 1 min, f=60Hz
*4 For 10 s
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
PC3H510NIP
(Ta=25˚C)
ꢀ Electro-optical Characteristics
Parameter
Symbol
VF
Conditions
IF=5mA
MIN.
TYP.
1.2
−
MAX.
1.4
10
Unit
V
Forward voltage
−
−
Input
Reverse current
IR
VR=4V
µA
pF
nA
V
Terminal capacitance
Ct
V=0, f=1kHz
VCE=10V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=0.5mA, VCE=2V
−
30
−
250
1000
−
ICEO
BVCEO
BVECO
IC
−
35
6
Collector dark current
Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Output
−
−
−
V
14
60
mA
3
Collector current
−
VCE(sat)
−
Collector-emitter saturation voltage
Isolation resistance
IF=1mA, IC=2mA
DC500V, 40 to 60%RH
V=0, f=1MHz
1.0
−
V
Ω
Transfer
charac-
teristics
RISO
Cf
tr
5×1010
1011
0.6
60
53
Floating capacitance
−
−
−
1.0
300
250
pF
µs
µs
VCE=2V
IC=10mA
RL=100Ω
Rise time
Response time
Fall time
tf
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
15
10
10
5
0
5
0
−30
0
25
50
75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
PC3H510NIP
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
200
150
100
200
170
150
100
50
0
50
0
−30
0
25
50
75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
2000
1000
500
Pulse width
Ta = 25˚C
≤
100µs
200
100
50
20
10
5
10−3
2
5
10−2
Duty ratio
2
5
10−1
2
5
1
Application Circuits
NOTICE
●The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
●Contact and consult with a SHARP representative if there are any questions about the contents of this
publication.
115
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