BU90030G-TR [ROHM]

Display Driver, PDSO6;


型号：	BU90030G-TR
厂家：	ROHM
描述：	Display Driver, PDSO6 光电二极管
文件：	总5页 (文件大小：112K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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Structure

Function

Silicon Monolithic Integrated Circuit

Voltage Regulated Charge Pump IC

Product

BU90030G

Function

- Input voltage range 2.0V～4.0V

- PFM operation

- Output voltage 4.0V (typ)

- 1.5MHz(typ) switching frequency.

- SSOP6 package

Absolute Maximum rating（Ta=25c）

Item

Symbol

Rating

Unit

Maximum input power

supply voltage

VCC

-0.3 ～ 7

Maximum input voltage

CP, CN, SHD, VOUT

-0.3 ～ 7

675 (*1)

Power dissipation

Operating temperature

range

Topr

-35～+85

Storage temperature

range

Junction temperature

Tstg

-55～+125

Tjmax

+125

*1 When mounted on the specified PCB (70mm×70mm×1.6mm glass epoxy).

Deducted by 6.75mW/c when used over Ta=25c.

Operating range (Ta=25c)

Rating

Item

Symbol

Unit

Condition

Min.

2.0

Typ.

Max.

4.0

VBAT

Cfly

Power supply voltage

Flying Capacitor

0.1

1.0

Output Capacitor

CCPOUT

IOMAX

VCC=2.5V,

Maximum Output Current

mA Cfly=1.0uF,

COUT=1.0uF

REV. Ａ

2/4

Electrical characteristics (unless otherwise specified VBAT=2.5[v], Ta=25[c])

Rating

Typ.

Item

Symbol

Unit

Condition

Min.

Max.

【Voltage Control part】

Vcpout1

Vcpout2

3.8

3.6

4.0

4.2

Cfly=COUT=1uF

Output voltage 1

VCC=2.0V, IOUT=40mA,

Cfly=COUT=1.0uF

Output voltage 2

【Oscillator circuit】

VCC=2.0V, VOUT=3.8V,

VOUT=40mA

Fosc

1.0

1.5

2.0

MHz

MaximumOscillator frequency

【Output discharge circuit】

Discharge resistor

RDIS

300

600

900

VCC=2.5V, VOUT=4.0V

【SHD part】

RSHD

VSHDH

VSHDL

100

1.4

200

400

4.0

0.4

kΩ

SHD pin pull down resistor

Operation

SHD pin control

voltage

Non operation

【Circuit current】

ISHD

Circuit current at shutdown

* No design for durability against radiation

External dimention/Pin layout

1PIN MARK

Block diagram

REV. Ａ

3/4

Cfly

Driver + FET

VCC

VOUT

CIN

COUT

CONTROL

SHD

LOGIC

VREF

ON/OFF

OSC

GND

Pin number/name/function

Pin nr

Name

Function

VOUT Starting charge pump output pin

GND

SHD

GND pin

Shutdown pin

Flying Capacitor L side input pin

Power supply input pin

Flying Capacitor H side input pin

VCC

Operation Notes

REV. Ａ

4/4

1.) Absolute maximum ratings

An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit.

If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,

such as fuses.

2.) GND voltage

The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages

up to -0.3 V to be applied to the IC pin.

3.) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions

4.) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

5.) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction

6.) Mutual impedance

Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple

as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance

and capacitance).

7.) Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode

or transistor. For example, as shown in the figures below, the relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in

mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes

operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.

8.) Thermal shutdown Circuit (TSD Circuit)

This model IC has a built-in TSD circuit. This circuit is only to cut off the IC from thermal runaway, and has not been

design to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation

in mind.

9.) External Component

Use a small ESR ceramic capacitor for the external capacitor (CIN,COUT,Cfly) and set them nearby IC.

Use the CIN capacitor’s value that meets this condition ( CIN≧COUT ).

And Use the Cfly capacitor’s value that meets this condition ( Cfly≦COUT ).

There may be a case that it doesn’t achieve the objective characteristic because the capacity come down lower than the

normal capacitor because of the bias voltage and the temperature when using a small layered ceramic capacitor.

Therefore, the user should use it after checking the DC bias capacity and other characteristics.

REV. Ａ

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

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R1010

BU90030G-TR [ROHM]

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