BD60203EFV_技术文档

Datasheet

36V

2ch DC Brush Motor Driver

BD60203EFV

General Description

Key Specifications

BD60203EFV is 2ch H-bridge motor driver for DC brush

motor. This driver can facilitate low power consumption by

PWM constant current control. Various protection circuits

are built in. And also a circuit for lock detection is built in,

so it is possible to output an error detection signal

corresponding to Wired-Or signaling motor lock status. It

contributes to high reliability of the set.



Power Supply Voltage Range:

Rated Output Current:

Rated Output Current (Peak):

Operating Temperature Range:

Output ON-Resistance:

8.0 V to 28.0 V

1.7 A

3.0 A

-25 °C to +85 °C

0.65 Ω (Typ)

(Total of upper and lower resistors)

Features

Package

HTSSOP-B24

W(Typ) x D(Typ)x H(Max)

7.80 mm x 7.60 mm x 1.00 mm



Single Power Supply Input (rated voltage of 36 V)

Rated Output Current (peak): 1.7 A(3.0 A)

Low ON-Resistance DMOS Output

PH, EN Input

Power Save Function

PWM Constant Current Control (current limit function)

Built-in Spike Noise Cancel Function (external noise

filter is unnecessary)



Driver for 2 DC Brush Motor

Built-in Logic Input Pull-down Resistor

Cross-conduction Prevention Circuit

Thermal Shutdown Circuit (TSD)

Figure 1. HTSSOP-B24

Over-current Protection Circuit (OCP)

Under Voltage Lockout Circuit (UVLO)

Over Voltage Lockout Circuit (OVLO)

Built-in Comparator for Lock Detection

Ghost Supply Prevention (protects against malfunction

when power supply is disconnected)

Microminiature, Ultra-thin and High Heat-radiation

(exposed metal type) HTSSOP-B24 Package

Typical Application Circuit

GND

PH1

EN1

PH2

LOCK1



EN2

LOCK2

VCC1

SET1

SET2

Applications

OUT1A

Plain Paper Copier (PPC), Multi-function Printer, Laser

Printer, Inkjet Printer, Photo Printer, FAX, Mini Printer and

etc.

VREF1

VREF2

OUT1B

RNF1

VCC2

OUT2A

CR

OUT2B

RNF2

TEST

PS

GND

Figure 2. Application Circuit

○Product structure：silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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Pin Configuration

Block Diagram

[TOP VIEW]

11

LOCK1

OUT2B

RNF2

NC

1

24

23

22

GND

16

SET1

Detect

SET2 17

VREF1 14

VREF2 15

2

3

4

OUT1B

RNF1

12 LOCK2

＋

－

＋

－

1/8

RNF1

1/8

＋

－

＋

－

OUT1A

VCC1

21

20

19

18

17

OUT2A

VCC2

GND

Regulator

TSD

RNF2

OCP

5

6

7

8

9

Blank time

TEST

CR

6

PWM control

UVLO

OVLO

TEST

PH1

18

OSC

VCC1

5

CR

4 OUT1A

Forward

Reverse

BRAKE

Open

2

OUT1B

SET2

EN1

PH1

EN1

7

8

RNF1

3

1

16 SET1

PH2

EN2

GND

13

PS

20

VCC2

15 VREF2

10

11

Forward

Reverse

BRAKE

Open

9

21

24

PH2

EN2

OUT2A

OUT2B

RNF2

EXP-PAD

10

14

LOCK1

LOCK2

VREF1

23

19

GND

12

13 PS

Figure 3. Pin Configuration

Figure 4. Block Diagram

Pin Descriptions

Pin No. Pin Name

Function

Pin No. Pin Name

Function

1

2

GND

Ground pin

13

14

PS

Power save pin

OUT1B

H bridge output pin

VREF1

Current limit value setting pin

Motor lock current setting pin

Chopping frequency setting pin

Ground pin

Connection pin of resistor

for output current detection

3

4

RNF1

OUT1A

VCC1

TEST

PH1

15

16

17

18

19

20

21

22

23

24

-

VREF2

SET1

SET2

CR

H bridge output pin

5

Power supply pin

6

Test pin (Connected to GND)

H bridge control pin

7

GND

VCC2

OUT2A

NC

8

EN1

H bridge control pin

Power supply pin

9

PH2

H bridge control pin

H bridge output pin

10

11

12

-

EN2

H bridge control pin

No connection

Connection pin of resistor

for output current detection

LOCK1

LOCK2

EXP-PAD

Motor lock detection signal output pin

RNF2

OUT2B

-

H bridge output pin

The EXP-PAD of the center of product

connected to GND.

-

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Absolute Maximum Ratings (Ta=25 °C)

Parameter

Symbol

VCC1, VCC2

V_IN

Rating

-0.2 to +36.0

-0.3 to +5.5

0.7

Unit

V

Supply Voltage

Input Voltage for Control Pin

RNF Maximum Voltage

Output Current

V

V_RNF

V

I_OUT

1.7^{(Note 1)}

3.0^{(Note 1)}

-55 to +150

+150

A/ch

°C

Output Current (Peak) ^{(Note 2)}

Storage Temperature Range

Maximum Junction Temperature

I_OUTPEAK

Tstg

Tjmax

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) Do not exceed Tjmax=150 °C.

(Note 2) Pulse width tw ≤1ms, duty 20 %

Thermal Resistance^{(Note 3)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 5)}

2s2p^{(Note 6)}

HTSSOP-B24

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 4)}

θ_JA

143.8

7

26.4

2

°C/W

Ψ_JT

(Note 3) Based on JESD51-2A(Still-Air).

(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 5) Using a PCB board based on JESD51-3.

(Note 6) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Thermal Via^{(Note 7)}

Layer Number of

Measurement Board

Material

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

FR-4

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

(Note 7) This thermal via connects with the copper pattern of all layers.

Recommended Operating Conditions

Min

-25

+8

-

Typ

Max

+85

Unit

°C

Parameter

Operating Temperature

Supply Voltage

Symbol

Topr

+25

+24

-

VCC1, VCC2

I_OUT

+28

V

Maximum Output Current (Continuous)

+1.2^{(Note 8)}

A/ch

(Note 8) Do not exceed Tjmax=150 °C.

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Electrical Characteristics (Unless otherwise specified Ta=25 °C, VCC1, VCC2=24 V)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

[Whole]

Circuit Current at Standby

Circuit Current

I_CCST

I_CC

-

10

µA

PS=L

2.5

5.0

mA

PS=H, VREF1=VREF2=2 V

[Control Input]

H Level Input Voltage

L Level Input Voltage

H Level Input Current

L Level Input Current

V_INH

V_INL

I_INH

I_INL

2.0

-

V

0.8

100

-

35

-10

50

0

µA

V_IN=5 V

V_IN=0 V

[Output (OUT1A, OUT1B, OUT2A, OUT2B)]

I_OUT=±1.0 A

(Sum of upper and lower)

Output ON-Resistance

Output Leak Current

R_ON

-

0.65

0.85

10

Ω

I_LEAK

-

µA

[Current Control]

RNFx^{(Note 9)}Input Current

VREFx^{(Note 10)}Input Current

VREFx Input Voltage Range

I_RNF

-80

-2.0

-

-40

-0.1

-

µA

V

RNFx=0 V

I_VREF

VREFx=0 V

V_VREF

t_ONMIN

V_CTH1

2.0

5.5

+0.02

Minimum ON Time

(Blank Time)

µs

V

1.5

-0.02

3.0

0

Comparator Threshold Accuracy

[Lock]

VREFx=1.5 V

SETx=0 V

SETx^{(Note 11)}Input Current

SETx Input Voltage Range

Comparator Threshold Accuracy

I_SET

V_SET

V_CTH2

-2.0

0

-

µA

V

2.0

-0.03

0

+0.03

V

SETx=2 V

(Note 9) x=1 or 2

(Note 10) x=1 or 2

(Note 11) x=1 or 2

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Application Information and Points to Notice for Pin Description and PCB Layout

PS/ Power Save Pin

PS can make circuit into standby state and make motor outputs OPEN.

Be careful because there is a delay of 40 μs (Max) at PS=L→H, until it is returned from standby state to normal state and

the motor output becomes ACTIVE.

PS

State

POWER SAVE (STANDBY)

ACTIVE

L

H

PS, EN1, EN2, PH1, PH2/ H Bridge Control Pin

It decides output logic for H bridge.

Input

Output

OUT1A

OUT2A

OPEN

L

State

EN1

EN2

x^{(Note 12)}

PH1

PH2

OUT1B

OUT2B

OPEN

PS

L

x^{(Note 12)}

POWER SAVE (STANDBY)

BREAK

H

L

H

L

H

L

OPEN

H

REVERSE

H

OPEN

L

STOP

H

FORWARD

(Note 12) x=H or L

VCC1, VCC2/ Power Supply Pin

Motor’s drive current is flowing in it, so the wire should be thick, short and has low impedance. Voltage VCC may have

great fluctuation, so arrange the bypass capacitor of about 100 μF to 470 μF as close to the pin as possible and adjust the

voltage VCC is stable. When 100 μF or less is selected, please confirm that the voltage of the VCC1 and VCC2 pins of the

IC does not exceed the rating even instantly. Also, please make sure that there is no breakdown / malfunction etc. even if

the VCC1 and VCC2 pins voltage is within the rating. In particular, when using a large current or a motor with a large

counter electromotive force, please add the capacity of the capacitor as necessary. In addition, for the purpose of reducing

of power supply’s impedance in wideband, it is recommended to set parallel connection of multi-layered ceramic capacitor

of 0.01 μF to 0.1 μF etc. Extreme care must be used to make sure that the voltage VCC does not exceed the rating even

for a moment. The VCC1 pin and the VCC2 pin are shorted inside the IC, but be sure to short externally the VCC1 and the

VCC2 pins when using. If used without shorting, malfunction or destruction may occur because of concentration of current

routes etc. Still more, in the power supply pin, there is built-in clamp component for preventing of electrostatic destruction.

When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp

component operates, as a result there is the danger of destruction, so be sure that the absolute maximum rating must not

be exceeded. It is effective to mount a Zener diode of about the absolute maximum rating. Moreover, the diode for

preventing of electrostatic destruction is inserted between the VCC1, the VCC2 and the GND pins, as a result there is the

danger of IC destruction if reverse voltage is applied between the VCC1, the VCC2 and the GND pins, so be careful.

GND/ Ground Pin

In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, the wiring

impedance from this pin is made as low as possible to achieve the lowest electrical potential no matter what operating

state it may be. Moreover, design patterns not to have any common impedance with other GND patterns.

OUT1A, OUT1B, OUT2A, OUT2B/ H Bridge Output Pin

Motor’s drive current is flowing in it, so the wire should be thick, short and has low impedance. It is also effective to add a

Schottky diode if output has positive or negative great fluctuation when large current is used. For example, counter

electromotive voltage etc. Moreover, in the output pin, there is built-in clamp component for preventing of electrostatic

destruction. When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this

clamp component operates, as a result there is the danger of even destruction, so be sure that the absolute maximum

rating must not exceeded.

RNF1, RNF2/ Connection Pin of Resistor for Detecting of Output Current

Connect the resistor for current detection between this pin and GND. Determine the resistor so that power consumption

W=I_OUT²･R [W] of the current-detecting resistor should not have exceed the power dissipation of the resistor and the

absolute maximum rating of the RNF1 and RNF2 pins. Also, when using the motor lock detection comparator, consider the

two values of the current limit setting value and the motor lock detection setting value, and decide the resistance value of

the RNF1 and RNF2 pins.

In addition, it should have a low impedance and should not have a common impedance with other GND patterns because

motor’s drive current flows in the pattern through the RNF1 and RNF2 pins to current-detecting resistor to GND. Do not

exceed the rating because there is the possibility of circuits’ malfunction etc. if the RNF1 and RNF2 pin voltage has

exceeded the maximum rating (0.7 V). If the RNF1 and RNF2 pins are open, then there is the possibility of such

malfunction as output current does not flow either, so do not let it open.

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Application Information and Points to Notice for Pin Description and PCB Layout – continued

VREF1, VREF2/ Output Current Limit Setting Pin

This is the pin to set the current limit value. It can be set by the VREF1 and VREF2 pins voltage and current-detecting

resistor (RNF resistor).

푉

퐼_푂푈푇

=

^ꢀ푅퐸퐹/ ꢁ푁ꢂ

[A]

8

Where:

I_OUTis the output current.

V_VREFis the voltage of output current limit setting.

RNF is the current-detecting resistor.

Avoid using it with the VREF1 and VREF2 pins open because if the VREF1 and VREF2 pins are open, the input is

unsettled, and there is the possibility of malfunctions such as the setting current increases and a large current flows. Keep

to the input voltage range because if the voltage of 2 V or more is applied on the VREF1 and VREF2 pins, there is also the

danger that a large current flows in the output and OCP or TSD will operate. Besides, select the resistance value in

consideration of the outflow current (Max 2 μA) if it is inputted by resistance division. If the setting voltages of the VREF1

and the VREF2 pins are equal, there is no problem even if the VREF1 and the VREF2 pins are short-circuited and input.

The minimum current, which can be controlled by the VREF1 and VREF2 pins voltage, is determined by motor coil’s L, R

values and minimum ON time because there is a minimum ON time in PWM drive.

CR/ Chopping Frequency Setting Pin

This is the pin to set the switching frequency of the output. Please connect the external C (330 pF to 680 pF) and R (10 kΩ

to 150 kΩ) between this pin and GND. Please refer to PWM Constant Current Control.

Please connect the external components to GND in such a way that the interconnection does not have impedance in

common with other GND patterns. In addition, please create the pattern design in such a way to keep sudden pulses as

square wave etc. away and that there is no noise spike. Please mount the two components of C and R if PWM constant

current control is being used. This is because normal PWM constant current control cannot be used if the CR pin is open

or it is biased externally. When not using PWM constant current control, connect this pin to GND.

SET1, SET2/ Motor Lock Current Setting Pin

Compare the voltage set by the SETx^{(Note 13)}pin with 4 times the voltage of the RNFx^{(Note 14)}pin, and when the RNFx pin

voltage increases, the LOCKx^{(Note 15)}pin become L. For this output voltage, a mask circuit of about 50 μs (Typ) is provided

for detection in order to prevent malfunction. And at the time of the release, the LOCKx pin become H after 50 μs (Typ)

was delayed.

Locked condition occurred

Motor OFF signal input

Output current[A]

Lock detection current set value

Lock signal

Figure 5. Lock Signal Timing Chart

LOCK1, LOCK2/ Motor Lock Detection Signal Output Pin

When the RNFx pin voltage becomes higher than the voltage set by the SETx pin, the LOCKx pin drop to L. This signal

can be connected to the microcomputer and the system can be shut down. Since the output format of this pin is an open

drain type, please pull up the resistor of 5 kΩ to 100 kΩ in resistance to a power supply of 7 V or less (eg 5 V or 3.3 V

power supply) before using. When this pin is not used, please use it with GND connection.

LOCK

Non motion

Motion

Output LOCK pin

H (OFF)

L (ON)

(Note 13) x=1 or 2

(Note 14) x=1 or 2

(Note 15) x=1 or 2

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Application Information and Points to Notice for Pin Description and PCB Layout – continued

TEST/ Pin for Testing

This is the pin used at the time of distribution test. Connect to GND. Be careful because there is a possibility of malfunction

if it is not connected to GND.

NC Pin

This pin is unconnected electrically with the IC internal circuit.

EXP-PAD

HTSSOP-B24 package has the heat-radiating metal on its backside. It is the precondition that making the heat-radiating

treatment when in use. Therefore, it must be connected by solder with the GND plane on the board and ensure the

sufficient heat-radiation area by taking the GND pattern as wide as possible. Moreover, the backside metal is shorted with

IC chip’s backside and becomes the GND potential, so there is the danger of malfunction and destruction if shorted with

potentials other than GND. Never design any wiring patterns other than GND through the IC’s backside.

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Protection Circuits

Thermal Shutdown (TSD)

This IC has a built-in Thermal Shutdown circuit for thermal protection. When the IC’s chip temperature rises 175 °C (Typ)

or more, the motor output becomes OPEN. Also, when the temperature returns to 150 °C (Typ) or less, it automatically

returns to normal operation. However, even when TSD is in operation, if heat is continued to be applied externally, heat

overdrive can lead to destruction.

Over-Current Protection (OCP)

This IC has a built in Over-Current Protection circuit as a provision against destruction when the motor outputs are shorted

to each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN

condition when the regulated current flows for 4 μs (Typ). It returns with power reactivation or a reset of the PS pin. The

over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor

output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to

take into account this circuit’s functions. After OCP operating, if irregular situations continue and the return by power

reactivation or a reset of the PS pin is carried out repeatedly, then OCP operates repeatedly and the IC may generate heat

or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long of faults, ground faults and

shorting, there is a possibility of destruction after the over current has flowed and the output pin voltage jumps up and the

absolute maximum values can be exceeded. Also, when current which is the output current rating or more and the OCP

detection current or less flows, the IC can heat up to over Tjmax=150 °C and can deteriorate, so current which exceeds

the output rating should not be applied.

Under Voltage Lockout (UVLO)

This IC has a built-in Under Voltage Lockout function to prevent false operation such as IC output during power supply

under voltage. When the applied voltage to the VCC pin goes 5 V (Typ) or less, the motor output is set to OPEN. This

switching voltage has a 1 V (Typ) hysteresis to prevent malfunction due to noise etc. Be aware that this protection circuit

does not operate during power save mode.

Over Voltage Lockout (OVLO)

This IC has a built-in Over Voltage Lockout function to protect the IC output and the motor during power supply over

voltage. When the applied voltage to the VCC pin goes 32 V (Typ) or more, the motor output is set to OPEN. This

switching voltage has a 1 V (Typ) hysteresis and a 4 μs (Typ) mask time to prevent malfunction due to noise etc. Although

this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power

supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Be aware that this

protection circuit does not operate during power save mode.

Ghost Supply Prevention (protects against malfunction when power supply is disconnected)

If a control signal (PH1, PH2, EN1, EN2, PS, VREF1, VREF2, SET1, SET2) is applied when there is no power supplied to

the IC, there is a function which prevents a malfunction where voltage is supplied to power supply of this IC or other IC in

the set via the electrostatic destruction prevention diode from these input pins to the VCC. Therefore, there is no

malfunction in the circuit even when voltage is supplied to these input pin while there is no power supply.

Operation Under Strong Electromagnetic Field

The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is

found when using the IC in a strong electromagnetic field.

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PWM Constant Current Control

This function can limit the peak current or switching current in driving DC brush motor.

(1) Current Control Operation

When the output transistor is turned on, the output current increases. When the RNF voltage (the voltage obtained by

converting the output current by the external resistor of the RNFx^{(Note 16)}pin) reaches the IC internal reference voltage

value set by the VREFx^{(Note 17)}input voltage, the current limit comparator operates and enters current decay mode.

Thereafter the output turned on again after a period of time determined the internal timer. The process repeats itself

constantly.

(Note 16) x=1 or 2

(Note 17) x=1 or 2

(2) Blank Time (Fixed in Internal Circuit)

In order to avoid misdetection of output current due to RNF spike noise that may occur when the output turns ON, the IC

employs an automatic current detection-masking period (t_ONMIN3.0 µs Typ). During this period, the current detection is

disabled immediately after the output transistor is turned on. This allows for constant-current drive without the need for

an external filter.

(3) CR Timer

The CR component connected to the CR pin is repeatedly charged and discharged between the V_CRHand V_CRLlevels.

The CR continues to discharge during this period until it reaches V_CRL, at which point the IC output is switched back ON.

The CR charge time (t_CHARGE) and discharge time (t_DISCHARGE) are set by external components, according to the following

formulas. The total of t_CHARGEand t_DISCHARGEthe chopping period, t_CHOP

.

′

ꢃ ×ꢃ

−0.4

−1.0

× 푙푛 (^푉_푉

)

[s]

ꢆ푅

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

푡_{퐶퐻퐴ꢃ퐺ꢄ}≈ ꢅ ×

′

ꢃ +ꢃ

t_CHARGEis CR charge time.

C

R

is the capacitance of the CR pin.

is the resistance of the CR pin.

R’ is the CR pin internal impedance 5 kΩ(Typ)

V_CRis the CR pin voltage.

200

400

600

C [pF]

800

ꢃ

′

ꢇ_퐶ꢃ= ꢇ × _{ꢃ +ꢃ}

[V]

V

is the internal regulator voltage 5 V(Typ).

푡_{퐷ꢈ푆퐶퐻퐴ꢃ퐺ꢄ}≈ ꢅ × ꢁ × 푙푛 (¹₀⁺_.4^훼

)

[s]

t_DISCHARGEis the CR discharge time.

α

is refer to the right graph.

푡_퐶퐻푂푃= 푡_{퐶퐻퐴ꢃ퐺ꢄ}ꢉ 푡_{퐷ꢈ푆퐶퐻퐴ꢃ퐺ꢄ}

[s]

t_CHOPis the chopping period.

Spike noise

Output current

RNF voltage

CR voltage

Current limit value

0 mA

Current limit value

GND

V_CRH(1.0 V Typ)

V_CRL(0.4 V Typ)

GND

Chopping period t_CHOP

Figure 6. Timing Chart of Internal Voltage, RNF Voltage and Output Current

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BD60203EFV

Power Dissipation

Confirm that the IC’s chip temperature Tj is not over 150 °C in consideration of the IC’s power consumption (W), thermal

resistance (°C/W) and ambient temperature (Ta). When Tj=150 °C is exceeded, the functions as a semiconductor do not

operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration

and eventually destruction of the IC. Tjmax=150 °C must be strictly obeyed under all circumstances.

Thermal Calculation

The IC’s consumed power can be estimated roughly with the power supply voltage (V_CC), circuit current (I_CC), output

ON-Resistance (R_ONH, R_ONL) and motor output current value (I_OUT).

Here, the calculation method per H bridge 1ch in direct PWM drive (SLOW DECAY) is shown.

When using 2 channels at the same time, calculate for each H bridge.

푊_푉퐶퐶= ꢇ_퐶퐶× 퐼_퐶퐶[W]

where:

W_VCCis the consumed power of the V_CC

V_CCis the power supply voltage.

I_CCis the circuit current.

.

푊_퐷푀푂푆= 푊_푂ꢊꢉ 푊_{퐷ꢄ퐶퐴푌}[W]

표ꢍ_푑푢ꢎ푦

100

2

ꢋ

ꢌ

푊_푂ꢊ= ꢁ_푂ꢊ퐻ꢉ ꢁ_푂ꢊ퐿× 퐼_푂푈푇

×

[W]

100−표ꢍ_푑푢ꢎ푦

×

100

2

ꢋ

ꢌ

푊_{퐷ꢄ퐶퐴푌}= ꢏ × ꢁ_푂ꢊ퐿× 퐼_푂푈푇

where:

W_DMOSis the consumed power of the output DMOS.

W_ONis the consumed power during output ON.

W_DECAYis the consumed power during current decay.

R_ONHis the upper P-channel DMOS ON-resistance.

R_ONLis the lower N-channel DMOS ON-resistance.

I_OUTis the motor output current value.

on_duty is PWM on duty[%].

“ ꢏ ” is the H bridge A and B.

Upper P-Channel DMOS ON-Resistance

Lower N-Channel DMOS ON-Resistance

Model Number

BD60203EFV

R_ONH[Ω] (Typ)

R_ONL[Ω] (Typ)

0.40

0.25

푊_푡ꢐ푡푎푙 = 푊_푉퐶퐶ꢉ 푊_퐷푀푂푆

[W]

ꢑ푗 = ꢑ푎 ꢉ 휃푗푎 × 푊_푡ꢐ푡푎푙

[°C]

where:

W_total is the upper P-channel DMOS ON-resistance.

Tj is the junction temperature.

Ta is the air temperature.

θja is the thermal resistance value.

However, the thermal resistance value θja [°C/W] differs greatly depending on circuit board conditions. The calculated

values above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application

board used, and create the thermal design with enough margin not to exceed Tjmax=150 °C. Although unnecessary with

normal use, if the IC is to be used under especially strict heat conditions, consider externally attaching a Schottky diode

between the motor output pin and GND to abate heat from the IC.

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Power Dissipation – continued

Temperature Monitoring

There is a way to directly measure the approximate chip temperature by using the TEST pin. However, temperature

monitor using the TEST pin is only for evaluation and experimenting, and must not be used in actual usage conditions.

The TEST pin has a protection diode to prevent electrostatic discharge. The temperature can be monitored using this

protection diode.

(1) Measure the pin voltage when a current of I_DIODE=50 μA flows from the TEST pin to the GND, without supplying

VCC to the IC. This measurement is the V_Fvoltage inside the diode.

(2) Measure the temperature characteristics of this pin voltage. (V_Fhas a linear negative temperature factor against

the temperature.) With the results of these temperature characteristics, chip temperature can be calibrated from

the TEST pin voltage.

(3) Supply VCC, confirm the TEST pin voltage while running the motor, and the chip temperature can be approximated

from the results of (2).

-V_F[mV]

TEST

Circuitry

I_DIODE

V

25

150

Chip temperature Tj [°C]

Figure 7. Model Diagram for Measuring Chip Temperature

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Application Examples

Constant Voltage Control or External PWM Control

3.3 V or 5.0 V

When using the LOCK output

function

Pull up resistor 5 kΩ to 100

kΩ.

10 kΩ

LOCK1

SET1

Detect

SET2

When not using the LOCK

output function

Connect to GND.

Refer to LOCK1, LOCK2/ Motor

Lock Detection Signal Output

Pin.

3.3 V or 5.0 V

10 kΩ

VREF1

LOCK2

1/8

RNF1

VREF2

1/8

Regulator

TSD

RNF2

Control input pin.

Input PWM signal (to 100

kHz) at external PWM

control.

OCP

Blank time

PWM control

Bypass capacitor.

UVLO

OVLO

Refer

to

Application

Setting range is

Information and Points to

Notice for Pin Description

and PCB Layout for

detail.

100 µF to 470 µF (electrolytic)

0.01µF to 0.1µF(multilayer

ceramic etc.)

Refer to VCC1, VCC2/ Power

Supply Pin for detail.

CR

OSC

VCC1

Be sure to short VCC1

VCC2.

&

OUT1A

Forward

Reverse

BRAKE

Open

PH1

EN1

M

OUT1B

RNF1

GND

Power save pin

Refer to PS/ Power Save

Pin for detail.

100 µF

0.1 µF

PS

VCC2

OUT2A

OUT2B

RNF2

Forward

Reverse

BRAKE

Open

PH2

Pin for testing

Connect to GND.

M

EN2

TEST

Figure 8. Block Diagram & Application Circuit Diagram

(1) Example of external PWM control sequence

SLOW DECAY (forward rotation)

Input

Output

OUT1A

OUT2A

State

ON

EN1

EN2

PH1

PH2

OUT1B

OUT2B

PS

H

L

H

L

H

L

SLOW DECAY

ON

H

L

H

L

H

L

SLOW DECAY

ON

H

FAST DECAY (forward rotation)

Input

Output

State

EN1

EN2

PH1

PH2

OUT1A

OUT2A

OUT1B

OUT2B

PS

H

L

H

L

H

L

ON

FAST DECAY

ON

H

L

H

L

H

L

FAST DECAY

ON

H

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Application Examples – continued

PWM Constant Current Control

Sets the current limit value.

Input range: 0V to 2 V

3.3 V or 5.0 V

When using the LOCK

output function

Pull up resistor 5 kΩ to

100 kΩ.

When not using the

LOCK output function

Connect to GND.

Refer to LOCK1, LOCK2/

Motor Lock Detection

Signal Output Pin.

10 kΩ

Refer to VREF1, VREF2/

Output Current limit setting Pin

for detail.

LOCK1

3.3 V or 5.0 V

SET1

Detect

SET2

3.3 V or 5.0 V

10 kΩ

12.0 kΩ

6.8 kΩ

VREF1

LOCK2

1/8

RNF1

VREF2

1/8

Sets the switching frequency.

Setting range is

C:330 pF to 680 pF

R:10 kΩ to 150 kΩ

Refer to CR /Chopping

Frequency Settng Pin, and

Regulator

TSD

RNF2

Bypass capacitor.

Setting range is

OCP

100 µF to 470 µF(electrolytic)

Blank time

PWM control

0.01 µF to 0.1 µF(multilayer ceramic

UVLO

OVLO

PWM

Constant

Current

etc.)

Control.

Refer to VCC1, VCC2/ Power Supply

Pin for detail.

Be sure to short VCC1 & VCC2.

CR

OSC

VCC1

39 kΩ

470 pF

OUT1A

OUT1B

RNF1

Forward

Reverse

BRAKE

Open

PH1

EN1

Control input pin. Input

PWM signal (to 100 kHz)

at external PWM control.

M

Refer

to

Application

Information and Points to

Notice for Pin Description

and PCB Layout for

detail.

0.2 Ω

GND

100 µF

0.1 µF

PS

VCC2

OUT2A

OUT2B

RNF2

Forward

Reverse

BRAKE

Open

PH2

Current

setting resistor

0.1 Ω to 0.3 Ω

detection

Power save pin

Refer to PS/ Power Save

Pin for detail.

M

EN2

Refer

to RNF1,

TEST

RNF2/Connection

Pin of Resistor for

Detecting of Output

Current for detail.

0.2 Ω

Pin for testing

Connect to GND.

Figure 9. Application Circuit Diagram of

Constant Voltage Control or External PWM Control

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I/O Equivalence Circuits

LOCK1

LOCK2

SET1

SET2

5 kΩ

10 kΩ

Control

input

100 kΩ

VREG(Internal power supply)

10 kΩ

5 kΩ

10 kΩ

5 kΩ

VREF1

VREF2

CR

5 kΩ

VCC1, VCC2

10 kΩ

OUTxA^{(Note 18)}

OUTxB^{(Note 19)}

5 kΩ

RNFx ^{(Note 20)}

Internal circuit

(Note 18) x=1 or 2

(Note 19) x=1 or 2

(Note 20) x=1 or 2

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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BD60203EFV

Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 10. Example of Monolithic IC Structure

12. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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BD60203EFV

Ordering Information

E F V

B D 6 0 2 0 3

-

E 2

Part number

Package type

Packaging and forming specification

EFV : HTSSOP-B24

E2: Reel-wound embossed taping

Marking Diagram

HTSSOP-B24 (TOP VIEW)

Part Number Marking

B D 6 0 2 0 3

LOT Number

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

HTSSOP-B24

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BD60203EFV

Revision History

Date

Revision

001

Changes

21.May.2018

New Release

Application Information and Points to Notice for Pin Description and PCB Layout in

page 5, changed the written pin name from IN1 and IN2 to PS, EN1, EN2, PH1 and PH2.

And the state of output logic are partial changed.

And the expression of RNFx is changed.

Application Information and Points to Notice for Pin Description and PCB Layout in

page 6, changed the expression of VREFx and SETx.

27.May.2020

002

Application Examples of page 12 and 13, the Input/Output table is deleted.

And the logic of Example of external PWM control sequence are partial changed.

I/O Equivalence Circuits of page14, changed the circuits.

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BD60203EFV
厂家：	ROHM
描述：	BD60203EFV是能驱动2个DC有刷电机的含2个电路的H桥电机驱动器。通过恒流PWM控制可实现高效率驱动。内置各种保护电路。还内置锁定检测用电路，可输出通知电机锁定状态的支持Wired-Or的异常检测信号，有利于实现组件的高可靠性。电机驱动驱动器
文件：	总22页 (文件大小：1687K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD60203EFV [ROHM]

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