BD60223FP [ROHM]
BD60223FP是额定电源36V、额定输出电流1.5A的低功耗双极PWM恒流驱动器。输入接口采用CLK-IN驱动方式,通过内置DAC,励磁模式可适用于FULL STEP、HALF STEP、QUARTER STEP、1/16 STEP模式。电流衰减方式方面可任意设定FAST DECAY/SLOW DECAY的比率,可对所有电机实现很好的控制状态。另外,也可使用一个系统电源进行驱动,有助于提高整机设计的便利性。;型号: | BD60223FP |
厂家: | ROHM |
描述: | BD60223FP是额定电源36V、额定输出电流1.5A的低功耗双极PWM恒流驱动器。输入接口采用CLK-IN驱动方式,通过内置DAC,励磁模式可适用于FULL STEP、HALF STEP、QUARTER STEP、1/16 STEP模式。电流衰减方式方面可任意设定FAST DECAY/SLOW DECAY的比率,可对所有电机实现很好的控制状态。另外,也可使用一个系统电源进行驱动,有助于提高整机设计的便利性。 电机 驱动 驱动器 |
文件: | 总28页 (文件大小:2370K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
36V Stepping Motor Driver
BD60223FP
General Description
Key Specifications
BD60223FP is a bipolar low-consumption driver that
driven by PWM current. Rated power supply voltage of
the device is 36 V, and rated output current is 1.5 A. CLK-
IN driving mode is adopted for input interface, and
excitation mode is corresponding to FULL STEP mode,
HALF STEP mode, QUARTER STEP and 1/16 STEP
mode via a built-in DAC. In the method of current decay,
the FAST DECAY/SLOW DECAY ratio can set without any
limitation, and all available modes can be controlled in the
most appropriate way. In addition, the power supply can
be driven by one single system, which simplifies the
design.
■
■
■
■
■
Range of Power Supply Voltage
Rated Output Current (continuous)
Rated Output Current (peak value)
Range of Operating Temperature -25°C to +85°C
Output ON Resistance
8V to 28V
1.5A
2.0A
0.55Ω(Typ)
(total of upper and lower resistors)
Package
HSOP25
W(Typ) x D(Typ)x H(Max)
13.60mm x 7.80mm x 2.11mm
Features
■
■
■
■
Rated Output Current(DC)1.5A
Low ON Resistance DMOS Output
CLK-IN Drive Mode
PWM Constant Current (the other excitation
method)
■
Built-in Spike Noise Blanking Function (external
noise filter is unnecessary)
■
■
■
Full-, Half-, Quarter-, 1/16 Step Functionality
Free Timing Excitation Mode Switch
Current Decay Mode Switch Function
(linearly variable FAST/SLOW DECAY ratio)
Normal Rotation and Reverse Rotation Switching
Function
Typical Application Circuit
■
GND
TEST
■
■
■
■
■
■
■
■
Power Save Function
Built-in Logic Input Pull-down Resistor
Power-on Reset Function
Thermal Shutdown Circuit (TSD)
Over-current Protection Circuit(OCP)
Under Voltage Lock Out Circuit (UVLO)
Over Voltage Lock Out Circuit (OVLO)
Ghost Supply Prevention (protects against
malfunction when power supply is disconnected)
Adjacent Pins Short Protection
PS
CLK
MODE1
MODE0
CW_CCW
ENABLE
VCC1
OUT1A
■
VREF
OUT1B
RNF1
RNF1S
VCC2
Application
PPC, Multi-function printer, Laser beam printer, and
■
OUT2A
CR
Ink-jet printer, Monitoring camera and WEB camera,
Sewing machine, Photo printer, FAX, Scanner and
Mini printer, Toy and Robot
OUT2B
RNF2
MTH
RNF2S
GND
Figure 1. BD60223FP application circuit diagram
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD60223FP
Pin Configuration
Block Diagram
[TOP VIEW]
6
TEST
MODE1
MODE0
CW_CCW
ENABLE
CLK
1
2
3
4
5
6
25 PS
TSD
OCP
5
CLK
24 N.C.
23 MTH
22 VREF
Translator
14
GND
OVLO
UVLO
MODE1
MODE0
1
2
RESET
25 PS
3
4
CW_CCW
ENABLE
CR
21
20
GND
TEST
+
-
VREF 22
DAC
FIN
19
VCC1
FIN
+
-
18 OUT1A
RNF1S
RNF2S
15
16
OUT1B
RNF1
VCC2
OUT2A
RNF2S
7
8
9
+
-
19 VCC1
18 OUT1A
17 RNF1S
16 RNF1
15 OUT1B
17 RNF1S
Blank time
PWM control
RNF2 10
N.C. 11
7
VCC2
8
OUT2A
OUT2B
CR 21
OSC
12
OUT2B 12
N.C. 13
RNF2
10
9
Mix decay
control
GND
14
MTH
23
RNF2S
GND
Regulator
20
Figure 2. Pins Configuration Diagram
Figure 3. BD60223FP Block Diagram
Pin Description
Pin
No.
Pin
No.
Pin name
Function
Pin name
Function
MODE1
MODE0
Motor excitation mode setting pin
Motor excitation mode setting pin
GND
Ground pin
H bridge output pin
1
2
14
OUT1B
15
Connection pin of resistor for output
CW_CCW Motor rotating direction setting pin
RNF1
3
16
current detection
Input pin of current detection
comparator
ENABLE
CLK
RNF1S
OUT1A
VCC1
4
5
6
Output enable pin
17
18
19
Clock input pin for advancing the
electrical angle.
Pin for testing
H bridge output pin
Power supply pin
TEST
(Used by connecting with GND)
Pin for Thermal
Pin for Thermal
FIN
7
FIN
FIN
20
FIN
GND
CR
(Used by connecting with GND)
(Used by connecting with GND)
VCC2
OUT2A
Ground pin
Power supply pin
Connection pin of CR for setting
chopping frequency
8
H bridge output pin
21
Input pin of current detection
comparator
RNF2S
RNF2
VREF
MTH
9
22
23
Output current value setting pin
Current decay mode setting pin
Connection pin of resistor for output
current detection
10
N.C.
OUT2B
N.C.
N.C.
PS
11
12
13
Non connection
H bridge output pin
Non connection
24
25
Non connection
Power save pin
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BD60223FP
Absolute Maximum Rating (Ta=25°C)
Item
Symbol
Rated Value
Unit
Supply Voltage
VCC1, VCC2
VIN
-0.2 to +36.0
-0.2 to +5.5
0.7
V
Input Voltage for Control Pin
RNF Maximum Voltage
V
V
VRNF
Maximum Output Current (DC)
Maximum Output Current (PEAK) (Note 2)
Storage Temperature Range
Maximum Junction Temperature
IOUT
1.5(Note 1)
2.0(Note 1)
-55 to +150
+150
A/Phase
A/Phase
°C
IOUTPEAK
Tstg
Tjmax
°C
(Note 1) Do not, however exceed Tjmax=150°C.
(Note 2) Pulse width tw≤1ms, duty 20%.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Recommended Operating Condition
Item
Symbol
Rated Value
Unit
Operating Temperature Range
Supply Voltage
Topr
VCC1, VCC2
IOUT
-25 to +85
8 to 28
°C
V
Maximum Output Current (DC)
1.2(Note 3)
A/Phase
(Note 3) Not exceeding Tj=150°C.
Thermal Resistance(Note 4)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 6)
2s2p(Note 7)
HSOP25
Junction to Ambient
Junction to Top Characterization Parameter(Note 5)
θJA
102.4
9
46.8
5
°C/W
°C/W
ΨJT
(Note 4) Based on JESD51-2A(Still-Air).
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 6) Using a PCB board based on JESD51-3.
(Note 7) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
70μm
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Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC1, VCC2=24V)
Specification
Item
Symbol
Unit
Condition
Min
Typ
Max
[Whole]
Circuit Current at Standby
Circuit Current
ICCST
ICC
-
-
-
10
µA
PS=L
2.5
5.0
mA
PS=H, VREF=3V
[Control Input]
H-level Input Voltage
L-level Input Voltage
H-level Input Current
L-level Input Current
[Control Input] ( PS )
H-level Input Voltage
L-level Input Voltage
H-level Input Current
L-level Input Current
[Output]
VIN1H
VIN1L
IIN1H
IIN1L
2.0
-
-
-
-
V
V
0.8
100
-
35
-10
50
0
µA
µA
VIN1=5V
VIN1=0V
VIN2H
VIN2L
IIN2H
IIN2L
2.0
-
-
-
-
V
V
0.8
300
-
105
-10
150
0
µA
µA
VIN2=5V
VIN2=0V
IOUT =±1.0A (total of upper and
lower resistors)
Output ON Resistance
Output Leak Current
[Current Control]
RON
-
-
0.55
-
0.80
10
Ω
ILEAK
µA
RNFXS Input Current
RNFX Input Current
VREF Input Current
VREF Input Voltage Range
MTH Input Current
MTH Input Voltage Range
IRNFS
IRNF
-2.0
-80
-2.0
0
-0.1
-40
-0.1
-
-
-
µA
µA
µA
V
RNFXS=0V
RNFX=0V
VREF=0V
IVREF
VVREF
IMTH
-
3.0
-
-2.0
0
-0.1
-
µA
V
MTH=0V
VMTH
tONMIN
VCTH
3.5
1.5
0.621
Minimum ON Time
(Blank time)
0.3
0.579
0.7
0.600
µs
V
C=1000pF, R=39kΩ
Comparator Threshold
VREF=3V
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BD60223FP
Function Explanation
CLK/Clock input Pin for advancing the electrical angle
CLK is working on rising edge. The Electrical angle advances by one for each CLK input.
Motor’s misstep will occur if noise gets mixed with the CLK pin, so design the pattern there is no noise plunging.
MODE0, MODE1/Motor Excitation Mode Setting Pin
Set the motor excitation mode
MODE0
MODE1
Excitation Mode
L
H
L
L
L
FULL STEP
HALF STEP
H
H
QUARTER STEP
1/16 STEP
H
Refer to the P.14 for the timing chart and motor torque vector of various excitation modes.
Unrelated to CLK, change of setting is forcibly reflected. (refer to P.16).
CW_CCW Pin/Motor rotating direction setting
Set the motor’s rotating direction. Change of setting is reflected by the CLK rising edge immediately after that. (refer to P.15)
CW_CCW
Rotating Direction
L
Clockwise (CH2’s current is outputted with a phase lag of 90°on the basis of CH1’s current)
Counter Clockwise(CH2’s current is outputted with a phase lead of 90°on the basis of CH1’s
H
current)
ENABLE Pin/Output enable Pin
Turn off forcibly all the output transistors (motor output is open).
When ENABLE=L, input to CLK is blocked, and phase advance operation of internal translator circuit is stopped.
However, when the excitation mode (MODE 0, MODE 1) is switched in the ENABLE = L periode, The switched mode is valid
in the excitation mode when the ENABLE Pin returns from Low to High. (refer to P. 16)
ENABLE
Motor Output
OPEN (electrical angle maintained)
ACTIVE
L
H
PS/Power save Pin
PS can make circuit standby state and motor output OPEN. In standby state, translator circuit is reset (initialized) and electrical
angle is initialized.
Be careful because there is a delay of 40µs(Max), as PS=L→H, until it is returned from standby state to normal state and the
motor output becomes ACTIVE (refer to P.13).
PS
Status
Standby State(RESET)
ACTIVE
L
H
The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows.
(refer to P.14)
Excitation Mode
Initial Electrical Angle
FULL STEP
45°
45°
45°
45°
HALFSTEP
QUARTERSTEP
1/16 STEP
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Function Explanation – continued
VCC1, VCC2/Power supply Pin
Motor’s drive current is flowing in it, so the wire is thick, short and has low impedance. Voltage VCC may have great fluctuation,
so arrange the bypass capacitor of about 100µF to 470µF as close to the pin as possible and adjust the voltage VCC is stable.
Increase the capacity as needed especially, when a large current is used or those motors that have great back electromotive
force are used.
In addition, for the purpose of reducing of power supply’s impedance in wideband, it is recommended to set parallel connection
of multi-layered ceramic capacitor of 0.01µF to 0.1µF etc. Extreme care must be used to make sure that the voltage VCC
does not exceed the rating even for a moment. VCC1 and VCC2 are shorted inside IC, but be sure to short externally VCC1
and VCC2 when using. If used without shorting, malfunction or destruction may occur because of concentration of current
routes etc. Still more, in the power supply pin, there is built-in clamp component for preventing of electrostatic destruction.
When a steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp
component operates, as a result there is the danger of destruction, so be sure that the absolute maximum rating must not be
exceeded. It is effective to mount a Zener diode of about the absolute maximum rating. Moreover, the diode for preventing of
electrostatic destruction is inserted between VCC pin and GND pin, as a result there is the danger of IC destruction if reverse
voltage is applied between VCC pin and GND pin, so be careful.
GND/Ground Pin
In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, the wiring
impedance from this pin is made as low as possible to achieve the lowest electrical potential no matter what operating state
it can be. Moreover, design patterns not to have any common impedance with other GND patterns.
OUT1A, OUT1B, OUT2A, OUT2B/H Bridge output Pin
Motor’s drive current is flowing in it, so the wire is thick, short and has low impedance. It is also effective to add a Schottky
diode if output has positive or negative great fluctuation when large current is used. For example, counter electromotive
voltage etc. Moreover, in the output pin, there is built-in clamp component for preventing of electrostatic destruction. When a
steep pulse signal or voltage such as a surge exceeding the absolute maximum rating is applied, this clamp component
operates, as a result there is the danger of even destruction, so be sure that the absolute maximum rating must not exceeded.
RNF1, RNF2/Connection Pin of resistor for detecting of output current
Connect the resistor of 0.1Ω to 0.3Ω for current detection between this pin and GND. Determine the resistor so that power
consumptionW=IOUT2・R [W] of the current-detecting resistor does not exceed the power dissipation of the resistor. In addition,
it has a low impedance and does not have a common impedance with other GND patterns because motor’s drive current
flows in the pattern through RNF Pin to current-detecting resistor to GND. Do not exceed the rating because there is the
possibility of circuits’malfunction etc., if RNF voltage has exceeded the maximum rating (0.7V). Moreover, be careful because
if RNF pin is shorted to GND, large current flows without normal PWM constant current control, then there is the danger that
OCP or TSD will operate. If RNF pin is open, then there is the possibility of such malfunction as output current does not flow
either, so do not let it open.
RNF1S, RNF2S/Input Pin of current detection comparator
In this series, RNFS pin, which is the input pin of current detection comparator, is independently arranged in order to decrease
the lowering of current-detecting accuracy caused by the wire impedance inside the IC of RNF pin. Therefore, be sure to
connect RNF pin and RNFS pin together when using in the case of PWM constant current control. In addition, because the
wires from RNFS pin is connected near the current-detecting resistor in the case of interconnection, the lowering of current-
detecting accuracy, which is caused by the impedance of board pattern between RNF pin and the current-detecting resistor,
can be decreased. Moreover, design the pattern there is no noise plunging. In addition, be careful because if pins of RNF1S
and RNF2S are shorted to GND, large current flows without normal PWM constant current control and, then there is the
danger that OCP or TSD will operate.
VREF/Output current value setting Pin
This is the pin to set the output current value. It can be set by VREF voltage and current-detecting resistor (RNF resistor).
푉푅퐸퐹
퐼푂푈푇
퐼푂푈푇
=
=
× 0.7071/ ꢀ푁ꢁ
[A] (FULL Step)
5
푉푅퐸퐹 / ꢀ푁ꢁ
[A] (ALL step modes except FULL Step)
5
Where:
IOUT
is the output current.
VREF is the voltage of output current value-setting pin.
RNF is the current-detecting resistor.
Avoid using it with VREF pin open because if VREF pin is open, the input is unsettled, and the VREF voltage increases, and
then there is the possibility of such malfunctions as the setting current increases and a large current flows etc. Keep to the
input voltage range because if the voltage of 3V or more is applied on VREF pin, then there is also the danger that a large
current flows in the output and so OCP or TSD will operate. Besides, select the resistance value in consideration of the
outflow current (Max 2µA) if it is inputted by resistance division. The minimum current, which can be controlled by VREF
voltage, is determined by motor coil’s L, R values and minimum ON time because there is a minimum ON time in PWM drive.
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Function Explanation – continued
CR/Connection pin of CR for setting chopping frequency
This is the pin to set the chopping frequency of output. Connect the external C(470pF to 1500pF) and R(10kΩ to 200kΩ) to
GND. Refer to P9.
Interconnect from external components to GND not to have a common impedance with other GND patterns. In addition, carry
out the wire pattern design it keeps away such steep pulses as square wave etc. and has little noise plunging. Mount the two
components of C and R if being used by PWM constant current control because normal PWM constant current control
becomes impossible if CR Pin is open or it is biased externally.
MTH/Current decay mode-setting Pin
This is the pin to set the current decay mode. Current decay mode can be optionally set according to input voltage.
MTH pin input voltage[V]
Current decay mode
0 to 0.3
SLOW DECAY
MIX DECAY
0.4 to 1.0
1.5 to 3.5
FAST DECAY
Connect to GND if using at SLOW DECAY mode.
Avoid using with MTH pin open because if MTH pin is open, the input is unsettled, and then there is the danger that PWM
operation becomes unstable. Besides, select the resistance value in consideration of the outflow current (Max 2µA) if it is
inputted by resistance division.
TEST/Pin for inspection
This pin is used for delivery inspection on IC, and shall be grounded before use.
In addition, malfunctions can be caused by application without grounding.
NC
This pin is unconnected electrically with IC internal circuit.
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Protection Circuits
Thermal Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises 175°C (Typ) or
more, the motor output becomes OPEN. Also, when the temperature returns to 150°C (Typ) or less, it automatically returns
to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive
can lead to destruction.
Over Current Protection (OCP)
This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted
each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition
when the regulated current flows for 4µs (Typ). It returns with power reactivation or a reset of the PS pin. The over current
protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor output shorts, and
is not meant to be used as protection or security for the set. Therefore, sets should not be designed to take into account
this circuit’s functions. After OCP operating, if irregular situations continue and the return by power reactivation or a reset
of the PS pin is carried out repeatedly, then OCP operates repeatedly and the IC may generate heat or otherwise deteriorate.
When the L value of the wiring is great due to the wiring being long, if the output pin voltage jumps up and the absolute
maximum values can be exceeded after the over current has flowed, there is a possibility of destruction. Also, when current
which is the output current rating or more and the OCP detection current or less flows, the IC can heat up to Tjmax=150°C
or more and can deteriorate, so current which exceeds the output rating should not be applied.
Under Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under
voltage. When the applied voltage to the VCC pin goes 5V (Typ) or less, the motor output is set to OPEN. This switching
voltage has a 1V (Typ) hysteresis to prevent false operation by noise etc. Be aware that this circuit does not operate during
power save mode. Also, the electrical angle is reset when the UVLO circuit operates.
Over Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage.
When the applied voltage to the VCC pin goes 32V (Typ) or more, the motor output is set to OPEN. This switching voltage
has a 1V (Typ) hysteresis and a 4µs (Typ) mask time to prevent false operation by noise etc.
Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value
for power supply voltage is exceeded. Therefore, the absolute maximum value should not be exceeded. Be aware that this
circuit does not operate during power save mode.
Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
If a signal (logic input, MTH, VREF) is input when there is no power supplied to this IC, there is a function which prevents
a malfunction where voltage is supplied to power supply of this IC or other IC in the set via the electrostatic destruction
prevention diode from these input pins to the VCC. Therefore, there is no malfunction of the circuit even when voltage is
supplied to these input pins while there is no power supply.
Operation Under Strong Electromagnetic Field
The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is
found when using the IC in a strong electromagnetic field.
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PWM Constant Current Control
1) Current control operation
The output current increases due to the output transistor turned on. When the voltage on the RNF pin, the output current is
converted it due to connect the external resistance to RNF pin, reaches the voltage value set by the internal 4-bit DAC and
the VREF input voltage, the current limit comparator engages and enters current decay mode. Thereafter the output turned
on again after a period of time determined the CR pin. The process repeats itself constantly.
2) Noise-masking function
In order to avoid misdetection of current detection comparator due to RNF spikes that may occur when the output turns ON,
the IC employs an automatic current detection-masking period (tONMIN), while the minimum ON-time from the output transistor
turned on is invalidated the current detection. This allows for constant-current drive without the need for an external filter.
3) CR Timer
The CR pin is repeatedly charged and discharged between the VCRH and VCRL levels by connected the external capacitor and
resistor. The CR pin voltage decides in IC and it is VCRL=0.4V, VCRH=1.0V respectively. The detection of the current detection
comparator is masked while charging from VCRL to VCRH. (As mentioned above, this period defines the minimum ON-time of
the motor output transistor.) The CR pin begins discharging once the voltage reaches VCRH. When the output current reaches
the current limit during this period, then the IC enters decay mode. The CR continues to discharge during this period until it
reaches VCRL, at which point the IC output is switched back ON. The current output and CR pin begin charging simultaneously.
The CR charge time (tONMIN) and discharge time (tDISCHARGE) are set by external components, according to the following
formulas. The total of tONMIN and tDISCHARGE yield the chopping period, tCHOP
.
′
푅 ×푅
푉ꢄ푅−ꢅ.4
푉ꢄ푅−ꢆ.ꢅ
푡푂ꢂ푀ꢃꢂ ≈ 퐶 ×
× 푙푛 (
)
[s]
′
푅 +푅
is the minimum ON-time.
is the capacitance of the CR Pin.
is the resistance of the CR Pin.
tONMIN
C
R
0.30
0.25
0.20
0.15
0.10
0.05
0.00
is the CR Pin internal impedance 5kΩ(Typ)
is the CR Pin voltage.
R’
VCR
푅
′
ꢇ퐶ꢀ = ꢇ × 푅 +푅
[V]
is the internal regulator voltage 5V(Typ).
V
0
500
1000
C [pF]
1500
2000
ꢆ+훼
푡퐷ꢃ푆ꢄ퐻퐴푅퐺퐸 ≈ 퐶 × ꢀ × 푙푛 (
)
[s]
ꢅ.4
is the CR discharge time.
refer to the right graph.
tDISCHARGE
α
푡ꢄ퐻푂푃 = 푡푂ꢂ푀ꢃꢂ ꢈ 푡퐷ꢃ푆ꢄ퐻퐴푅퐺퐸
[s]
is the chopping period.
tCHOP
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3)CR Timer – continued
Spike noise
Current limit Value
0mA
Output current
RNF Voltage
Current limit Value
GND
VCRH(1.0V Typ)
CR Voltage
VCRL(0.4V Typ)
GND
Discharge
time
tDISCHARGE
Chopping Period
tCHOP
Minimum ON Time
tONMIN
Figure 4. Timing chart of CR voltage, RNF voltage and output current
Attach a resistor of at least 10 kΩ to the CR Pin (10 kΩ to 200 kΩ recommended) as lower values may keep the CR from
reaching the VCRH voltage level. A capacitor in the range of 470 pF to 1500 pF is also recommended. As the capacitance
value is thousands or more, however, the noise-masking period (tONMIN) also increases, and there is a risk that the output
current may exceed the current setting value due to the internal L and R components of the output motor coil. Also, ensure
that the chopping period (tCHOP) is not set longer than necessary, as doing so will increase the output ripple, thereby
decreasing the average output current and yielding lower output rotation efficiency. Select optimal value so that motor drive
sound, and distortion of output current waveform can be minimized.
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PWM Constant Current Control – continued
Current Decay Mode
PWM Constant Current Control can be optionally set the current decay mode in which the ratio of fast and slow decay.
The following diagrams show the state of each transistor and the regenerative current path during the current decay for each
decay mode:
FAST DECAY
SLOW DECAY
OFF→OFF
OFF→OFF
ON→OFF
ON→OFF
OFF→ON
ON→OFF
OFF→ON
M
M
ON→ON
Output ON Time
Current Decay Time
Figure 5. Route of Regenerated Current during Current Decay
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PWM Constant Current Control – continued
The merits of each decay mode are as follows:
SLOW DECAY
The voltage of motor coils is small and the regenerative current decreases slowly. So the output current ripple is small and
this is favorable for keeping motor torque high. However, output current increasing according to fall-off current characteristic
deterioration in the low-current region and it is easily influenced by EMF when pulse late is high. As a result, the waveform
is distortion and motor oscillation increasing in half-step or quarter-step modes. Thus, this decay mode is most suited to
full-step modes or low-pulse-rate as half-step or quarter-step modes.
FAST DECAY
Fast decay decreases the regeneration current much more quickly than slow decay, greatly reducing distortion of the output
current waveform. However, fast decay yields a much larger output current ripple, which decreases the overall average
current running through the motor. This causes two problems: first, the motor torque decreases (increasing the current limit
value can help eliminate this problem, but the rated output current must be taken into consideration); and sond, the power
loss within the motor increases and thereby radiates more heat. If neither of these problems is of concern, then fast decay
can be used for high-pulse rate half-step or quarter-step drive.
Additionally, this IC allows for a mixed decay mode that can help to improve upon problems that arise from using fast or slow
decay. In this mode, the current control characteristic improves without increasing the output current ripple by switching the
IC between slow and fast decay. The time ratio of fast to slow decay can be changed via the voltage input to the MTH pin;
therefore, it is possible for each motor to be realized the optimal control state. During mixed decay mode about chopping
cycle, the first X%(t1 to t2) of which operates the IC in slow decay mode, and the remainder(t2 to t3) of which operates in fast
decay mode. However, if the output current (i.e., the voltage on the RNF pin) does not reach the set current limit during the
first X% (t1 to t2) decay period, the IC operates in fast decay mode only.
MTH Pin input Voltage [V]
Current Decay Mode
SLOW DECAY
MIX DECAY
0 to 0.3
0.4 to 1.0
1.5 to 3.5
FAST DECAY
t2
t3
t1
1.0V
CR Voltage
MTH Voltage
0.4V
GND
Chopping Period
tCHOP
Current limit value
Output Current
FAST DECAY
SLOW
DECAY
0A
Figure 6. CR Pin voltage and output current during mixed decay
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BD60223FP
Translator Circuit
This series builds in translator circuit and can drive stepping motor in CLK-IN mode.
The operation of the translator circuit in CLK-IN drive mode is described as below.
Reset operation
The translator circuit is initialized by power ON Reset function and PS Pin.
Initializing operation when power supply is turned on
①If power supply is turned on at PS=L (Use this sequence as a general rule)
When power supply is turned on, the power ON reset function operates in IC and initialized, but as long as it is PS=L,
the motor output is the OPEN state. After power supply is turned on, because of the changing of PS=L→H, the motor
output becomes the ACTIVE state, and the excitation is started at the initial electrical angle.
But at the time of PS=L→H, it returns from the standby state to the normal state and there is a delay of 40µs(Max)
until the motor output has become the ACTIVE state.
ACTIVE
Reset is released
①
Delay
②
PS
CLK
OUT1A
OUT1B
Motor output OPEN
②If power supply is turned on at PS=H
Motor output ON
When power supply is turned on, the power ON function in IC operates, and be initialized before the motor output
becomes the ACTIVE state during EN=H, and the excitation is started at the initial electrical angle.
Initializing operation during motor operating
Input the reset signal to PS pin when the translator circuit is initialized during motor fundamentally operating. (Refer to
P.15) But at the time of PS=L→H, it returns from the standby state to the normal state and there is a delay of 40µs
(Max) until the motor output has become the ACTIVE state, so be careful.
Control input timing
Input as shown below because the translator circuit operates at the rising edge of CLK signal. If you disobey this timing and
input, then there is the possibility that the translator circuit does not operate as expected. In addition, at the time of PS=L→H,
it returns from the standby state to the normal state and there is a delay of 40µs (Max) until the motor output has become the
ACTIVE state, so within this delay interval there is no phase advance operation even if CLK is inputted.
A
PS
B
C
CLK
MODE0
MODE1
D
E
F
G
F
G
CW_CCW
ENABLE
A: PS minimum input pulse width • • • • 20µs
B: PS rising edge to CLK rising edge input possible maximum delay time • • • • 40µs
C: CLK minimum period • • • • 4µs
D: CLK minimum input H pulse width • • • • 2µs
E: CLK minimum input L pulse width • • • • 2µs
F: MODE0, MODE1, CW_CCW, ENABLE set-up time • • • • 1µs
G: MODE0, MODE1, CW_CCW, ENABLE hold time • • • • 1µs
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Translator Circuit – continued
Full step
Half step
Quarter step
1/16 step
ch1 current[%] ch2 current[%] step angle[°]
1
2
3
4
5
6
7
8
1
1
2
3
4
5
6
7
8
9
100.00
99.52
98.08
95.69
92.39
88.19
83.15
77.30
70.71
63.44
55.56
47.14
38.27
29.03
19.51
9.80
0.00
9.80
0.0
5.6
11.3
16.9
22.5
28.1
33.8
39.4
45.0
50.6
56.3
61.9
67.5
73.1
78.8
84.4
90.0
19.51
29.03
38.27
47.14
55.56
63.44
70.71
77.30
83.15
88.19
92.39
95.69
98.08
99.52
100.00
99.52
98.08
95.69
92.39
88.19
83.15
77.30
70.71
63.44
55.56
47.14
38.27
29.03
19.51
9.80
2
3
initial position→
1
2
3
4
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
4
5
0.00
-9.80
95.6
-19.51
-29.03
-38.27
-47.14
-55.56
-63.44
-70.71
-77.30
-83.15
-88.19
-92.39
-95.69
-98.08
-99.52
-100.00
-99.52
-98.08
-95.69
-92.39
-88.19
-83.15
-77.30
-70.71
-63.44
-55.56
-47.14
-38.27
-29.03
-19.51
-9.80
101.3
106.9
112.5
118.1
123.8
129.4
135.0
140.6
146.3
151.9
157.5
163.1
168.8
174.4
180.0
185.6
191.3
196.9
202.5
208.1
213.8
219.4
225.0
230.6
236.3
241.9
247.5
253.1
258.8
264.4
270.0
275.6
281.3
286.9
292.5
298.1
303.8
309.4
315.0
320.6
326.3
331.9
337.5
343.1
348.8
354.4
6
7
8
9
0.00
-9.80
-19.51
-29.03
-38.27
-47.14
-55.56
-63.44
-70.71
-77.30
-83.15
-88.19
-92.39
-95.69
-98.08
-99.52
-100.00
-99.52
-98.08
-95.69
-92.39
-88.19
-83.15
-77.30
-70.71
-63.44
-55.56
-47.14
-38.27
-29.03
-19.51
-9.80
10
11
12
13
14
15
16
0.00
9.80
19.51
29.03
38.27
47.14
55.56
63.44
70.71
77.30
83.15
88.19
92.39
95.69
98.08
99.52
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Translator Circuit – continued
Reset Timing Chart (QUARTER STEP, MODE0=L, MODE1=H, CW_CCW=L, ENABLE=H)
If the Pin PS is input to L, the reset operation is done with regardless of other input signals when reset the translator circuit
while motor is working. At this time, IC internal circuit enters the standby mode, and makes the motor output OPEN.
RESET
①
②
③
④
⑤
⑥
⑦
⑧
⑨
⑩
①
②
③
④
⑤
⑥
⑦
⑧
PS
CLK
OUT1A
OUT1B
OUT2A
OUT2B
100%
67%
33%
IOUT(CH1)
IOUT(CH2)
-33%
-67%
-100%
100%
67%
33%
-33%
-67%
-100%
CW_CCW Switch Timing Chart (FULL STEP, MODE0=L, MODE1=L, ENABLE=H)
The switch of CW_CCW is reflected by the rising edge of CLK that comes immediately after the changes of the CW_CCW
signal. However, depending on the state of operation of the motor at the switch the motor cannot follow even if the control on
driver IC side is correspondent and there are possibilities of step-out and mistake step in motor, so evaluate the sequence of
the switch enough.
CW
CCW
①
②
③
②
①
PS
CW_CCW
CLK
OUT1A
OUT1B
OUT2A
OUT2B
100%
IOUT(CH1)
IOUT(CH2)
-100%
100%
-100%
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Translator Circuit – continued
ENABLE Switch Timing Chart (FULL STEP, MODE0=L, MODE1=L)
The switch of the ENABLE signal is reflected by the change in the ENABLE signal with regardless of other input signals.
In the section of ENABLE=L, the motor output becomes OPEN and the electrical angle doesn't advance. Because the
translator circuit stop and CLK input is canceled. Therefore, the progress of ENABLE=L→H is completed before the input of
ENABLE=L. Excitation mode (MODE0, MODE1) also switches within ENABLE=L interval. Where excitation mode switched
within ENABLE=L interval, restoring of ENABLE=L→H was done in the excitation mode after switch.
Output off & Translator stop
①
②
②
③
PS
ENABLE
CLK
OUT1A
OUT1B
OUT2A
OUT2B
100%
IOUT(CH1)
IOUT(CH2)
-100%
100%
-100%
Restoring in the state prior to input of ENABLE=L
About the Switch of the Motor Excitation Mode
The switch of the excitation mode can be done with regardless of the CLK signal at the same time as changing of the signal
MODE0 and MODE1. The following built-in function can prevent motor out-of-step caused by discrepancies of torque vector
of transitional excitations during switch between excitation modes. However, due to operation state of motor during switch,
motor may not act following control on driver IC side control, and thereby lead to out-of-step or miss step. Therefore, switch
sequence shall be evaluated sufficiently before any decision.
Cautions of Bidirectional Switch of CW_CCW and Excitation Modes (MODE0, MODE1)
As shown in the figure below, the area between the end of reset discharge (PS=L→H) and beginning of the first CLK signal
input is defined as interval A, while the area until the end of the first CLK signal input is defined as interval B.
Interval A
=> For CW_CCW, no limitation is applied on switch of excitation mode.
Interval B
=> In CLK1 period, or within ENABLE=L interval, CW_CCW and excitation mode can’t be switched together.
Violation of this restriction may lead to false step (with one extra leading phase) or out-of-step.
Therefore, in case that CW_CCW and excitation modes are switched simultaneously, PS Pin must be input with reset
signal. Then start to operate in interval A before carrying out such bidirectional switch.
Interval A
Interval B
PS
CLK
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BD60223FP
Power Dissipation
Confirm that the IC’s chip temperature Tj is not over 150°C in consideration of the IC’s power consumption (W), thermal
resistance (°C/W) and ambient temperature (Ta). When Tj=150°C is exceeded, the functions as a semiconductor do not
operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration
and eventually destruction of the IC. Tjmax=150°C must be strictly obeyed under all circumstances.
Thermal Calculation
The IC’s consumed power can be estimated roughly with the power supply voltage (VCC), circuit current (ICC), output ON
resistance (RONH, RONL) and motor output current value (IOUT).
The calculation method during FULL STEP drive, SLOW DECAY mode is shown here:
푊
푉ꢄꢄ
= ꢇ × 퐼ꢄꢄ
[W]
ꢄꢄ
where:
WVCC
VCC
is the consumed power of the VCC
is the power supply voltage.
is the circuit current.
.
ICC
푊퐷푀푂푆 = 푊 ꢈ 푊퐷퐸ꢄ퐴푌 [W]
푂ꢂ
= ꢀ푂ꢂ퐻 ꢈ ꢀ푂ꢂ퐿 × 퐼푂푈푇2 × ꢋ × 표푛_푑푢푡푦 [W]
ꢉ
ꢊ
푊
푂ꢂ
2
ꢉ
ꢊ
ꢉ
ꢊ
푊퐷퐸ꢄ퐴푌 = ꢋ × ꢀ푂ꢂ퐿 × 퐼푂푈푇 × ꢋ × 1 ꢌ 표푛_푑푢푡푦 [W]
where:
is the consumed power of the output DMOS.
is the consumed power during output ON.
is the consumed power during current decay.
is the upper P-channel DMOS ON-resistance.
is the lower N-channel DMOS ON-resistance.
is the motor output current value.
WDMOS
WON
WDECAY
RONH
RONL
IOUT
PWM on duty
on_duty
푡푂ꢂ
=
⁄
푡ꢄ퐻푂푃
is the H bridge A and B.
“ ꢋ ”
tON varies depending on the L and R values of the motor coil and the current set value. Confirm by actual measurement, or
make an approximate calculation.
tCHOP is the chopping period, which depends on the external CR. Refer to P. 9, 10 for details.
Upper Pch DMOS ON Resistance
Lower Nch DMOS ON Resistance
IC number
BD60223FP
RONH[Ω] (Typ)
RONL[Ω] (Typ)
0.35
0.20
푊_푡표푡푎푙 = 푊 ꢈ 푊퐷푀푂푆 [W]
푉ꢄꢄ
ꢍ푗 = ꢍ푎 ꢈ 휃푗푎 × 푊_푡표푡푎푙 [°C]
where:
is the consumed total power of IC.
is the junction temperature.
is the air temperature.
W_total
Tj
Ta
is the thermal resistance value.
θja
However, the thermal resistance value θja[°C/W] differs greatly depending on circuit board conditions. The calculated values
above are only theoretical. For actual thermal design, perform sufficient thermal evaluation for the application board used,
and create the thermal design with enough margin to not exceed Tjmax=150°C. Although unnecessary with normal use, if
the IC is to be used under especially strict heat conditions, consider externally attaching a Schottky diode between the motor
output pin and GND to abate heat from the IC.
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Power Dissipation – continued
Temperature Monitoring
In respect of BD60223FP, there is a way to directly measure the approximate chip temperature by using the TEST pin with a
protection diode for prevention from electrostatic discharge. However, temperature monitor using this TEST pin is only for
evaluation and experimenting, and must not be used in actual usage conditions.
(1) Measure the pin voltage when a current of IDIODE=50µA flows from the TEST pin to the GND, without supplying VCC to
the IC. This is measurement of the VF voltage inside the diode.
(2) Measure the temperature characteristics of this pin voltage. (VF has a linear negative temperature factor against the
temperature.) With the results of these temperature characteristics, chip temperature can calibrated from the TEST pin
voltage.
(3) Supply VCC, confirm the TEST pin voltage while running the motor, and the chip temperature can be approximated from
the results of (2).
-VF[mV]
TEST
Internal circuit
IDIODE
V
25
150 Chip temperature Tj[°C]
Figure 7. Model diagram for measuring chip temperature
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Example for Applied Circuit
Power save pin
Refer to P.5 for detail.
Logic input pins
Refer to P.5 for detail.
TSD
OCP
CLK
TEST
PS
MODE1
OVLO
UVLO
Translator
MODE0
CW_CCW
ENABLE
RESET
-
VREF
DAC
Bypass capacitor.
Set the output current.
Input by resistor division.
Refer to P.6 for detail.
Setting range is
100µF to 470µF(electrolytic)
0.01µF to 0.1µF(multilayer ceramic etc.)
Refer to P.6 for detail.
VCC1
OUT1A
+
-
Be sure to short VCC1 and VCC2.
RNF1S
RNF2S
Set the chopping
frequency.
Setting range is
C:470pF to 1500pF
R:10kΩ to 200kΩ
OUT1B
RNF1
+
0.2Ω
100µF
0.1µF
RNF1S
VCC2
Refer to P.7, 9 for detail.
Blank time
PWM control
OUT2A
CR
OSC
Resistor for current detection
Setting range is
0.1Ω to 0.3Ω.
OUT2B
RNF2
39kΩ
1000pF
Mix decay
control
Refer to P.6 for detail.
0.2Ω
MTH
RNF2S
GND
Regulator
Set the current decay mode.
①SLOW DECAY
Connect to GND.
Resistor for current detection
Setting range is
0.1Ω to 0.3Ω.
Refer to P.6 for detail.
②MIX DECAY
Input by resistor division.
Refer to P.7, 12 for detail.
Figure 8. BD60223FP block diagram and applied circuit diagram
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BD60223FP
Input Output Equivalent Circuit Diagram
CW_CCW
MODE0
MODE1
CLK
VREF
MTH
10kΩ
5kΩ
ENABLE
10kΩ
PS
10kΩ
100kΩ
33kΩ
VREG (internal regulator)
RNF1S
RNF2S
5kΩ
5kΩ
CR
5kΩ
5kΩ
VCC
OUT1A
OUT2A
OUT1B
OUT2B
RNF1, RNF2
circuit
Figure 9. Input output equivalent circuit diagram
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BD60223FP
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic can be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
9. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD60223FP
Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 10. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. The IC should
be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the
OFF state even if the Tj falls below the TSD threshold.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
14. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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TSZ22111 • 15 • 001
22.Mar.2018 Rev.001
BD60223FP
Ordering Information
F
P
B D 6
0
2
2
3
-
E 2
Package type
FP : HSOP25 E2: Reel-wound embossed taping
Packing, Forming specification
ROHM Model
Marking Diagram
HSOP25 (TOP VIEW)
Part Number Marking
LOT Number
BD60223FP
Pin 1 Mark
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23/25
TSZ22111 • 15 • 001
22.Mar.2018 Rev.001
BD60223FP
Physical Dimension and Packing Information
Package Name
HSOP25
Max 13.95 (include. BURR)
(UNIT: mm)
PKG: HSOP25
Drawing: EX139-5001
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TSZ22111 • 15 • 001
TSZ02201-0P2P0C702000-1-2
24/25
22.Mar.2018 Rev.001
BD60223FP
Revision History
Date
Revision
001
Changes
22.Mar.2018
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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